Abstract: A connector mountable to a printed circuit board is disclosed including a nonconductive housing with a plurality of slots, each slot having an opposed first and second end walls with grooves in each end wall and a plurality of terminals (41). Each terminal has a longitudinal axis, a retaining base (42), a solder portion (44), a resilient contact arm (43) and an alignment tab (45). The retaining base (42) has opposed edges with each edge fitting into a respective groove in the end walls holding each terminal to the non-conductive housing. The solder portion (44) extends from the retaining base (42) adjacent to the first end wall of the slot for soldering to the printed circuit board. The resilient contact arm (43) has opposed first and second sides extending from the retaining base (42), the first side of the arm is located adjacent the second end wall of the slot. The contact arm (43) is adapted to engage with a terminal (21) from a mating connector.

Abstract: An electrical contact component includes a base defining an external terminal to be mounted on a surface of a wiring board with a solder and a fitting portion having a substantially tubular shaped fitting periphery. The external terminal has a first principal surface opposing the surface of the wiring board, a second principal surface substantially parallel to the first principal surface, and sides substantially perpendicular to the first and second principal surfaces and connecting the first principal surface to the second principal surface. The fitting portion is continuously provided on the second principal surface. The fitting periphery of the fitting portion is electrically connected to the second principal surface and the sides of the external terminal by metal layers formed over their respective surfaces. The metal layer contains Ni as a principal constituent and Co, and the metal layer contains Au as a principal constituent.

Abstract: A connector has an insulative housing, a plurality of terminals and a metal shell. Each terminal has a soldering section. The soldering sections of a power terminal and a grounding terminal are the outermost terminals and are located outside remaining terminals instead of being located respectively between the soldering sections of signal transmitting or receiving terminals. The outermost soldering sections of the power and grounding terminals prevent the interference with the signal transmitting and receiving terminals during signal transmission.

Abstract: A cable assembly includes an insulated housing (100) and a plurality of contacts (10) received therein, each contact having a tail portion extending beyond rear surface of the insulated housing; a printed circuit board (2) having a front portion and an opposite rear portion, with a plurality of conductive traces (220) arranged on the front portion and a number of conductive pads (240, 242) arranged on the rear portion. The tail portions of the contacts are soldered to the conductive traces of the front portion of the printed circuit board. The conductive pads on the rear portion of the printed circuit board are separated into at least two groups and connecting to two kinds of cables (4), selectively. A cover (9) is mold over a rear portion of the connector and a front portion of corresponding cable.

Abstract: An exemplary cable connector includes a housing, a terminal module including a first terminal and a second terminal, a printed circuit board fixed in the housing, and a cable including a first core and a second core. The terminal module is detachably assembled in a first end of the housing, and the first and second terminals are contacting the printed circuit board. The cable is fixed in a second end of the housing, and the first and the second cores of the cable are welded to the printed circuit board. The first and second terminals are electrically communicating with the first and second cores via the printed circuit board.

Abstract: According to one embodiment, a printed circuit board includes a wiring board, a through-hole mount device, and a surface mount device. The wiring board has a first surface, a second surface opposite to the first surface, and through holes. The through-hole mount device has leads. The leads are soldered inside the through holes so that the through-hole mount device is mounted on the first surface. The leads have distal ends positioned inside the through holes. An adhesive fills the region between the wiring board and the through-hole mount device. The adhesive fixes the through-hole mount device to the first surface. A surface mount device is soldered to the second surface and closes the through holes in which the leads are inserted.

Abstract: An electronic apparatus is disclosed that includes a board and an electronic component having a body. The board has multiple through-holes and multiple lands covering multiple through-holes. The electronic component has multiple terminals. The terminals are respectively coupled with the lands while a part of each terminal being inserted into a through-hole. A shape of the through-hole is generally circular and different from a part of the land on a back surface of the board. The part of the land on the back surface has a width and the width is different in directions.

Abstract: A solder ball is adapted for a ball grid array socket and comprises a core portion (1) and a layer (2) of solder alloy coated an outer surface of the core portion. The core portion is consisting of tin essentially, and the layer of solder alloy contains at least two metal materials.

