Abstract: In example implementations, an apparatus is provided. The apparatus includes a riser card body, a first interface, a first 2×8 slot on a surface of the riser card body, and a second 2×8 slot on a same side of the surface of the riser card body as the first 2×8 slot. The first interface includes a first set of fingers and a second set of fingers at an end of the riser card body to connect to a peripheral component interconnect express (PCIe) slot of a motherboard. The first 2×8 slot and the second 2×8 slot are positioned perpendicular to the PCIe slot of the motherboard.

Abstract: A heat dissipation structure has a heat dissipation base and at least one heat conduction assembly mounted in a through hole of the heat dissipation base. Each of the at least one heat conduction assembly includes a resilient clamp and a heat pipe. When a transceiver is inserted in the through hole of the heat dissipation base, two heat conducting sections of the heat pipe are pushed by the resilient clamp to abut against the transceiver and the heat dissipation base respectively. Heat generated while the transceiver is operating can be quickly and efficiently conducted through the heat pipe to the heat dissipation base and then dissipated. Temperature increase of the transceiver can be effectively avoided and performance and reliability of the transceiver during operation can be ensured.

Abstract: In one embodiment, a method for monitoring total power consumption of a component coupled to a riser card includes: capturing, by a power cable sensor, a first signal associated with a power cable; receiving, by a power monitor, the first signal from the power cable sensor via a first bus; determining, by the power monitor, a first power consumption level indicating a first voltage supplied to the component via the power cable; capturing, by a card slot sensor, a second signal associated with a card slot; receiving, by the power monitor, the second signal from the card slot sensor via a second bus; determining, by the power monitor, a second power consumption level indicating a second voltage supplied to the component via the card slot; and determining, by the power monitor, a total power consumption level associated with the component based on the first and the second power consumption levels.

Abstract: A circuit board for use in a modular electrical connector. The circuit board has a first surface and an oppositely facing second surface. Signal pathways are provided on the first surface. The signal pathways have signal pathway ends abutting a mounting end of the circuit board. First ground pathways are provided on the first surface. The first ground pathways are positioned adjacent at least one of the signal pathways. The first ground pathways have first ground pathway ends abutting the mounting end of the circuit board. One or more second ground pathways are provided on the second surface. The one or more second ground pathways have second ground pathway ends abutting the mounting end of the circuit board. The positioning of the signal pathway ends, the first ground pathway ends and the second ground pathway ends abutting the mounting end reduces crosstalk between signal pairs.

Abstract: A module arrangement for a modular field device connection unit comprises a frame module having an interface receptacle, an interface module adapted to be inserted into the interface receptacle along a module insertion path, and a resetting mechanism adapted to reset the movable coding element into the neutral position by insertion of the interface module into the interface receptacle and/or removal of the interface module from the interface receptacle. The interface module has a cartridge receptacle and a movable coding element. The movable coding element is movable from a neutral position into a coding position by insertion of a cartridge member into the cartridge receptacle. The resetting mechanism has a trigger element at least partially protruding into the module insertion path.

Abstract: A fluid ejection device, in an example, that includes a housing with the housing including a plurality of lateral hooks to engage with a plurality of posts of a connector, the lateral hooks running, at least partially, parallel to a cable receiving surface wherein a portion of a printed circuit board (PCB) comprising electrical interconnects extends beyond the cable receiving surface to interface with the connector.

Abstract: An electrical connector includes an insulation body, a seat, and a positioning plug. The seat is disposed on an outer peripheral surface of the insulation body. The seat includes a tunnel defined through the seat to form an inlet and an outlet. The outlet and a front surface of the insulation body face the same side. The seat further includes a slit and one or more first bumps disposed on an inner wall of the slit. The positioning plug includes a sliding block and rib. The sliding block movably disposed in the tunnel via the inlet with the rib movably disposed in the slit. The positioning plug further includes a second bump disposed on a lateral side of the rib facing the first bump. When the sliding block moves to an installation position, the first bump stops the second bump to fix the sliding block at the installation position.

