And Feeding Of Tool Or Work Holder Patents (Class 451/10)
  • Patent number: 10166649
    Abstract: A machining apparatus for a workpieces includes an upper turn table support mechanism supporting an upper turn table from above to be vertically movable by a cylinder extending along a rotational axis direction of the table, a horizontal plate fixed to the cylinder so that a main surface thereof becomes perpendicular to a longitudinal axis of the cylinder, at least three displacement sensors which measure horizontal plate surface height positions when the upper turn table has moved down to a fixed position, and a control apparatus to calculate a relative upper turn table height position and an angle formed between the upper turn table rotational axis and the cylinder longitudinal axis from the horizontal plate surface height positions measured by the displacement sensors. A workpiece holding abnormality can be accurately and quickly detected before machining the workpiece to avoid damage, and an cylinder eccentric angle can be detected during machining.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: January 1, 2019
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Taichi Yasuda, Tatsuo Enomoto
  • Patent number: 10068785
    Abstract: An embodiment relates to a wafer loading apparatus of wafer polishing equipment.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: September 4, 2018
    Assignee: SK SILTRON CO., LTD.
    Inventor: Jae Hyun Bae
  • Patent number: 10037889
    Abstract: The present invention provides methods for chemical mechanical polishing (CMP polishing) spin coated organic polymer films on a semiconductor wafer or substrate as part of lithography or as part of electronic packaging. The methods comprising spin coating an organic polymer liquid on a semiconductor wafer or substrate; at least partially curing the spin coating to form an organic polymer film; and, CMP polishing the organic polymer film with a polishing pad and an aqueous CMP polishing composition having a pH ranging from 1.5 to 4.5 and comprising elongated, bent or nodular silica particles containing one or more cationic nitrogen or phosphorus atoms, from 0.005 to 0.5 wt. %, based on total CMP polishing composition solids, of a sulfate group containing C8 to C18 alkyl or alkenyl group surfactant, and a pH adjusting agent.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: July 31, 2018
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Julia Kozhukh, Lee Melbourne Cook, Michael E. Mills
  • Patent number: 9991145
    Abstract: A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into and out of the stocker setting section.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: June 5, 2018
    Assignee: EBARA CORPORATION
    Inventor: Yoshio Minami
  • Patent number: 9970754
    Abstract: A surface measurement device includes a rotating platform, a motion lever, a measuring module and a control module. The rotating platform rotates an object at a rotating speed. The motion lever is above the rotating platform. The measuring module moves to a variety of measuring positions on the motion lever. When the measuring module is at one of the measuring positions, the measuring module measures the heights of a plurality of sampling points on the surface of the object in a sampling frequency. The control module selectively modifies the rotating speed of the rotating platform or the sampling frequency of the measuring module according to the measuring position of the measuring module to make the distance between the sampling points in at least a region of the surface of the object match a sampling rule.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: May 15, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Hung Cho, Kai-Ping Chuang, Yi-Wei Chang
  • Patent number: 9886027
    Abstract: A lens processing management system includes a lens processing section that processes a lens based on design data, an authentication section that is substantially attached to a lens material or a semi-finished lens product, and an authentication processing section that performs an authentication process for the processing of the lens using the authentication section.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: February 6, 2018
    Assignees: NIKON-ESSILOR CO., LTD., NIKON CORPORATION
    Inventors: Yoshinori Yoshida, Yukio Honma, Hideya Inoue, Koji Yamagaki
  • Patent number: 9836039
    Abstract: A method and system simulates a work process on a machine tool using a virtual machine. The virtual machine is set up to simulate the work process on the machine tool using machine data, workpiece data, and tool data as a function of numerical control (NC) control data and programmable logic control (PLC) control data. The work process is simulated on a platform that comprises a plurality of processor cores, wherein the work process is simulated in partial simulations that run in parallel on different processor cores.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: December 5, 2017
    Assignee: DMG ELECTRONICS GMBH
    Inventors: Peter Pruschek, Rudolf Hahn, Bruno Willi, Michael Tarnofsky
  • Patent number: 9835449
