Abstract: To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a printed circuit board (PCB). In one embodiment, the IC package is mounted on the substrate using a land grid array arrangement. Corresponding lands on the IC package and substrate are coupled using a solderless compression connector. The compression connector includes a plurality of electrically conductive particles, and a thin, flexible apertured support that aligns the particles with corresponding lands on the IC package and substrate. A compression connector may also be used to electrically couple an IC to an IC package substrate. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system, are also described.

Abstract: An anisotropically conductive connector, not causing permanent deformation by contact of target electrodes to be connected with pressure and deformation by abrasion even if the target electrodes are projected, and achieving stable conductivity over a long time period even when pressed repeatedly, a production process thereof, and an inspection circuit board equipped with the connector. The connector includes (1) anisotropically conductive film, with plural conductive path-forming parts each extending in a thickness-wise direction of the film arranged insulated by insulating parts and including at least 2 elastic layers, which are each formed by an insulating elastic polymeric substance, and (2) conductive particles exhibiting magnetism in portions of the respective elastic layers, at which conductive path-forming parts are formed. The connector satisfies H1?30, and H1/H2?1.

Abstract: A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact structures can be adapted for making contact with leads having a very fine pitch. In a first embodiment, the contact structures include raised members formed over a body of the interposer. A conductive layer is formed over each of the raised members to provide a contact surface for engaging the leads of the chip package. In another embodiment, the raised members are replaced with depressions formed into the interposer. A conductive layer is formed on an inside surface of each depression to provide a contact surface for engaging the leads of the chip package. Moreover, any combination of raised members and depressions may be used.

Abstract: The present invention provides an anisotropic conductive film for testing an electronic component, which comprises a film substrate comprising an insulating resin and plural conductive paths insulated from each other and penetrating the film substrate in the thickness direction, preferably, an anisotropic conductive film wherein the plural conductive paths are disposed in a houndstooth check pattern and the distance between conductive paths between adjacent rows of conductive paths is smaller than the distance between conductive paths within a row of conductive paths. In another preferable embodiment, the insulating resin comprises a naphthalene skeleton epoxy resin crosslinked with a phenol resin and an acrylic rubber, and both ends of the plural conductive paths are exposed on both the front and the back surfaces of the film substrate.

Abstract: An anisotropic conductive material body includes an insulating medium; and a plurality of conductive members dispersed in the medium. At least a surface of each of the plurality of conductive members is conductive. A force is applied to at least one of the plurality of conductive members so as to change the at least one conductive member, so that the conductive property of the anisotropic conductive material body provided by the at least one conductive member is changed to an insulating property.

Abstract: A Land Grid Array connector for connecting a Land Grid Array package mounted on a package board with a printed board. The Land Grid Array connector includes columns for conduction between the electrode of the Land Grid Array package and the electrode of the printed board and a socket supporting the columns. The Land Grid Array connector also includes a structure in which the columns receive an even load when the Land Grid Array package is mounted.

Abstract: Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them.

Abstract: An apparatus and method for making a compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member. The first dielectric layer has a first major surface and a plurality of through openings. A plurality of electrical traces are positioned against the first major surface of the first dielectric layer. The electric traces include a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer. The first distal ends are adapted to electrically couple with the first circuit member. The second dielectric layer has a first major surface positioned against the electric traces and the first major surface of the first dielectric layer. The second dielectric layer has a plurality of through openings through which the electric traces electrically couple with the second circuit member.

Abstract: An electrical connector includes a holder configured to be mechanically and electrically connected to a circuit board. The holder has a surface that is at least partially conductive. A conductive elastomeric member is mounted in the holder and electrically connected to the at least partially conductive surface of the holder. The at least partially conductive surface is configured to convey electrical current between the elastomeric member and the circuit board.

Abstract: A boot for a vibration motor of a mobile communication device is provided. The motor has a generally flat upper surface and is adapted to be installed in a mounting slot in a mobile communication device frame with the upper surface substantially parallel to an adjacent surface of said frame, and the mounting slot is at an angle with respect to a normal of the adjacent surface. The boot has an outer surface corresponding to the shape and angle of said mounting slot, an exposed surface generally parallel to said adjacent surface, and a motor-receiving slot for receiving said vibration motor, the motor-receiving slot having an axis angled from an axis of the mounting slot and generally normal with respect to the adjacent surface.

Abstract: An apparatus and method for making a compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member. The first dielectric layer has a first major surface and a plurality of through openings. A plurality of electrical traces are positioned against the first major surface of the first dielectric layer. The electric traces include a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer. The first distal ends are adapted to electrically couple with the first circuit member. The second dielectric layer has a first major surface positioned against the electric traces and the first major surface of the first dielectric layer. The second dielectric layer has a plurality of through openings through which the electric traces electrically couple with the second circuit member.

