Adapted To Be Sandwiched Between Preformed Panel Circuit Arrangements Patents (Class 439/91)
  • Patent number: 10117745
    Abstract: A connector for coupling a distal sheath to an inner shaft of a medical delivery device includes a wedge defining a lumen for accepting the inner shaft of the medical delivery device and a cylindrical ring sized to mate with the wedge. The wedge may be welded or otherwise fixed to the inner shaft. The wedge and the ring are configured to be pressed together and lock a portion of the distal sheath therebetween.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: November 6, 2018
    Assignee: St. Jude Medical, Cardiology Division, Inc.
    Inventor: John Ibeling
  • Patent number: 10090075
    Abstract: A display device connected by an anisotropic conductive film, wherein the anisotropic conductive film includes conductive particles and has a minimum melt viscosity of 900 Pa·s to 90,000 Pa·s at 80° C. to 140° C.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: October 2, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Youn Jo Ko, Kyoung Ku Kang, Soon Young Kwon, Ie Ju Kim, Hyun Joo Seo, Se Mi Heo
  • Patent number: 9728527
    Abstract: An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: August 8, 2017
    Assignee: Invensas Corporation
    Inventors: Cyprian Emeka Uzoh, Rajesh Katkar
  • Patent number: 9656353
    Abstract: The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: May 23, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazuhiro Miyauchi, Naoya Suzuki, Nozomu Takano, Yukihiko Yamashita
  • Patent number: 9490228
    Abstract: An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in ?m).
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: November 8, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Kyoung Soo Park, Soon Young Kwon, Ji Yeon Kim, Young Woo Park, Jae Sun Han, Ja Young Hwang
  • Patent number: 9490229
    Abstract: Provided is a semiconductor device, including an anisotropic conductive film connecting the semiconductor device, the anisotropic conductive film having a maximum stress of 0.4 kgf/mm2 or more; and a stress-strain curve having a slope (A) of greater than 0 and less than or equal to 0.2 kgf/(mm2·%) as represented by the following equation 1: slope(A)=(½Smax?S0)/x??(1), wherein: Smax=maximum stress, x=strain (%) at half (½) of the maximum stress, and S0=stress at a strain of 0.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: November 8, 2016
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Ji Yeon Kim, Kyoung Ku Kang, Kyoung Soo Park, Byeong Geun Son, Young Ju Shin, Kwang Jin Jung, Ja Young Hwang
  • Patent number: 9357645
    Abstract: A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 31, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hirofumi Ebe, Yoshihiro Furukawa
  • Patent number: 9277654
    Abstract: An array of composite polymer-metal contact members adapted to form solder free electrical connections with a first circuit member. The contact members include a resilient polymeric base layer and an array of metalized traces printed on selected portions of the base layer. Conductive plating is applied to the metalized layer to create an array of conductive paths. The resilient polymeric base layer, the metalized layer, and the conductive plating have an aggregate spring constant sufficient to maintain distal portions of the contact members in a cantilevered configuration and to form a stable electrical connection between the distal portions and the first circuit member solely by compressive engagement.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: March 1, 2016
    Assignee: HSIO Technologies, LLC
    Inventor: James Rathburn
  • Patent number: 9231357
    Abstract: A mid-plane assembly for use in an IT device includes a circuit board having a first surface and a second surface. At least one drive connector is positioned on the first surface of the circuit board. At least one board connector is positioned on the second surface of the circuit board and at least partially behind the at least one drive connector positioned on the first surface.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: January 5, 2016
    Assignee: EMC Corporation
    Inventors: Mickey S. Felton, Eddy M. Paul, Ralph C. Frangioso
  • Patent number: 9202160
    Abstract: A memory card adaptor is provided which includes a housing including a bottom lid and a top lid that form the housing. The housing may be configured to receive a memory card. The memory card adaptor may include a package substrate between the bottom lid and the top lid. The package substrate may include a core having a first surface and a second surface; a first layer on the first surface, and the first layer may include a plurality of contact lands; and a second layer on the second surface, and the second layer may include a plurality of contact pads that are electrically connected with the contact lands through a plurality of via holes. The plurality of via holes may be formed such that they penetrate the core. One of the first and second layers may include a return path on at least one signal line.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: December 1, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Seok-Jae Han
  • Patent number: 9049789
    Abstract: There is provided a mounting adapter to be disposed between a socket and an electronic component when the electronic component is mounted with the socket. The mounting adapter includes a base having insulating property, a first electrode provided on a first surface of the base, the first surface facing the electronic component, the first electrode being to be in contact with an electric pad of the electronic component, a second electrode provided on a second surface of the base, the second electrode facing the socket, the second electrode being to be in contact with a conductor of the socket, and a through via that penetrates through the base and electrically connects the first electrode and the second electrode.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: June 2, 2015
    Assignee: FUJITSU LIMITED
    Inventors: Satoshi Ohsawa, Akira Tamura
  • Publication number: 20150126051
    Abstract: A connector insert comprising a plurality of layers of conductive elastomer, and a concomitant method of employing a connector insert, the method comprising the steps of fabricating a plurality of layers of conductive elastomer as an insert and placing the insert into a connector.