Abstract: The invention relates to a rail-mounted building automation device adaptable to space and communication requirements, comprising a communications module having a communications bus, an application module that implements the functionality. A bus connector supplies power and transferring data. The communications module includes a first casing having ten bus connector pins, a lower body with the communications bus, having a wall further forward than another in relation to a user. The application module includes a second casing with a pin-receiving connector having three terminals, a first projection separated from a second projection at approximately the width of the rail, in use when the ten pins are introduced into the receiving connector and an upper body of the first casing is introduced into a third recess of the second casing, with both being joined by a securing apparatus.

Abstract: One example of a device includes a low voltage direct current (LVDC) bus and a high voltage direct current (HVDC) to LVDC converter to receive HVDC power from an enclosure and provide main LVDC power. The device includes a circuit to pass the main LVDC power to the LVDC bus while the main LVDC power is within regulation limits and to pass backup LVDC power from the enclosure to the LVDC bus in response to the main LVDC power falling outside the regulation limits.

Abstract: A connector assembly includes a plurality of circuit boards and a bracket retaining the plurality of circuit boards. The circuit boards each have a plugging portion to be plugged into a mating connector and each have a first main face facing a second main face of an adjacent circuit board of the plurality of circuit boards. The bracket retains the plurality of circuit boards with the plugging portions facing downward and with each of the circuit boards capable of making a predetermined amount of independent movement in a pair of directions in a horizontal plane.

Abstract: A connector includes: a main body and a holder. The main body includes: a frame guiding a connected member in a mounting direction; a first support member being flexible toward the frame and protruding from the frame in a first outer direction; and a second support member being flexible toward the frame and protruding from the frame in a second outer direction. The holder include: first and second contact surfaces to which the first and second support members contact, respectively, when the main body has been inserted into the holder; and inclined surfaces inclined in a direction approaching the main body from both edges of each of the first and second contact surfaces. When the main body inside the holder moves in a direction orthogonal to the mounting direction, the first and second support member slide on the inclined surfaces and elastically deform in a direction approaching the frame.

Abstract: An Off The Module (OTM) cable assembly includes a back shell assembly and a guide block, where the guide block is disposed on a top surface of a electronic package. The back shell assembly is disposed inside a cavity of the guide block, where the back shell assembly includes a plurality of cable subassemblies and a back shell holder. Each cable subassembly from the plurality of cable subassemblies includes a compression connector portion and a cable portion, where the cable portion is mechanically coupled and electrically coupled to the compression connector portion. A contact wire and a contact spring of each cable subassembly is compressed against a respective plated contact pad on the top surface of the electronic package, where the compressed contact wire and the compressed contact spring of each cable subassembly is electrical coupled to the electronic package via the respective plated contact pad.

Abstract: A main circuit wiring member for electrically connecting a supply source of direct-current power and a semiconductor element module to each other or semiconductor element modules to each other, includes a first conductor covered with an insulating film and configured to allow a first potential to be applied thereto, a second conductor covered with the insulating film and configured to allow a second potential to be applied thereto, the second potential being lower than the first potential, and an insulating member that has intermediate-potential layer conductors sandwiched therein and is arranged between the first conductor and the second conductor.

Abstract: A storage array and systems for configuring a storage array are provided. In one example, the storage array includes a motherboard. The motherboard includes a first compute module and an input/output (I/O) mid-plane that is routed to the first compute module. The I/O mid-plane has a plurality of peripheral component interconnect express (PCIe) lanes coupled to the first compute module. A bridge module interconnect is routed to the I/O mid-plane via one or more of the plurality of PCIe lanes of the I/O mid-plane. The bridge module interconnect provides bridge connections to receive to two or more types of protocol bridge modules. A storage mid-plane provides integrated routing between each of a plurality of drive connectors and each of the bridge connections of the two or more types of protocol bridge modules of the bridge module interconnect.

Abstract: Exemplified methods and systems are disclosed that provide a control IO device comprising a head unit and a plurality of IO slices coupled to a common backplane in which two or more adjacent IO slices are functionally connected to one another over an independent IO bus to form a functional IO slice group.

