Abstract: A board mount connector (10) includes a connector body configured to be mated with a counterpart connector (30) and a plurality of conductive terminals (20a, 20h) projecting from the connector body (11). Each of the terminals includes a contact portion (21a, 21b) configured to contact a corresponding terminal (33) of the counterpart connector (30), a leg portion (24a, 24b) configured to be inserted into a corresponding connection hole (41a, 41b) and soldered thereto, and a bent portion (23a, 23b) which connects the arm portion (21a, 21b) and the leg portion (24a, 24b). The bent portion (23a) of each longer terminal (20a) forms an arc with a center angle of 90 degrees and the bent portion (23b) of each shorter terminal (20b) forms an arc with a center angle greater than 90 degrees. The contact portion (21a, 21b) of the terminals extends parallel to the circuit board (41), and the leg portion (24a, 24b) of the terminals extends perpendicular to the circuit board (41).

Abstract: Disclosed herewith a socket connector configured with an insulative housing defining a mating interface surrounded with peripheral walls and a mounting surface. A plurality of passageways is defined between the mating interface and the mounting surface and having an opening at the mounting surface. The insulative housing includes an encampment associated with each of the passageway at the mounting surface, and includes an extension crossing over an inner wall of the passageway to substantially narrow the opening of the opening. The socket connector furthers includes a plurality of contact terminals each received in the passageway and further includes a curvilinear solder portion extending beyond the mounting surface. And the socket connector further is incorporated with a plurality of solder balls each disposed between the encampment and the curvilinear solder portion.

Abstract: A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.

Abstract: The present disclosure is directed to conductive connector attachments for use in electrically connecting printed circuit boards to absorbent products such as diapers, training pants, incontinence products, feminine hygiene products, and the like. Specifically, various configurations and methods of securely attaching conventional conductive hook and loop attachments to printed circuit boards are disclosed.

Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.

Abstract: Provided is a connector capable of facilitating a work of connecting first and second connection targets. A first receiving part to be coupled to a first plug connector and a second receiving part to be coupled to a second plug connector are formed at the housing of a relay connector which electrically connects the first and second plug connectors to be mounted on a chassis. The housing is provided with a contact which establishes conduction between the first plug connector coupled to the first receiving part and the second plug connector coupled to the second receiving part. The housing comprises a housing body having the first and second receiving parts, and a hook provided at the housing body to engage with a hole provided in the chassis.

Abstract: An electrical connector (1), which is adapted for mounting to a circuit board (5), has a mounting foot (21) with a top mounting surface (211), an elongated base portion (23) protruded outwardly from said top mounting surface (211) and fitting members (4) set on the top mounting surface (211). In assembly, the top mounting surface (211) is face to the back of the circuit board (5), and the whole mounting foot (21) is left below the circuit board (5), which can minimize the mounting profile of the connector (1) effectively.

Abstract: An electrical connector (100) is soldered to a circuit board (4) via a number of solder members (3) and includes an insulative housing defining a number of passageways (12), and a number of contact terminals (2) inserted in the passageways respectively. Each contact terminal has a body portion (21) secured in the passageway, and a tail portion (23) extending from the body portion and inserted through the solder member then into the circuit board. The tail portion of the contact terminal has an interfering portion (231) interlocked with the solder member and a blocking portion (232) extending from the interfering portion and restricting the solder member above the blocking portion.

Abstract: Camera module embodiments and methods of manufacturing camera modules are provided. A camera module can include a housing and a printed circuit board having an image sensor. The housing can be mounted to the printed circuit board using a surface mount technology. In a method of manufacturing the camera module, the image sensor and the housing can be mounted to the printed circuit board, and a lens and a filter can be coupled to an upper portion of the housing.