    Type: Application
    Filed: October 31, 2014
    Publication date: May 7, 2015
    Inventors: Ken Godana, Dusty Erven, Kevin Foreman, Paul Miller
  • Patent number: 8988895
    Abstract: An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: March 24, 2015
    Assignee: Tessera, Inc.
    Inventors: Ilyas Mohammed, Belgacem Haba
  • Patent number: 8981809
    Abstract: A compliant printed circuit semiconductor tester interface that provides a temporary interconnect between terminals on integrated circuit (IC) devices being tested. The compliant printed circuit semiconductor tester interface includes at least one dielectric layer printed with recesses corresponding to a target circuit geometry. A conductive material is deposited in at least a portion of the recesses comprising a circuit geometry and a plurality of first contact pads accessible along a first surface of the compliant printed circuit. At least one dielectric covering layer is preferably applied over the circuit geometry. A plurality of openings in the dielectric covering layer are provided to permit electrical coupling of terminals on the IC device and the first contact pads. Testing electronics that to test electrical functions of the IC device are electrically coupled to the circuit geometry.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: March 17, 2015
    Assignee: Hsio Technologies, LLC
    Inventor: James Rathburn
  • Patent number: 8974626
    Abstract: A method of manufacturing a micro structure, includes the steps of: preparing separate first and second substrates, the first substrate having a first surface on which a first structural body having a first height and a second structural body having a second height greater than the first height of the first structural body are arranged, the second substrate having a second surface; then placing the first and second substrates to cause the first and second surfaces to face each other across the first and second structural bodies; and then bonding the first and second substrates to each other while compressing the second structural body in a height direction thereof between the first and second surfaces to cause the second structural body to have a height defined by the first structural body.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: March 10, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Takamichi Fujii, Akihiro Mukaiyama
  • Patent number: 8926343
    Abstract: An electrical interconnect device includes an array of conductive elastomeric columns, each of the elastomeric columns extending between a first end and a second end and being internally conductive between the first and second ends. Upper and lower holders cover the array of conductive elastomeric columns. The upper holder has an upper substrate and a plurality of discrete upper pads held by the upper substrate and arranged in a complementary pattern to the array of elastomeric columns. The discrete upper pads cap corresponding first ends of the elastomeric columns. The lower holder has a lower substrate and a plurality of discrete lower pads held by the lower substrate and arranged in a complementary pattern to the array of elastomeric columns. The discrete lower pads cap corresponding second ends of the elastomeric columns. The upper and lower holders support the array of conductive elastomeric columns.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: January 6, 2015
    Assignee: Tyco Electronics Corporation
    Inventors: Jeffery Walter Mason, Wayne Stewart Alden, III
  • Patent number: 8870579
    Abstract: An elastomeric material includes an elastomeric matrix having one or more outer surfaces and a set of electrically conductive pathways disposed through the elastomeric matrix. The elastomeric material also includes a thermally-conductive and electrically-insulative material, disposed through the elastomeric matrix, which improves the formation of the electrically conductive pathways.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: October 28, 2014
    Assignee: Paricon Technologies Corporation
    Inventors: Roger E. Weiss, Clifford Read, Everett Simons
  • Patent number: 8766658
    Abstract: A probe includes a contact member brought into contact with an object to be tested. Contact particles having conductivity are uniformly distributed in the contact member. A part of the contact particles protrude from a surface of the contact member on the side of the object to be tested. A conductive member having elasticity is placed on a surface of the contact member on the opposite side to the object to be tested. The probe further includes an insulating sheet including a through hole and the contact member is so positioned as to penetrate the through hole. An upper part of the contact member is formed of a conductor which does not include the contact particles. An additional conductor is placed on a surface of the conductor on the side opposite to the object to be tested.
