Overlying Second Preformed Panel Circuit, Both Adapted To Be Electrically Connected Patents (Class 439/74)
  • Publication number: 20080305657
    Abstract: A male connector is attached to a circuit board and fits with a female connector in a fitting direction perpendicular to a surface of the circuit board. A terminal of the male connector extends outside a housing thereof in parallel to the circuit board. The terminal has a connection portion to be connected with a circuit portion of the circuit board with solder. When the male connector and the female connector are fitted with each other, the connection portion has a facing region facing a top face of a peripheral wall of a housing of the female connector. The terminal includes a solder barrier layer formed at least in a nearest facing region of the facing region. The nearest facing region is situated to be closest to the top face.
    Type: Application
    Filed: June 5, 2008
    Publication date: December 11, 2008
    Inventor: Kazuya Midorikawa
  • Patent number: 7458822
    Abstract: An electrical connector includes a housing having a first sidewall surface and a second sidewall surface extending in a first direction in parallel to each other with a first distance therebetween; a first terminal having a first contact portion protruding from the first sidewall surface in a second direction substantially perpendicular to the first direction; a second terminal having a second contact portion protruding from the second sidewall surface; and an extension portion having a first external wall surface and a second external wall surface. The extension portion is arranged so that a center point between the first external wall surface and the second external wall surface is shifted with respect to a center point between the first contact portion and the second contact portion. The first external wall surface extends in parallel to the second external wall surface with a second distance larger than the first distance.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: December 2, 2008
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Shozo Ono
  • Patent number: 7458821
    Abstract: According to some embodiments, a connector to receive a memory module includes a first row of a first plurality of interconnect ends, a second row of a second plurality of interconnect ends adjacent to the first row, and a third row of a third plurality of interconnect ends adjacent to the second row. An interconnect end of the first plurality of interconnect ends, an interconnect end of the second plurality of interconnect ends, and an interconnect end of the third plurality of interconnect ends may be substantially aligned.
    Type: Grant
    Filed: December 7, 2005
    Date of Patent: December 2, 2008
    Assignee: Intel Corporation
    Inventors: Dan Willis, David Kraus
  • Publication number: 20080293265
    Abstract: An alignment system for a mezzanine-type printed circuit board is provided. The alignment system includes tab portions formed from the insulating material of the printed circuit board, in which the tab portions engage receptacles and limit movement of the printed circuit board.
    Type: Application
    Filed: June 25, 2007
    Publication date: November 27, 2008
    Inventors: John D. Nguyen, Jon Kolas
  • Publication number: 20080293266
    Abstract: A communication relay apparatus includes a first connecting section for connecting to a first wire harness connected to an electronic control device, a second connecting section for connecting to a second wire harness connected to a plurality of electronic equipments, a communication address setting section which has a plurality of connection portions and sets a communication address for the electronic control device with a conducting pattern based on presence or absence of conduction at the connection portions, and a communication relay section which is electrically connected to the first connecting section and the second connecting section, and relays communication between the electronic control device and the electronic equipments on the basis of the communication address. The communication address setting section is formed so that the presence or absence of the conduction of the connection portions can be viewed from the exterior and that the conducting pattern can be set from the exterior.
