Abstract: A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.

Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

Abstract: A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.

Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

Abstract: A wearable device includes a skin-attachable device to be attached to a skin of a user to acquire user data, an electronic device that supplies power to the skin-attachable device, and a connection device including a first cable connected to the skin-attachable device and a second cable connected to the first cable and detachably attached to the electronic device.

Abstract: A contact element for use between electronic components like computer chips and printed circuit boards, or the connection between an electronic component in a test socket to provide high current, high density, and high frequency connections between the electronic components. The contact element preferably achieves a good connection between electrical components when they are connected and pressed together. The contact element is preferably made of a conductive silicone rubber which has been plated.

Abstract: A printed circuit board assembly has a first printed circuit board with first and second surfaces, a plurality of electrical contact pins which pass through the first printed circuit board, wherein first ends of the contact pins are electrically contacted on the second surface by soldered elevations, and with first electrical contacts which are arranged on the second surface; and a second printed circuit board with first and second surfaces in which a plurality of blind holes are formed for receiving the first ends of the contact pins, wherein the second printed circuit board has second electrical contacts on the second surface, and the second surfaces of the first printed circuit board and the second printed circuit board are joined together such that the contact pins reach into the blind holes such that the first electrical contacts electrically contact the second electrical contacts.

Abstract: An electrical interconnection system for electrical components of a module includes a hub printed circuit board (PCB) having a first electrically conductive track and a second electrically conductive track. Each of the first and second electrically conductive tracks is configured to electrically connect at least two of the electrical components of the module, wherein the at least two of the electrical components of the module are external to the hub PCB. The system also includes multiple electrical terminals, wherein each of the electrical terminals is configured to electrically connect one of the first and second electrically conductive tracks of the hub PCB to one of the at least two electrical components of the module.

Abstract: A float connector for interconnecting printed circuit boards that has a contact assembly including a contacts and a holder and each of the contacts has opposite first and second contact ends for electrically connecting to the boards. A first guide member is slidably and flexibly coupled to the contact assembly and has openings corresponding to the first contact ends. A second guide member is slidably and flexibly coupled to the contact assembly and has openings corresponding to the second contact ends. A biasing member biases the guide members away from one another to an open position. Axial float of the contact assembly is provided between the first and second guide members to compensate for axial misalignment between the first and second printed circuit boards. Radial float of the contact assembly is provided between the first and second guide members to compensate for radial misalignment between the boards.

Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer comprises a plurality of contact elements, each comprising a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements, the guide comprising a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

Abstract: In a control unit having a press-fit structure, a substrate includes: a connected portion to which the press-fit terminal is connected; and a guide portion extending from the substrate around the connected portion. The press-fit terminal includes: a tip end portion; a contact portion adjacent to the tip end portion; and an enlarged portion. The guide portion includes: an opening portion; a guide hole extending from the opening portion to the substrate; a tapered surface formed on an inner side of the opening portion; and a reduced-hole portion formed continuous to the tapered surface. The tip end portion of the press-fit terminal is configured such that the contact portion is positioned with respect to the connected portion while the enlarged portion is guided by the tapered surface and an inner wall of the reduced-hole portion.

Abstract: Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.

Abstract: There is provided a compact printed circuit board. The compact printed circuit board has a flexible rigid printed circuit board connector with a rigid printed circuit board attached at each end of the connector. The printed circuit board can then be folded into a compact, overlying configuration. As such, the compact printed circuit board has a smaller footprint than a standard rectangular printed circuit board, while maintaining the same or having increased micro-electronics and functionality. The compact configuration allows the folded printed circuit board to be integrated with a solenoid used in the control of a valve or sprinkler of an irrigation system.

Abstract: A double-shielded high-speed docking connector is disclosed in this invention. The connector includes a shell, a positioning seat and a row of frame assemblies. The frame assembly includes an insulating body, two columns of signal terminals supported by the insulating body and arranged to be multiple differential pairs, a first shielding member mounted on one side of the insulating body, and a second shielding member mounted on the other side of the insulating body and connected with the first shielding member. The double-shielded high-speed docking connector of the present invention can not only reduce crosstalk between the signal terminals of adjacent differential pairs, but also effectively reduce signal interference of adjacent frame assemblies by disposing two shielding members on each frame assembly.