    Type: Grant
    Filed: April 1, 2009
    Date of Patent: July 1, 2014
    Assignee: Tokyo Electron Limited
    Inventor: Shigekazu Komatsu
  • Publication number: 20140141632
    Abstract: An electrical interconnect device includes an array of conductive elastomeric columns, each of the elastomeric columns extending between a first end and a second end and being internally conductive between the first and second ends. Upper and lower holders cover the array of conductive elastomeric columns. The upper holder has an upper substrate and a plurality of discrete upper pads held by the upper substrate and arranged in a complementary pattern to the array of elastomeric columns. The discrete upper pads cap corresponding first ends of the elastomeric columns. The lower holder has a lower substrate and a plurality of discrete lower pads held by the lower substrate and arranged in a complementary pattern to the array of elastomeric columns. The discrete lower pads cap corresponding second ends of the elastomeric columns. The upper and lower holders support the array of conductive elastomeric columns.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 22, 2014
    Applicant: Tyco Electronics Corporation
    Inventors: Jeffery Walter Mason, Wayne Stewart Alden, III
  • Publication number: 20130344719
    Abstract: A connector, the connector comprises a tabulate main body and a plurality of tabulate conductors provided on the main body, nested with a pairing connector. Each conductor includes a tabulate terminal located in the main body and engaged with a pairing terminal of the pairing connector, and a rear end outwardly extended to the main body and connected to a terminal connecting part provided on the surface of a mounting part. A face of the rear end on the side of the mounting part is more distant to the surface of the mounting part than a face of the main body on the side of the mounting part. The rear end is connected to the terminal connecting part through an anisotropic conductive film provided between its face on the side of the mounting part and the terminal connecting part.
    Type: Application
    Filed: June 12, 2013
    Publication date: December 26, 2013
    Inventors: Keiko FUKUI, Hideo NAGASAWA, Toshihiro NIITSU, Hirokazu SUZUKI
  • Patent number: 8535093
    Abstract: A socket includes a socket body having a first surface and a second surface with a plurality of openings extending between the first and second surfaces. Sleeve assemblies are received in corresponding openings of the socket body. Each sleeve assembly includes a socket contact configured to interconnect a first electronic component and a second electronic component and each sleeve assembly includes a conductive sleeve extending along a majority of a length of the socket contact between the first and second electronic components. The conductive sleeve provides electrical shielding for the socket contact such that each socket contact is individually shielded from other socket contacts.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: September 17, 2013
    Assignee: Tyco Electronics Corporation
    Inventor: Jeffery W. Mason
  • Patent number: 8537559
    Abstract: A compliant insert is provided to support electronic assemblies to mitigate the effects of external loading. The insert comprises a polymer material having a durometer of between 10 and 90 on the Shore A scale and a 3-D negative relief on the surface of the polymer material. The 3-D negative relief is the negative of the 3-D positive relief of a specified geometric design of an electronics assembly. The compliant insert is mated with an instance of the electronics assembly such that the 3-D negative relief of the polymer material engages the 3-D positive relief of the assembly's PCB and electronic components. The polymer material is compliant enough to absorb the vertical and lateral spacing tolerances of the electronic components and stiff enough to mitigate deflections under loading.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: September 17, 2013
    Assignee: Raytheon Company
    Inventor: Nate B. Herse
  • Patent number: 8475180
    Abstract: A conductive component includes a tubular body having at least one of at least one through-hole which penetrates the tubular body from outside to inside thereof; and at least one notch which is cut in from an edge of the tubular body, which are formed at least one predetermined portion on the tubular body. The tubular body includes a first portion, which includes a solder joint portion, and a second portion, which includes a contact portion. The first portion and the second portion are located on the opposite sides from one another with the at least one predetermined portion sandwiched therebetween. The tubular body further includes at least one spring portion which includes the at least one predetermined portion.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: July 2, 2013
    Assignee: Kitagawa Industries Co., Ltd
    Inventor: Hideo Yumi
  • Patent number: 8441275
