With Indicating Patents (Class 451/8)
  • Patent number: 10207386
    Abstract: A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: February 19, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Ingemar Carlsson, Doyle E. Bennett, Wen-Chiang Tu, Hassan G. Iravani, Tzu-Yu Liu
  • Patent number: 10040972
    Abstract: A process of manufacturing a single-crystal silicon-carbide substrate, includes contacting a surface of a single-crystal silicon-carbide plate with a surface of a polishing pad; and moving the surface of the single-crystal silicon-carbide plate relative to the surface of the polishing pad while supplying a polishing solution to the surface the polishing pad, to polish the surface of the single-crystal silicon-carbide plate. The polishing pad comprises a non-woven fabric or a porous resin. The polishing solution comprises an oxidizing agent which comprises a transition metal having oxidation-reduction potential of 0.5 V or more. Neither the polishing pad nor the polishing solution comprises an abrasive.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: August 7, 2018
    Assignee: ASAHI GLASS COMPANY, LIMITED
    Inventors: Iori Yoshida, Satoshi Takemiya, Hiroyuki Tomonaga
  • Patent number: 9731397
    Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.
    Type: Grant
    Filed: January 12, 2015
    Date of Patent: August 15, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
  • Patent number: 9502230
    Abstract: A method of manufacturing a SiC substrate of the invention includes at least an oxide film-forming process of forming an oxide film (10) to cover a surface (1a) of the SiC substrate (1); and a planarization process of polishing the SiC substrate (1) from an oxide film side (10) in accordance with a CMP method so as to remove the oxide film (10), and of polishing the surface (1a) of the SiC substrate (1) to planarize the surface (1a).
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: November 22, 2016
    Assignee: SHOWA DENKO K.K.
    Inventors: Yuzo Sasaki, Kenji Suzuki
  • Patent number: 9403256
    Abstract: A pressure control assembly for a carrier head of a polishing apparatus includes a pressure supply line configured to fluidically connect to a chamber of a carrier head, a sensor to responsive to pressure in the chamber and configured to generate a signal representative of the pressure, and a pneumatic control unit configured to receive the signal, to control a pressure applied to the pressure supply line, and to record the signal in a non-transitory storage media of a storage device removably attached to the pneumatic control unit.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: August 2, 2016
    Assignee: Applied Materials, Inc.
    Inventor: Simon Yavelberg
  • Patent number: 9304396
    Abstract: Provided herein are multi-layer stacks for use in extreme ultraviolet lithography tailored to achieve optimum etch contrast to shrink features and smooth the edges of features while enabling use of an optical leveling sensor with little or reduced error. The multi-layer stacks may include an atomically smooth layer with an average local roughness of less than a monolayer, and one or more underlayers, which may be between a target layer to be patterned and a photoresist. Also provided are methods of depositing multi-layer stacks for use in extreme ultraviolet lithography.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: April 5, 2016
    Assignee: Lam Research Corporation
    Inventors: Nader Shamma, Thomas Mountsier, Don Schlosser
  • Patent number: 9213340
    Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: December 15, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
  • Patent number: 9193025
    Abstract: A method of polishing a wafer is disclosed that includes determining a removal profile. The wafer is measured to determine a starting wafer profile and then the wafer is polished. The wafer is again measured after being polished to determine a polished wafer profile. The starting wafer profile and the polished wafer profile are compared to each other to determine the removal profile by computing the amount and shape of material removed from the first wafer during polishing.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: November 24, 2015
    Assignee: SunEdison Semiconductor Limited (UEN201334164H)
    Inventors: Sumeet S. Bhagavat, Khiam How Low, Ichiron Yoshimura, John Allen Pitney
  • Patent number: 9168629
    Abstract: A chemical mechanical polishing system includes a carrier head having a flexible membrane and a chamber to apply pressure to the flexible membrane, a pressure control unit, a pressure supply line connecting the pressure control unit to the chamber, and a sensor located along the pressure supply line to detect a contaminant in the pressure supply line.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: October 27, 2015
    Assignee: Applied Materials, Inc.