    Abstract: A surface measuring device includes a rotary platform, a shifting lever, a measuring module, and a control module. The rotary platform carries an object under test and rotates the object under test at a rotating speed. The shifting lever is above the rotary platform. The measuring module disposed on the shifting lever moves to measurement positions on the shifting lever and performs a surface height measurement at a sampling frequency to sampling points on a surface of the object under test when located at one measurement position. The control module selectively adjusts the rotational speed for the rotary platform or the sampling frequency for the measuring module according to the measurement position of the measuring module on the shifting lever in order to fit a distance between the sampling points on at least one part of the surface of the object under test to a sampling rule.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: December 5, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Hung Cho, Kai-Ping Chuang, Ming-Cheng Tsai
  • Patent number: 9808906
    Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: November 7, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Shou-Sung Chang, Takashi Fujikawa, Hung Chih Chen, Paul D. Butterfield
  • Patent number: 9694467
    Abstract: A polishing method of polishing a substrate includes moving a stopper from a predetermined initial position by a distance corresponding to a target polishing amount of a substrate. The method further includes pressing a polishing tool against the substrate by a pressing member while rotating the substrate. The method further includes polishing the substrate until a positioning member which moves together with the pressing member is brought into contact with the stopper.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: July 4, 2017
    Assignee: EBARA CORPORATION
    Inventors: Masaya Seki, Tetsuji Togawa
  • Patent number: 9682458
    Abstract: The present disclosure relates to a technical field of manufacturing a display device, and more particular to a method and a device for controlling a grinding of a flexible substrate. The method includes: grinding an etching side of the flexible substrate; irradiating the flexible substrate with infrared rays or near infrared rays, receiving waves reflected by a side opposite to the grinding side and waves reflected by the grinding side of the flexible substrate respectively, and calculating a distance between the two sides based on the reflected waves; comparing the distance with a predetermined thickness of the flexible substrate in real time, and controlling an extent of grinding by a grinding device based on a difference of the distance from the grinding side to the side opposite to the grinding side of the flexible substrate and the predetermined thickness of the flexible substrate.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: June 20, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Yangkun Jing
  • Patent number: 9669514
    Abstract: Polishing systems and methods for polishing a substrate are provided. The polishing system includes a polishing assembly having a platen and a polishing pad over the platen. The polishing system also includes a substrate carrying assembly configured to engage a substrate to the polishing pad. The polishing system further includes a thickness sensing assembly configured to monitor a thickness of the polishing pad.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: June 6, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Jiun-Yu Lai, Ying-Hsiu Tsai, Wei-Chen Chang, Yi-Ching Chiou
  • Patent number: 9551985
    Abstract: An apparatus for positioning a geometric model comprises a machine tool, a control unit electrically coupled to the machine tool, a storage unit electrically coupled to the control unit, a positioning module electrically coupled to the storage unit, a virtual target geometry module electrically coupled to the positioning module, and a virtual machine tool module electrically and respectively coupled to the virtual target geometry module and the positioning module. A method for positioning the geometric model includes using components of the apparatus.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: January 24, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Yuan Hsu, Shuo-Peng Liang, Jui-Ming Chang, Hsin-Chuan Su
  • Patent number: 9530704
    Abstract: There is provided a polishing apparatus capable of detecting uneven wear occurring on a polishing pad and detecting an appropriate replacement timing of the polishing pad. The polishing apparatus detects, every predetermined time, a value of rotation speed or a value of rotation torque of a table drive shaft for rotationally driving a polishing table or a dresser drive shaft for driving a dresser, or a value of swing torque of a dresser swing shaft for driving the dresser; calculates a change quantity thereof based on the value of the detected rotation speed, the value of the detected rotation torque, or the value of the detected swing torque; determines whether or not the change quantity exceeds a predetermined value; and notifies a user of a warning when a determination is made that the change quantity exceeds the predetermined value.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: December 27, 2016