Abstract: A solderable electric contact terminal includes; an insulating foam rubber having a predetermined volume; an insulating non-foam rubber coating layer adhered to the insulating foam rubber such that the insulating non-foam rubber encloses the insulating foam rubber; and a heat resistant polymer film having inner surface adhered to the insulating non-foam rubber coating layer such that the heat resistant polymer film encloses the insulating non-foam rubber coating layer, and outer surface on which a metal layer is integrally formed.

Abstract: The present invention relates to an electrical connector used for connecting a mating device with multiple pins and comprising a body and at least one terminal. The terminals are secured in the body and have at least one coarse surface and at least one glossy surface with a protection layer of noble metal. The coarse surfaces and the glossy surfaces locate at a position for making the pins scrape with the coarse surfaces and finally contact the coarse surfaces and the glossy surfaces simultaneously.

Abstract: The electrical connecting apparatus according to the present invention is used for providing electrical contacts for an electronic device and comprises a housing and a plurality of electrical contacts. At least one passageway is set on the housing. At least two ribs are set in the passageways. Within the passageways, at least one holding space is formed between two adjacent ribs. The electrical contacts are set in the passageways, respectively. In addition, portions of at least two electrical contacts are accommodated in the same holding space. The electrical contact has a base portion located underneath the rib. A pair of contact portions is formed by extending upwards from the base portion along corresponding two sides of the rib. Besides, at least one contact portion pass through the holding space. When the paired contact portions of each said electrical contact make contact with the electronic device, the contact portions move away from said rib.

Abstract: An electrical connection device is used for electrically connecting an electronic element having solder balls, and includes an insulating body and a plurality of pins. The insulating body has a plurality of receiving slots formed by a plurality of first rib boards and second rib boards respectively and crossly disposed along the X and Y-coordinate direction. Each pin has a base portion extending upwardly to form a first and a second flexible arm. The end of the first and the second flexible arm respectively form a first contact portion and a second contact portion. At least one of the receiving slots receives the first flexible arm of the pin and the second flexible arm of another pin. The first and the second contact portion located in the same receiving slot are disposed staggered in an upper and a lower location along the X-coordinate direction and not connected to each other.

Abstract: In a connector, a fixed member is configured to be fixed to a substrate. An insertion member is arranged separate from the fixed member and configured to be insertable into an insertion part of a mating connector. Pairs of contacts are arranged on side surfaces of the insertion part of the mating connector to connect the fixed member and the insertion member to each other. Each contact includes a first fixed part fixed to the fixed member, a second fixed part fixed to the insertion member, and a contact part to contact with a contact piece of the mating connector. A cross-sectional shape of a portion of each contact between the first fixed part and the second fixed part is such that the insertion member is displaceable relative to the fixed member in an arranging direction of the pair of contacts and a direction perpendicular to the arranging direction.

Abstract: An electrical connector assembly includes an upper insulative base and a lower insulative base discrete from each other, and assembled therewith along an up-to-down direction instead of a left-to-right direction. Thus, a small assembly space will be achieved compared to the prior art.

Abstract: An electrical connector adapted to be mounted to a PCB for electrically connecting with a butting component includes an insulating housing and a plurality of terminals received in the insulating housing. The insulating housing defines a soldering surface and a mating surface contiguous to the soldering surface. The mating surface has a receiving recess for receiving the butting component. The receiving recess has a bottom protruding outwards to form a receiving plate substantially perpendicular to the soldering surface, with a plurality of terminal grooves extending substantially perpendicular to the mating surface formed thereon. Each of the terminals has a contacting portion received in the terminal groove and a soldering portion substantially perpendicular to the contacting portion. The soldering portions are arranged in plural rows and extend outside the soldering surface for being soldered on the PCB.

Abstract: A connector assembly (100) adapted for electrically connecting with a complementary connector along a mating direction includes an insulative housing (2) defining a mating port, a number of contacts (3) disposed in the housing, a circuit board (4) located on a rear side of the housing and including a front surface facing to the rear side of the housing and an opposite rear surface, and a number of solder tails (8) located behind the rear surface of the circuit board and electrically connecting the contacts with the printed circuit board.