Abstract: A mounting structure of an interface jack includes an insulating housing, multiple electrical wires, a first metallic piece, a second metallic piece, and at least one third metallic piece. The insulating housing has an upper surface, a lower surface, a backside surface, a first lateral wall, a second lateral wall and an entrance. The entrance is communicated with a receptacle disposed within the insulating housing. The backside surface is connected with the upper surface, the lower surface, the first lateral wall and the second lateral wall. The electrical wires are arranged inside the insulating housing and extended out of the backside surface of the insulating housing. The first metallic piece is attached on the bottom surface of the first lateral wall. The second metallic piece is attached on the bottom surface of the second lateral wall. The third metallic piece is attached on the lower surface.

Abstract: A socket connector is bonded to a circuit board by solder materials. The solder materials are well arranged so that no short circuits occur. The socket connector can be applied in a wide range of uses with high yield and reduced cost. The socket connector has an insulative housing having a plurality of terminals and a solder material therein. The socket connector is characterized by the insulative housing being provided with a plurality of overflow holes in a direction along which the insulative housing and terminals apply pressure to the solder material.

Abstract: A low-profile socket contact is provided that is mountable on a print substrate and has a high contact pressure. The socket contact includes a base portion provided on a print substrate, and a contact connecting portion connecting to the tab-shaped contact provided on a central portion of the base portion. The base portion has an opening in which the tab-shaped contact passes through, and a plurality of lead portions solderable to the print substrate. The contact connecting portion has a pair of first bending fragments, a pair of first inverted arms, a pair of second bending fragments, and a pair of second inverted arms. A contact point in contact with the tab-shaped contact is provided on each front ends of the pair of first inverted arms, and a guiding face in which the tab-shaped contact slides is provided on the pair of second inverted arms.

Abstract: A socket contact that makes contact with a lead pin is provided on a mating electronic component, wherein this socket contact comprises a retention section that is press-fit in a contact cavity provided in a housing, a base section that extends downward from this retention section, and a pair of resilient contact pieces that extend from either side edge of this base section in mutually facing directions. The paired resilient contact pieces respectively comprise end sections that extend backward from the side edges of the base section, and lead pin contact sections that extend upward and forward at an inclination from the rear ends of the base section and that are also formed with an inclination so as to approach each other toward the tip ends thereof, and after the lead pin is inserted into the contact cavity toward the rear ends of the base end parts, the lead pin moves forward so as to contact the lead pin contact section in a position to the rear side of the retention section.

Abstract: A printed circuit board (PCB) assembly includes a PCB and a screwless terminal connection having a conductor rail and a clamping spring. The PCB has a recess on an edge. The conductor rail has a base part soldered to the PCB and bridging the PCB recess. The base part includes an end extending past the PCB edge. The clamping spring includes three spring legs. The first leg contacts the base part and is between the base part and the PCB recess. The first leg includes an end extending past the PCB edge and contacting the end of the base part. The second leg extends from the first leg through the PCB recess and is beneath the PCB. The third leg includes a clamping aperture and extends upward from the second leg above the PCB. The ends of the base part and the first leg extend through the clamping aperture.

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

Abstract: A solderable electric contact terminal includes; an insulating foam rubber having a predetermined volume; an insulating non-foam rubber coating layer adhered to the insulating foam rubber such that the insulating non-foam rubber encloses the insulating foam rubber; and a heat resistant polymer film having inner surface adhered to the insulating non-foam rubber coating layer such that the heat resistant polymer film encloses the insulating non-foam rubber coating layer, and outer surface on which a metal layer is integrally formed.

Abstract: Provided is a receptacle connector for a battery in a mobile electric device. The receptacle connector includes a contact terminal, a connection terminal, and an extension portion. The contact terminal electrically contacts a plug connector of the mobile electric device. The connection terminal is fit and soldered in a through hole of a battery PCB, and is integrally formed with the contact terminal. The extension portion is bent and extends from a front end of the connection terminal to form a solder receiving space for receiving solder flowing through the through hole of the PCB together with the connection terminal while a soldering operation is performed on the connection terminal. The extension portion together with the connection terminal is fit and soldered in the through hole of the PCB.