    Assignee: Ebara Corporation
    Inventors: Ryuichi Kosuge, Tadakazu Sone
  • Patent number: 9425109
    Abstract: A planarization method is provided. The planarization method includes providing a wafer, in which the wafer includes a work function layer, a surface layer formed on the work function layer and oxidized from the work function layer, and a planarization layer disposed on or above the surface layer, performing a chemical-mechanical planarization (CMP) process on the planarization layer, providing an incident light to a surface of the wafer under the CMP process, detecting absorption of the incident light by the surface layer; and stopping the CMP process in response to an increase in the detected absorption of the incident light.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: August 23, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Liang Cheng, Yen-Yu Chen, Chang-Sheng Lee, Wei Zhang
  • Patent number: 9272389
    Abstract: A polishing apparatus capable of monitoring an accurate progress of polishing is disclosed. The polishing apparatus includes: a polishing table for supporting a polishing pad; a table motor configured to rotate the polishing table; a top ring configured to press a substrate against the polishing pad to polish the substrate; a dresser configured to dress the polishing pad while oscillating on the polishing pad during polishing of the substrate; a filtering device configured to remove a vibration component, having a frequency corresponding to an oscillation period of the dresser, from an output current signal of the table motor; and a polishing monitoring device configured to monitor a progress of polishing of the substrate based on the output current signal from which the vibration component has been removed.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: March 1, 2016
    Assignee: Ebara Corporation
    Inventors: Taro Takahashi, Yuta Suzuki
  • Patent number: 9186774
    Abstract: A method of controlling a polishing operation includes receiving a first measurement of a first amount of metal on a substrate made by a first x-ray monitoring system after a first metal layer is deposited on the substrate and before a second metal layer is deposited on the substrate, transferring the substrate to a carrier head of a chemical mechanical polishing apparatus the substrate after the second metal layer is deposited on the substrate, making a second measurement of a second amount of metal on the substrate with a second x-ray monitoring system in the chemical mechanical polishing apparatus, comparing the first measurement to the second measurement to determine a difference, and adjusting a polishing endpoint or a polishing parameter of the polishing apparatus based on the difference.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 17, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Boguslaw A. Swedek, Dominic J. Benvegnu, Wen-Chiang Tu
  • Patent number: 9017138
    Abstract: A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: April 28, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Thomas H. Osterheld, Charles C. Garretson, Jason Garcheung Fung
  • Patent number: 8968052
    Abstract: Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: March 3, 2015
    Assignee: Strasbaugh
    Inventors: Thomas A. Walsh, Michael R. Vogtmann
  • Patent number: 8961267
    Abstract: The invention relates to an ophthalmic machining machine comprising machining means and means for supporting a blank. The invention is characterized in that the machine is capable of transferring marks to said blank that can be identified by monitoring means for repositioning the blank on said supporting means after machining the opposite surface. The invention also relates to a workholding tool. The invention is characterized in that said supporting means are mounted on a bearing surface, which is oblique in relation to a surface of a carriage, by depression of an opening surrounded by an O-ring seal and a fixed bearing. The invention also relates to a machining method according to which the markings are transferred to a blank, the position of said markings is assessed by monitoring means which position machining means for the machining process, and each surface of the resulting lens is polished with polishing means.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: February 24, 2015
    Inventor: Guy Monnoyeur
  • Patent number: 8944315
    Abstract: A device and a method for processing an optical lens are proposed, whereby lens-production data and/or geometric data of the lens are determined from desired optical data of the lens when a corresponding activation code is acquired. Preferably, the lens or a block piece and/or an assigned shipping container is/are provided with the activation code and/or other information relative to the lenses that are to be processed.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: February 3, 2015
    Assignee: Schneider GmbH & Co. KG