    Type: Application
    Filed: March 13, 2008
    Publication date: November 27, 2008
    Applicant: YAZAKI CORPORATION
    Inventors: Akiyoshi KANAZAWA, Takashi GOHARA, Ken ITO
  • Publication number: 20080293264
    Abstract: A connector including a housing and a contact is disclosed for electrically connecting a first electrical device to a second electrical device across the contact in such a manner that the contact is broken if the connector is removed from the second electrical device. The contact includes a press-fit connection that may be either a compliant eye-of-the-needle or a cylindrical tail.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 27, 2008
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: David A. TROUT, James L. FEDDER, Attalee S. TAYLOR, Jason E. VRENNA
  • Publication number: 20080293272
    Abstract: A connector assembly including a modified contact is disclosed for connecting a first electrical device to a second electrical device. In a first embodiment, the connector assembly includes a tool necessary to press-fit the connector to the second electrical device. In a second embodiment, the connector assembly includes two connectors that mate in such a manner so as to render the modified contact unusable if the two connectors are unmated.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 27, 2008
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: David A. TROUT, Daniel R. RINGLER, James L. FEDDER, Attalee S. TAYLOR
  • Patent number: 7452216
    Abstract: A receptacle assembly for a transceiver module includes a transceiver cage that is configured to receive the transceiver module. The transceiver cage is configured to be mounted proximate a cutout in a circuit board such that a portion of the transceiver cage extends through the cutout. A connector is configured to mate with the transceiver module and is disposed within the cage. The transceiver cage and the connector are configured to be mounted on the same surface of a circuit board.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: November 18, 2008
    Assignee: Tyco Electronics Corporation
    Inventors: Keith McQuilkin Murr, Michael Eugene Shirk, Michael J. Phillips
  • Patent number: 7452214
    Abstract: In one embodiment, an interconnect assembly includes conductive contact bumps extending from a bumped flex circuit assembly, and conductive contact pads attached to a rigid printed circuit assembly. Each conductive contact pad has a contact surface having a hole and an abutment zone adjacent to the hole, wherein the contact surface is sized to allow contact, prior to disposition within the hole, by the distal end of one of the bumps, and wherein the abutment zone is sized to allow contact of the lateral periphery, and prevent contact of the distal end, of the bump disposed within the hole. A method of forming an interconnect is also disclosed. In one embodiment the method includes wiping lateral portions of conductive contact bumps against conductive contact pads, and abutting lateral portions of the bumps against the pads without contacting distal ends of the bumps.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: November 18, 2008
    Assignee: Verigy (Singapore) Pte. Ltd.
    Inventor: Barry W. Eppler
  • Patent number: 7448880
    Abstract: In the case where high speed differential signals are transmitted in differential transmission lines through via holes with open-stubs, signal waveforms are distorted due to impedance mismatch in the open-stubs of the via holes, thus causing jitter, which has become an issue of high speed signals. For differential transmission lines that pass through via holes with open-stubs, a degree of coupling of the lines is decreased while the differential characteristic impedance is made constant. Thereby, the effects of backward cross talk noise caused by the coupling can be minimized, and thus jitter can be suppressed.
    Type: Grant
    Filed: November 20, 2006
    Date of Patent: November 11, 2008
    Assignee: Hitachi, Ltd.
    Inventor: Hideki Osaka
  • Publication number: 20080274630
    Abstract: The present disclosure generally pertains to wireless communication modules that can be used for enabling wireless communication in various applications. A wireless communication module in accordance with one embodiment may be interfaced with other devices, such as nodes of a wireless sensor network (WSN). The module has rows of male integrated circuit (IC) pins that may be interfaced with female pin receptacles of another device. The module receives wireless signals and provides the data of such wireless signals to the other device. The module also receives data from the other devices and packetizes such data for wireless communication.
    Type: Application
    Filed: May 2, 2008
    Publication date: November 6, 2008
    Inventors: Gary W. Shelton, Terry G. Phillips, Thomas J. Watson
  • Patent number: 7445466
    Abstract: A board-to-board connector assembly includes a receptacle and a plug. The receptacle has a receptacle housing, first contacts and two first fixing contacts mounted in the receptacle housing. The receptacle housing has a base, two first sidewalls, and two second sidewalls. A recess is formed among the base and the sidewalls. Each first fixing contact has a first fixing portion fixed in the corresponding second sidewall, the middle of the first fixing portion extending upward then bending downward to form an elastic portion which extends to form a contacting portion. The plug has a plug housing received in the recess, second contacts mounted in the plug housing, and two second fixing contacts. Each second fixing contact has a second fixing portion fixed in two opposite ends of the plug housing, the contacting portion of the first fixing contact being against the outside of the second fixing portion.
