Abstract: A socket and methods of manufacturing the socket are disclosed. The socket facilitates electrical interconnection. In an embodiment, the socket includes an insulating substrate having a first surface and a second surface that is on an opposite side relative to the first surface. The insulating substrate includes a plurality of apertures each aperture providing a passage between the first and second surfaces. Moreover, the socket includes a plurality of conductive contacts. Each conductive contact is positioned in a respective one of the apertures such that a first end of the conductive contact extends from the first surface and a second end of the conductive contact extends from the second surface. Additionally, each conductive contact is comprised of a foam metal. Alternatively, each conductive contact is comprised of a foam metal and an elastomer.

Abstract: A connector for board-to-board or board-to-socket interconnect applications includes a plurality of conductive elastomeric columnar contacts surrounded by an insulative body. In one embodiment employed in board-to-board applications, the columnar contacts are substantially longer than wide to facilitate mounting of components between opposed boards. The conductive columnar contacts extend slightly beyond the surfaces of the insulative body. The body may include integral raised collars that surround opposing ends of the conductive columnar contacts and at least one stop flange integral with the body that limits overstress on tips of the conductive columnar contacts.

Abstract: An electrical connector includes at least a first contact element and a second contact element, wherein each of the first and second contact elements include alternating conductive materials and nonconductive materials. An insulating layer separates the first contact element and the second contact element. The insulating layer divides the first and second contact elements into dedicated contact regions and has a length to prevent the first contact element and the second contact element from contacting more than one terminal contact surface on an electrical component.

Abstract: A method of making electrical connecting elements includes a metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a substrate 17 having a transfer layer 16 of adherent (or adhesive) material applied to one side surface thereof is provided; and the transfer layer 16 side of the substrate is brought into intimate contact with the metallic thin film 15 laid over the protrusions 12, followed by pulling the transfer layer apart from the mold so as to transfer the metallic thin film 15 covering the protrusions 12 onto the transfer layer 16 to thereby form the conductor pattern 18 on the transfer layer 16.

Abstract: A connector for board-to-board and board-to-device interconnect applications includes a plurality of conductive elastomeric columnar contacts arranged in a contact array and retained in a first plurality of openings in an insulative substrate and a plurality of stops retained in a second plurality of openings in the insulative substrate. The stops are dispersed among the contacts of the contact array or positioned on the periphery of the contact array and located in non-abutting relation with respect to adjacent contacts. The contacts and the stops have opposing end surfaces and the end surfaces of the contacts are located a greater distance from the substrate than the end surfaces of the stops such that the stops limit the compression of the elastomeric contacts when the connector is disposed in its intended mounting orientation.

Abstract: A portable testing apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board. Included is a housing assembly having a size and shape to simulate an integrated circuit assembly to be tested; a loading element coupled for movement relative to the housing assembly and engageable with a load detecting system for transferring forces thereto in response to forces applied by a force applying apparatus; an interposer which mates the housing assembly to a circuit board; and, a load detecting system associated with the housing assembly for providing signals representative of characteristics of loading forces applied thereto by a force applying apparatus, whereby the load delivery characteristics of a force applying apparatus can be determined. A method of testing is also provided.

Abstract: A contact member formed with a flat metal structure and an integrated elastomeric body. The contact member can be used to ground a printed circuit board (PCB) with a surrounding housing. The housing loads the contact member in a direction perpendicular to the face of the PCB. The elastomeric body supports the flat metal structure during repeated cycles of loading and unloading of the contact member. The elastic resiliency of the elastomeric body can help to reduce the effects of plastic deformation of the contact member, resulting in more reliable electrical connections a source outside of the PCB. And the elastomeric body does not require adhesive or separate fixing devices to hold it in place.

Abstract: A metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a substrate 17 having a transfer layer 16 of adherent (or adhesive) material applied to one side surface thereof is provided; and the transfer layer 16 side of the substrate is brought into intimate contact with the metallic thin film 15 laid over the protrusions 12, followed by pulling the transfer layer apart from the mold so as to transfer the metallic thin film 15 covering the protrusions 12 onto the transfer layer 16 to thereby form the conductor pattern 18 on the transfer layer 16. The metal film may include cooper and a weak adherence layer 13 which may be gold.