    Inventor: Gunter Schneider
  • Patent number: 8920211
    Abstract: A truing device of a grinding machine includes: a truer that corrects a shape of a grinding wheel; a swivel table that supports the truer such that the truer is swivelable about a swivel axis Ac; detecting means for directly detecting a distance from a truing edge position of the truer, which contacts the grinding wheel during correction of the shape of the grinding wheel, to a swivel center O of the swivel table; and control means for controlling the truing edge position of the truer with respect to the grinding wheel based on the distance L detected by the detecting means to true the grinding wheel.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: December 30, 2014
    Assignee: JTEKT Corporation
    Inventors: Yoshio Wakazono, Tetsuro Furuhata, Hisanobu Kobayashi
  • Patent number: 8920080
    Abstract: A machine tool 1 comprises a bed 11, a column 12, a spindle head 15, a spindle 16, a saddle 17, a table 18, a feed mechanism for moving the spindle head 15, the saddle 17 and the table 18 in Z-axis, Y-axis and X-axis directions respectively, a position detector for detecting the positions of the spindle head 15, saddle 17 and table 18, a controller for feedback controlling the feed mechanism, a position detector 51 for detecting the position of the spindle head 15, a position detector 54 for detecting the position of the spindle head 15, a position detector 57 for detecting the position of the table 18, and a measurement frame 50 which is configured with a different member from the bed 11 and the column 12 and on which readers 53, 56, 59 of the position detectors 51, 54, 57 are disposed.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: December 30, 2014
    Assignees: DMG Mori Seiki Co., Ltd., Intelligent Manufacturing Systems International
    Inventors: Kazuo Yamazaki, Toru Fujimori
  • Patent number: 8915768
    Abstract: Provided is a method of phasing a threaded grinding stone, as well as a device therefor, the aforementioned method and device being such that contact or non-contact of a threaded grinding stone with a disk dresser can be detected with high accuracy, with the result that the phasing of the threaded grinding stone can be accurately performed. For the purpose of achieving the above, a threaded grinding stone (14) is phased with respect to a disk dresser (32) prior to the engagement of the threaded grinding stone (14) with the disk dresser (32) during dressing. In performing this phasing, it is determined whether or not the threaded grinding stone (14) contacted the disk dresser (32), on the basis of a voltage (V) which is commensurate with the amplitude of the elastic wave generated in the threaded grinding stone (14) at the time when the threaded grinding stone (14) contacted the disk dresser (32).
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: December 23, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Yoshikoto Yanase, Kazuyuki Ishizu, Tomohito Tani
  • Patent number: 8900033
    Abstract: An object of the present invention is to provide a method of polishing silicon wafers, capable of suppressing generation of undesired sounds from carriers and reducing the thickness variation of the wafers after polished. The method is a wafer polishing method in which wafers 20 are polished by supplying a polishing solution to surfaces 30a of a pair of polishing pads 30 positioned above and below carriers 10 each having a circular hole 11 for retaining the wafers 20, the carriers 10 being thinner than the wafers 20; and sliding the polishing pads 30 relatively to the carriers 10, thereby simultaneously polishing both surfaces of the wafers 20 retained in the carriers 10. The method is characterized in that information sourced from the carriers 10 when a difference between the thickness of the carriers 10 and the thickness of the wafers 20 reaches a predetermined value is detected to calculate the thickness of the wafers 20, thereby terminating polishing.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: December 2, 2014
    Assignee: Sumco Corporation
    Inventors: Kazushige Takaishi, Keiichi Takanashi, Tetsurou Taniguchi, Shinichi Ogata, Shunsuke Mikuriya
  • Patent number: 8882564
    Abstract: A gear grinding machine, whose tool spindle (18) is supported on a first swivel-motion unit (17) seated on a first linear-motion unit (15), has a second linear-motion unit (19) which is arranged on the first linear-motion unit (15) and carries a dressing spindle (21) that is capable of being driven in rotary movement.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: November 11, 2014
    Assignee: Gleason-Pfauter Maschinenfabrik GmbH
    Inventor: Claus Kobialka
  • Publication number: 20140302750
    Abstract: Some embodiments comprise an apparatus for reseating valves, where an eccentric, non-rotational motion is applied in a grinding or lapping process. Other embodiments comprise a micrometer that permits repeatable application of pressure against a plate when the apparatus is removed and reinstalled. In yet other embodiments, levered arms provide an expedient mechanism for positioning a reseating apparatus.