Abstract: An electric connector is disclosed to include an electrically insulative housing, which has solder ball receiving portions, terminals respectively mounted in the housing corresponding to the solder ball receiving portions, each terminal having an endpiece, which defines with the sidewall of each of the solder ball receiving portions a respective receiving chamber, and solder balls respectively movably accommodated in the receiving chambers defined by the endpieces of the terminals and the sidewalls of the solder ball receiving portions.

Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

Abstract: An electrical connector element for connection of a conductor to a circuit board, having a housing, at least one clamp connector for the conductor and at least two connector pins for preferably soldered connection to the circuit board, is disclosed. The housing has at least one separating element made from insulating material, projecting from the lower side, facing away from the circuit board in the assembled position, at least partly arranged between the connector pins and extending through the circuit board in the assembled position, in order to permit the connector pins of the electrical connector element to be arranged closer together.

Abstract: A surface mount electrical connector for mounting to a substrate comprising a housing and a contact carried by the housing, the contact comprising a retention section held by the housing and a tine configured for mounting to a surface of the substrate wherein the tine extends from the retention section and wherein the tine lies inside an outer contour line of the housing is disclosed. A method of connecting a surface mount electrical connector to a substrate comprising the steps of providing a housing carrying a contact, the contact having a tine within a projected footprint of the housing on the substrate, attaching the housing to the substrate, inserting a jig into an opening of the housing, and bending the tine toward the substrate is disclosed.

Abstract: An electrical connector (100) for connecting a sheet-like connection member includes an insulating housing (1) provided with a plurality of conductive terminals (2, 3) and a pair of retaining members. The housing defines a pair of slots (15) each with an upper groove (153) and a lower groove (154) at a front portion thereof. The retaining members (4) are embedded in the slots (15), and each comprises an upper arm (441) retained in the upper groove (153), a lower arm (442) received in the lower groove (154) and a soldering portion (42) extending from a bottom edge thereof. The lower groove (154) runs though the housing in an insertion direction of the retaining members (4).

Abstract: A holder with a device for holding a flexible circuit board is provided. The holder comprises at least one further device for holding at least one component such that the component may be electrically connected to or disconnected from the circuit board.

Abstract: One aspect of this disclosure provides an electrical connector pin for a printed wiring board. This embodiment includes an unmachined, collar having an acircular configuration and including a side wall. This embodiment further includes a machined first cylindrical connector shaft integrally formed with the collar and extending from collar along the longitudinal axis, and a machined second cylindrical connector shaft integrally formed with the collar and extending from the collar and along the longitudinal axis in a direction opposite to that of the first cylindrical connector shaft.

Abstract: A surface mounting structure applied to a BGA includes a substrate, a first soldering pad, a first lead, a second lead and a passivation layer. The substrate has a top surface for the first soldering pad to be disposed thereon. The first lead has a first end connected to the first soldering pad and a second end. The second lead has a third end connected to the first soldering pad and a fourth end connected to the second end of the first lead. A well is defined among the first lead, the second lead, and the first soldering pad. The passivation layer covers the top surface of the substrate, and has a first opening corresponding to the top of the first soldering pad to expose the first soldering pad and the well. Chip failure resulting from the warp occurring at four corners in the surface mounting procedure is prevented.

Abstract: An electrical connector has an insulative housing, terminals and two fastening assemblies. Each fastening assembly has a latching member and a bracket. The latching member is mounted movably on the insulative housing and has a hooking section to hook on a memory module. The bracket is mounted pivotally on the latching member and has a soldering section soldered on a PCB. Because the bracket is pivotally adjustable on the latching member, the electrical connector may be mounted easily on different PCBs with different tolerances.