Abstract: An anisotropic connector part (2) made of a rubber elastic element having a conductive part formed by orienting a desired place of a conductive medium by means of a magnetic force and an attaching part (4) having engaging parts (3) to be attached to electronic parts or a substrate are integrating into one place, thereby making it possible to easily perform attachment to the electronic parts or the substrate and also reduce a manufacturing cost and a mount space.

Abstract: An interposer comprising a non-conductive carrier sheet with a pre-arranged pattern of conductive interconnect members positioned therethrough and formed from an elastomeric thermoplastic with suspended spherical and non-spherical conductive particles. The non-spherical conductive particles of the present invention are positioned substantially perpendicularly to and partially through the contact faces of the interconnect member, thereby resulting in higher conductivity and efficiency. The interposer is formed by a mold comprising two sections with first and second sets of vias formed in the first and second mold sections, respectively, which permit the injected elastomer mixture to flow completely through the mold cavity and thereby aligns the non-spherical conductive particles.

Abstract: Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface of the dielectric portion for connection to a first electronic component. A second terminal is disposed on the second surface of the dielectric portion for connection to a second electronic component. The apparatus further includes a passage extending through the dielectric portion along a longitudinal axis oriented at an oblique angle relative to the first surface. The passage is at least partially filled with conductive material electrically connecting the first terminal to the second terminal.

Abstract: The present invention relates to an elastic contact-connecting device. An elastic elevation 3 is applied to a carrier area 2 of a carrier 1. The elastic elevation 3 has a first oblique area 4, a second ramp 5 and a roof area 6. The first oblique area 4 has a lesser inclination (30) with regard to the carrier area 2 than the second oblique area 5. A contact region 20 is applied to the roof area 6 of the elastic elevation. The contact region 20 is connected to other structures 12 on the carrier 1 via a conductor track 10. For this purpose, the conductor track 10 is guided over the first oblique area 4. If a mating contact is pressed onto the contact region 20, the elastic elevation yields, but presses against the mating contact on account of its elastic property and thus enables a reliable contact. In this case, essentially only the second oblique area 5 is deformed; the first oblique area 4 and the conductor track 10 applied thereto are not subjected to any mechanical stress.

Abstract: An Anisotropic Conductive Elastomer (ACE)—based electrical connector that interconnects two or more electrical circuit elements. The connector includes at least two layers of ACE separated by alternate interconnection elements that include conductive elements. The conductive elements provide void space for the ACE elastomer to move to during the interconnection process.

Abstract: An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes.

Abstract: An interface module connector for an interface module card to be used in an electronic device. The interface module connector includes a sheet having raised areas that correspond to the position of the electrical contacts of the interface module card. An electrically conductive compliant material extends through the raised areas, providing electrical contacts for the connector. The connector electrical contacts may be electrically connected to a PCB. The connector may be for a SIM card. A PCB assembly may be provided, including a connector mounted to a PCB, with a shield mounted to the PCB and substantially enclosing the connector. The shield may define a slot to receive an interface module. In one embodiment the PCB may be a PCI Mini Express Card, and in another embodiment the slot adapted to receive the interface module may have a height of approximately 1.35 mm or less.

Abstract: A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with a woven contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the woven contact is spaced away from the at least one of the conductive pads, and a second position where woven contact electrically engages one of the conductive pads.

Abstract: A material for use as part of an internal capacitor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ferroelectric ceramic component, the ferroelectric ceramic component nano-particles having a particle size substantially in the range of between about 0.01 microns and about 0.9 microns and a surface within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.

Abstract: The invention relates to a gas sensor and its method of manufacture. Electrochemical gas sensors usually comprise an external housing, which acts as a reservoir for electrolyte; a wick to keep electrodes wetted with the electrolyte and external electrical terminals, for making electrical contact with the electrodes. Typically a gas permeable/microporous membrane has been used to seal a gas sensor in order to prevent leakage of electrolyte. A problem with existing sensors has been that there was a risk of electrolyte leaking through the membrane around the region where electrical connectors passed therethrough. The present invention overcomes this by providing a method of urging conductive polymer through the membrane under controlled conditions of heat and pressure, thereby ensuring the integrity of the membrane remains in tact while defining an electrically/conductive pathway therethrough.