Abstract: Methods and apparatuses for transmitting images captured by first and second image sensors are disclosed. In some embodiments, each image sensor generates a plurality of pixel values each represented by a plurality of data bits having a pixel bit length. In some embodiments, a method involves combining pixel values generated by each of the first and second image sensors into a single image data stream, transforming the single image data stream into a plurality of data words having a word bit length, and encoding the data by selection of one of a plurality of symbols having an encoded bit length that is at least one bit longer than the word bit length to reduce a running disparity. The method also involves serializing the symbols to generate and transmit a DC balanced serial bitstream. Methods for synchronizing a receiver for extracting image data from the serial bitstream are also disclosed.

Abstract: A connector system includes a first connector and a second connector. The first connector includes a plug housing that holds a circuit card. The plug housing includes a tongue portion extending to a mating end of the plug housing. The circuit card protrudes beyond the mating end. The plug housing includes a rail disposed along an outer surface of the tongue portion. The second connector includes a receptacle housing that defines a card slot configured to receive the circuit card of the first connector therein. The second connector includes a shell mounted to the receptacle housing. The shell protrudes beyond a mating end of the receptacle housing to define a receptacle that receives the tongue portion of the plug housing therein. The shell defines a guide channel configured to receive the rail of the plug housing therein as the tongue portion enters the receptacle.

Abstract: A display device is disclosed. The display device includes a display unit including a display panel, a back cover positioned on a back surface of the display panel, and a light shielding plate positioned between the display panel and the back cover, a housing into which at least a portion of a lower area of the display unit is inserted, and on which a printed circuit board (PCB) is mounted, a link bar connecting the housing to the display unit, and a front deco entirely positioned inside the housing and shielding at least a portion of a lower portion of the display unit.

Abstract: An insert bus bar plate includes a plate-shaped resin material and a plurality of metal bus bars that are embedded within the resin material by insert molding and have a terminal part exposed to a mounting surface that is one of principal faces of the resin material. The bus bars are formed, before the insert molding, as a bus bar assembly before molding the one ends different from the terminal part of which are coupled to each other by a carrier to be cut after the insert molding. The insert bus bar plate (a substrate main body) is formed by the insert molding performed by oppositely arranging two bus bar assemblies before molding of the same shape so that two terminal parts are positioned in between two carriers.

Abstract: A method and apparatus for migrating a first control system to a second control system. The method includes receiving a first plurality of signals from an element of a first control system, segregating the first plurality of signals into individual signals, and outputting the individual signals as a second plurality of signals to a second control system. The apparatus includes an input module configured to receive a first plurality of signals from an element of a first control system and segregate the first plurality of signals into individual signals, an isolation module, and an output module configured to receive the individual signals and output the individual signals as a second plurality of signals to a second control system.

Abstract: The disclosed technology includes an assembly of two planar expansion card cards, which provides functionality to be leveraged by an upper planar expansion card. The base planar expansion card includes a first connector A, a first connector B, a connector C, a first pass-through connector A configured to connect to the first connector A, and a first pass-through connector B configured to connect to the first connector B. An upper planar expansion card includes a second connector A and a second connector B. The second connector A and the second connector B connect to the first pass-through connector A and the first B connector pass-through, respectively. In some implementations, the second connector A and second connector B are configured for a PCI-E and the connector C is configured for Ethernet KR signals.

Abstract: A motherboard can include a socket coupled to a cable. The motherboard can also include an adapter coupled to a central processing unit (CPU). The adapter can be received in the socket upon installation of the CPU in the motherboard. The socket and the cable can be installed in the motherboard prior to installation of the CPU.

Abstract: A memory module connector (100) is described herein. The memory module connector (100) comprises a plurality of connector pins (102) distributed into a plurality of columns (104). The plurality of connector pins (102) further comprises a plurality of ground pins (106) for providing electrical ground to the memory module connector (100) and a plurality of signal pins (108) for carrying data signals across the memory module connector (100). Further, for each signal pin (108) provided in a column (104), each connector pin (102) adjacent to the signal pin (108) in an adjacent column (104) is a ground pin (106).