Abstract: The electronic apparatus includes a first circuit board on which a circuit mounted, a second circuit board arranged close to the circuit on the first circuit board, and a conductive terminal, which is in contact with a ground pattern on the first circuit board, and is arranged at a location between the circuit and the second circuit board so as to extend over the circuit.

Abstract: State information corresponding to a subject on a visible light image, such as temperature information and sound field information, is acquired from state information indicating a subject state not indicated on the visible light image by an information acquisition unit. An effect processing unit performs an effect process on the visible light image on the basis of the state information acquired by the information acquisition unit. In the effect process, an effect component image is superimposed or a subject image is modified based on the type and temperature of the subject and an effect component image is superimposed or a subject image is modified based on the type of a sound source and the volume of a sound.

Abstract: A wafer test system includes a cabinet housing multiple instruments, a test head having multiple pin modules, and cable connecting at least some of the instruments to the pin modules. The cabinet has at least one front door, left and right side panels, a rear door, a ceiling unit, and a bottom unit. Each of the instruments has a front surface, left and right side surfaces, and a rear surface. At least some of the instruments each include at least one first connection terminal. The cabinet further includes a first space defined between the at least one front door and the front surface of each of the instruments, and a second space defined between the rear door and the front surface of each of the instruments. The first space and the second space are separated in the cabinet to separate intake air and exhaust air of the instruments.

Abstract: An electrical connection box includes: a frame main body; a lid assembled to the frame main body; a plate-shaped member sandwiched between the frame main body and the lid; and a bus bar which has a main body arranged on a surface of the plate-shaped member and a terminal portion bent from the main body toward the lid. The bus bar has a protrusion protruding from a side surface of the terminal portion. The lid has a bus bar holding portion into which the terminal portion is inserted. In the bus bar holding portion, a wall portion opposing the side surface of the terminal portion has a holding groove into which the protrusion is press-fitted.

Abstract: An electrical connector includes an insulating block, and multiple differential signal terminals and multiple ground terminals embedded in the insulating block. Multiple first protruding blocks and multiple second protruding blocks protrude and extend forward from a front surface of the insulating block. A slot is formed between the first protruding block and the second protruding block adjacent to each other. Each differential signal terminal is embedded in and extends forward out of a first protruding block. Each of left and right sides of one pair of differential signal terminals has a first side surface. Each ground terminal is provided between two adjacent pairs of the differential signal terminals, and is embedded in and extends forward out of a second protruding block. Each of left and right sides of the ground terminal has a second side surface. A medium between the first side surface and the second side surface is air.

Abstract: A non-arcing electrical coupling including a male connecter including an electrically conductive prong extending from an electrically insulating base member, the prong covered with an arc-mitigating coating formed of a resilient quantum tunneling compound, wherein the arc-mitigating coating exhibits a first electrical resistance when in an uncompressed state and exhibits a second electrical resistance when in a compressed state, the first electrical resistance greater than the second electrical resistance, and a female connecter including an electrically insulating base member defining a receptacle adapted to receive the prong of the male connecter, the receptacle containing an electrically conductive clip comprising a pair of electrically conductive tines adapted to compress at least a portion of the arc-mitigating coating when the prong is inserted into the receptacle.

Abstract: Embodiments of the present disclosure provide an adapter for use in a storage device. The adapter comprises a substrate including a circuit board and adapted to support a PCIe card in the storage device; a first connector fixed on the substrate and electrically connected with the circuit board, the first connector adapted to connect to the storage device; and an adapting part connected with the substrate and electrically connected with the circuit board, the adapting part including a slot that is adapted to connect to a second connector of the PCIe card. In this manner, additional user-defined IC card functions and advanced features are supported while functions of the existing PCIe cards are fully utilized.

Abstract: Provided is a power conversion apparatus that can enhance the strength of the vicinity of an opening through which a connector is exposed, and can prevent water from entering a casing through the opening or reduce such water intrusion. The power conversion apparatus includes a circuit board, a connector mounted on the circuit board, and a lid having an opening to allow the connector to be exposed therethrough and placed over the circuit board and the connector. The lid includes a bead that protrudes from a top plate to enclose an exposed portion of the connector.