Abstract: An elastic connector integrated with electrodes on at least either a chip-type LED or a circuit board facing each other is sandwiched and compressed by the chip-type LED and the circuit board so as to provide an electric connection. The thus obtained integrated connector is thin and cost-effective while able to provide a secure conductivity between the electrodes of the printed circuit board and the chip-type LED in a simple connection method, and a LED including the integrated connector also is provided.

Abstract: An area array connector adapted to connect contact pads on a first generally planar circuit element to corresponding contact pads on a second generally planar circuit element is described. The area array connector includes an interposer housing and at least one electrical interconnector positioned within the interposer housing. The at least one electrical interconnector is comprised of a plurality of electrical contacts stacked in a substantially parallel relationship to one another. The at least one electrical interconnector is positioned to make contact with a first contact pad on the first generally planar circuit element and a second contact pad on the second generally planar circuit element to provide an electrical interconnection therebetween.

Abstract: Devices and methods of stressing anisotropic conductive elastomer (ACE) sheet material that defines a plurality of electrical pathways through its thickness. The perimeter of the sheet is mechanically gripped, while leaving an interior portion of the sheet free. A surface over which the interior portion of the sheet is to be stretched is provided, and the sheet and the surface are contacted. The sheet and the surface are then relatively moved, to stretch the sheet over the surface, and thereby stress the interior portion of the sheet.

Abstract: An electrical connector includes an elastomer in the form of a layer, and a plurality of fine conductive wires embedded in the elastomer and extending rectilinearly in vertical directions to front and rear surfaces of the elastomer. The fine conductive wires have an overall length substantially the same as or slightly larger than the thickness of the elastomer so that both the ends of the fine conductive wires extend from the front and rear surfaces of the elastomer. The electrical connector includes a flexible printed circuit board connected to the fine conductive wires. The flexible printed circuit board includes at least three electric contacts arranged substantially concentrically around and electrically connected to each of the fine conductive wires. With this arrangement, the electrical connector enables a stable inspection for integrated circuit pads in a manner which minimizes irregularities in repeatedly measured values of electric resistance and skew.

Abstract: A connector is used for connecting a plurality of first terminals formed on a first electronic part to a plurality of respective second terminals formed on a second electronic part. The connector comprises an intermediate basis material having a spring characteristic, a plurality of first electrically conductive members provided on a first surface of the intermediate basis material, a plurality of second electrically conductive members provided on a second surface of the intermediate basis material, and wiring for connecting each of the first electrically conductive members to a corresponding one of the second electrically conductive members. Such electrically-conductive members may be columnar, tubular, spherical, and the like, and of appropriate width, thickness and material with regard to the characteristic requirements of the intermediate basis material.

Abstract: An interposer includes an array of buttons on a carrier having a proximity to each other that allows contact between two adjacent buttons to occur when at least one of the two adjacent buttons is axially compressed above a predetermined threshold. The chip package includes a chip having a first surface and a second surface, a printed circuit board having a first surface and a second surface, and an interposer having an array of buttons between the chip and the printed circuit board. The first surfaces are closer to each other than the second surfaces.

Abstract: A connector provides electrical connection between an object (21) to be connected having contact portions (23) and a mating connection object (31) having mating contact portions (33). The connection is achieved when the connector is in contact with the contact portions (23) and the mating contact portions (33). The connector has a base member (11), elastic members (13) provided on the base member, electrically conductive patterns (15a, 15b) arranged on the base member so as to provide electrical connection between the front and back surfaces of the base member, and terminals (17) arranged on the elastic members (13) so as to be in contact with the contact portions (23) and the mating contact portions (33). The terminals (17) and the conductive patterns (15a, 15b) are connected to each other. Those portions of the base member (11) where either elastic members (13) or conductive patterns are provided are shaped in a mesh-like form.

Abstract: A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component.

Abstract: An apparatus and method for making a compliant interconnect assembly. The compliant interconnect assembly includes a first carrier having a first major surface and a plurality of through openings. A first major surface of a first flexible circuit member having a plurality of electrical traces is attached to the first major surface of the first carrier. The electrical traces include a plurality of compliant members having at least one distal end projecting in one of the openings of the first carrier. A first major surface of a second carrier is positioned opposite a second major surface of the first flexible circuit member. The second carrier has a plurality of through openings aligned with the plurality of the compliant members.

Abstract: A display module is composed of: a display panel (1) including a display layer and a terminal pattern (1c) connected with an electrode for driving the display layer and formed on the edge portions of the display panel; and a flexible board (2) including a main portion (2a) having an electrode terminal for establishing electrical connection with the terminal pattern and having a geometry approximately the same as the display panel, and a connector portion (2b) connected to the electrode terminal and used for establishing connection with an external circuit. The flexible board is integrated with the display panel by overlapping the main portion with the display panel, and the electrode terminal is arranged so as to face the terminal pattern and connected with the terminal pattern.