Abstract: A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact structures can be adapted for making contact with leads having a very fine pitch. In a first embodiment, the contact structures include raised members formed over a body of the interposer. A conductive layer is formed over each of the raised members to provide a contact surface for engaging the leads of the chip package. In another embodiment, the raised members are replaced with depressions formed into the interposer. A conductive layer is formed on an inside surface of each depression to provide a contact surface for engaging the leads of the chip package. Moreover, any combination of raised members and depressions may be used.

Abstract: An IC socket for an IC package as an electrical part has a socket body to which a number of contact pins are arranged so as to establish an electrical connection between a printed circuit board and a terminal of the IC package. The contact pin comprises a first contact piece disposed on an electrical part side so as to contact the terminal of the electrical part and a second contact piece disposed on a printed circuit board side so as to contact the printed circuit board. When the first contact piece contacts the terminal and is pressed, the first contact piece is inclined and a contact end portion of the first contact piece is moved so as to slide with respect to the electrical part.

Abstract: An array of contacts for electrically connecting a semiconductor package to a circuit board. The contacts are carried by a tape having an adhesive border. The tape, along with the contacts, are applied easily to either the substrate or the circuit board using the adhesive border. Each contact is made of two S-shaped pieces in perpendicular directions. The contacts are inserted into holes in the tape and held there by friction.

Abstract: A connector assembly having a supporting boot and a connector that is retained with the boot and a method for producing the connector assembly. The boot serves as a retention member that includes a through opening sized to receive the connector. The boot includes first and second opposing surfaces. In a preferred embodiment, the opening at the second surface of the boot is sized for an interference fit with the connector. The opening adjacent the first surface of the boot is larger than the opening at the second body surface. The differential sizes of the though hole openings at respective ends of the through-hole provides a flow channel between the connector and the boot. Wells are provided in the first surface of the boot for a binding agent. A liquid binding agent that is injected into the wells flows through the flow channel and securely fixes the connector within the boot.

Abstract: A connector for board-to-board and board-to-device interconnect applications includes a plurality of conductive elastomeric columnar contacts arranged in a contact array and retained in a first plurality of openings in an insulative substrate and a plurality of stops retained in a second plurality of openings in the insulative substrate. The stops are dispersed among the contacts of the contact array or positioned on the periphery of the contact array and located in non-abutting relation with respect to adjacent contacts. The contacts and the stops have opposing end surfaces and the end surfaces of the contacts are located a greater distance from the substrate than the end surfaces of the stops such that the stops limit the compression of the elastomeric contacts when the connector is disposed in its intended mounting orientation.

Abstract: This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths as narrow as 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is preferably used to fabricate the interconnection circuits. A multi-layer interconnection circuit is fabricated on the glass panel using a release layer. A special assembly layer is formed over the interconnection circuit comprising a thick dielectric layer with openings formed at input/output (I/O) pad locations. Solder paste is deposited in the openings using a squeegee to form wells filled with solder. IC chips are provided with gold stud bumps at I/O pad locations, and these bumps are inserted in the wells to form flip chip connections. The IC chips are tested and reworked. The same bump/well connections can be used to attach fine-pitch cables.

Abstract: An anisotropic conductive elastic connector of the present invention includes plural linear conductors arranged in the thickness direction of an insulation elastic resin material. On the side face of the linear conductor, an electric insulation coating having a withstand voltage of 1 V/&mgr;m or more is formed in a thickness of 1 &mgr;m or more. The linear conductors are arranged with a pitch interval of 0.01 mm or less or are adjacent to each other in the direction of the arrangement. Thus, an anisotropic conductive elastic connector, which does not cause a short even if metal fibers are arranged with high density, is provided.

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.