Abstract: An electrical connection unit for electrically interconnecting two electronic boards, is disclosed. The connection unit includes at least one electrical pin for electrically interconnecting the two boards, a mechanical link part for mechanically interlinking the two boards, where the electrical connection unit is disposed to enable concomitantly the electrical connection of the two boards via the pin and the mechanical link of the two boards via the link part, and a body which simultaneously carries the electrical pin and the mechanical link part, the body including a support portion for receiving and supporting one of the electronic boards, the support portion and the link part being disposed in such a way that the electronic board is held in place by being wedged between the support portion of the body and a point at which the mechanical link part is secured to the board.

Abstract: An active plug connector (100; 300) adapted to plug into a receptacle includes a shell (11; 21; 31) defining a receiving room (114; 314), a pair of printed circuit boards (12, 13; 22, 23; 32, 33) received in the receiving room and disposed horizontally and spaced apart from each other along a vertical direction, an active element mounted on one of the two printed circuit boards, and a connecting member (14; 24; 34) electrically connected with the two printed circuit boards to share the active element. A method for assembling the active plug connector comprises inserting the connecting member into the receiving room to electrically connect with the conductive pads of the printed circuit boards to share the active element.

Abstract: A light emitting diode lamp may include a socket; a first circuit board; and at least one plug connector electrically connected to the socket; wherein the connector is connected to the circuit board by means of a plug section.

Abstract: Printed circuit boards for communications connectors are provided that include a dielectric substrate formed of a first insulative material having a first dielectric constant. First and second pairs of input terminals and first and second pairs of output terminals are provided on the dielectric substrate. A first differential transmission line electrically connect the first pair of input terminals to the first pair of output terminals, and a second differential transmission line electrically connect the second pair of input terminals to the second pair of output terminals. The dielectric substrate includes an opening that is positioned between the conductive paths of the first differential transmission line, the opening containing a second insulative material having a second dielectric constant.

Abstract: An illumination device may include at least one light source; and at least two printed circuit boards arranged at least partially one above the other; wherein the at least two circuit boards are connected by means of at least one plug-connection element, with the plug-connection element being embodied on at least one side as a press-fit plug.

Abstract: An electric connector includes at least one terminal pin having, at opposite ends thereof, terminals to be inserted into through-holes formed through printed circuit boards spaced away from and facing each other, and an aligner for aligning the terminal pins in a row in such a condition that the terminal pins are movable relative to the aligner, the terminal pin including a movement-limiter which restricts movement of the terminal pin in a direction of an axis thereof.

Abstract: A power supply module adapted to supply power to a peripheral device includes a power supply and an output-structure detachably assembled to the power supply and electrically connected between the power supply and the peripheral device. The height of the output-structure relatively to the bottom portion of the power supply is adjustable and the power supply, output-structure and the peripheral device together form a concave combination-structure. As a result, by using a separated output-structure in the invention, the power supply is able to maneuverably adjust the interconnection position of the peripheral device and the power supply through the second circuit board. Meanwhile, the power supply has a larger usable space therein.

Abstract: A board-to-board connector capable of preventing a short-circuit from occurring between contacts when connectors are fitted to each other. Pin-shaped male-side contact portions protrude from one surface of a male-side insulating film, and male-side terminal portions are provided on the other surface of said male-side insulating film. This makes it possible to prevent a short-circuit from occurring between adjacent female-side contacts by the male-side contacts.

Abstract: A modular battery device may include a substantially planar dielectric substrate having a first major surface and a second major surface spaced from and opposite the first major surface. A plurality of conductive couplers may extend through the substrate from the first major surface to the second major surface at spaced locations. Each conductive coupler may have a first connector element disposed at the first major surface of the substrate electrically connected to an associated second connector element forming an extension extending from the second major surface of the substrate. The device may be selectively engageable with another such device by selectively mating the first connector element of a first conductive coupler on the device in mechanical and electrical engagement with the second connector element of a second conductive coupler on the other such device. Devices having batteries may be stacked to provide parallel and/or series connections.

Abstract: In some embodiments an Integrated Circuit package includes a plurality of system functional pins, at least one system functional pin depopulation zone, and at least one non-system functional pin located in the at least one functional pin depopulation zone. Other embodiments are described and claimed.

Abstract: A mechanical device for electrically connecting a first flexible assembly to a second flexible assembly comprises a wafer and a housing. The wafer has an insulator core and a plurality of wafer electrical connectors. The core has a first base side and an opposed second base side. The wafer electrical connectors include a first set of wafer electrical connector contacts exposed on the first base side and a second set of wafer electrical connector contacts exposed on the second base side. The wafer electrical connector contacts are adapted to electrically connect with each of the flexible assembly electrical contacts. The housing retains the wafer, the first flexible assembly terminal, and the second flexible assembly terminal in such a way that each of the first flexible assembly electrical contacts is removably secured and electrically connected to one of the wafer electrical connector contacts.

