Abstract: An apparatus includes a base including a receiving portion that receives a substrate on which semiconductor elements are disposed; and at least one ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base.

Abstract: The present disclosure relates to a vibration polishing device, comprising: a vibration drive for generating an oscillating vibration for polishing samples; polishing disc which is connected to and can be driven by the vibration drive; and polishing bowl which is designed to receive a polishing medium and the samples to be polished and is coupled to the polishing disc; wherein the coupling between the polishing bowl and the polishing disc is accomplished by a quick-type coupling for transferring the oscillating vibrations from the polishing disc to the polishing bowl when the vibration polishing device is in operation and thereby to move the sample to be polished in the polishing bowl.

Abstract: One object is to improve the uniformity of polishing of a substrate. The present application discloses, as one embodiment, a substrate polishing device for a quadrilateral-shaped substrate, the device including: a surface plate; a substrate support mechanism that is attached to the surface plate and that supports the substrate; a polishing head mechanism for attaching a polishing pad, the polishing head mechanism opposing the surface plate; and an orbital drive mechanism for orbitally driving the polishing head mechanism. The substrate support mechanism includes: a base plate; a plate flow passage provided to the base plate; and a plurality of substrate support chambers that are connected to the plate flow passage, wherein each substrate support chamber independently applies a vertical direction force to the substrate, and the vertical direction force applied to the substrate corresponds to an internal pressure of the substrate support chamber.

Abstract: A method for decontaminating support surfaces of a wafer chuck, such as a wafer chuck, entails lightly passing a treatment tool having a nominally flat contacting surface over the regions of the chuck where contaminants are to be removed. The treatment tool and the chuck surface may have about the same hardness. The treatment tool may be minimally constrained so that it may conform to the surface being processed. When the treatment tool is contacted to a flat surface, the locust of contact may be in the form of a circle, ring or annulus. At higher application pressures, the treatment tool will abrade the chuck, which here is to be avoided, or at least minimized. Thus, the instant inventors have discovered that the same treatment tool that is used to engineer the elevation or profile of the surface, and its roughness, at lower application pressures can be used to remove grinding debris and other contaminants from the surface.

Abstract: A method of altering an additively manufactured part can include orienting a surface of the additively manufactured part toward a rotational center that may be independent of a rotational axis defined by the additively manufactured part, flowing an abrasive media past the surface, rotating the additively manufacturing part about the rotational center; urging abrasive particles in the abrasive media past the surface abrasive media to impinge the surface with centrifugal force generated by the rotating, and improving surface finish of the surface.

Abstract: Various examples are provided for hybrid tools including fixed-abrasive and loose-abrasive phases. In one example, a hybrid tool for finishing an internal surface of a workpiece includes a metallic rod and magnetic abrasive bonded to one or more defined portions of the metallic rod by an adhesive that dissolves when n contact with a lubricant used to finish the internal surface of the workpiece. In another example, a method for finishing an internal surface of a workpiece includes mounting the workpiece in a chuck of a lathe; positioning a hybrid tool inside an internal cavity of the workpiece using one or more pole-tips; providing an amount of the lubricant to the internal cavity; and rotating the workpiece with the lathe while controlling positioning of the hybrid tool inside the internal cavity using the one or more pole-types.

Abstract: A ceramic component and methods for making a ceramic component are disclosed. In particular, a sapphire component may be polished by positioning a compliant pad adjacent to a surface of the sapphire component. An abrasive slurry may be disposed or introduced between the compliant pad and the surface. The compliant pad may be moved with respect to the surface to produce a polished surface. The abrasive slurry may include a liquid component having a high pH level and medium-sized abrasive particulates.

Abstract: The invention discloses a seamless flowing type finishing machine, comprising a supporting frame; the supporting frame is provided with a lower container, an upper container and a tray; the tray is movably connected with the lower container. A plurality of bolts is arranged between the lower container and the upper container for connection; springs are arranged at the connections of the bolts. The upper edge of the tray extends to the lower edge of the upper container; with the elastic force of the springs, the lower edge of the upper container clings to the upper edge of the tray so as to form a seamless connecting structure; a water outlet is arranged on the tray. A water-filling nozzle is arranged on the sidewall of the lower container. The seamless flowing type finishing machine disclosed by the invention can be used for processing of various ultra-small parts.

Abstract: A fixture is provided for retaining a metal workpiece for contact by finishing media during operation of a media based finishing operation. The fixture comprises a body and a magnet for retaining the workpiece in contact with the body. By use of super-magnetic materials a significant holding force may be achieved.