    Inventor: Ronald Vern Schauer
  • Patent number: 9138860
    Abstract: Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: September 22, 2015
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivakumar Dhandapani, Jun Qian, Christopher D. Cocca, Jason G. Fung, Shou-Sung Chang, Charles C. Garretson, Gregory E. Menk, Stan D. Tsai
  • Patent number: 9132523
    Abstract: A method of performing chemical mechanical polish (CMP) processes on a wafer includes providing the wafer; determining a thickness profile of a feature on a surface of the wafer; and, after the step of determining the thickness profile, performing a high-rate CMP process on the feature using a polish recipe to substantially achieve a within-wafer thickness uniformity of the feature. The polish recipe is determined based on the thickness profile.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: September 15, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shen-Nan Lee, Ying-Mei Lin, Yu-Jen Cheng, Keung Hui, Huan-Just Lin
  • Patent number: 9120193
    Abstract: Disclosed is a method and apparatus for polishing an edge of an article involving providing at least one carrier including: first and second opposing surfaces defining a groove, the first and second opposing surfaces being spaced apart in a first direction to receive the edge; and magnetic field generator configured to provide a magnetic field in the groove to stiffen magnetorheological (MR) fluid disposed in the groove to provide at least one polishing zone; receiving the edge in the polishing zone; and driving relative motion between the at least one carrier and the edge in a second direction substantially transverse to the first direction.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: September 1, 2015
    Assignee: Agency for Science, Technology and Research
    Inventors: Yee Ming Stephen Wan, Takashi Sato
  • Patent number: 9102033
    Abstract: An apparatus and method for providing target thickness and surface profile uniformity control of a multi-head chemical mechanical polishing (CMP) process is disclosed. An exemplary method includes providing at least two wafers; determining a surface profile of each of the at least two wafers; determining an operation mode for a chemical mechanical polishing (CMP) process based on the surface profiles of the at least two wafers; determining a CMP polishing recipe for each of the at least two wafers based on the operation mode; and performing the CMP process on the at least two wafers based on the determined CMP polishing recipes.
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: August 11, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keung Hui, Jin-Ning Sung, Huang Soon Kang, Yen-Di Tsen, Jong-I Mou
  • Patent number: 9039485
    Abstract: The method for machining a series of workpieces (21) via at least one machining jet includes the following steps: each workpiece (21) is associated with an identifier for uniquely identifying the workpiece, during the machining of a respective workpiece, the temporal characteristic of the machining jet is detected by at least one sensor (30), the detected temporal characteristic is evaluated so as to obtain at least one comparative value, and for detecting incorrect machining, the at least one comparative value is compared with at least one threshold value.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: May 26, 2015
    Assignee: MICROMACHINING AG
    Inventor: Walter Maurer
  • Patent number: 9033762
    Abstract: A master servo motor and a slave servo motor that synchronously drive for rotation a master main spindle provided with a center that supports one end of a work piece and a slave main spindle provided with a center that supports the other end of the work piece are included. Before grinding, a slip detection cycle that detects a limit current value for the servo motors, at which the work piece and the centers slip, is executed and, during grinding, a grinding condition is changed to prevent a slip between the work piece and the centers in advance at the time when any one of current values of the servo motors has reached a slip threshold value set on the basis of the limit current value.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: May 19, 2015
    Assignee: JTEKT Corporation
    Inventor: Akira Makiuchi
  • Patent number: 9018099
    Abstract: An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: April 28, 2015
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Kazuyuki Ogawa, Atsushi Kazuno, Tsuyoshi Kimura, Tetsuo Shimomura
  • Patent number: 9011204
    Abstract: A waterjet system in accordance with a particular embodiment includes a pressurizing device configured to pressurize a fluid, a cutting head downstream from the pressurizing device, and a catcher positioned to collect a jet from the cutting head. The system can further include a treatment assembly configured to treat a feed fluid to the pressurizing device and/or a byproduct fluid from the catcher, such as by removing submicron colloidal particles from the feed fluid and/or from the byproduct fluid. For example, the treatment assembly can include a coagulation unit, such as a chemical coagulation unit or an electrocoagulation unit, configured to coagulate the submicron colloidal particles. The pressurizing device, the cutting head, and the treatment assembly can be at different respective portions of a fluid-recycling loop.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: April 21, 2015
    Assignee: OMAX Corporation
    Inventors: Chidambaram Raghavan, Tanner Coker, Scott Thomas, James M. O'Connor, John H. Olsen
  • Publication number: 20150104620
    Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
    Type: Application
    Filed: December 19, 2014
    Publication date: April 16, 2015
    Inventors: Tamami TAKAHASHI, Masaya SEKI, Hiroaki KUSA, Kenji YAMAGUCHI, Masayuki NAKANISHI
  • Patent number: 9007059
    Abstract: Methods and apparatuses for calibrating eddy current sensors. A calibration curve is formed relating thickness of a conductive layer in a magnetic field to a value measured by the eddy current sensors or a value derived from such measurement, such as argument of impedance. The calibration curve may be an analytic function having infinite number terms, such as trigonometric, hyperbolic, and logarithmic, or a continuous plurality of functions, such as lines. High accuracy allows the omission of optical sensors, and use of eddy current sensors for endpoint detection, transition call detection, and closed loop control in which a process parameter is changed based on the measured magnetic flux density change in one or more processing zones.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: April 14, 2015
    Assignee: Novellus Systems, Inc.