    Type: Grant
    Filed: July 30, 2007
    Date of Patent: November 4, 2008
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventor: Yung-Chi Peng
  • Patent number: 7445467
    Abstract: A board electrical connector includes a plurality of the terminals provided in a housing. The terminals are attached to a circuit board on one side of the housing and fit each other with a middle connector on the other side of the housing. The terminals contact with pad portions of middle members of the middle connector. A receiving groove having an opening portion to receive an edge portion of the middle member of the middle connector is provided in the housing. A contact portion of the terminal enters the receiving groove for contacting with the middle member with a contact pressure. A protrusion having a smaller entry amount than that of the contact portion is provided on an inner wall surface of the receiving groove in a receiving direction of the receiving groove. The protrusion is situated at the same position as that of the contact portion.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: November 4, 2008
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Tsutomu Matsuo
  • Patent number: 7445459
    Abstract: An electrical connector includes an insulative housing (2) having an exterior side (23) adapted to face a substrate, a substantially elongated terminal (1), and a body of reflowable, electrically conductive material (5). The terminal is adapted to mate with a mating component and extends substantially to the exterior side of the insulative housing. The terminal includes a movable contact end (12) longitudinally movable relative to the insulative housing. The body of reflowable, electrically conductive material is disposed on the movable contact end adjacent the exterior side of the insulative housing. As such, since the electrical connector is assembled onto the substrate by the formation of the body of conductive material between terminals of the electrical connector and the substrate, no openings or holes have been defined on the substrate, thereby doing no damage to a wiring or connection layout on the substrate.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: November 4, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Shih-Wei Hsiao, Ming-Yue Chen
  • Patent number: 7443844
    Abstract: A switched fabric mezzanine storage module (560) includes a storage module (562) and a switched fabric connector (563) coupled to the storage module. The storage module is coupled to directly communicate with a switched fabric (506), where the switched fabric storage mezzanine module is coupled to a payload module (502) having one of a 3U form factor, a 6U form factor and a 9U form factor. The payload module can include at least one multi-gigabit connector (518) coupled to a rear edge (519) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface with a backplane (504).
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: October 28, 2008
    Assignee: Emerson Network Power - Embedded Computing, Inc.
    Inventors: Douglas L. Sandy, Jeffrey M. Harris, Robert C. Tufford
  • Patent number: 7440450
    Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: October 21, 2008
    Assignee: Emerson Network Power-Embedded Computing, Inc.
    Inventors: Jeffrey M. Harris, Douglas L. Sandy, Robert C. Tufford
  • Patent number: 7435097
    Abstract: The present invention relates to circuit boards with radially arrayed components. One specific embodiment is a memory circuit board with memory components, such as, for example, DRAM chips, radially arrayed around a central point. The present invention also relates to stacking and connecting multiple circuit boards with radially arrayed components. Another embodiment of the invention involves methods of preparing radially arrayed components on a circuit board module with substantially equidistant paths to the components.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: October 14, 2008
    Assignee: Legacy Electronics, Inc.
    Inventor: Donald W. Mecker
  • Patent number: 7436270
    Abstract: A duplexer assembly is provided and includes a circuit board and a duplexer connected to the circuit board by a joint material, wherein the joint material provides a joint thickness of at least about 10 mils.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: October 14, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Joseph M. Ratell, Jr., Michael T. Dolce
  • Patent number: 7431617
    Abstract: A connector configured to mate with a corresponding connector. The connector comprises a conductive shell, a housing and a plurality of terminals. The conductive shell comprises an elastic portion and a plate portion having an opening. The plate portion is configured to define a first region and a second region and arranged between the first region and the second region. The elastic portion comprises a first bend section arranged on the plate portion, a second bend section arranged in the first region, a contact section arranged in the second region, a first piece extending between the first bend section and the second bend section and a second piece extending between the second bend section and the contact section through the opening. The housing is arranged in the first region. The plurality of terminals is retained by the housing.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: October 7, 2008
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Takahiro Yamaji
  • Patent number: 7429176
    Abstract: A modular board to board mezzanine ball grid array BGA connector includes a plug, a receptacle and if needed an adapter. The plug and the receptacle can be made form the same base pieces to accommodate different stack heights. If a greater stack height is needed, spacers can be used in the plug and the receptacle to accommodates a greater selected stack height. The plug and the receptacle both include a base having an interstitial diamond recesses in which the solder balls are disposed and in which one end of a contact is inserted. The plug may further include a plug cover that can be connected to the base, and the receptacle may include a receptacle cover that fits over its base. The plug can have a plug contact assembly, and the receptacle can have a receptacle contact assembly. The plug and the receptacle can be mated by mating the plug cover to the receptacle cover and the receptacle contacts to the plug contacts.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: September 30, 2008
    Assignee: FCI Americas Technology, Inc.