Abstract: A pin grid array integrated circuit connecting device which including a substrate, a sliding slice, a guiding frame and a driving apparatus. Said substrate further includes multiple holes to hold pins of a integrated circuit package, multiple conductive positioning components in the holes to hold said pins and connect said pins electrically, circuit device with proper circuit layout and multiple electrical connecting spots on the bottom of said substrate which connecting said multiple conductive positioning components thru said circuit device. The extra electronic components placed on said substrate will provide the additional function. Said sliding slice is placed on the top of said substrate and can be moved relatively. Multiple holes are placed on said sliding slice and positioned correspondingly to the holes on said substrate. Said guiding frame is placed on at least the two opposite sides of said substrate which guide said sliding move linearly along the extension of said guiding frame.

Abstract: An elastomeric connector assembly for electrically coupling electronic components comprises a first contact member extending from a surface of a first electronic component in a generally vertical plane for providing electrical connection to the first electronic component and a second contact member extending from a surface of a second electronic component in a generally vertical plane for providing electrical connection to the second electronic component. An elastomeric connector is disposed between the first contact member and the second contact member in a generally horizontal plane. The elastomeric connector couples the first contact member and the second contact member for providing an electrical connection between the first and second electronic components.

Abstract: A socket and methods of manufacturing the socket are disclosed. The socket facilitates electrical interconnection. In an embodiment, the socket includes an insulating substrate having a first surface and a second surface that is on an opposite side relative to the first surface. The insulating substrate includes a plurality of apertures each aperture providing a passage between the first and second surfaces. Moreover, the socket includes a plurality of conductive contacts. Each conductive contact is positioned in a respective one of the apertures such that a first end of the conductive contact extends from the first surface and a second end of the conductive contact extends from the second surface. Additionally, each conductive contact is comprised of a foam metal. Alternatively, each conductive contact is comprised of a foam metal and an elastomer.

Abstract: As an anisotropic conductive film capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at a low temperature at which the circuit board is not deteriorated, an anisotropic conductive film is provided, which has a plurality of conductive paths 2 insulated from each other and penetrating the film substrate 1A in the direction of the thickness of the film substrate, both ends 2a and 2b of each conductive path being exposed to the top and back faces of the film substrate, wherein the film substrate 1A is mainly composed of a polycarbodiimide copolymer having a structure represented by formula (I) below: R3—NCN&Brketopenst;&Parenopenst;R2—NCN&Parenclosest;nR2—A&Parenopenst;R1—O—CO—O&Parenclosest;mR1—A—R2&Brketclosest;x&Parenopenst;NCN—R2&Parenclosest;nNCN—R3  (I) wherein m represents an integer of 2-50; n represents an integer of 1-30; x represents an i

Abstract: A connector for board-to-board and board to device interconnect applications includes a plurality of conductive elastomeric columnar contacts surrounded by respective insulative support columns. The elastomeric columnar contacts extend through holes in an insulative subtrate. The insulative support columns have opposing end surfaces disposed on opposite sides of a substrate and end surfaces of the columnar contacts are located at a distance from the substrate slightly greater than the distance between the substrate and the support column end surfaces. Insulative intermediate columns serve a mechanical stops that resist further compression of the elastomeric contacts and the support columns when the connector is subjected to excessive axial compressive forces. The intermediate columns have opposing end surfaces on opposing sides of the substrate that are spaced from the substrate a distance less than the support column end surfaces.

Abstract: An elastomeric connector assembly for electrically coupling electronic components comprises a first contact member extending from a surface of a first electronic component in a generally vertical plane for providing electrical connection to the first electronic component and a second contact member extending from a surface of a second electronic component in a generally vertical plane for providing electrical connection to the second electronic component. An elastomeric connector is disposed between the first contact member and the second contact member in a generally horizontal plane. The elastomeric connector couples the first contact member and the second contact member for providing an electrical connection between the first and second electronic components.

Abstract: An Anisotropic Conductive Elastomer (ACE)—based electrical connector that interconnects two or more electrical circuit elements. The connector includes at least two layers of ACE separated by alternate interconnection elements that include conductive elements. The conductive elements provide void space for the ACE elastomer to move to during the interconnection process.