    Abstract: An electronic device test fixture deploys a plurality of contact elements in a dielectric housing. The plumb arrangement of contact elements each include an armature or transversal configured to first depress and then slide laterally when urged downward by the external contacts of a device under test. The rotary movement of the transversal is optimized via the configuration of a surrounding forked regulator such that surface oxide deposition on the external device under test terminal is disrupted to reliably minimize contact resistance without damaging or unduly stressing the electrical junction of the device under test.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: May 14, 2013
    Assignee: Tapt Interconnect, LLC
    Inventor: Patrick J Alladio
  • Patent number: 8403681
    Abstract: An electrical connector assembly includes an electrical connector, a chip located and a printed circuit board located at opposite sides of the anisoptropic conductive film. The electrical connector has an anisoptropic conductive film and a loading mechanism. The anisoptropic conductive film includes an adhesive and a number of conductive particles dispersed in the adhesive. The anisoptropic conductive film has conductivity only in a thicknesswise direction by pressing. The loading mechanism can exert pressure on the anisoptropic conductive film so that the chip and the printed circuit board electrically couples with each other.
    Type: Grant
    Filed: March 17, 2011
    Date of Patent: March 26, 2013
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Cheng-Ching Chien, Been-Yang Liaw
  • Patent number: 8366452
    Abstract: A socket connector includes an insulative housing with a plurality of receiving holes, and a plurality of contacts received in the receiving holes. The contact has a soldering portion, and a retaining arm and a resilient arm respectively extending upwardly from the soldering portion. The retaining arm has a broken edge facing downward, which is formed by breaking a carrier from the contact.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: February 5, 2013
    Assignee: Hon Hai Precision Ind. Co., Ltd
    Inventor: Cheng-Chi Yeh
  • Patent number: 8334595
    Abstract: A silicon contactor of which a side contacts test terminals of a semiconductor testing device and of which an other side contacts ball leads of a semiconductor device so as to be used in the semiconductor testing device, including: conductive silicon parts which are formed opposite to the ball leads and/or the test terminals and include silicon rubber and conductive powders; and an insulating silicon part which is formed by filling silicon rubber among areas of the conductive silicon parts, which do not contact the ball leads, and supports the conductive silicon parts, wherein the conductive powders of the conductive silicon parts include plate type powders. Therefore, the plate type powders are used as the conductive powders of the conductive silicon parts to improve contact characteristics between the conductive silicon parts and the semiconductor device.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: December 18, 2012
    Assignee: ISC Technology Co., Ltd.
    Inventor: Young Seok Jung
  • Patent number: 8282431
    Abstract: An electrical connector includes a lengthwise housing and two rows of terminals. The housing defines two rows of passageways running through opposite first surface and second surface thereof to load with terminals. Each terminal includes a middle portion and two contacting arms extending from opposite ends of the middle portion. The two contacting arms of the terminals respectively extend beyond the first and second surfaces and curving inwards. Each terminal further includes a stopping rib and a spring rib at opposite lateral sides of the middle portion. Each passageway defines a first stopping shoulder adjacent to the second surface and a second stopping shoulder adjacent to the first surface. The stopping ribs are lodged against the first stopping shoulder or the spring ribs are lodged against the second stopping shoulder so that the terminals are moveable limited in the passageways.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: October 9, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: George Huanyi Zhang
  • Patent number: 8241957
    Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: August 14, 2012
    Assignee: International Business Machines Corporation
    Inventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
  • Publication number: 20120202364
    Abstract: An electrical interconnect providing an interconnect between contacts on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a plurality of through holes extending from a first surface to a second surface. A resilient material is located in the through holes. The resilient material includes an opening extending from the first surface to the second surface. A plurality of discrete, free-flowing conductive nano-particles are located in the openings of the resilient material. The conductive particles are substantially free of non-conductive materials. A plurality of first contact members are located in the through holes adjacent the first surface and a plurality of second contact members are located in the through holes adjacent the second surface. The first and second contact members are electrically coupled to the nano-particles.