    Inventors: Sudeep Kumar Lahiri, Paul Franzen
  • Publication number: 20150087206
    Abstract: A lens processing system used for removing a lens blank (98, 110) from an edging block (40). The system includes an elongated collet (22) that engages the mating edging block (40). The block (40) includes an enlarged groove (41) that receives a pair of blades (65, 66) extended upwardly from the floor (75) of the collet (22). Each lens blank (98,110) is formed to include a series of surface markings (191,192) to verify proper functioning of the edging machine that forms a finished lens. Each lens blank also includes a series of circular markings (117,133) arranged in diagonal rows to verify the accurate drilling of bores with the lens blank (98,110).
    Type: Application
    Filed: September 26, 2013
    Publication date: March 26, 2015
    Inventor: JAMES GREGORY GOERGES
  • Publication number: 20150072595
    Abstract: Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles.
    Type: Application
    Filed: March 24, 2014
    Publication date: March 12, 2015
    Inventor: Chien-Min Sung
  • Patent number: 8968052
    Abstract: Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: March 3, 2015
    Assignee: Strasbaugh
    Inventors: Thomas A. Walsh, Michael R. Vogtmann
  • Patent number: 8951095
    Abstract: Various embodiments of a semiconductor processing fluid delivery system and a method delivering a semiconductor processing fluid are provided. In aspect, a system for delivering a liquid for performing a process is provided that includes a first flow controller that has a first fluid input coupled to a first source of fluid and a second flow controller that has a second fluid input coupled to a second source of fluid. A controller is provided for generating an output signal to and thereby controlling discharges from the first and second flow controllers. A variable resistor is coupled between an output of the controller and an input of the second flow controller whereby the output signal of the controller and the resistance of the variable resistor may be selected to selectively control discharge of fluid from the first and second flow controllers.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: February 10, 2015
    Assignees: Samsung Austin Semiconductor, L.P., Samsung Electronics Co., Ltd.
    Inventors: Randall Lujan, Ahmed Ali, Michelle Garel, Josh Tucker
  • Publication number: 20150034607
    Abstract: A grinding system includes a welding gun movable relative to a workpiece. A pair of clamp devices move relatively toward each other to clamp a workpiece. A welding tip is disposed on one of the pair of clamp devices. A detector detects a relative movement amount of the welding tip with respect to the other clamp device. A dresser grinds the welding tip. While the dresser is grinding the welding tip, a determinator determines whether to make the dresser end grinding the welding tip based on the movement amount detected by the detector. When the determinator determines to make the dresser end grinding the welding tip, an instructor instructs the dresser to end grinding the welding tip.
    Type: Application
    Filed: July 29, 2014
    Publication date: February 5, 2015
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Yosuke MORI, Teppei SONODA
  • Publication number: 20150034608
    Abstract: A grinding system includes a period determiner that determines, on the basis of a torque of a grinder of a dresser that grinds a welding tip, whether the current period is a grinding period in which the grinder is grinding the welding tip or a non-grinding period in which the grinder is not grinding the welding tip; and an anomaly detector that detects anomalies that are associated beforehand with each of the grinding period and the non-grinding period.