Abstract: A method and apparatus for achieving a fine pitch interconnect between a flexible circuit member and another circuit member with co-planar electrical contacts that have a large range of compliance. The interconnect assembly includes a substrate with one or more compliant raised portions. At least one flexible circuit member having a first surface with a plurality of contact pads and a second surface is provided. The substrate is located along the second surface of the flexible circuit member with the compliant raised portions aligned with the contact pads so that the compliant raised portions bias the contact pads with corresponding contact pads on the first circuit member when in a compressive relationship.

Abstract: An interconnect assembly to electrically interconnect one or more integrated circuits to an electronic device may comprise a base package to couple to a circuit board of the electronic device. A terminal mezzanine package may support the integrated circuit(s) above the base package. A first set of conductors of a first material and design carry low-frequency signals between the base and terminal connector packages. A second set of conductors of a second material and design carry high-frequency signals. In particular embodiments the base package may comprise a base mezzanine integrating one or more additional integrated circuits and intermediate mezzanines supporting one or more additional integrated circuits each and enabling multi-story modular interconnection structures. In particular embodiments, the second set of conductors may comprise columns of compressible polymer compound embedded with metallized particles, and the columns may be dispersed amongst pins and sockets of a pin-grid array.

Abstract: A contact sheet is provided including two insulative base sheets having a plurality of through-holes formed therethrough in an array pattern and a plurality of conductive contacts interposed between the insulative base sheets. Each contact includes a fixed part bonded to an end of a respective through-hole and an integral moving part contiguous with the fixed part. The moving part includes a contact portion formed as an elastic cantilever. Part of the moving part protrudes from one side of the base sheet inside the through-hole and the contact portion elastically extends from the other side of the base sheet. The total area of the through-hole and the fixed part of the contact is greater than a unit grid area formed by an arrangement of the terminals of an electronic device, and the length of the moving part, including the contact portion, substantially corresponds to the overall length of the through-hole.

Abstract: An assembly having a thermosetting layer pierced by a plurality of conductors is formed on a release sheet and subsequently sandwiched between an IC and a PWB or other supporting surface and subsequently cured. The release sheet is removed either before or during curing of the thermosetting material. Removal prior to curing may be accomplished via peeling. Removal during curing may be by destruction of the layer by the curing process.

Abstract: A batch electrically connecting sheet makes it possible to form an electric connection with mechanical, thermal, and electrical stability at plural points of contact. A batch electrically connecting sheet comprises a heat-resistant sheet having plural perforations, conductive blocks, inserted in the perforations, having ridges including indentations and projections; the projections are outstanding from the perforations, and the conductive blocks are thicker than the heat-resistant sheet, and the heat-resistant sheet has an adhesive layer composed of a heat curable adhesive agent applied on at least one surface thereof, covering the projections of the conductive blocks.

Abstract: An area array connector adapted to connect contact pads on a first generally planar circuit element to corresponding contact pads on a second generally planar circuit element is described. The area array connector includes an interposer housing and at least one electrical interconnector positioned within the interposer housing. The at least one electrical interconnector is comprised of a plurality of electrical contacts stacked in a substantially parallel relationship to one another. The at least one electrical interconnector is positioned to make contact with a first contact pad on the first generally planar circuit element and a second contact pad on the second generally planar circuit element to provide an electrical interconnection therebetween.

Abstract: A land grid array includes a flat-plate connector plastic housing having a plurality of terminal grooves, and a plurality of terminals having a pair of contact points and disposed in the various terminal grooves, wherein the contact points serve as connecting structures between a circuit board and another circuit board, or between an integrated circuit and a circuit board. Each terminal is formed by bending an integral metal plate, and has a fixing portion, a flexible portion and a signal transmission portion. The terminal is capable of reducing overall stress, such that the signal transmission portion is easily deformed without leaving permanent deformation. Meanwhile, wiping motions by the contact points are performed between a circuit board and another circuit board, or between an integrated circuit and a circuit board for removing oxidized thin-films on contact surfaces involved.

Abstract: A plasma display device which improves the adhesion rate of a thermal conductive medium. A chassis base is disposed substantially parallel to a plasma display panel. A thermally conductive medium is disposed between the plasma display panel and the chassis base and is closely adhered to both the plasma display panel and the chassis base. An adhesive pad is interposed between the plasma display panel and the chassis base along the edge of the thermally conductive medium and is adhered to both the plasma display panel and the chassis base. The thermally conductive medium includes a plurality of thermally conductive particles of high thermal conductivity.