    Type: Application
    Filed: April 2, 2014
    Publication date: October 9, 2014
    Applicant: Dexter Innovative Solutions LLC
    Inventor: Thomas Joseph LeBoeuf
  • Patent number: 8814632
    Abstract: The described embodiment relates generally to the polishing of a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. More particularly, a method and an apparatus are described for calibrating a polishing process in which a precise amount of material can be removed. Accurate measurement of such a polishing process can be especially helpful in accurately determining material removal rates and pad wear occurring across curved surfaces and edges where such parameters tend to be difficult to predict.
    Type: Grant
    Filed: June 24, 2012
    Date of Patent: August 26, 2014
    Assignee: Apple Inc.
    Inventor: Simon R Lancaster-Larocque
  • Patent number: 8790157
    Abstract: A method for grinding the surface of non-round workpieces. The method includes the steps of clamping a workpiece within a machining unit; machining the workpiece; without unclamping the workpiece, contactlessly measuring the workpiece using an optical measuring device having a conoscopic holography sensor with a characteristic measuring range; and machining and measuring the workpiece in an alternating manner to iteratively approach the desired measurements of a specified form by adjusting the distance between the optical measuring device and the surface of the workpiece depending on there being a deviation of the surface from the specified form so that a respectively measured area of the surface of the workpiece remains within the measuring range of the optical sensor.
    Type: Grant
    Filed: February 18, 2013
    Date of Patent: July 29, 2014
    Assignee: L. Kellenberger & Co.
    Inventors: Daniel Honegger, Hugo Thurnherr, Claus P. Keferstein, Bernard Gschwend, Markus Ritter
  • Patent number: 8790155
    Abstract: The present invention relates to a grinding machine for grinding a workpiece, in particular cams, with a grinding wheel having a profile with a grinding region running substantially parallel to the axis of rotation of the grinding wheel and at least one profile section which does not run parallel to the axis of rotation of the grinding wheel, a control unit for controlling the grinding process, wherein the control unit is configured in such a manner that, with reference to position information on positions of edges of the workpiece in the direction of the longitudinal axis of the workpiece, the edges of the workpiece are successively deburred or chamfered by the at least one profile section of the grinding wheel during or after the grinding of the workpiece.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: July 29, 2014
    Assignee: Schaudt Mikrosa GmbH
    Inventor: Berthold Stroppel
  • Patent number: 8784156
    Abstract: A core grinding wheel that has a grinding layer on an outer periphery of a core is used. An ultrasonic wave is output from an ultrasonic sensor to the grinding layer via grinding fluid. An ultrasonic measuring device control unit calculates a thickness of the grinding layer on the basis of a sonic velocity in the grinding layer and an arrival time difference between a reflected wave from a surface of the grinding layer and a reflected wave from a surface of the outer periphery of the core. A grinding process and a truing process are controlled on the basis of an outside diameter of the grinding wheel, which is calculated on the basis of the measured thickness of the grinding layer and an outside diameter of the core.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: July 22, 2014
    Assignee: JTEKT Corporation
    Inventors: Makoto Tano, Yoshio Wakazono
  • Patent number: 8781787
    Abstract: A substrate carrying mechanism includes: a base; a substrate holding member placed on the base and capable of holding a substrate and of being advanced and retracted relative to the base; four or more detecting units respectively for detecting different parts of the edge of a substrate held by the substrate holding member when the substrate holding member holding a substrate is retracted; and a controller that determines whether or not a notch formed in the edge of the substrate has been detected by one of the detecting units, on the basis of measurements measured by the four or more detecting units and corrects an error in a transfer position where the substrate is to be transferred to the succeeding processing unit on the basis of measurements measured by the detecting units excluding the one detecting unit that has detected the notch of the substrate.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: July 15, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Tokutarou Hayashi, Kiminari Sakaguchi