    Type: Application
    Filed: July 30, 2014
    Publication date: February 5, 2015
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Yosuke MORI, Teppei SONODA
  • Publication number: 20150031271
    Abstract: A wafer polishing apparatus configured to polish simultaneously both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding bole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, the wafer polishing apparatus can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.
    Type: Application
    Filed: July 30, 2014
    Publication date: January 29, 2015
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Daisuke FURUKAWA, Kazumasa ASAI, Takahiro KIDA, Tadao TANAKA
  • Patent number: 8932106
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: January 13, 2015
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Katsuhide Watanabe, Hozumi Yasuda, Satoru Yamaki
  • Patent number: 8920210
    Abstract: A method and method for processing grit used for abrasive blasting may include receiving grit blasted onto a surface, where the grit includes moisture content. Air in which the grit being recycled is being processed may be heated. The moisture content may be evaporated from the grit using the heated air to produce dry recycled grit. The dried recycled grit may be stored.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: December 30, 2014
    Inventor: Ronald C. Benson
  • Patent number: 8915767
    Abstract: A sandpaper replacement device is used for replacing sandpaper of a polishing device, including a support platform, a driver, a driving detector sensor, a clamping member, a clamping detector and a controller. The driver includes a cylinder body and an extension rod movably positioned on the cylinder body. The cylinder body is positioned on the support platform, and the extension rod passing through and protruding out from the support platform. The driving detector sensor is positioned on the support platform adjacent to the extension rod. The clamping member includes a main body and two claws positioned oppositely to each other on the main body. The main body is mounted on the support platform away from the cylinder body. The clamping detector is positioned adjacent to the two claws. The controller is electrically connected to the driver, the driving detector sensor, the clamping detector and the clamping member.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: December 23, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chao Shen
  • Patent number: 8912790
    Abstract: A measuring device for measuring a film thickness of a silicon wafer (1) comprises: position and velocity sensors (4) linearly arranged along a longitudinal direction into first and second position and velocity sensor arrays spaced apart from each other in a lateral direction, in which the position and velocity sensors (4) in the first position and velocity sensor array are in one-to-one correspondence with the position and velocity sensors (4) in the second position and velocity sensor array in the lateral direction; an eddy current sensor (2) disposed in a symmetrical plane between the first position and velocity sensor array and the second position and velocity sensor array and perpendicular to the lateral direction; and a controller connected to the position and velocity sensors (4) and the eddy current sensor (2) respectively for controlling measurement of the thickness of the film according to detection signals from the position and velocity sensors (4) and the eddy current sensor (2).
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: December 16, 2014
    Assignee: Tsinghua University
    Inventors: Xinchun Lu, Pan Shen
  • Patent number: 8870625
    Abstract: A dressing method is used to dress a polishing pad of a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing process on the polishing pad, during the dressing process, measuring a height of an upper surface of the polishing pad at a predetermined point in one of plural zones on the polishing surface, and repeating the repetitive moving of the dresser and the measuring of the height of the upper surface of the polishing pad so as to measure the height of the upper surface of the polishing pad in all of the plural zones.
    Type: Grant
    Filed: November 24, 2008
    Date of Patent: October 28, 2014
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Keisuke Namiki, Satoru Yamaki
  • Patent number: 8858297
    Abstract: Provided is a gear grinding method wherein an initial cutting position by a grindstone is appropriately set, resulting in an improvement being able to be made in machining accuracy. For this purpose, the gear grinding method is such that rotation of a workpiece (W) about a workpiece rotation axis (C), cutting by a grindstone (15) in the X-axis direction, and feeding of the grindstone (15) in the Z-axis direction are controlled, resulting in the workpiece (W) being ground by the grindstone (15).