Abstract: A finisher arrangement for surface finishing of parts, including a bowl-type centrifugal finishing device for agitating a mixture of parts and treating media within the bowl, and a handler for loading and unloading the parts/media to and from the bowl, respectively. The finishing device and handler are positioned sidewardly adjacent but on opposite sides of a rotary drive unit which defines a transfer horizontal drive axis. Arm linkages couple each of the finishing device and handler to the drive unit so that each is independently vertically swingable about the drive axis into respective loading and unloading positions.

Abstract: A drag and/or dip finishing machine has at least one workpiece holder for the releasable fastening of the workpieces to be machined and a container, disposed beneath the workpiece holder, for accommodating the grinding and/or polishing granules, wherein the workpiece holder and the container are movable relative to each other in that at least the container is rotationally driven. The container has a chamber, which extends around the whole of the periphery thereof and is fluidically connected to the inside, accommodating the grinding and/or polishing granules, of the container, at least on a lower portion thereof, the chamber being equipped with a liquid discharge unit in order to be able to discharge the machining agent from the chamber in the event of an excess of machining agent in the container.

Abstract: An ultrasonic cleaning apparatus according to the present invention comprises a plurality of cleaning tanks configured to store a cleaning liquid, an object-to-be-processed holder capable of being inserted into each cleaning tank, the object-to-be-processed holder being configured to hold an object to be processed and to immerse the object to be processed into the cleaning liquid, a vibrator disposed on each cleaning tank, a single ultrasonic oscillator configured to make each vibrator ultrasonically vibrate, an output switch interposed between the ultrasonic oscillator and the vibrator of each respective cleaning tank, the output switch being configured to switch the vibrator that is connected to the ultrasonic oscillator, and a control device configured to control the ultrasonic oscillator and the output switch, wherein the control device controls the ultrasonic oscillator and the output switch such that a timing at which the vibrator of one of the cleaning tanks is made to ultrasonically vibrate, and a tim

Abstract: Curved plastic objects and systems and methods for deburring the same are disclosed. The curved plastic object can be the cap or grill of a headphone or earbud.

Abstract: Method and device for processing a surface (5) of a diamond (1) with a mechanical part (3) which is moved in relation to the surface (5) of the diamond (1), whereby unbound diamond grains (2) are provided in between the mechanical part (3) and the surface (5) of the diamond (1), whereby the mechanical part (3) subjects the diamond grains (2) to a rolling motion over the surface (5) of the diamond (1), such that the diamond grains (2) move in relation to the mechanical part (3) and the surface (5) of the diamond (1), whereby the mechanical part (3) makes a mechanical contact with the surface (5) of the diamond (1) via the diamond grains (2), whereby this mechanical contact represents a contact length (8) over which the diamond grains (2) roll on the surface (5) of the diamond (1), mainly according to the direction of the relative motion of the mechanical part (3) in relation to the surface (5) of the diamond (1) and, whereby the diamond grains (2), with the support of the mechanical part (3), press themselves

Abstract: An ultra-low temperature magnetic polishing machine includes a housing defining therein a grinding chamber, a door hinged to the housing and controllable to open/close the grinding chamber, a motor mounted inside the housing below the grinding chamber, a magnetic disc set in between the grinding chamber and the motor and rotatable by the motor to cause an alternative magnetic field in the grinding chamber, a freezer having an output pipeline inserted into the grinding chamber and freezing medium deliverable through the output pipeline into the grinding chamber, a container set in the grinding chamber, and magnetically conductive grinding media put in the container.

Abstract: A magnetic particle carrying device includes a magnetic field generator and a hollow cylindrical structure. The magnetic field generator generates a magnetic field. The hollow cylindrical structure encases the magnetic field generator and attracts magnetic particles on an external surface of the hollow structure using the magnetic field. The external surface of the hollow cylindrical structure is provided with a plurality of elliptical depressions. The depressions include first type depressions and second type depressions. A long axis of a first type of elliptical depression is substantially extending in an axial direction of the hollow cylindrical structure, and a long axis of a second type of elliptical depression is substantially extending in a circumferential direction of the hollow cylindrical structure. The external surface of the hollow cylindrical structure has more elliptical depressions of the second type than elliptical depressions of the first type.