    Type: Application
    Filed: April 17, 2012
    Publication date: August 9, 2012
    Applicant: HSIO TECHNOLOGIES, LLC
    Inventor: James RATHBURN
  • Patent number: 8226442
    Abstract: An electronic module adapted to be removably, operably connected to an electronic device. The electronic module includes a housing; at least one electronic component in the housing; and a plurality of electrical contact areas. The housing has a general electronic card shape with relatively large top and bottom sides and relatively thin side edges between the top and bottom sides. The plurality of electrical contact areas are located on a first one of the side edges. The electrical contact areas are connected to the at least one electronic component such that, when the electronic module is operably connected to the electronic device, the electrical contact areas on the first side edge are adapted to electrically couple the at least one electronic component to the electronic device along the first side edge.
    Type: Grant
    Filed: March 2, 2007
    Date of Patent: July 24, 2012
    Assignee: Nokia Corporation
    Inventors: Matti Uusimaki, Timo T. Laitinen
  • Patent number: 8215969
    Abstract: A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: July 10, 2012
    Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research Institute, TPO Displays Corp.
    Inventors: Sheng-Shu Yang, Shyh-Ming Chang
  • Patent number: 8210857
    Abstract: An electronic device includes least two electronic components linked electrically to one another using a flexible connector. The flexible connector includes multiple conducting blades, and is interposed between the two electrical components such that longitudinal edges of the flexible connector are held in contact against respective connection pads of each of the electronic components. The flexible connector is ultimately compressed, respectively, against both electronic components. The electronic device is equipped with two additional conducting blades for checking the state of compression of the flexible connector. The two additional conducting blades include an electrical circuit for determining the state of compression of the flexible connector by a resistive measurement and integrating at least one additional conducting blade of the flexible connector.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: July 3, 2012
    Assignee: Valeo Systemes Thermiques
    Inventor: Tan Duc Huynh
  • Patent number: 8163835
    Abstract: An anisotropic conductive adhesive composition includes an acrylic rubber binder having a weight average molecular weight of about 100,000 to about 1,000,000, a first component including at least one of a mono(meth)acrylate compound and a di(meth)acrylate compound, a second component including at least one of a tri(meth)acrylate compound and a compound having more than three (meth)acrylate groups, an organic peroxisde, and conductive particles. The second component is present in an amount of about 1 to about 10% by weight, based on the total weight of the acrylic rubber, the first component, the second component, the organic peroxide, and the conductive particles.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: April 24, 2012
    Assignee: Cheil Industries, Inc.
    Inventors: Kyoung Soo Park, Hyun Hee Namkung, Kyoung Hun Shin, Byeong Hwan Jeon, Kang Bae Yoon, Cheon Seok Lee
  • Patent number: 8134444
    Abstract: An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: March 13, 2012
    Assignee: Shinko Electronic Industries Co., Ltd.
    Inventors: Michio Horiuchi, Yukio Shimizu, Kazunari Sekigawa, Tsuyoshi Kobayashi
  • Patent number: 8124885
    Abstract: An anisotropically conductive connector and an anisotropically conductive connector device. The anisotropically conductive connector includes a supporting member, a plurality of through-holes each extending in a thickness-wise direction of the supporting member, and anisotropically conductive sheets respectively held in the through-holes of the supporting member. Each anisotropically conductive sheet includes a frame plate, a plurality of through-holes each extending in a thickness-wise direction of the frame plate, and a plurality of anisotropically conductive elements arranged in the respective through-holes of the frame plate. Each of the anisotropically conductive elements includes a conductive part, conductive particles contained in an elastic polymeric substance in a state oriented so as to align in a thickness-wise direction of the element, and an insulating part to cover the outer periphery of the conductive part and including an elastic polymeric substance.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: February 28, 2012
    Assignee: JSR Corporation
    Inventors: Daisuke Yamada, Kiyoshi Kimura
  • Publication number: 20120025860
    Abstract: A burn-in socket for carrying an electronic device to let the electronic device electrically connect to a circuit board via the burn-in socket is provided. The electronic device has a body and at least a lead. The burn-in socket comprises a frame and a carrier, the frame has an opening and a plurality of first aligning portions, wherein the opening fits onto the contour of the body, and the first aligning portions surrounds the opening. The carrier has a plurality of second aligning portions. The frame is assembled to the carrier with the conjunction of the first aligning portions and the second aligning portions. The body is capable of fitting into the opening to let the lead electrically connect to the circuit board via the carrier.