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: October 14, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventor: Yoshikoto Yanase
  • Publication number: 20140295737
    Abstract: There is provided a polishing apparatus capable of detecting uneven wear occurring on a polishing pad and detecting an appropriate replacement timing of the polishing pad. The polishing apparatus detects, every predetermined time, a value of rotation speed or a value of rotation torque of a table drive shaft for rotationally driving a polishing table or a dresser drive shaft for driving a dresser, or a value of swing torque of a dresser swing shaft for driving the dresser; calculates a change quantity thereof based on the value of the detected rotation speed, the value of the detected rotation torque, or the value of the detected swing torque; determines whether or not the change quantity exceeds a predetermined value; and notifies a user of a warning when a determination is made that the change quantity exceeds the predetermined value.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 2, 2014
    Inventors: Ryuichi Kosuge, Tadakazu Sone
  • Patent number: 8834230
    Abstract: The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, there is provided a wafer polishing method that can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: September 16, 2014
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Daisuke Furukawa, Kazumasa Asai, Takahiro Kida, Tadao Tanaka
  • Publication number: 20140256227
    Abstract: The present invention is directed to a double-side polishing method including interposing a wafer held by a carrier between upper and lower turn tables to which respective polishing pads are attached, and rotating and revolving the carrier while supplying a polishing agent to polish both surfaces of the wafer at the same time, the method including the steps of: first polishing at a high polishing rate; second polishing at a low polishing rate; measuring flatness of the polished wafer; and determining polishing conditions of the second polishing in a next polishing batch on a basis of the measured flatness. The method can stably improve the flatness of a wafer without being affected by variations in carrier thickness over time.
    Type: Application
    Filed: October 4, 2012
    Publication date: September 11, 2014
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Kazuaki Aoki, Shigeru Oba
  • Patent number: 8821212
    Abstract: A method for operating a machining tool, comprising: setting a flow rate and a pressure of a flow of coolant to a target flow rate and a pressure target, respectively, the coolant flow being provided to the machining tool; machining a work-piece using the machining tool; measuring the flow rate and the pressure of the flow of coolant; and detecting an anomaly with respect to the coolant flow; and taking a corrective action depending on the type of the detected anomaly.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: September 2, 2014
    Assignee: Pratt & Whitney Canada Corp.
    Inventors: James Leishman, Amr Elfizy
  • Patent number: 8821211
    Abstract: Disclosed herein is a device for cutting a glass sheet, continuously supplied after a melting and solidification process, into quadrangular glass substrates. The glass sheet cutting device includes two or more cutters for cutting a glass sheet into quadrangular glass substrates, a defect inspector for scanning the glass sheet to three-dimensionally check defect positions in a length direction, a width direction and a thickness direction of the glass sheet, a position adjuster for moving at least one of the cutters to a portion of the glass sheet at which few defects are distributed, and a controller for informing the position adjuster of positions of the cutters based on the scanned results received from the defect inspector.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: September 2, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Ho Kyung Lee, Kyu Hwang Lee, Soon Ki Heo
  • Patent number: 8814631
    Abstract: A method of polishing includes polishing a substrate, receiving an identification of a selected spectral feature to monitor during polishing, measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, determining a location value and an associated intensity value of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of coordinates, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of coordinates. At least some of the spectra of the sequence differ due to material being removed during the polishing, and the coordinates are pairs of location values and associated intensity values.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: August 26, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Xiaoyuan Hu, Zhize Zhu, Harry Q. Lee
  • Patent number: 8790158
    Abstract: A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 29, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: One-Moon Chang, Jae-Phil Boo, Jong-Bok Kim, Soo-Young Tak, Jong-Sun Ahn, Shin Kim
  • Patent number: 8784156
    Abstract: A core grinding wheel that has a grinding layer on an outer periphery of a core is used. An ultrasonic wave is output from an ultrasonic sensor to the grinding layer via grinding fluid. An ultrasonic measuring device control unit calculates a thickness of the grinding layer on the basis of a sonic velocity in the grinding layer and an arrival time difference between a reflected wave from a surface of the grinding layer and a reflected wave from a surface of the outer periphery of the core. A grinding process and a truing process are controlled on the basis of an outside diameter of the grinding wheel, which is calculated on the basis of the measured thickness of the grinding layer and an outside diameter of the core.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: July 22, 2014
    Assignee: JTEKT Corporation
    Inventors: Makoto Tano, Yoshio Wakazono
  • Patent number: 8773670
    Abstract: A method accurately monitors the progress of polishing and accurately detects the polishing end point. The method includes directing light to the substrate during polishing of the substrate, receiving reflected light from the substrate, measuring an intensity of the reflected light at each wavelength, and producing a spectrum indicating a relationship between intensity and wavelength from measured values of the intensity. The method also includes calculating an amount of change in the spectrum per predetermined time, integrating the amount of change in the spectrum with respect to polishing time to obtain an amount of cumulative change in the spectrum, and monitoring the progress of polishing of the substrate based on the amount of cumulative change in the spectrum.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: July 8, 2014
    Assignee: Ebara Corporation
    Inventor: Yoichi Kobayashi
  • Patent number: 8758087
    Abstract: In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: June 24, 2014
    Assignee: DENSO CORPORATION
    Inventors: Kyohei Koutake, Hiromichi Morita, Fumiyoshi Kano, Tetsuji Yamaguchi, Sumitomo Inomata, Masatake Nagaya
  • Patent number: 8758086
    Abstract: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: June 24, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Gabriel Lorimer Miller, Manoocher Birang, Nils Johansson, Boguslaw A. Swedek, Dominic J. Benvegnu
  • Publication number: 20140170935
    Abstract: The method for machining a series of workpieces (21) via at least one machining jet includes the following steps: each workpiece (21) is associated with an identifier for uniquely identifying the workpiece, during the machining of a respective workpiece, the temporal characteristic of the machining jet is detected by at least one sensor (30), the detected temporal characteristic is evaluated so as to obtain at least one comparative value, and for detecting incorrect machining, the at least one comparative value is compared with at least one threshold value.