Abstract: A system for directly connecting multiple printed circuit boards (PCB) circuits without the need for peripheral connectors. Multiple PCBs are electrically and mechanically interfaced with one or more plated holes or tabs on at least one first PCB and one or more plated tabs or holes on at least one second PCB. The plated tab(s)/hole(s) from said second PCB mate with the corresponding plated tab(s)/hole(s) from said first PCB to form a mechanical and electrical interconnect.

Abstract: A power semiconductor module including a contact element. One embodiment provides an electrically conductive contact element extending in a longitudinal direction and having a first end and a second end lying opposite the first end. The contact element has a first flange at its first end. The first flange is embodied such that when the contact element is placed with the first flange ahead onto a plane perpendicular to the longitudinal direction, the first flange has with the plane a number of first contact areas spaced apart from one another.

Abstract: A board mounted connector for a board to board connector system is disclosed which can be smaller, provide a more robust connection to a conductive circuit on a printed circuit board while allowing for a high degree of circuit design freedom on the board circuit due to the terminal insertion from the mating side of the housing where the terminals are generally above a bottom portion (33) of the non-conductive housing (31) adjacent the board. The housing (31) is provided with fitting holes (37) extending from an end surface (32d) on the side which mates with the male housing (21). The female terminals (35) have anchor portions (36) to be fitted into the fitting holes (37) of the female housing (31) and contact portions (35b) to engage terminals in a mating connector Forward end portions (36a) of the anchor portions (36) are soldered to a circuit terminal of the board (3).

Abstract: This invention provides a printed wiring board having an intensified drop impact resistance of a joint portion between pad and solder. An electrode pad comprises pad portion loaded with solder ball and a cylindrical portion projecting to the solder ball supporting the pad portion. An outer edge of the pad portion extends sideway from a cylindrical portion so that the outer edge is capable of bending. If the outer edge bends when stress is applied to the solder ball 30, stress on the outer edge of the pad portion on which stress is concentrated can be relaxed so as to intensify the joint strength between an electrode pad and solder ball.

Abstract: An element (1) for mechanical and electrical coupling of a passive and/or active electrical unit (2) to an electrical circuit unit (3). The element (1) comprises at least one electrical contact element (10, 11) for electrical contacting of the passive and/or active electrical unit (2) with electrical circuit unit (3), a first side, which faces toward passive and/or active electrical unit (2), which comprises a second side (13), which faces toward electrical circuit unit (3), and at least one first means (14) for secure mechanical connection to the electrical circuit unit is attached fixed to second side (13). Also discloses an electromedical implant for stimulating human/animal organism and/or sensing human/animal physiological signals. Comprises at least one electrical circuit unit (3), at least one passive and/or active electrical unit (2), and at least one coupling element, to electrically and mechanically couple unit (2) and unit (3) together.

Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.

Abstract: A holding member, for an electronic component inserted into a through hole provided in an electronic circuit board which includes a plate-shaped base that is fixed to the electronic component, a first leg and a second leg. The first leg extends from the base, and is inserted into the through hole. The first leg has a catch that projects laterally and outwardly with respect to an inserting direction in which the first leg is inserted into the through hole and locked with an edge of the through hole after the first leg is inserted. The second leg extends from the base and is inserted into the through hole together with the first leg. The second leg elastically deforms when the second leg comes into contact with an inner surface of the through hole, presses the first leg to an opposite side inner surface of the through hole, and elastically holds the catch in a state in which the catch is locked with the edge of the through hole after the second leg is inserted.

Abstract: An electronic apparatus is disclosed that includes a board and an electronic component having a body. The board has multiple through-holes and multiple lands covering multiple through-holes. The electronic component has multiple terminals. The terminals are respectively coupled with the lands while a part of each terminal being inserted into a through-hole. A shape of the through-hole is generally circular and different from a part of the land on a back surface of the board. The part of the land on the back surface has a width and the width is different in directions.

Abstract: The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.