Abstract: Method and device for processing a surface (5) of a diamond (1) with a mechanical part (3) which is moved in relation to the surface (5) of the diamond (1), whereby unbound diamond grains (2) are provided in between the mechanical part (3) and the surface (5) of the diamond (1), whereby the mechanical part (3) subjects the diamond grains (2) to a rolling motion over the surface (5) of the diamond (1), such that the diamond grains (2) move in relation to the mechanical part (3) and the surface (5) of the diamond (1), whereby the mechanical part (3) makes a mechanical contact with the surface (5) of the diamond (1) via the diamond grains (2), whereby this mechanical contact represents a contact length (8) over which the diamond grains (2) roll on the surface (5) of the diamond (1), mainly according to the direction of the relative motion of the mechanical part (3) in relation to the surface (5) of the diamond (1) and, whereby the diamond grains (2), with the support of the mechanical part (3), press themselves

Abstract: A finishing device for finishing the exterior, flutes and tip of a drill bit is disclosed. The finishing device includes a containment vessel which houses an abrasive media which may have a visco-elastic component and an abrasive component. The drill bit is inserted into or through the abrasive media and rotated. A rotary member may be connected to the shank of the drill bit to provide rotation of the drill bit. The drill bit displaces the abrasive media thereby finishing the exterior, flutes, cutting edges and tip of the drill bit.

Abstract: A positioning member is used to position the movable jaw to the sliding groove of the adjustable wrench and the adjustable wrench together with the positioning member are applied by vibrate grinding technology so as to make the outer surface of the movable jaw to be a mirror surface and the rod of the movable jaw is kept as the surface condition after being machine. The tolerance between the rod and the sliding groove is controlled within expected range.

Abstract: A positioning member is used to position the movable jaw to the sliding groove of the adjustable wrench and the adjustable wrench together with the positioning member are applied by vibrate grinding technology so as to make the outer surface of the movable jaw to be a mirror surface and the rod of the movable jaw is kept as the surface condition after being machine. The tolerance between the rod and the sliding groove is controlled within expected range.

Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an abrasive liquid 50 containing free abrasive grains being supplied, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an abrasive liquid 50 containing free abrasive grains being supplied, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

Abstract: In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2a in a slurry flow rate target process until the flow rate increases to a target value of a slurry feed flow rate. When the flow rate reaches the target flow-rate, the cylinder is stopped and switched to another cylinder 2b and the operation fluid flow rate of the fine aperture is thereafter measured. In a metering process, to be executed next, a necessary processing time is calculated on the basis of the operation fluid flow rate and polishing is carried out for a necessary processing time by another cylinder 2b. Another cylinder is then stopped and switched and the operation fluid flow rate is measured. In this way, the metering process is repeated until the operation fluid flow rate reaches a predetermined value. In each process, the supply of the slurry is not interrupted.

Abstract: A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respect to an etching reagent to be used, on the surface of the glass substrate and in the vicinity thereof, and performing chemical etching using the etching reagent on the glass substrate having the compression stressed part formed thereon, so as to form a relief on the surface of the glass substrate.

Abstract: A method of polishing an object is disclosed. In one embodiment, the method comprises the steps of creating a polishing zone within a magnetorheological fluid; determining the characteristics of the contact between the object and the polishing zone necessary to polish the object; controlling the consistency of the fluid in the polishing zone; bringing the object into contact with the polishing zone of the fluid; and moving at least one of said object and said fluid with respect to the other. Also disclosed is a polishing device.

Abstract: A surface finishing method for aluminum shapes by barrel polishing, wherein caps are mounted at both open ends of a hollow aluminum shape, and two aluminum shapes each mounted with the caps are set on two right and left holders so as not to interfere with each other, the two aluminum shapes held above and below by the two right and left holders are next put in a barrel pot, and water, a compound, and a medium are put in the barrel pot, and then the barrel pot is closed by a lid. A plurality of barrel pots are installed on a centrifugal barreling machine, and the centrifugal barreling machine is operated so that the aluminum shapes are rotated and revolved.

Abstract: The present invention is an apparatus for polishing a precision screw. The apparatus uses abrasive in a sealed container for polishing. Hence, the present invention can do precise polishing to obtain smooth surface of thread by removing tiny burrs with the abrasive.

Abstract: In order to provide a treatment apparatus for treating workpieces or groups of workpieces that are conveyed from an inlet to an outlet of the treatment apparatus, wherein the treatment apparatus comprises a plurality of treatment levels and with said treatment apparatus the workpieces to be treated are passed from level to level in a safe and controlled manner, it is proposed that the treatment apparatus comprises a housing and receiving chambers, which rotate relative to the housing, for receiving the workpieces or groups of workpieces, wherein the receiving chambers are disposed in at least two different chamber levels and an outlet opening in the housing is associated with a first chamber level, through which the workpieces or groups of workpieces travel first, and an inlet opening is associated with a second chamber level, through which the workpieces or groups of workpieces travel after the first chamber level, and wherein the treatment apparatus comprises at least one transfer apparatus, which moves the

Abstract: A surface of the gas turbine blade is smoothed by way of a drag finish process. A first ring-shaped container is filled with a liquid abrasive medium. A second container which is arranged next to the first container is filled with a second liquid abrasive medium. A pivoting arm is arranged between and above the containers and can be pivoted along a pivoting direction. A drag device is arranged on the pivoting arm. The drag device leads a gas turbine blade on a carrier arm through the abrasive medium.