Abstract: A connector assembly adapted for electrically connecting with a mating plug connector includes a socket connector and a PCB. The socket connector has an insulating housing defining a front surface, a rear surface and a lateral surface. The front surface is formed with an inserting recess for receiving the mating plug connector. The lateral surface has a receiving groove communicating with the inserting recess. The rear surface has a receiving slot communicating with the inserting recess. A first terminal has a base plate received in the receiving groove and a first soldering plate exposing outside the insulating housing. A second terminal includes a fixing plate fixed in the receiving slot and a second soldering plate exposing outside the insulating housing. The PCB has two soldering portions. Two conductors are provided for connecting the first soldering plate and the second soldering plate with the soldering portions, respectively.

Abstract: A connector assembly is configured to be mounted to a substrate that has an opening extending between a mounting side and an opposite side. The connector assembly includes a housing and one or more contacts. The housing has a front end and a back end, with an interior chamber extending inward from a mating interface. The front end of the housing is configured to be partially inserted through the opening in the substrate until a housing mounting surface engages the mounting side of the substrate. The contact extends between a mating end and a contact mounting surface. The contact mounting surface is configured to be mounted to the mounting side of the substrate. The housing and contact mounting surfaces are substantially coplanar in a mourning plane, and a distance between the mating interface and the mounting plane is at least as great as a thickness of the substrate.

Abstract: A pin connector includes an insulating housing defining pin- retaining- holes and connector pins retained in the retaining holes. Each of the connector pin has a header portion with a soldering face thereof and a shank portion extending from the header portion. The header portion defines notches opening through the soldering face.

Abstract: An electrical connector (200) adapted for electrically connecting an electronic package with a circuit substrate, comprises an insulative housing (3), a plurality of terminals (4) and a reinforcement member (5). The housing (3) comprising an upper surface (32) for supporting the electronic package and an opposite bottom surface (31) for being mounted to the circuit substrate. The terminals (4) comprising a soldering portion (42) extending beyond the bottom surface (31) of the insulative housing (3) adapted for electrically connecting the circuit substrate, a spring arm (41) with a mating portion (411) extending beyond the upper surface (32) of the insulative housing (3) adapted for electrically connecting the electronic package at a free end thereof. The reinforcement member (5) is made of material different from that of the insulative housing (3) and attached to the bottom surface (31) of the insulative housing (3).

Abstract: A board connector (1) has a housing (10) and terminal fittings (20) penetrate through the back wall (11) of the housing (10). A board connecting portion (21) of each terminal fitting (20) penetrates through the back wall (11) and is solder-connected to a board (2). The housing (10) has a heat transfer inhibiting portion for inhibiting heat transfer to the back wall (11). The heat transfer inhibiting portion has a through-hole (13) or heat-insulating grooves (17) in the back wall (11). As a result, heat transfer to the back wall (11) is inhibited and deformation of the back wall (11) due to thermal expansion also is inhibited. Consequently, it is possible to prevent the terminal fittings (20) from separating from the board (2) and going into a state of being not solder-connected thereto.

Abstract: A method of attaching a solder element to a contact and the contact assembly formed thereby. The contact assembly is used in a connector. The solder element is either staked or stapled to the contact. The solder element can take a variety of shapes and disclosed herein is a tear-drop shape, a “wolf's head” shape and a circular shape. An over-stress feature is also provided for when the contact assembly is mounted to a printed wiring board.

Abstract: A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.

Abstract: The invention relates to a first component (12, 13, 31, 36a-36c, 50, 62) intended for being connected to a second component (14, 15, 51, 63a-63c). The first component (12, 13, 31, 36a-36c, 50, 62) comprises at least one recess (16, 17, 32, 37a-37c, 52a-52c, 64a-64c) having at least one opening (19, 20, 34, 35, 54a-54c) which will be filled at least in part by the second component (14, 15, 51, 63a-63c) which latter is in a flowing condition during establishment of the connection, at least in the area of the opening (19, 34, 54a-54c). A reduction in cross-section (18, 33, 38a-38c, 53a-53c, 65a-65c) is provided in the recess (16, 17, 32, 37a-37c, 52a-52c, 64a-64c) that will be back-filled by the second component (14, 15, 51, 63a-63c) during establishment of the connection. The reduction in cross-section (18, 33, 38a-38c, 53a-53c, 65a-65c) is provided in the recess (16, 17, 32, 37a-37c, 52a-52c, 64a-64c) on the side facing the second component (14, 15, 51, 63a-63c).