    Inventors: Douglas Michael Johnescu, Craig W. Clewell, Lewis R. Johnson
  • Publication number: 20080227310
    Abstract: Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.
    Type: Application
    Filed: March 16, 2007
    Publication date: September 18, 2008
    Inventors: Seah Sun Too, Raj N. Master, Jacquana Diep, Mohammad Khan
  • Publication number: 20080227311
    Abstract: An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board.
    Type: Application
    Filed: March 14, 2007
    Publication date: September 18, 2008
    Inventors: Jason Edward Chan, Jose Ricardo Paniagua
  • Patent number: 7425137
    Abstract: A connector assembly for connecting first and second circuit boards in a substantially parallel relationship includes a first connector matable to the first circuit board and a second connector matable to the second circuit board. A third connector is matable to the first and second connectors and is positioned therebetween. The third connector includes a wafer configured to provide a predetermined spacing between the first and second circuit boards.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: September 16, 2008
    Assignee: Tyco Electronics Corporation
    Inventors: Lynn Robert Sipe, James Lee Fedder
  • Patent number: 7425158
    Abstract: A socket body and a header body are respectively reinforced by inserted reinforcing members, so that a protruding table in a plug groove of the socket body is eliminated and a width dimension thereof is reduced. The socket body is formed in a flat rectangular parallelepiped shape by resin molding, and a pair of socket reinforcing members is inserted into both end portions in longitudinal direction, each having a pair of fixed portions respectively protruding outward from lower ends of side walls of the socket body and a coupling portion for coupling between a pair of the fixed portions. A plug groove of substantially rectangular shape is formed at center portion of the socket body, and plural pairs of socket contacts are respectively arranged in two lines on both side walls in longitudinal direction along the plug groove.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: September 16, 2008
    Assignee: Matsushita Electric Works, Ltd.
    Inventor: Kenji Ookura
  • Publication number: 20080220632
    Abstract: The present invention provides a large dimension electrical connector configured by modular unit sections. Specially, each modular unit has a plurality of contacts received therein and includes a plurality of edges that each has a plurality of flanges. The flange of one particular section of the modular unit interconnects with a flange of an adjacent one of the modular unit to form the large dimension electrical connector. In addition, the flanges of two adjacent modular unit connectors are disposed to overlap in a vertical direction and thickness of the two flanges after mated together is equal to the thickness of the large dimension electrical connector.
    Type: Application
    Filed: March 5, 2008
    Publication date: September 11, 2008
    Inventor: Chun-Yi Chang
  • Publication number: 20080220631
    Abstract: The present invention relates to a socket for electronic component which contains an electronic component. The socket for electronic component comprises a platy base, containers formed to be concaved on a front face of the base and to contain LED packages therein, connectors provided on side faces and connected to other members, supports each of which supports and fixes the LED package contained in the container and electrically connected to the LED package, heat conductors each of which is provided continuously from a bottom face side of the container to a rear face of the base and contacts the LED package contained in the container so as to conduct heat generated by the LED package, and terminals electrically connected to the other members coupled with the connectors and the supports. The heat generated by the LED package is conducted to the rear face of the base through the heat conductors, and effectively radiated to an installation member on which the socket for electronic component is mounted.
    Type: Application
    Filed: May 25, 2006
    Publication date: September 11, 2008
    Applicant: Matsushita Electric Works, Ltd.
    Inventors: Masaaki Isoda, Kazuhiro Takamura, Tokushi Yamauchi, Katsuyuki Kiyozumi, Nobumichi Nishihama
  • Publication number: 20080220630
    Abstract: A connector assembly for connecting first and second circuit boards in a substantially parallel relationship includes a first connector matable to the first circuit board and a second connector matable to the second circuit board. A third connector is matable to the first and second connectors and is positioned therebetween. The third connector includes a wafer configured to provide a predetermined spacing between the first and second circuit boards.