Abstract: The invention relates to an electronics card (1) comprising a printed circuit board (2) and a piece of equipment (3) such as a motor or a loudspeaker fastened to said printed circuit board (2). The piece of equipment (3) is fastened to a face (4) of the printed circuit board (2) by snap-fastening in metal clips (6, 7) that project from said face (4), each clip (6, 7) having a first end (8, 9) fastened to said face (4) of the printed circuit board (2) by soldering, and a second end (11, 12) bearing resiliently on a corresponding portion of the piece of equipment (3) for holding it pressed against said face (4) of the printed circuit board (2). The invention applies in particular to electronics cards for motor vehicles.

Abstract: A probe for electrical test comprises a probe body having a base end attached to a support base plate through a solder and a front end continuous with said base end and a surface layer showing a conductivity higher than that of the probe body and a solder wettability higher than that of the probe body and extending on the surface of the probe body from the base end to the front end. In the vicinity of the base end of the surface layer, a shield region having a smaller solder wettability than that of the surface layer is formed across the surface layer.

Abstract: A mounting structure includes: a surface mounting connector including a housing and a plurality of terminals; a substrate including a plurality of lands, each of which is electrically connected to the terminal with a bonding member; a plurality of support portions for supporting the connector on the substrate; and a plurality of fixing members for positioning the connector on the substrate. Each fixing member is connected to the housing, and contacts a part of the substrate, which is different from a surface portion of the substrate contacting the support portion. Each terminal is positioned on the substrate with a predetermined distance between the terminal and the substrate by the support portions and the fixing members.

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

Abstract: A surface mount electrical connector is disclosed. Such an electrical connector may include a connector housing and a leadframe assembly received into the connector housing. he connector housing may define a first planar surface, and have a first rigidity. The leadframe assembly may have a second rigidity that is greater than the first rigidity. Thus, the leadframe assembly may cause the first surface to remain planar at a solder reflow temperature.

Abstract: An electrical connector assembly comprises an upper connector and a lower connector stacked vertically for electrically connecting two memory modules to a PCB. Said upper connector includes a plurality of first contacts having a plurality of horizontal first soldering legs which are soldered on a top surface of the PCB by SMT. Said lower connector includes a plurality of second contacts having a plurality of second vertical second soldering legs which are soldered on a bottom surface of the PCB. Said bottom surface of the PCB has a plurality of soldering holes which are not getting through the top surface of the PCB for retaining said vertical second soldering legs therein so as to provide an available soldering area for said horizontal first soldering legs on the top surface of the PCB. Said electrical connector assembly reduces the size and the occupancy on said PCB efficiently, which saves the space of the PCB.

Abstract: A socket, adapt for electrically connecting a semiconductor package to a print circuit board, comprises an insulating housing, a plurality of contacts received in the insulating housing and a plurality of solder balls disposed on bottom ends of the contacts. The socket is mounted on the print circuit board by soldering the solder balls to the print circuit board, after that, an accessional member, which is made of epoxy resin, is displaced between the insulating housing and the print circuit board by insert-molding to surround the solder balls.

Abstract: The present invention discloses an electrical connector comprising: a housing; a base body having a tongue, whose one surface is disposed with a plurality of first terminal slots and whose other surface is disposed with a plurality of second terminal slots; a first terminal assembly whose each first terminal is disposed with a leg and a contact portion slightly perpendicular to the leg, respectively, with the legs being alternately arranged; and a second terminal assembly whose each second terminal is disposed with a leg and a contact portion slightly perpendicular to the leg and then bending downward, respectively.

Abstract: A connector for connecting a card to a printed circuit board is provided. The connector includes a housing Z and a plurality of terminals. The housing includes a plurality of slots and at least one trench disposed in the vicinity of each of the plurality of slots. Each of the plurality of terminals includes a contact portion to be in contact with the card, an anchoring portion, four feet extending vertically from the anchoring portion, and a soldering portion extending from the anchoring portion and to be soldered to the printed circuit board. The terminal is mounted on the housing with at least one of the feet of the terminal inserted in at least one trench. The soldering portion is offset from the contact portion so that the contact portion will not come into contact with the soldering portion (when the contact portion is pressed towards the soldering portion, thereby providing a low-profile connector.