Abstract: A system can include a chassis; a board operatively coupled to the chassis where the board includes card slots aligned along respective parallel planes and circuitry operatively coupled to the slots; a retainer; and a bracket operatively coupled to the chassis where the bracket includes a guide that guides rotation of the retainer to and translation of the retainer along a plane orthogonal to the parallel planes. Various other apparatuses, systems, methods, etc., are also disclosed.

Abstract: An electronic device for transmitting data is described herein. In some examples, the electronic device includes a package substrate, and a plurality of integrated circuits to be coupled to the package substrate, at least one integrated circuit comprising a topside connector or an edge connector to be coupled to a cable that is to couple to a cable receptacle.

Abstract: An extending device includes a first riser card, a signal coupling card and a second riser card. A first electric socket of the first riser card is disposed on a side surface of a first circuit board of the first riser card, and a first electric connector is disposed at an edge of the first circuit board. A second electric connector and a third electric connector of the signal coupling card are respectively disposed on both side surfaces of a third circuit board of the signal coupling card. The second electric connector inserts into the first electric socket. A second electric socket and an extending socket of the second riser are respectively disposed on both side surfaces of a second circuit board of the second riser. The third electric connector inserts into the second electric socket and the extending socket is electrically connected to the second electric socket.

Abstract: A high performance computing (HPC) system includes computing blades having a first region that includes computing circuit boards having processors for performing a computation, and a second region that includes non-volatile memory for use in performing the computation. The regions are connected by a plurality of power connectors that convey power from the computing circuit boards to the memory, and a plurality of data connectors that convey data between the first and second regions. The power and data connectors are configured redundantly so that failure of a computing circuit board, a power connector, or a data connector does not interrupt the computation. A method of performing such a computation, and a computer program product implementing the method, are also disclosed.

Abstract: A packet network device such as a network switch includes a number of functional cards or chassis modules at least some of which are connected to both an electrical backplane and a wireless backplane. The electrical backplane provides data plane signal paths and the wireless backplane provides control plane signal paths.

Abstract: A high performance computing (HPC) system includes computing blades having a first region that includes processors for performing a computation, and a second region that includes non-volatile memory for use in performing the computation and another computing processor for performing data movement and storage. Because data movement and storage are offloaded to the secondary processor, the processors for performing the computation are not interrupted to perform these tasks. A method for use in the HPC system receives instructions in the computing processors and first data in the memory. The method includes receiving second data into the memory while continuing to execute the instructions in the computing processors, without interruption. A computer program product implementing the method is also disclosed.

Abstract: A server system utilizing a backplane structure comprises first and second hard disk modules; a first backplane comprising a first wiring board comprising air vents and passive components and a second wiring board connected to a bottom portion of the first wiring board at a first angle and comprising first active components; and a second backplane comprising a third wiring board comprising second air vents and second passive components and a fourth wiring board connected to a bottom portion of the third wiring board at a second angle and comprising second active components thereon; wherein the first and second backplanes are disposed between the first and second hard disk modules; the first wiring board is directly corresponding to the first hard disk module; the third wiring board is directly corresponding to the second hard disk module; the first backplane is higher than the second backplane.

Abstract: A mounting apparatus configured for securing a number of peripheral component interconnect (PCI) cards includes a number of positioning members. Each positioning member includes a positioning block positioning a corresponding PCI card, an inserting portion extending away from a first side of the positioning block, and a latching portion extending away from a second side of the positioning block. The inserting portion of each of the positioning members is latched to the latching portion of an adjacent positioning member.

Abstract: According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable “D” interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board.

Abstract: An image processing board and a display apparatus having the same are provided. The image processing board includes a substrate, common input terminals installed on the substrate, and an additional input terminal selectively installed on the substrate. The additional input terminal is selectively installed on the substrate according to a type of display apparatus, and thus the image processing board may be used in various types of display apparatuses.

Abstract: In order that even the cell connectors (17) of, for instance, a traction rechargeable battery (11) which carry very high currents can be connected to a battery management system (21) in a fault-resistant and functionally reliable manner, firstly a circuit board (24) in the form of a leadframe (25) encapsulated with plastic by injection molding is latched onto the housing (13) mechanically grouping the cells (12), said circuit board in any case not projecting higher than the adjacent end faces (15) of the cell terminal connections (14) projecting at a clear radial distance therefrom.