Abstract: An optically transparent elastomeric electrical interconnect, the interconnect made from an optically transparent elastomeric material, with a number of conductive elements embedded in the elastomeric material and defining conductive pathways through the material.

Abstract: A shielded carrier with electrical components is provided, resulting in LGA interposer connectors with improved electrical performance and enhanced functionality. The carrier includes components such as resistors and capacitors on and/or in the carrier. The components are preferably of the surface mount variety or are imbedded within the carrier, due to the inherent lower profile of these form factors. Decoupling capacitors and terminating resistors are two examples of components that may improve performance.

Abstract: In the invention the various effects of temperature and responsiveness in the technology is moderated in the resulting interconnect structure by building into the supporting frame arrangement a selected thermal expansion property that operates to exert some control on the thermal dimensional aspects of the elastomeric interconnect in its' fabrication and throughout its' service. In accordance with the invention the materials involved in the interconnect and frame are at least partially provided with a selected coefficient of thermal expansion (CTE) property that provides a direction and magnitude aspect in the structure that operates to compensate for dimensional changes to the interconnects that may occur to the array in fabrication and service.

Abstract: A socket comprises a substrate having a plurality of cavities extending therethrough. The socket also comprises an electrically-conductive carbon nanotube structure disposed within at least one of the cavities.

Abstract: The present invention is directed to an electrocardiogram electrode connector for connecting an electrode to an electrocardiogram device that solves the problems with the Prior Art noted above as well as providing numerous advantages. The connector of the present invention comprises a lower portion having an electrode end and an ECG end, and an upper portion pivotally connected to the lower portion. The upper portion likewise has an electrode end and an ECG end. The connector also comprises a spring between the lower portion and the upper portion to bias the electrode ends together to clamp about an electrode. Further, the connector comprises an electrical assembly having an elastomeric electrical connector to provide electrical continuity between the electrode and the ECG device when the electrode ends of the lower portion and the upper portion of the connector are biased together.

Abstract: A Z-axis electrical contact may be formed using a resinous deposit containing conductive particles which may align along surface regions to form an electrical conduction path over the resinous material. If the resinous material is thermoplastic, the material may be heated to mechanically bond to contact surfaces. Advantageously, the resinous material may be formed by forcing a resinous matrix containing conductive particles through an annular opening in a stencil. The resulting member allows surfaces to be contacted which may be irregular or may be covered by native oxide layers.

Abstract: An anisotropically conductive sheet comprises an anisotropically conductive functional region part exhibiting conductivity in its thickness-wise direction and an insulating peripheral region part located about the functional region part. The thickness of the functional region part is greater than that of the peripheral region part. The difference in thickness makes a space for inserting a holding tip part of a carrier between a target to be electrically connected and an upper surface of the peripheral region part.

Abstract: A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

Abstract: A thin profile electrical connector includes an insulating body member having a longitudinally extending leg defined between opposite ends. A plurality of adjacently disposed and spaced apart connector elements are mounted on the longitudinal leg, for example within recesses or grooves defined transversely to the longitudinal leg. Each connector element includes a closed end and an open end defined by extending arms. The closed end wraps around the longitudinal leg at each connector position. Each connector element includes outwardly facing contact surfaces defined on each of the extending arms for mating contact with respective pads of separate facing circuit boards.

Abstract: A holder 1 forming monolithically a holder portion for holding a small size sound device 2 and an elastic conductive connector 11 for electrically connecting said small size sound device 2, wherein an acoustically required communication sound hole 13 is provided on a point corresponding to the sound hole 22 on the back face of the small size sound device 2 and, moreover, a test electrode section 14 used for leak test is provided, separately from the elastic conductive connector 11, without obstructing the acoustically required sound hole 13 on the back face of the small size sound device 2, and allowing also to simplify the mounting process, reduce the production cost, reduce the mounting position space of the small size sound device 2, and facilitate the leak test of the small size sound device 2.