Abstract: An electrical connector includes an insulating housing (1) defining a first direction and a plurality of conductive contacts (20) arrayed in the housing along the first direction. The contacts are divided into a first type and a second type and each includes a soldering portion extending out the insulating housing. The soldering portion of the second type is wider than that of the first type and distances between every adjacent soldering portions of the first and second type are the same.

Abstract: An electrical connector (1) for attaching an IC package to a circuit member includes a base (3) defining four side walls, a number of terminals receiving in the base, a cover (4) slidably mounted on the base and a lever (5) slidably moving the cover relative to the base. The base defines a plurality of grooves (31) extending from one side wall of the base to any other side wall of the base and one end of the groove is communicated with exterior space to decline the temperature of the terminals.

Abstract: An electrical contact (10) using for electrically connecting a chip module to a printed circuit board includes a base portion (101), an arm portion (102) extending from side of the base portion (101), a retaining device (104) extending downwardly from the base portion (101) for retaining a soldering ball (20). The retaining device further comprises a plurality of clipping portions, said clipping portions forming a retaining space (1044) for receiving the soldering ball jointly, and at least one of said clipping portions defining a guiding surface (1046) and a recess (1045). By above way, steady attachment between the soldering ball and the contact is achieved.

Abstract: An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

Abstract: A board-to-board electrical connector comprising a male connector including a first insulating base, a plurality of male terminals, each said male terminal having a male contact and a male stator; a female connector including a second insulating base, a plurality of female terminals, each female terminal having a female lead and a female contact extending from the female lead in an bending direction for engagement with said male contact, and a female stator which engages with said male stator, the male contact is a closed ring in shape with at least a protrusion formed at its outside surface, which is restrained in the receiving cavity formed between the first convex of the female contact and the second convex set abreast to the first convex, and the outside surface of which contacts with the first convex and the second convex respectively, the first convex and the second convex being formed with the arm of the female contact bended forth and then back, the protrusion engaging with the first convex or the sec

Abstract: An electrical connector assembly, for electrically connecting an IC package and a printed circuit board (PCB) (1), comprises an insulative housing (2); an insulator (4) separated with the insulative housing, and comprising a bottom surface and a guiding portion (42) extending downwardly from the bottom surface; a shell (3) covering the insulative housing, and one end of the shell assembled on the insulator; a PCB comprising a retaining hole (11) for receiving the guiding portion of the insulator, and the bottom surface of the insulator attached to the PCB.

Abstract: A connector (100) includes an insulative housing (1) having a base portion (11), a first tongue portion (12) extending forwardly from the base portion and a plurality of first passageways (123), the first tongue portion is thinner than the base portion and defines a front mating face (120), an upper side face (121) and a lower side face (122) opposite to the upper side face. A number of first electrical contacts (21) are received in the first passageways respectively, the first electrical contacts each defines a first contacting portion (210), a first soldering portion (212) and a first retaining portion (211) connecting with the first contacting portion and the first soldering portion. A number of optical components (4, 5) are mounted on the first tongue portion and exposed to exterior through the front mating face.

Abstract: A burn-in socket includes an insulative housing and a number of electrical terminal assemblies secured to the insulative housing. The terminal assembly includes a first contact and a second contact contacting with each other. The first and second contact each is provided with a mating end projecting beyond the insulative housing. The second contact includes a stem portion sliding along a slot in the connecting end of the first contact and a coiled spring. The coiled spring is connected with and surrounding the stem portion.