Abstract: A twist pin is used as an interconnect interface to conduct signals to and from an electronic component. The twist pin includes a bulge which establishes compressive contact force with a sidewall of a via in which the twist pin resides, and the resulting force resists movement of the end of the twist pin away from the electronic component to assure good signal conductivity. The arrangement may be used as a test socket for testing integrated circuit components or permanently docking electronic components.

Abstract: A level bridge for electrically bridging two contacts located on top of each other in a fastening. The level bridge comprises a conductive section for electrically bridging two contacts located on top of each other and an elastic section allowing introduction and secure fastening. The conductive section and the elastic section of the level bridge are embodied in one piece. Additionally, a method for producing level bridges which comprises the step of punching a metallic material so that a metallic one-piece blank of a level bridge develops is also provided.

Abstract: A connector comprises a generally cylindrical dielectric body with a central bore in the dielectric body. The dielectric body has a first end and second end opposite the first end. Conductors extend axially through the cylindrical dielectric body and are spaced apart from each other in a generally circular or elliptical arrangement. Each conductor comprises an embedded portion in the dielectric body and mating portions extending from the first end and the second end.

Abstract: An enclosure for outside plant equipment includes a base unit and first Printed Circuit Board (PCB) carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted. A heat sink is connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side. A cover is attached to the base unit and has an inside surface covering the enclosure. A second PCB has a circuit side and opposing component side on which electronic components are mounted. The second PCB is supported by the inside surface of the cover. A heat sink is connected to the second circuit board at the circuit side and configured to dissipate heat from any electronic components mounted on the second PCB. A PCB finger connector interconnects the first and second PCB's at the component side.

Abstract: A mechanical device for electrically connecting a first flexible assembly to a second flexible assembly comprises a wafer and a housing. The wafer has an insulator core and a plurality of wafer electrical connectors. The core has a first base side and an opposed second base side. The wafer electrical connectors include a first set of wafer electrical connector contacts exposed on the first base side and a second set of wafer electrical connector contacts exposed on the second base side. The wafer electrical connector contacts are adapted to electrically connect with each of the flexible assembly electrical contacts. The housing retains the wafer, the first flexible assembly terminal, and the second flexible assembly terminal in such a way that each of the first flexible assembly electrical contacts is removably secured and electrically connected to one of the wafer electrical connector contacts.

Abstract: A circuit board includes a substrate having an upper surface and a lower surface. The circuit board has signal vias extending at least partially through the substrate along signal via axes being configured to receive signal terminals and ground vias extending at least partially through the substrate along ground via axes being configured to receive ground terminals. The ground vias are arranged in a predetermined pattern around the signal vias to create a ground ring surrounding the corresponding signal via, wherein the ground vias are at least partially filled with a conductive material to create a ground column. Each ground column extends from a column top to a column bottom. A first subset of the ground columns extending to a first depth and a second subset of the ground columns extending to a second depth greater than the first depth.

Abstract: A structure for stacking Printed Board Assemblies (PBAs) in an electronic device is provided. The structure for stacking PBAs in an electronic device includes a clip mounted on a main Printed Circuit Board (PCB), a sub-PCB including a ground portion, a sub-PBA including the sub-PCB, and a clip header mounted on a lower part of the sub-PBA, wherein the clip header is inserted into the clip. Therefore, electronic components mounted on a main PCB can be shielded from outer electromagnetic waves while reducing material costs without using a shield can, and a sub-PBA can be stacked on the main PBA.

Abstract: An enclosure for outside plant equipment includes a base unit and first Printed Circuit Board (PCB) carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted. A heat sink is connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side. A cover is attached to the base unit and has an inside surface covering the enclosure. A second PCB has a circuit side and opposing component side on which electronic components are mounted. The second PCB is supported by the inside surface of the cover. A heat sink is connected to the second circuit board at the circuit side and configured to dissipate heat from any electronic components mounted on the second PCB. A PCB finger connector interconnects the first and second PCB's at the component side.