    Type: Application
    Filed: March 7, 2007
    Publication date: September 11, 2008
    Inventors: Lynn Robert Sipe, James Lee Fedder
  • Publication number: 20080207011
    Abstract: The invention relates to a board-to board connector (9) comprising at least a first contact module (9a) with a first set of board contacts (20) for connecting to a first board (8), and a second contact module (9B) with a second set of board contacts (21). The connector further comprises an interconnection element (22) for interconnecting at least one of said first set of contacts with at least one of said second set of contacts. The interconnection element enables rerouting and compensation of skew.
    Type: Application
    Filed: February 18, 2005
    Publication date: August 28, 2008
    Applicant: FCI
    Inventors: Thierry Clementine Louis Maria Goosens, Bernardus Lambertus Franciscus Paagman, Eugene Maria Brinkhof, Ludwig Gerardus Martinus Antonius Lange
  • Publication number: 20080203547
    Abstract: An insert molded leadframe assembly (IMLA) for an electrical connector is disclosed. The IMLA may include an array of electrically conductive contacts, a dielectric leadframe housing overmolded onto the array of contacts, and a mass disposed within the leadframe housing. The additional mass may shift the IMLA's center of gravity, thereby providing a counterbalance to a non-proportional ball-grid array connector.
    Type: Application
    Filed: February 26, 2007
    Publication date: August 28, 2008
    Inventor: Steven E. Minich
  • Publication number: 20080207014
    Abstract: A board-to-board electrical connector assembly includes a first connector having a dielectric housing for mounting on a first printed circuit board for receiving a plug portion of a second connector mounted on a second printed circuit board. The connectors are mateable in a mating direction. A plurality of first conductive terminals are mounted on the housing of the first connector along the receptacle for engaging a plurality of second conductive terminals mounted along the plug portion of the second connector. A first retention member is mounted on one of the connectors and is engageable with a second retention member on the other connector in the mating direction. The first retention member includes a flexible engaging portion which extends in a direction generally perpendicular to the mating direction. The second retention member includes a rigid engaging portion for engaging and flexing the flexible engaging portion to hold the connectors in mated condition.
    Type: Application
    Filed: January 27, 2006
    Publication date: August 28, 2008
    Applicant: MOLEX INCORPORATED
    Inventors: Ryotaro Takeuchi, Tomonari Kaneko
  • Publication number: 20080200044
    Abstract: A method for manufacturing an anti-pressure linear circuit board includes the following steps. First, a first circuit board is provided. The first circuit board is cut to form cut grooves. The cut grooves define a second circuit board, which is electrically connected with the first circuit board. A precisely calibrated pressure sensor and an OP amplifier are disposed on the second circuit board. Meanwhile, the second circuit board is electrically connected with the first circuit board that includes is learning point. Thus, the manufacturing process of the anti-pressure linear circuit board is completed. This anti-pressure linear circuit board can reduce the effect of pressure on the reading precision of the pressure sensor and the OP amplifier.
    Type: Application
    Filed: April 21, 2008
    Publication date: August 21, 2008
    Inventor: Chin-Jung CHEN
  • Patent number: 7413444
    Abstract: A connector assembly has a plug connector and a socket connector. The plug connector has a first insulative housing and at least one row of first terminals. The first terminals are mounted on the first insulative housing and each terminal has an inside contacting portion and an interference portion. The socket connector has a second insulative housing and at least one row of second terminals corresponding respectively to the at least one row of the first terminals. The second terminals are selectively engaged and respectively with the first terminals and each second terminal has an inner contacting portion and a shoulder portion. The inner contacting portion selectively contacts the inside contacting portion of one first terminal. The shoulder portion is selectively engaged with the interference portion of one first terminal and prevents the first terminal from disengaging inadvertently from the second terminal.
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: August 19, 2008
    Assignee: Advance Connectek Inc.
    Inventor: Mei-Hui Wang
  • Patent number: 7410364
    Abstract: A connector comprising a header connector 20 and a socket connector 25. The connector 25 includes a fixed section 272 that is continuously formed at the tip of one end 2711 of a contact section 271 so that a part 2721 of the section 272 is arranged in parallel with the one end. A housing 26 of the connector 25 sandwiches and retains both sides of the part 2721 between a pair of facing retention grooves, and also sandwiches and receives both sides of the one end 2711 between a pair of facing guiding grooves so that the one end 2711 can move only along facing surfaces including the above each groove.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: August 12, 2008
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Masanori Kishi, Kenji Okura
  • Publication number: 20080188098
    Abstract: Microwave or millimeter wave module packaging having a module with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.