Abstract: A pin module of RJ connector includes a circuit board and eight pins, which contain a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin and an eighth pin. Each pin includes a turning part and a stretching part. One end of the turning part is extended to form a first end of the pin. The first ends of the pins are arranged in a series. One end of the stretching part is coupled to the other end of the corresponding turning part. The other end of the stretching part is extended to form a second end of the pin, and the second ends of the pins clips the circuit board.

Abstract: A connector connecting a main circuit board and a sub circuit board has two bases, two electrical contacting sets, two resilient bar sets and two mounting brackets. The bases are mounted on the main circuit board. The electrical contacting sets are mounted respectively in the bases and each electrical contacting set has multiple electrical contacting elements. The resilient bar sets are mounted respectively on the bases. The mounting brackets are mounted respectively on the bases and cover the electrical contacting sets and the resilient bar sets. Circuit-board-receiving channels are defined between the bases and the mounting brackets for receiving the sub circuit board such that combination of the main circuit board and the sub circuit board are parallel and flat.

Abstract: First and second memory module connectors are secured in end-to-end alignment on a circuit board for receiving memory modules along a central plane. Each memory module connector has an ejector latch pivotally coupled to the adjacent ends of the memory module connectors to pivot about an axis perpendicular to the plane. A distal portion of an upper arm of each ejector latch lies on opposite sides of the plane, such that the ejector latches interleave when either ejector latch is pivoted to an open position. The adjacent ends of the first and second memory module connectors are separated by a narrow gap, such that pivoting of the either ejector latch from a closed position to an open position will push the other ejector latch toward a closed position.

Abstract: Remote sensor units for a vehicle are described. An apparatus may comprise a satellite housing having an electrical connector interface portion, and an electrical connector disposed within the electrical connector interface portion of the satellite housing. The electrical connector may be arranged to conduct electrical signals for an electronic component having an electronic sensor operative to monitor conditions for a vehicle, the electrical connector comprising a capture portion at a first end and a pin portion at a second end, the capture portion having a pair of opposing mechanical contact elements arranged to receive at least one edge of the electronic component. Other embodiments are described and claimed.

Abstract: A test card includes a substrate and a goldfinger structure disposed on a side of the substrate. The goldfinger structure includes a first conductive section and a second conductive section. The first conductive section is inserted into a slot of a socket for electrically connecting to the socket. The second conductive section is connected to the first conductive section in a separable manner, and the second conductive section is inserted into the slot of the socket for electrically connecting to the socket after the first conductive section is cut for separating from the second conductive section.

Abstract: A circuit board assembly includes a motherboard, a first daughterboard, and a first metal bar. Two ends of the first metal bar are respectively fastened to the motherboard and the first daughterboard, and are electrically connected between the motherboard and the first daughterboard. The first metal bar is supported between the motherboard and the first daughterboard, so as to position the first daughterboard separately over the motherboard and enable the first daughterboard to be substantially perpendicular to the motherboard.

Abstract: A mounting apparatus for an expansion card includes a bottom plate, a circuit board, and mounting bracket. The bottom plate defines mounting hole. The circuit board is secured to the bottom plate, and a gap is defined between the bottom plate and the circuit board. The mounting bracket includes a base secured to the bottom plate. The base includes two positioning pieces and an elastically deformable mounting portion. The two positioning pieces are received in the gap, to prevent the mounting bracket from moving along a first direction substantially perpendicular to the bottom plate, and the elastically deformable mounting portion is engaged in the mounting hole, to prevent the mounting bracket from moving along a second direction substantially parallel to the bottom plate.

Abstract: Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency, cost, modularity, accessibility, and space utilization of the components within the enclosure. Presented herein are power distribution architectures involving a distribution board oriented along a first (e.g., vertical) axis within the enclosure, comprising a power interconnect configured to distribute power among a set of load boards oriented along a second (e.g., lateral) axis and respectively connecting with a set of load units oriented along a third (e.g., sagittal) axis, and a set of power supplies also oriented along the third axis. This orientation may compactly and proximately position the loads near the power supplies in the distribution system, and result in a comparatively low local current that enables the use of printed circuit boards for the distribution board and load boards.