Abstract: A circuit package includes a circuit substrate having a cutout portion defined therein, an interconnect electrically coupled to the circuit substrate and an active circuit component disposed off the circuit substrate within the cutout portion and electrically coupled to the interconnect. An optical circuit includes a lead frame and an optical component electrically coupled to the lead frame. The lead frame includes a first lead portion at a first level having an upper surface and a lower surface, and a second lead portion at a second level lower than the first level and electrically connected to the first lead portion. The lower surface of the first lead portion is arranged to electrically connect to a surface of a circuit substrate. The second lead portion includes an upper surface and a lower surface. The optical component is disposed on the upper surface of the second lead portion.

Abstract: An enhanced contact construction and loading support mechanism for plastic land grid array (PLGA) modules. A plurality of inverted hybrid land grid array (LGA) contacts are each respectively captured in and extend at least partially through one of a plurality of holes of an inverted hybrid LGA interposer. The inverted hybrid LGA contacts are affixed to a plurality of metal pads on a PLGA module carrier. Preferably, the inverted hybrid LGA contacts are affixed simultaneously using surface-mount technology (SMT) and have a metallurgy construction (e.g., beryllium-copper springs coated with nickel and hard gold) that provides enhanced wear and corrosion resistance. Each of the inverted hybrid LGA contacts is configured to make mechanical/pressure contact with a metal contact on another substrate, such as a printed wiring board (PWB).

Abstract: A socket, adapted for electrically connecting a printed circuit board to an IC package, comprises a housing and a plurality of contacts arranged in an angular fashion within the passageways. The housing defines a mating face and a mounting face opposed to the mating face and a number of angular passageways extending from the mating face to the mounting face. Each contact includes a bend portion, a first leg and a second leg extending from two opposed ends of the bend portion. The second leg has an arc contacting portion extending out of the mating face for contacting with the IC package. Firstly a solder ball is disposed on a bottom surface of the bend portion and soldered to the printed circuit board to mount the contact to the printed circuit board. Or secondly the contacts (Mounting end) have no solder balls and solder paste is applied to PCB then connector is placed onto PCB and reflow soldered into place without use of solder balls.

Abstract: An electrical connector is provided for mounting on a circuit board having first and second vias. The electrical connector includes a housing having a mounting face for mounting along the circuit board, and first and second signal terminals held by the housing. The first and second signal terminals include respective first and second mounting contacts extending outward from the mounting face of the housing. The first and second mounting contacts are configured to be received within the first and second vias, respectively, of the circuit board. The first mounting contact extends a different length from the mounting face of the housing than the second mounting contact.

Abstract: An electrical connector includes a housing having a mating end and a board end. The housing has a plurality of contact cavities extending along a longitudinal axis between the mating and board ends. A plurality of contacts are received within the contact cavities. The contacts have a mating end and a mounting end, and the contacts have a flexible tail at the mounting end. The tail has a first portion extending along the longitudinal axis and a second portion angled with respect to the first portion with the second portion having a board mounting surface configured to mount to a circuit board. The tail includes a slot open along the board mounting surface.

Abstract: The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.

Abstract: A connector assembly includes a housing and a contact. The housing extends from a front end to an opposite back end. The housing includes an interior chamber inwardly extending from the front end that is configured to receive a mating connector through the front end of the housing. The contact is joined with the housing and extends between a mating end and a mounting surface. The mating end is configured to engage a mating contact of the mating connector. The mounting surface is configured to be mounted to a substrate to electrically couple the mating connector with the substrate. The housing extends through an opening in the substrate such that the housing protrudes from opposite sides of the substrate.

Abstract: Embodiments of electrical connectors include substantially identical first and second halves. The first and second halves each include insert molded leadframe assemblies that comprise electrical conductors. Each electrical conductor of the first half engages a substantially identical electrical conductor of the second half when the first and second halves are mated.