    Type: Application
    Filed: February 2, 2007
    Publication date: August 7, 2008
    Applicant: Harris Stratex Networks, Inc.
    Inventors: Ronald D. Boesch, Edwin John Nealis, Costel Nicolae
  • Publication number: 20080176421
    Abstract: A connecting part for ensuring a secure connection includes first connecting terminals that are arranged on one face of a supporting member and second connecting terminals that are arranged on the back face of the supporting member. The supporting member may have an elastic body. The connecting terminals are interconnected by conductive films which are formed on the face of the supporting member. Connecting parts are arranged between circuit boards on which electronic parts are mounted, and the circuit boards are mutually fixed in the state in which the connecting parts are compressed. The first and second connecting terminals are pushed against lands on the circuit boards by restoring force of the connecting parts, and then the circuit boards are electrically interconnected.
    Type: Application
    Filed: July 30, 2007
    Publication date: July 24, 2008
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Kazuaki Suzuki, Masaki Taniguchi
  • Patent number: 7402054
    Abstract: The board-to-board connector comprises an insulating housing and a plurality of terminals. The terminals are mounted in corresponding terminal-receiving passages which are arranged in the insulating housing. The insulating housing has a base plate. A pair of first sidewalls protrudes upwards from the opposite longwise sides of the base plate. A pair of second sidewalls protrudes upwards from another opposite sides of the base plate. The central island portion keeps a certain distance to the first sidewalls and the second sidewalls, thus a periphery-receiving place is formed between the central island portion and sidewalls. Fixing parts are formed on the inside wall of the first sidewall exposed in the periphery-receiving place.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: July 22, 2008
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Yung-Chi Peng, Hsin-Ta Chen
  • Patent number: 7402055
    Abstract: A circuit board type connector includes a connector socket and a connector plug. In the connector plug, a circuit board replaces wires or cables to transmit signals. The connector is provided with a clipping device to clip the circuit board and securely connect the connector plug with the connector socket. The clipping device includes a pair of clips, a supporting plate and a circuit board cover to securely hold the circuit board. The clip engages with a clip connection slot of the connector socket to securely connect the connector plug with the connector socket.
    Type: Grant
    Filed: March 2, 2007
    Date of Patent: July 22, 2008
    Assignee: Chief Land Electronics Co., Ltd.
    Inventors: Ying-Chung Chen, Chih-Chien Hung
  • Publication number: 20080171454
    Abstract: An electrical connector (1) has a base portion (22), a number of terminals (3) mounted to the base portion, a first circuit board (42) assembled to the base portion, a substrate paralleled with the base portion and a number of pins (212) mounted on the substrate and a second circuit board (41) electrically engaging with the number of pins. The first and the second circuit boards together defines a receiving space (6). The electrical connector further has a number of electrical elements (5) received in the receiving space and together electrically connecting with the first circuit board and the second circuit board.
    Type: Application
    Filed: January 17, 2008
    Publication date: July 17, 2008
    Inventors: Zhi-Jian Liu, Zheng-Hua Xu, Li-Chun Wu
  • Patent number: 7399186
    Abstract: A multi-card connector assembly includes a mainboard on which a mainboard connector is disposed, a multi-card connector, and a circuit board, on which traces and a connection interface are formed. The multi-card connector includes a common seat formed with a plurality of slots into which different electrical cards may be inserted, and terminals disposed on the common seat. Each terminal has a pin extending out of a bottom surface of the common seat. Each trace has a first terminal and a second terminal, which are disposed on a plane of the circuit board. The first terminals of the traces are arranged in correspondence with the pins of the terminals of the multi-card connector such that the pins of the terminals are respectively soldered to the first terminals of the traces. The connection interface is electrically connected to the second terminals of the traces and is flexibly and electrically connected to the mainboard connector.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: July 15, 2008
    Inventor: Chou Hsuan Tsai
  • Patent number: 7393214
    Abstract: A socket connector for connecting a post or ball wherein the female element grips the post with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by the female element in response to the withdrawal force. The female element comprises a tube of resilient conductive material that has been sliced or helically partitioned into opposing helical prongs so as to allow the prongs of the connector to spirally open around the post or ball-like bump and mechanically grip the post or bump as the post or bump is inserted along the longitudinal axis of the tube. The tubular element may be made by forming helical prongs in the end of a tube in helical cuts from about a mid section to one end of the tube.