    Type: Application
    Filed: November 23, 2010
    Publication date: February 2, 2012
    Applicant: Global Unichip Corporation
    Inventors: Yu-Min Sun, Chih-Feng Cheng
  • Patent number: 8096812
    Abstract: The socket releasably couples a packaged integrated circuit to a circuit board. The socket includes a clamp, a latch, and an array interconnect. The clamp is configured to be pivotally coupled to a circuit board. The latch is configured to be coupled to the circuit board and configured to releasably hold the clamp in a predetermined position. The array interconnect configured to be coupled to the printed circuit board. In use the latch releasably holds the hinged clamp in the predetermined position to clamp both a packaged integrated circuit between the clamp and the array interconnect, and the array interconnect between the packaged integrated circuit and the circuit board.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: January 17, 2012
    Assignee: Rambus Inc.
    Inventors: Donald V. Perino, Wayne S. Richardson, John B. Dillon
  • Patent number: 8066517
    Abstract: An electrical connector using an isotropic conductive elastomer as the interconnect medium.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: November 29, 2011
    Inventor: James V. Russell
  • Patent number: 8043096
    Abstract: A conductive rubber component includes a laminate in which conductive rubber layers and insulating rubber layers are laminated alternately in parallel, and the conductive rubber layers and the insulating rubber layers are integrated at their boundaries by a cross-linking reaction. A solderable metal coating is integrated with at least one surface of the laminate that is perpendicular to the electrical conduction direction by the deposition of at least one selected from atoms and molecules. This conductive rubber component can have good compression load properties and good compression set properties, achieve a stable electric connection for a long period of time due to the good compression set properties, be soldered to a printed wiring board or the like because of the presence of the integrated metal coating, suppress the occurrence of burrs, reduce costs, and improve the production efficiency.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: October 25, 2011
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Jinya Tanaka, Masakazu Koizumi
  • Patent number: 8033835
    Abstract: An interconnect assembly for interconnecting first and second electrical components includes a substrate having opposed first and second surfaces and a first array of contacts on the first surface for engaging corresponding elements on the first electrical component. The first array of contacts defines a compressible interface that mates with the first electrical component. The first array of contacts includes signal contacts transferring data signals across the compressible interface and the first array of contacts includes a combination of power contacts that jointly convey power across the compressible interface. The interconnect assembly also includes a second array of contacts on the second surface for engaging corresponding elements on the second electrical component. The second array of contacts having signal contacts electrically connected to the signal contact of the first array of contacts and power contacts electrically connected to the power contacts of the second array of contacts.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: October 11, 2011
    Assignee: Tyco Electronics Corporation
    Inventors: Robert Neil Mulfinger, Jason M'Cheyne Reisinger, Richard Elof Hamner, Steven J. Millard
  • Patent number: 7976927
    Abstract: A metal-integral conductive rubber component (10) of the present invention includes a laminate in which conductive rubber layers (1) and insulating rubber layers (2) are laminated alternately in parallel. The conductive rubber layers (1) and the insulating rubber layers (2) are integrated at their boundaries by cross-linking between the conductive rubber layers and the insulating rubber layers. The volume resistivity of the conductive rubber layers (1) is 10?5 ?·cm or more and 10 K ?·cm or less. The volume resistively of the insulating rubber layers (2) is 1 M ?·cm or more and 1016 ?·cm or less. A metal plate is integrated with at least one surface of the laminate that is perpendicular to the electric conduction direction via a conductive adhesive layer (3) made of conductive rubber.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: July 12, 2011
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Jinya Tanaka, Masakazu Koizumi
  • Patent number: 7950933
    Abstract: The present invention provides an electrical socket comprising a wafer defining a plurality of slots extending between an upper face and a lower face of the wafer; an upper frame mounted on the upper face of the wafer, a lower frame mounted on the lower face of the wafer, and a plurality of contacts each having a base portion floating received in corresponding slots. The upper frame defines a plurality of interior walls to form a plurality of first openings. The lower frame defines a plurality of interior walls to form a plurality of second openings. The contact comprises an upper contacting arm extending through a corresponding first opening and beyond an upper surface of the upper frame, and a lower contacting arm extending through a corresponding second opening and beyond a lower surface of the lower frame.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: May 31, 2011
    Assignee: Hon Hai Precison Ind. Co., Ltd.