  • Patent number: 8758085
    Abstract: Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: June 24, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Sivakumar Dhandapani, Asheesh Jain, Charles C. Garretson, Gregory E. Menk, Stan D. Tsai
  • Patent number: 8758083
    Abstract: A method and system for providing transducer(s) including a disk structure and having an air-bearing surface (ABS) are described. The disk structure resides a distance from the ABS and has a disk dimension substantially perpendicular to the ABS. Lapping control and disk windage ELGs are provided. The lapping control ELG has first and second edges first and second distances from the ABS. The disk windage ELG has edges different distances from the ABS. A difference between these edges corresponds to the disk dimension. A windage resistance of the disk windage ELG is measured and a disk windage determined. The disk windage corresponds to a difference between designed and actual disk dimensions perpendicular to the ABS. A lapping ELG target resistance is determined based on the disk windage. The transducer is lapped. Lapping is terminated based on a resistance of the lapping control ELG and the lapping ELG target resistance.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: June 24, 2014
    Assignee: Western Digital (Fremont), LLC
    Inventors: Steven C. Rudy, Changqing Shi, Yufeng Hu, Mark D. Moravec, Eric R. McKie, Nurul Amin
  • Patent number: 8758084
    Abstract: An apparatus for grinding hand knives, in particular for meat processing, with at least one grinding tool is proposed, by means of which a knife ground finish, in particular during the reconditioning of hand knives after use, is made possible in a repeatable manner with reproducible grinding quality. This is achieved according to the invention in that a knife magazine (6, 7) for accommodating at least one hand knife is provided, in that a driven manipulating device (3, 4, 5) having at least one knife gripper (5) is provided, in that at least one sensor unit (22) for at least partly recording the knife contour is provided, and in that an electronic evaluating and control unit for evaluating the sensor data and for activating the manipulating device (3, 4, 5) is provided.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: June 24, 2014
    Assignee: Knecht Maschinenbau GmbH
    Inventors: Manfred Knecht, Peter Heine
  • Patent number: 8689430
    Abstract: A method and system for providing a perpendicular magnetic recording (PMR) head are disclosed. A PMR pole having a bottom and a top wider than the bottom is provided. The PMR pole may be formed by depositing a PMR pole layer, then removing part of the PMR pole layer, leaving the PMR pole. The PMR pole may also be provided by forming a trench having the desired profile in a photoresist layer, depositing the PMR pole layer, then removing the photoresist layer, leaving the PMR pole in the location of the trench. A side gap is deposited over the PMR pole. A side shield is provided on the side gap. A planarization that removes part of the side shield on the PMR pole is performed. A top gap is provided on the PMR pole, substantially covering the entire PMR pole. A top shield is provided on the top gap.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: April 8, 2014
    Assignee: Western Digital (Fremont), LLC
    Inventors: Yingjian Chen, Kyusik Sin
  • Patent number: 8678880
    Abstract: A device for measuring tooth surface deviation includes a contact detector that measures the deviation at the tooth surface of a dresser with respect to a grinding tooth surface formed on a helical grinding tooth of a grinding tool when the grinding tool and a dresser toothed wheel are rotated synchronously in a state in which the grinding tooth surface and the dresser tooth surface of the dresser toothed wheel can be brought into contact, and detects contact between the grinding tooth surface and the dresser tooth surface; and a controller that changes the speed of rotation of the dresser toothed wheel in such a way that the detection result of the contact detector comes within the range of contact determination data, and also measures the amount by which the grinding tool and the dresser toothed wheel have been changed in one revolution of the dresser toothed wheel.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: March 25, 2014
    Assignee: Honda Motor Co., Ltd.