    Type: Grant
    Filed: February 1, 2007
    Date of Patent: July 1, 2008
    Assignee: Centipede Systems, Inc.
    Inventor: Thomas H. DiStefano
  • Publication number: 20080153324
    Abstract: A circuit board structure with an embedded semiconductor element and a fabrication method thereof are disclosed according to the present invention. The circuit board structure comprises: a carrier board having a first surface, a second surface, and at least one through hole penetrating the carrier board from the first surface to the second surface; a first semiconductor element received in the through hole and having an active surface and an inactive surface, the active surface having a plurality of electrode pads; at least one second semiconductor element mounted on the carrier board; a first encapsulation layer formed on the first surface of the carrier board to block one end of the through hole; and a second encapsulation layer formed on the second surface of the carrier board.
    Type: Application
    Filed: October 5, 2007
    Publication date: June 26, 2008
    Applicant: PHOENIX PRECISION TECHNOLOGY CORPORATION
    Inventor: Shih-Ping HSU
  • Patent number: 7390196
    Abstract: A connector includes a plug including a plug body made of an insulating material and a plug contact; a receptacle including a receptacle body made of an insulating material and a receptacle contact, wherein the receptacle contact contacts the plug contact to be electrically connected with the plug contact when the plug is inserted into the receptacle; a plug-contact contacting portion formed on the receptacle contact for contacting the plug contact when the plug is inserted into the receptacle; an inner-wall-contacting portion extending from an end of the plug-contact contacting portion toward an inner wall of the receptacle body; and a contacting portion formed on the plug contact extending in a plug insertion/extraction direction. The first contacting portion slides on the plug-contact contacting portion and the inner-wall-contacting portion contacts the inner wall of the receptacle body when the plug is inserted in/extracted from the receptacle.
    Type: Grant
    Filed: May 15, 2007
    Date of Patent: June 24, 2008
    Assignee: Kyocera Elco Corporation
    Inventor: Tomoya Sasaki
  • Publication number: 20080139016
    Abstract: A fault detection apparatus for surface mount packages is provided. The apparatus can include a retainer for releasably securing a circuit board such as a printed circuit board having an electrical component mounted thereon via a ball grid array surface mount package. When mounted within the apparatus, a test signal is applied to the electrical component. The apparatus includes a mechanical actuator, such as a solenoid, for applying a reciprocating force to the circuit board. The reciprocating force can disturb a defect in the ball grid array manifesting as a mechanically unreliable connection at one of the balls where an electrically intermittent connection is occurring. By disturbing the mechanically unreliable connection, the electrically intermittent connection can be caused to fail altogether and thereby reveal the defect as a test signal is carried through the printed circuit board.
    Type: Application
    Filed: February 19, 2008
    Publication date: June 12, 2008
    Applicant: RESEARCH IN MOTION LIMITED
    Inventor: John SHEERAN
  • Patent number: 7384274
    Abstract: A board to board connector includes a plug and a receptacle. The two ends of the receptacle sink to form a U-shape groove. The groove penetrates downward through the first housing of the receptacle and can accept a first locking piece. The first locking piece has a U-shaped body received in the groove, which extends to form welding portions, and the welding portions project out of the first housing. An inserting groove is opened in the end of the plug. The inserting groove can accept a second locking piece. A straight arm of the second locking piece projects out of the second housing of the plug. The board to board connector can be welded in PCBs by the first and second locking pieces.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: June 10, 2008
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Chung-Yu Chen, Mei-Chuan Yang, Chung-Hsin Huang
  • Publication number: 20080119065
    Abstract: A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements electrically connected to the conductive patterns; and leads connected to pads formed of the conductive patterns. Furthermore, a control element is fixed to an upper surface of a land part formed of a part of a lead, and a back surface of the land part is spaced apart from an upper surface of the circuit board.