Abstract: An electronic memory key is described. The key includes internal memory and contact points on an exemplary flat and annular surface with a mechanical fastening mechanism to securely affix the key to a device interface. Corresponding contacts are provided on the device to electronically communicate the key to device.

Abstract: A press-fit connecting element for being pressed into a first contact opening in a first connection element and into a second contact opening in a second connection element is provided. The press-fit connecting element includes an elongated base body configured to be guided through the second contact opening in the second connection element to the first contact opening in the first connection element. The press-fit connecting element further includes a first press-fit zone configured to contact-connect the first contact opening in a force-fitting manner and a second press-fit zone which is at a distance from the first press-fit zone in a longitudinal direction and configured to contact-connect the second contact opening in a force-fitting manner.

Abstract: An electronic control unit includes a sensor circuit board 30 which is mounted with sensors 33, 34 for detecting a predetermined physical quantity; a control circuit board 20 which controls an operation of an electric component on the basis of the physical quantity detected by the sensors 33, 34; and a housing 40 which accommodates the sensor circuit board 30 and the control circuit board 20, wherein at least one of the sensor circuit board 30 and the control circuit board 20 is mounted to a circuit board support stepped portion 47 formed in an inner surface of the housing 40 so that the sensor circuit board 30 and the control circuit board 20 are arranged in a layered state.

Abstract: The invention relates to a component arrangement. In at least one embodiment, the component arrangement comprises: an electronics module; a heat sink contacted by the electronics module; a printed circuit board, and; a fastening means for fastening the electronics module to the printed circuit board and to the heat sink. The electronics module has at least one elastic connecting limb for the solder-free contacting of the electronics module with the printed circuit board and has a location for the fastening means. The electronics module additionally comprises a decoupling means for decoupling the force of pressure between the connecting limb and the printed circuit board from the contact force between the heat sink and the electronics module. In at least one embodiment of the invention an electronics module is provided that can be used in the aforementioned component arrangement.

Abstract: A system for locating corresponding ends of a communications or data patch cable used to conduct a signal between computing or telecommunications devices. The invention provides a physical indication of the location of an opposite end of a given patch cable when a switching means on the first end of the same cable is activated. The invention utilizes an existing pair of wires in category-type cables to send a DC voltage when activated to illuminate a light emitting diode in the opposite end of a patch cable thereby providing an immediate indication of the location of the termination of the opposite end of a patch cable making it possible to visually identify a cable without removing the cable from service or from connection of the modular plugs on either end of the cable.

Abstract: A method of manufacturing a printed circuit board is disclosed. A method of manufacturing a printed circuit board, which includes: forming at least one interlayer connector on a first carrier, stacking at least one insulation layer on the first carrier such that the interlayer connector is exposed, removing the first carrier, and forming at least one circuit pattern on the insulation layer such that the circuit pattern is electrically coupled with the interlayer connector, can be used to increase the density of circuit patterns, as the method can provide electrical connection between circuit patterns and vias without using lands.

Abstract: An electrical connector assembly includes a circuit board having vias extending at least partially through the circuit board along via axes. The circuit board has traces and mounting pads that are electrically connected to corresponding traces, and that are exposed within corresponding vias. The vias have a staged diameter along the via axis with a constricted region proximate to the mounting. An electrical connector is mounted on the circuit board. The electrical connector includes a housing and signal terminals held by the housing. The signal terminals include mounting contacts being received in respective vias of the circuit board that engage corresponding mounting pads in the constricted region.

Abstract: This specification discloses a converter whose first electrical connector of a first standard is fixed on a first circuit board and whose second electrical connector of a second standard is connected to a second circuit board. The second circuit board is thus electrically connected to the first circuit board. Therefore, the converter expands the second connector to the first circuit board. This achieves the goal of connecting circuit boards of different connecting designs.

Abstract: A connector capable of being mounted onto a substrate is disclosed. Such a connector may include a housing, and a contact mounted within the housing. The contact may include a body, terminal pins extending from a first edge of the body, contact beams extending from a second edge of the body, and a flared portion. The edges of a first contact beam and a second contact beam of the contact beams may be positioned proximate respective adjacent surfaces of the housing. The flared portion may also be positioned proximate a respective adjacent surface of the housing. The relationship between the first contact beam and its respective adjacent surface, the relationship between the second contact beam and its respective adjacent surface, and the relationship between the flared portion and its respective surface may inhibit bowing of the body of the contact when the connector is mounted on the substrate.