    Inventors: Tatsuya Ito, Masao Kume, Naoki Iwasa, Hiroshi Ogawa, Keisuke Takahashi, Yuichi Tomizawa, Yasutaka Matsuo
  • Patent number: 8636559
    Abstract: A method of reducing manufacturing defects of semiconductor wafers during a back-grinding process. The method includes receiving a semiconductor wafer on a chuck table, wherein said chuck table has a surface upon which a front side of the wafer is placed, and wherein said chuck table has one or more holes in surface and one or more sensors placed in said one or more holes. The method further includes grinding at least a portion of a back side of the semiconductor wafer. The method further includes monitoring a parameter, while grinding, measured by the one or more sensors and adjusting the grinding based at least on the monitored parameter.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: January 28, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Fa Lu, Chiang-Hao Lee, Wei-Yu Chen, Chung-Shi Liu
  • Patent number: 8622783
    Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: January 7, 2014
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Axel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram
  • Patent number: 8591289
    Abstract: An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: November 26, 2013
    Assignee: International Business Machines Corporation
    Inventors: Michael A. Cobb, Mahadevaiyer Krishnan, Michael F. Lofaro, Dennis G. Manzer
  • Patent number: 8574028
    Abstract: An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: November 5, 2013
    Assignee: Illinois Tool Works Inc.
    Inventors: Charles E. Shewey, Douglas A. Ceckowski, Michael F. Hart
  • Patent number: 8568199
    Abstract: Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the substrate and receiving a reflected light from the substrate; obtaining a plurality of spectral profiles at predetermined time intervals, each spectral profile indicating reflection intensity at each wavelength of the reflected light; selecting at least one pair of spectral profiles, including a latest spectral profile, from the plurality of spectral profiles obtained; calculating a difference in the reflection intensity at a predetermined wavelength between the spectral profiles selected; determining an amount of change in the reflection intensity from the difference; and determining a polishing endpoint based on the amount of change.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: October 29, 2013
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Shinrou Ohta, Atsushi Shigeta
  • Patent number: 8550873
    Abstract: A method of prepping a surface using a high-frequency forced pulsed waterjet entails generating a high-frequency signal having a frequency f using a high-frequency signal generator, applying the high-frequency signal to a transducer having a microtip to cause the microtip of the transducer to vibrate to thereby generate a forced pulsed waterjet through an exit orifice of a nozzle having an exit orifice diameter d and a length L. The forced pulsed waterjet prepares the surface to within a predetermined range of surface roughness. The surface roughness is determined by selecting operating parameters comprising a standoff distance (SD), a traverse velocity VTR of the nozzle, a water pressure P, a water flow rate Q, a length-to-diameter (L/d) ratio, a microtip-to-orifice distance (a), the frequency f, and an amplitude A of the high-frequency signal.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: October 8, 2013
    Assignee: VLN Advanced Technologies Inc.
    Inventors: Mohan M. Vijay, Andrew Hung Tieu, Wenzhuo Yan, Bruce R. Daniels
  • Patent number: 8550876
    Abstract: A constant force finishing system used to finish a surface of a workpiece includes at least a first movement device arranged to apply a first movement to a finishing tool, the first movement having a range of distance D1. The finishing system also includes a constant force device (CFD) in mechanical communication with the finishing tool, the CFD arranged to apply a second movement in conjunction with the first movement to the finishing tool, the second movement having a range of ?1, where D1>>?1.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: October 8, 2013
    Assignee: Apple Inc.
    Inventor: Brian Demers
  • Publication number: 20130260646
    Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.