Abstract: A miniature microphone component comprises a miniature condenser microphone, conductive rubber contacts formed and fixed on a terminal area of the miniature microphone and a rubber casting (also called “bushing”) for protection against vibrations covering the circumference of the miniature microphone. To install the miniature microphone component, it is sufficient to insert the miniature microphone component into a small-size communication device so that the conductive rubber contacts formed and fixed on the terminal area of the miniature microphone are pressed against terminal portions on a circuit board. Thus, the working efficiency of the assembly can be considerably increased and the installation space can be minimized.

Abstract: The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: The present invention provides a method for sanding heads of buckling beam probes while the probes are disposed within a probe assembly between a lower die and upper die. Sanding provides that all the probes within a probe assembly have the same total length from tip to head. The method calls for contacting the probe tips to a flat fiducial plate such as a glass plate to ensure that the probe tips are coplanar. Then, the heads are sanded to a plane which is parallel with the fiducial plate. Preferably, the heads are sanded by placing the assembly and fiducial plate onto a Z-stage capable of moving in a Z direction. The Z-stage is located under a top surface of a table having a hole directly above the Z-stage. Raising the Z-stage lifts the probe heads to extend above the top surface of the table. Then, an abrasive plate resting on the top surface of the table is rubbed on the heads. Material is removed from the heads until all the probes are the same length.

Abstract: The present invention is directed to a structure comprising a substrate having a surface; a plurality of elongated electrical conductors extending away from the surface; each of said elongated electrical conductors having a first end affixed to the surface and a second end projecting away from the surface; there being a plurality of second ends; and a means for maintaining the plurality of the second ends in substantially fixed positions with respect to each other. The structure is useful as a probe for testing and burning in integrated circuit chips at the wafer level.

Abstract: A thermally efficient printed circuit board for a ball grid array (BGA) integrated circuit package. The printed circuit board includes a first outer conductive plane located on a top surface of a substrate. A portion of the first outer conductive plane is covered with a solder mask. The solder mask has an opening that exposes a portion of the first outer conductive plane. A solder ball of the BGA package is attached to the exposed portion of the conductive plane to mount the package to the printed circuit board. The outer conductive plane has a wide area that provides a relatively efficient thermal path to conduct heat that flows through the solder ball from the integrated circuit package. Additionally, the outer conductive plane is coupled to internal conductive planes by a plurality of vias. The internal conductive planes further dissipate the heat which flows from the package into the printed circuit board.

Abstract: An interconnection component with integral conductive elastomeric sheet material, comprising a connector frame and an elastomeric conductive polymer interface (ECPI) integrally coupled to the connector frame, the ECPI defining a series of spaced conductive columns through its thickness. Also described is a method of forming an interconnection component with integral conductive elastomeric sheet material, comprising providing a connector frame, casting uncured elastomeric conductive polymer interface (ECPI) material onto the connector frame, and curing the ECPI in the presence of a magnetic field, to integrally couple the ECPI to the connector frame, and create a series of spaced conductive columns through the ECPI thickness.

Abstract: An electrical connector includes a electrical connector extending between a pair of mechanical connectors to electrically couple circuits, and a supporting member between the mechanical connectors to reduce twisting of the electrical connector. The supporting member cambered to permit the mechanical connectors to translate with respect to one another. A clamping member includes a tapered clamping surface in an undeformed, unclamped position. The clamping member bends when in a clamped position, resulting in approximately planar clamping surface. Resilient pressure pads on the clamping members bias the electrical connector to the circuit board. The pressure pads are mounted in wells in the clamping members to support a sidewall of the pressure pads. Frames provide additional support to the sidewalls of the pressure pads. The pressure pads include a raised edge along a periphery of a contact surface of the pressure pad.

Abstract: A connector of a modular machine board disposed on an inner edge of a back board of a display apparatus of an electronic device contacts with joint points of the electronic device, such that metal resilient pieces of said connector are assured to tightly contact with said joint points by means of the resilience of resilient component. As a result, even under vibration, the resilient component can regulate the up-and-down position of said connector along with vibration force to enable the metal resilient pieces to maintain a tight contact at the joint points of the electronic device.