Abstract: At least one embodiment of the invention relates to a contact apparatus for SMT placement on a printed circuit board, the contact apparatus being provided for the electrically conductive connection to at least one conductor track on the printed circuit board. The contact apparatus includes a contact holder for accommodating the contact, and the contact of the contact apparatus is provided for the connection to at least one electrical mating contact. The contact apparatus is designed on an SMT basis and can therefore be produced inexpensively and fitted easily. According to at least one embodiment of the invention, the contact apparatus has a first housing part, the housing part having at least one elongate cutout for accommodating the contact holder, and at least one stop for the contact being integrally formed on the housing part, which stop is provided for the purpose of absorbing insertion forces when contact is made between the contact and an electrical mating contact.

Abstract: An electrical connector comprises an housing receiving a plurality of terminals and a shell assembled on the housing. The shell defines a pair of soldering tails each comprising a horizontal portion extending from an upper wall of the shell, a crook portion extending from the horizontal portion upwardly and then downwardly, and an upright portion extending from the crook portion downwardly. The upward crook portion ensures the horizontal portion to abut against the surface of PCB completely.

Abstract: A conduct (3) includes a retention portion (31), a contacting portion (334) extending upwardly from the retention portion (3), a tail portion (34) formed on a distal end of the retention portion. The tail portion (34) has a relatively larger bottom surface vertical to the major surface of the base defining a multilateral-shaped recess (340) adapted to engage a solder member, e.g. solder ball, thereby establishing electrical engagement between the contact and the PCB.

Abstract: A surface mount component (for example, an electrical connector) includes a connector body portion and a plurality of temperature-activated self-extending surface mount attachment structures (TASESMAS). During a reflow solder process, amounts of solder within the connector melt. Surface and interfacial tensions of structures within the connector cause the TASESMAS structures to extend away from the connector body portion and toward an object (for example, a printed circuit board) to which the surface mount component is to be surface mount soldered. Each TASESMAS may self-extend a different amount to accommodate nonplanarities in the surface to which the component is to be surface mounted. When the component cools after reflow soldering, the amounts of solder solidify thereby fixing the TASESMAS structures in their extended positions.

Abstract: A microphone connector includes an insulation housing and an electrical contact. The insulation housing has an insertion passage arranged at a top surface thereon, a receiving space arranged at a bottom surface thereon and communicated with the insertion passage and grooves passing through opposite sidewalls of the insulation housing. The electrical contact includes a body portion arranged up on the sidewalls, a soldering portion arranged at one end of the body portion, at least two opposite arms arranged at the other end of the body portion and received in the corresponding grooves respectively and elastic connection portions respectively arranged at the side arms and received in the receiving space. While a terminal of a microphone inserts into the insertion passage and electronically couples to the elastic connection portions to form multi-conductive areas, signal is transmitted between the microphone and the microphone connector stably through the multi-conductive areas.

Abstract: A connector and method for making wherein the connector has a connector body, connector leads extending from the connector body for solder connection to an electronic circuit wherein the connector leads do not extend a uniform distance from the body connector body. A solder paste is formed on each connector lead by stenciling it onto a flat plate that is non-wettable to the solder paste. The solder paste is composed of first solder particles having a first lower melting point and second solder particles having a second higher melting point. The solder paste is heated to the first melting point for adhering the solder paste to the connector leads while planarizing the solder covered electrical leads with the flat plate. The connector leads are soldered to an electrical circuit by removing the flat plate and heating the solder paste to the second higher melting point.

Abstract: A structure for connecting a flexible substrate and a terminal fitting is provided, the terminal fitting including: an upper plate; a lower plate; and a barrel which is formed in an upstanding manner on the lower plate, and is inserted into a hole formed in the flexible substrate; the flexible substrate being held between the upper plate and the lower plate by bending the barrel inserted to the hole, wherein a projection is formed in each of the upper plate and the lower plate, and the flexible substrate is held between the projections.