    Type: Application
    Filed: October 30, 2007
    Publication date: May 22, 2008
    Applicants: SANYO ELECTRIC CO., LTD., SANYO SEMICONDUCTOR CO., LTD.
    Inventors: Sadamichi TAKAKUSAKI, Noriaki SAKAMOTO, Katsuyoshi MINO
  • Patent number: 7374432
    Abstract: A connector includes contacts and an insulator. Each contact includes a contact portion, a first fixed portion, an elastic portion substantially in the form of a crank, a second fixed portion and a connection portion. The insulator includes a fixation block to which the second fixed portions are fixed, and a movable housing to which the first fixed portions are fixed. The movable housing is fixed only to the contacts and held by the elastic portions in a floating condition away from the bottom surface of the fixation block. The fixation block has a wall for preventing short circuit when the connector is being mounted on a substrate. A floating amount of more than 0.7 mm can be achieved with a simple construction without causing short circuit with a substrate when the connector is being fitted with a mating connector and without causing any failed connection.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: May 20, 2008
    Assignee: DDK Ltd.
    Inventors: Yasuyuki Koguchi, Isao Kojima
  • Patent number: 7371079
    Abstract: An electrical card connector includes an insulating housing having a plurality of passageways and a plurality of contacts received in the insulating housing. Said insulating housing has a plurality of bars near two sides of each passageway for restricting each said contact vertically. Each bar has a barb on an inner side thereof so that the contact can be retained in the insulating housing firmly to prevent the contact from dropping out from the insulating housing.
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: May 13, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Gong-Qing Yang, Chang-Shin Hsu
  • Patent number: 7371129
    Abstract: An electrical connector includes first and second connector bodies which are arranged to first be positioned together, and then separated once electrical contacts have been inserted in at least one of the first and second connector bodies. During, after, or both during and after the separating of the two connector bodies, portions of the first and second connector bodies are in direct contact with each other. The first connector body has first and second walls extending therefrom. At least one ramp and at least one stop are arranged on at least one of the first wall, the second wall, and the second connector body. At least one protrusion is arranged on at least one of the first wall, the second wall, and the second connector body. The at least one ramp, the at least one stop, and the at least one protrusion are arranged such that, when the at least one ramp and the at least one stop engage the at least one protrusion, a distance between the first and second connector bodies is fixed.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: May 13, 2008
    Assignee: Samtec, Inc.
    Inventor: John A. Mongold
  • Publication number: 20080108230
    Abstract: A method of forming a printed circuit board having a connector including providing a base portion including through holes into which terminals are inserted; inserting terminals projecting from a bottom surface of the base portion into a terminal hole provided on the printed circuit board; fitting a rib projecting from the bottom surface of the base portion with a through hole provided on the printed circuit board; temporarily fixing the bottom surface of the base portion, the surface contacting a surface of the printed circuit board; then fixing with soldering each of the terminals inserted into the terminal hole of the printed circuit board; fitting a connector housing with the base portion, the connector housing having a fitting hole within which the base portion is fitted; and placing the connector housing on the printed circuit board while the terminals are housed within the connector housing.
    Type: Application
    Filed: November 5, 2007
    Publication date: May 8, 2008
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Koji KASAI
  • Patent number: 7367816
    Abstract: An electrical connector assembly includes a socket connector soldered on one circuit board and a plug connector soldered on another circuit board. The socket connector includes an insulating socket base and a plurality of first terminals received in the first terminal-receiving slots of the insulating socket base. Each first terminal successively extends to form a first terminal lead, a first inverted U-shaped portion, a base U-shaped portion and an auxiliary-clamping portion. One leg of the base U-shaped portion includes a first elastic-contact portion. The plug connector includes an insulating plug base and a plurality of second terminals received in the second terminal-receiving slots of the insulating plug base. Each second terminal successively extends to form a second terminal lead and a second inverted U-shaped portion having a second elastic-contact portion.
    Type: Grant
    Filed: May 16, 2007
    Date of Patent: May 6, 2008
    Assignee: Molex Incorporated
    Inventor: Jun-Xian Liu