Abstract: The present invention discloses a circuit board interconnection architecture, which includes at least one first plugboard and at least two second plugboards substantially perpendicular to the first plugboard, where at least one of the first plugboard and the second plugboards is provided with several slots; the first plugboard and the second plugboards are mated and electrically connected by using signal connectors on both sides of the slots. The circuit board interconnection architecture solves a fitting precision problem of the first plugboard and the second plugboards in orthogonal directions. Even though there is an assembly tolerance between the first plugboard and the second plugboards, the connectors still satisfy assembly precision requirements, which can also avoid overall deformation of a first circuit board and a second circuit board after the first plugboard and the second plugboards are interconnected and mated orthogonally.

Abstract: A method for implementing an electrical system architecture capable of providing fixed or modular components, for example, interface connectors, is provided. Fixed components allow product cost to be minimized. Modular components provide flexible configurability of products. In accordance with at least one embodiment of the present invention, an electrical system architecture capable of providing fixed or modular components minimizes costs such as design, production, and customer support costs while being able to provide a range of product variants.

Abstract: A substantially cable-free board connection assembly may include a plurality of printed circuit boards (PCBs) forming an interconnect plane for a plurality of electronic devices respectively attached to a plurality of plane boards included in the interconnect plane. An insertion direction for substantially all connectors is substantially perpendicular to a face of the interconnect plane. At least a portion of the board connection assembly is mounted to a support structure via a flexible connection.

Abstract: A socket includes a conductive base, a first socket terminal, and a second socket terminal, the first socket terminal extends from one end of the base, and the second socket terminal extends from an other end of the base, opposite to the first socket terminal with the base therebetween. Further, the first socket terminal has a first contact portion extending from the base and contacting with a terminal of the connector, a second contact portion extending from the first contact portion and contacting with the terminal of the connector, and a first bending portion extending from the second contact portion and bending away from the first contact portion.

Abstract: A connector to be mounted on a substrate includes a first pad and a second pad formed on the surface, including a first contact including a first contacting portion to be in contact with the first pad when the connector is mounted on the substrate; and a second contact including a second contacting portion to be in contact with the second pad when the connector is mounted on the substrate, the first contact and the second contact being configured such that the first contacting portion slides on the first pad in a first direction while the second contacting portion slides on the second pad in a second direction opposite to the first direction, when the first contact and the second contact are pushed toward the first pad and the second pad, respectively, while the connector is being placed on and fixed to the substrate.

Abstract: A safety secondary battery pack formed by bridge connection of secondary battery cells and fuses is provided with a plurality of secondary battery cell groups and fuses, wherein the secondary battery cells and the fuses are connected in bridge mode, each of the positive or negative terminals of the secondary battery cells is provided with a fuse. Hence, the respective battery cell groups of the present invention can still work properly in the case that any single battery cell fails. When any of the secondary battery cells fails and the current flowing through the fuse exceeds the rated value, the fuse electrically connected to the failed secondary battery cell will be blown to stop current from flowing, so that the failed secondary battery cell is isolated from the rest good secondary battery cells to improve safety of the battery pack.

Abstract: A system and method for adapting a peripheral expansion card to a peripheral expansion slot are disclosed herein. A first board of an expansion card adapter is configured to mate with an expansion card connector. A second board of the expansion card adapter is configured to mate with peripheral expansion card that is incompatible with the expansion card adapter.

Abstract: The embodiments of the present invention disclose a backplane and backplane system. The backplane includes at least two service slots with the same function and an exchange slot. Among the pins of different service slots with the same function respectively connected to the exchange slot, at least two pins are arranged to resemble a stepped form. When arranged in this manner, the distribution and orientation of the connection lines connecting the pins of the service slots with the same function to the exchange slot may be adjusted, and wiring density within a single wiring layer may be increased, which therefore enables the connection lines between the service slots and the exchange slot to be staggered from each other in less wiring layers or even one wiring layer, and as a result, decreases the number of the wiring layers to be used, and reduces the costs of the backplane.