Abstract: An electrical connector (100) for electrically connecting an electronic package with a circuit substrate comprises an insulative housing (1) and a plurality of contacts (2) insert-molded on the insulative housing (1), the insulative housing (1) comprises a bottom surface (12) and an upper surface (11) opposite to the bottom surface (12), the contact (2) comprises a retaining portion (23), a first contact portion (21) extending upwardly beyond the upper surface (11) for connecting with the electronic package and a second contact portion (22) extending downwardly beyond the bottom surface (12) for connecting with the circuit substrate, the second contact portion (22) with spire shape formed a receiving space (221). Thus, the second contact portion (22) can connect with the circuit substrate by directly or indirectly style.

Abstract: A wireless headset has improved immunity to RF electromagnetic interference produced from wireless communications devices. A headset body is adapted to be worn by a user and includes a microphone and earpiece. An antenna receives wireless communication signals and passes them to RF and audio circuitry mounted within the headset body. The RF and audio circuitry include a Bluetooth module operatively connected to the antenna for transmitting and receiving wireless communication signals, an audio CODEC connected to the Bluetooth module, and audio connection lines connected between the CODEC and the earpiece and between the CODEC and the microphone. A filter is connected into each of the audio connection lines at the earpiece and microphone and operative for reducing the RF coupling from a mobile wireless communications device.

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

Abstract: Embodiments of electrical connectors include substantially identical first and second halves. The first and second halves each include insert molded leadframe assemblies that comprise electrical conductors. Each electrical conductor of the first half engages a substantially identical electrical conductor of the second half when the first and second halves are mated.

Abstract: A connector having a number of SMT pads and a number of in-line package pins is provided. The connector can be applied to both a peripheral component interconnection (PCI) card and a peripheral component interconnection express (PCIE) card. The number of the connectors can be reduced when the connectors are applied to the circuit board, and more space on the circuit board are then available for other electrical elements to be disposed.

Abstract: A circuit board mounted connector is equipped with an insulative housing, which holds a plurality of rows of contacts and is mounted on a circuit board. Each contact has a contact portion, for contacting another connector; and a leg portion, which is connected to the circuit board. Each leg portion has an extending portion that extends from a rear wall of the insulative housing; a flexible portion, which is formed continuously with the extending portions; and a linear portion that extends in a direction substantially perpendicular to the circuit board from the flexible portion and is connected to an aperture of the circuit board. Of the plurality of rows of contacts, at least the row closest to the circuit board has extending portions that extend away from the circuit board, up to the flexible portions. The linear portions of each of the leg portions are partially tin plated.

Abstract: The present invention provides an electrical connector for electrical connecting an IC package having a plurality of pins to a PCB. The electrical connector comprises a base defining a plurality of passageways, a plurality of contacts received in the passageways, and a cover moveable relative to the base from a first position to a second position. The cover defines a plurality of through holes corresponding the passageway. The contacts each have a resilient arm. During movement of the cover from the first position to the second position, pins of the IC package will compress the resilient arms of the contacts along a direction and the resilient will exert a normal force on the pins, thus ensuring proper connection between the resilient arm and the pins; wherein direction of the normal force is opposite to the direction of the pins moving.

Abstract: An electrical connector includes an housing having a base portion, a tongue portion extending forwardly from the base portion and a number of passageways, the tongue portion defining a front face, a first side face and a second side face; a metal shell enclosing the tongue portion to define a receiving room therebetween, and defines a top wall, bottom wall and a pair of side walls, a first receiving room being formed between the bottom wall and the first side face; a number of contacts received in the passageways respectively and including a plurality of first contacts and second contacts, the first contacts each defining a first contacting portion, a first soldering portion and a first retaining portion, the second contacts each defining a second contacting portion, a second soldering portion and a second retaining portion.

Abstract: An electrical connection assembly includes a substrate having first and second sides and a substrate aperture formed therein. The substrate is made of an electrically non-conductive material. A busbar is attached to the first side of the substrate. The busbar has a busbar aperture formed therein. A trace is formed on the second surface of the substrate. The busbar and trace are formed of an electrically conductive material. A pin is disposed in both the substrate aperture and the busbar aperture, wherein the pin is in electrical communication with the busbar and the trace.