    Inventor: Tod M. Harlan
  • Patent number: 7935892
    Abstract: Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: May 3, 2011
    Assignee: Panasonic Corporation
    Inventors: Kazuhiro Nishikawa, Hidenori Miyakawa, Norihito Tsukahara, Shigeaki Sakatani
  • Patent number: 7931476
    Abstract: An electrical connector using an isotropic conductive elastomer as the interconnect medium.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: April 26, 2011
    Inventor: James V. Russell
  • Patent number: 7905730
    Abstract: A contact has a spring section, and a pair of contact points. The spring section is formed as a single closed loop of material, prepared from Ni alloy. The loop may be subjected to elastic deformation through force. The pair of contact points formed in such way that the contact points project outwardly at positions separated from one another, the contact points positioned by about half way around the loop of the spring section. The pair of contact points capable of meeting with and coming into with terminals.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: March 15, 2011
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Katsuhiko Sakamoto, Eiichiro Takemasa
  • Publication number: 20110053393
    Abstract: A minute connector is provided with a first connecting member and a second connecting member. The first connecting member has a first conductive portion disposed at each of the bottom surface of a plurality of recessing portions set at an insulative first substrate connected to first ends, and first contacts made of first carbon nanotube bundles protruding from the surface of a first substrate at second ends. The second connecting member has second contacts made of second carbon nanotube bundles connected to second conductive portions disposed at each of the bottom surface of recessing portions set at an insulative second substrate corresponding to each of the first contacts at first ends. Each of the first carbon nanotubes contacts between the second carbon nanotubes with each other in an overlapping manner at the state that the first contacts are contacted with each of the corresponding second contacts.
    Type: Application
    Filed: July 16, 2010
    Publication date: March 3, 2011
    Applicant: SMK CORPORATION
    Inventor: Masayoshi SHIGIHARA
  • Patent number: 7887899
    Abstract: The invention offers an anisotropic electroconductive sheet suitable for connecting with pin electrodes of a through-hole-mounting type. The sheet has electrical conductivity in the direction of thickness. The sheet comprises a base film formed using a porous film (1) that is made of synthetic resin and that has electrically insulating property. The porous film (1) is provided with a plurality of holes (3) that are formed in the direction of thickness so that pin electrodes (2) can be through-hole-mounted. The inner walls of the holes (3) are coated with metals (4). The inserted pin electrodes (2) become electrically continuous, through the metals (4), with the surface opposite to the surface from which the pin electrodes (2) are inserted.
    Type: Grant
    Filed: May 1, 2006
    Date of Patent: February 15, 2011
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Taro Fujita, Yasuhiro Okuda, Tsuyoshi Haga
  • Patent number: 7887336
    Abstract: A double-sided connector is provided including: an insulating member having an insulating substrate and an elastomer insert-molded on both faces of the insulating substrate, and a through-hole formed along a thickness direction of the insulating substrate and the elastomer; a conductive member formed on an inner face of the through-hole, both ends of the conductive member exposed at the both faces; and a contact terminal part provided at one end of the conductive member. A protrusion is formed on at least a first face of the two faces of the insulating member and near one of the two ends of the through-hole. The protrusion formed by a part of the elastomer protruding from the first face enables an approximately hemispherical point of contact part connected to the sloping part and covering the top.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: February 15, 2011
    Assignee: Fujikura Ltd.
    Inventors: Shinichi Nikaido, Katsuya Yamagami, Yasuhiro Ouchi
  • Publication number: 20110034047
    Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.
    Type: Application
    Filed: October 18, 2010
    Publication date: February 10, 2011
    Applicant: International Business Machines Corporation
    Inventors: Gareth Geoffrey HOUGHAM, S. Jay CHEY, James Patrick DOYLE, Xiao Hu LIU, Christopher V. JAHNES, Paul Alfred LAURO, Nancy C. LaBIANCA, Michael J. ROOKS