    Type: Application
    Filed: May 21, 2013
    Publication date: October 3, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: David James LISCHKA, Thomas Lawrence TERRY
  • Patent number: 8545290
    Abstract: A wafer polishing apparatus includes a rotatable turntable for holding a polishing pad and at least one rotatable polishing head adapted for attachment of at least one wafer alignment assembly. A wafer alignment assembly includes an upper plate and a lower plate connected by three lever assemblies symmetrically positioned about a wafer alignment assembly axis of rotation. Each of the lever assemblies comprises a spherical joint, an elongated cylindrical hinge, and a kinematic axis which intersects a center of rotation for the spherical hinge, an axis of rotation for the elongated cylindrical hinge, and a gimbal point about which a wafer may tilt during polishing. The gimbal point may be positioned above, coincident with, or below a working surface of a polishing pad by adjustment of the lever assemblies. Some embodiments of the invention comprise steps in a method for polishing a wafer in a wafer polishing apparatus.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: October 1, 2013
    Inventors: Edmond Arzumau Abrahamians, Vladimir Volovich
  • Publication number: 20130225047
    Abstract: A honing tool holder utilizes pressure of a through-the-spindle coolant delivery system for automatically feeding the honing elements or stones of an attached honing tool when in the bore of a work piece, and for automatically stopping the feeding when a particular condition such as a bore size, is reached, so as to enable use of an in-process adjustable feed honing tool in a machine tool, machining center, or the like, lacking a feed mechanism or system but including a coolant delivery system. The holder can also include apparatus to automatically prevent feed past a limit. Both the feed force and feed limit can be adjustable, at least the latter by simple movements of the tool holder by the machine tool.
    Type: Application
    Filed: September 21, 2011
    Publication date: August 29, 2013
    Applicant: Sunnen Products Company
    Inventor: Daniel R. Cloutier
  • Patent number: 8500514
    Abstract: A piston processing apparatus includes a work attaching head capable of fixing a piston material, a work rotating device, a grinding wheel, a grinding wheel rotating device, first and second moving mechanisms for moving the grinding wheel, a rotational angle detector for detecting a rotational angle of the work attaching head, a first and second position detectors for detecting a position of a grinding surface of the grinding wheel, a controller controls the first and second moving mechanisms to grind the outer circumferential surface by the grinding wheel based on target-position information of the grinding surface corresponding to a position on the outer circumferential surface of the piston material. According to the piston processing apparatus, the outer circumferential surface of the piston material can be processed into a three-dimensional shape with high-accuracy, and a piston that can improve fuel efficiency.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: August 6, 2013
    Assignee: Koganei Seiki Co., Ltd.
    Inventor: Shuji Osaka
  • Patent number: 8485860
    Abstract: A coated abrasive product, comprising a first section and a second section, the first and the second sections being continuously joined together by a splice. The first section includes at least one first splice mark adjacent to the splice, wherein the first splice mark is a marking or a cluster of markings. A method of processing an article with such a coated abrasive product, and a method of acquiring information of such a coated abrasive product, respectively, includes detecting at least one characteristic of at least one first splice mark of the first section of the abrasive product, and comparing the detected characteristic to a database, wherein the detected characteristic of the first splice mark conveys approach of the splice and the end of the first section. The method of processing an article further includes providing a signal to skip the splice to thereby prevent the article being processed with splice area of the abrasive product.
    Type: Grant
    Filed: July 22, 2008
    Date of Patent: July 16, 2013
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Christophe C. Oliver, Lionel Rossignol
  • Patent number: 8453317
    Abstract: Methods of fabricating magnetic write heads and electrical lapping guides (ELG's) using a split gap deposition process is described. A removal process is performed on a magnetic material to define a main write pole and to define a corresponding ELG for the main write pole. A first non-magnetic gap layer is deposited. A mask and liftoff process is performed to deposit an electrically conductive material on the first gap layer disposed along a front edge of the ELG. A second non-magnetic gap layer is then deposited and a shield is fabricated for the write pole.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: June 4, 2013
    Assignee: HGST Netherlands, B.V.
    Inventors: Donald Allen, Jennifer Ai-Ming Leung, Aron Pentek, Thomas Roucoux