Abstract: A very high bandwidth electrical interconnect for conducting signals at high frequency. The interconnect includes a number of separate fine wire structures. Each such fine wire structure is made up of a string of generally spherical elements, each such element having a ferromagnetic core and a conductive coating over the core. The interconnect also includes an insulating medium surrounding the wire structures.

Abstract: An elastomeric device for interconnecting two or more electrical components, comprising, an elastomeric matrix having one or more outer surfaces; one or more electrically conductive pathways through the matrix; and one or more electrically conductive contact pads, wherein at least a portion of one or more of the pads is flush with or extends outward from one or more of the outer surfaces of the matrix, and wherein at least a portion of the pad is in at least intimate contact with one or more of the pathways; and methods for making same.

Abstract: Fiber optic modules, retention mechanisms, cages or receptacles and their electrical connections. An conductive elastomer is used to provide an electrical connection between contacts of a fiber optic module and contacts of a host printed circuit board or between contacts of a fiber optic module and contacts of an electrical connector. Hot-pluggable electrical connections for fiber optic modules are also described including parallel data connections for small form factor fiber optic modules.

Abstract: An elastomer interposer employed between a package and a printed circuit board and the method of manufacturing the same are disclosed. The elastomer interposer includes an elastomer, a plurality of conductive wires, Cu pads, solder resistant blocks and Ni/Au plated pads. The elastomer has two contact surfaces. The conductive wires are arranged inside the elastomer at a certain interval and tilted toward one of the contact surfaces with an inclined angle. The Cu pads are formed on both of the surfaces at a space, and electrically connected to the corresponding conductive wires. Also, the Ni/Au plated pads are formed over the Cu pads.

Abstract: To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a printed circuit board (PCB). In one embodiment, the IC package is mounted on the substrate using a land grid array arrangement. Corresponding lands on the IC package and substrate are coupled using a solderless compression connector. The compression connector includes a plurality of electrically conductive elements, such as compressible button contacts, and an apertured support that aligns the button contacts with corresponding lands on the IC package and substrate. In another embodiment, the connector includes electrically conductive pins embedded in a thin plastic sheet. In a further embodiment, the connector includes a microcrystalline film having electrically conductive crystals. In a further embodiment, the compression connector is used within an IC package to couple an IC to an IC package substrate.

Abstract: The invention includes an interposer, BGA connector, or other connection device that provides electrical contact with a ball grid array connector. The inventive interposer includes a housing with contacts. The contacts have a first end and a second end. The interposer also includes a first body and a second body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts. The first body and the second body provide an electrical contact between the interposer and a single body of reflowable, electrically conductive material of the ball grid array connector.

Abstract: An interconnect component comprises a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through the compliant layer. The first ends extend generally parallel to said first surface.

Abstract: Described are modular water sensors designed to speed assembly and otherwise improve manufacturability. Various sensors, modules, and cables communicate via connector systems that employ elastomeric conductors to establish and maintain electrical contact between perpendicular wiring-board surfaces. The elastomeric conductors are held in place using easily assembled systems of clips and retainers.

Abstract: An apparatus for applying a mechanically-releasable balanced compressive load to an assembly such as a compliant electrical connector that electrically connects an electrical device to a first side of a two-sided substrate. The apparatus includes a backup plate coupled to the second side of the substrate, a rocker plate behind the backup plate, the rocker plate touching the backup plate at only one location, and a rigid member coupled to the first side of the substrate. There are three or more pins mechanically coupled to the rocker plate and the rigid member. When there are four or more pins, a rocker member is mechanically coupled to two of the pins, and in contact with the rocker plate at a single pivot. A compressible spring, mechanically coupled to a pin, applies a force, coupled through the pin, to urge the backup plate and rigid member together and thereby compress the compliant electrical connector between the electrical device and the substrate to make the separable electrical connection.

Abstract: A conductive contact element is characterized by molding and curing a conductive silicone rubber composition comprising

Abstract: A pin-array, separable, compliant electrical contact member for separably, electrically interconnecting a first electrical device having electrical contacts to a second electrical device having electrical contacts. The inventive device includes a probe housing having a thickness, and defining a plurality of openings through the thickness, one or more pin probes, each pin probe located in and protruding from an opening in the probe housing, and each defining an enlargement larger than the opening in which the pin is located, to inhibit lateral pin motion, and also prevent the pins from being removed from their openings vertically in at least one direction, and a layer of Anisotropic Conductive Elastomer (ACE) adjacent to the probe housing and comprising a plurality of conductive chains of particles through the layer thickness and aligned generally perpendicularly to the layer's major surfaces.