Abstract: An electronic package assembly for electrical interconnection between two electronic modules having differing conductive array parameters is disclosed. The electronic package assembly includes two electronic modules, providing between the two electronic modules an interposer having a top surface and a bottom surface; a first set of conductive arrays having a first conductive array parameter on the top surface, and a second set of conductive arrays having a second conductive array parameter on the bottom surface, the second conductive array and the first conductive array having differing parameters.

Abstract: An elastomeric device for interconnecting two or more electrical components. The device includes an elastomeric matrix having one or more outer surfaces, one or more electrically conductive pathways through the matrix, and a frame for stretching the elastomer perpendicular to the electrical pathways.

Abstract: Disclosed is an interposer for electrically coupling two electrical components having different coefficients of thermal expansion (CTEs). The interposer has two substrates which have different CTE values, with each substrate having a first surface and a second surface. The interposer has electrical connectors located on the first surfaces of the two substrates, the connectors for making electrical connections to the two corresponding electrical components. A flexible-circuit layer is disposed between the two substrates and interconnects the connectors on the first substrate to the connectors on the second substrate. The two substrates are folded such that their second surfaces confront one another, where they may be attached to one another. General methods of making interposers for electrically coupling two electrical components are disclosed.

Abstract: A method of manufacturing an interconnector that is interposed between a pair of terminal plates each having electrodes arranged in a predetermined pattern, for electrically connecting the electrodes of the terminal plates, including arranging positioning plates in a container and inserting conductive wires into through holes of the positioning plates. Then forming a stacked body by alternately forming stacked insulating sheet layers and synthetic resin layers, in the container and thereafter cutting the stacked body at a middle portion of each synthetic resin layer before separating the synthetic resin layers from the insulating sheet layers, thereby forming interconnectors.

Abstract: A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together.

Abstract: A support assembly for mounting a semiconductor device vertically relative to a carrier substrate. The support assembly includes an interposer to which the semiconductor device is attached. The support assembly also includes traces carried on the interposer, which electronically connect the semiconductor device to contacts on the interposer. The contacts are disposed along a single edge of the interposer. The invention also includes an alignment device for releasably mounting the support assembly. The alignment device, which mounts to a carrier substrate, includes one or more receptacles. As a support assembly is inserted into a receptacle, the alignment device establishes an electrical connection between the contacts and corresponding terminals on the carrier substrate. The assembly may also include a cover that attaches to the top of the alignment device and biases the interposer against the carrier substrate.

Abstract: A grid array interconnect structure and method for interconnecting and removing a high density multichip interconnect decal, or grid array package, to and from a printed wiring board. The interconnect structure comprises conductive epoxy interconnects and nonconductive transfer tape that has adhesive disposed on both sides thereof. The transfer tape is applied to the back of the high density multichip interconnect decal or package. Conductive epoxy is disposed in pre-formed holes of the two-sided transfer tape and is partially cured to a semi-rigid condition to form the conductive epoxy interconnects. A mylar film may be applied to the exposed surface of the transfer tape. With the mylar film removed from the surface of the transfer tape, the decal or package is secured to the printed wiring board and a slight force is applied. This assembly is then cured.

Abstract: An anisotropic conductive film 1 comprising an insulating film 2 and plural conductive paths (3, 4), wherein the plural conductive paths are insulated from each other and penetrate the insulating film 2 in the thickness direction of the film, with both ends of the paths being exposed on both surfaces of the insulating film, and wherein a conductive path 3 capable of contact with an electrode 12 of a semiconductor element 11 and a circuit 14 of a circuit board 13 has at least one end protruding more than an end on the same side of a conductive path incapable of contact with the electrode and the circuit. The ACF of the present invention can prevent a conductive path not involved in electrical connection from being in contact with a part other than an electrode of a semiconductor element and/or a part other than a circuit of a circuit board.