    Type: Application
    Filed: December 18, 2013
    Publication date: June 19, 2014
    Applicant: Micromachining AG
    Inventor: Walter MAURER
  • Patent number: 8753172
    Abstract: A CNC system for effecting a finishing treatment of a surface, including: a mechanical assembly having a mechanical arm, adapted to move within at least two controllable axes of motion; a shoe arrangement, adapted to connect to an end of the arm and having at least one flexible surface finishing pad; and a drive mechanism adapted to drive the arm; a controller; a communication arrangement adapted to deliver communication signals between the controller and the mechanical assembly; and a positioning system providing the controller with positioning information with respect to the mechanical assembly, the system configured whereby the arm is responsive to the controller, the mechanical assembly adapted to urge the working surface against a workpiece surface, whereby a pressure is delivered thereto, the mechanical assembly including a controllable spring arrangement disposed and adapted to contribute to an overall mechanical compliance, normal to the working surface, of the mechanical assembly, the spring arrangem
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: June 17, 2014
    Assignee: Fricso Ltd.
    Inventors: Shai Aviezer, Sergei Dumenko, Sergei Stepanidin, Boris Shamshidov
  • Patent number: 8747189
    Abstract: A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: June 10, 2014
    Assignee: Applied Materials, Inc.
    Inventor: Jeffrey Drue David
  • Patent number: 8747188
    Abstract: A method and an apparatus for smart automation of robotic surface finishing of a three-dimensional surface of a work piece is described. A three-dimensional motion path is created along the surface of the work piece. A variable contact force profile is specified along the three-dimensional motion path. The three-dimensional motion path is modified based on the specified variable contact force profile. The surface of the work piece is finished using one or more surface finishing tools along the modified three-dimensional motion path. The surface of the work piece includes at least a flat region and a curved region.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: June 10, 2014
    Assignee: Apple Inc.
    Inventors: Max A. Maloney, Howard E. Bujtor, Brian K. Miehm
  • Patent number: 8734202
    Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: May 27, 2014
    Assignee: Applied Materials, Inc.
    Inventors: David James Lischka, Thomas Lawrence Terry
  • Patent number: 8715036
    Abstract: The invention relates to a grinding center for the simultaneous grinding of multiple main bearings and rod bearings and/or central sections of crankshafts (22). Two rod bearing grinding spindles (14, 15), wherein the first can be displaced only in the Z direction and the second can be minimally displaced only in the X direction, are mounted on a common rod bearing crosslide (11). In the final phase of the grinding, a correction of dimension deviation between the two machined rod bearings is carried out via a separate control of the second rod bearing grinding spindle (15), as a dimension or roundness correction. The deviations are detected by measuring devices.
    Type: Grant
    Filed: May 20, 2008
    Date of Patent: May 6, 2014
    Assignee: Erwin Junker Maschinenfabrik GmbH
    Inventor: Erwin Junker
  • Patent number: RE44986
    Abstract: Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: July 1, 2014
    Assignee: Siltronic AG
    Inventors: Clemens Zapilko, Thomas Jaeschke, Makoto Tabata, Klaus Roettger