Abstract: An abrasive device may include first ring-shaped container filled with a liquid abrasive medium. A second container may be arranged next to the first container and filled with a second liquid abrasive medium. A pivoting arm may be arranged between and above the containers and can be pivoted along a pivoting direction. A drag device may be arranged on the pivoting arm. The drag device may lead a gas turbine blade on a carrier arm through the abrasive medium.

Abstract: A microelectronic substrate and method for removing conductive material from a microelectronic substrate. In one embodiment, the microelectronic substrate includes a conductive or semiconductive material with a recess having an initially sharp corner at the surface of the conductive material. The corner can be blunted or rounded, for example, by applying a voltage to an electrode in fluid communication with an electrolytic fluid disposed adjacent to the corner. Electrical current flowing through the corner from the electrode can oxidize the conductive material at the corner, and the oxidized material can be removed with a chemical etch process.

Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an abrasive liquid 50 containing free abrasive grains being supplied, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

Abstract: A method of honing a cutting edge of a rotary cutting tool comprising inserting the cutting tool into a liquid bath having an abrasive media therein such that at least the cutting edges are immersed, and providing a relative displacement of the cutting tool and the liquid bath such that the abrasive media flows over the cutting edges.

Abstract: A surface of the gas turbine blade is smoothed by way of a drag finish process. A first ring-shaped container is filled with a liquid abrasive medium. A second container which is arranged next to the first container is filled with a second liquid abrasive medium. A pivoting arm is arranged between and above the containers and can be pivoted along a pivoting direction. A drag device is arranged on the pivoting arm. The drag device leads a gas turbine blade on a carrier arm through the abrasive medium.

Abstract: Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate comprises a counter-electrode and a pad positioned between a substrate and the counter-electrode and a pad positioned between a substrate and the counter-electrode. A dielectric insert is positioned between the counter-electrode and the substrate. The dielectric insert has a plurality of zones, each zone permitting a separate current density between the counter-electrode and the substrate. In another embodiment, an apparatus for polishing a substrate that include a conductive layer comprises a counter-electrode to the material layer. The counter-electrode comprises a plurality of electrically isolated conductive elements. An electrical connector is separately coupled to each of the conductive elements.

Abstract: A barrel polishing device for polishing a workpiece having a relatively complicated shape such as a vehicle wheel. The barrel polishing device comprises a polishing medium storage tank for storing polishing media, a base, a workpiece supporting shaft mounted on the base, and a workpiece detachably mounted on a tip part of the workpiece supporting shaft, the polishing media stored in the polishing medium storage tank being flowed by an appropriate means, and the workpiece supporting shaft being disposed so that a front side of the workpiece opposes the flow of the polishing media, the workpiece supporting shaft being rotated about an axis thereof, and a baffle member being placed in the vicinity of a back side of the workpiece.

Abstract: A device for finishing workpieces, such as automobile wheels. The device includes a bowl assembly containing polishing media therein, and a drive assembly including a rotatable turret which carries the wheels thereon so that same are orbitally driven through the polishing media. A cam arrangement is provided which essentially continuously adjusts the angle of the wheels relative to the polishing media by pivoting the wheels about respective vertical axes. The device is additionally provided with a vertical drive assembly which allows vertical oscillation of the wheels relative to the media, and the polishing device also permits adjustment of the pitch or rake angle of the wheels relative to the horizontal.

Abstract: The invention provides a grinding machine for grinding grinding material by means of grinding bodies or wheels, having at least one grinding unit and two parts rotatable relative thereto, which has a container for receiving grinding material and a rotary disk placed above a container base, accompanied by the formation of a finite gap.

Abstract: An apparatus and process of surface finishing golf balls prior to painting is provided. The apparatus and process make use of nylon loops as a finishing material that is used to abrade the surface of adjacent moving golf balls. Optionally, the abrading process between the nylon loops and the surface of the golf balls may be carried out in the presence of a continuous stream of water. As water is removed from the processing equipment, the removed water carries with it abraded material. The process provides for improved adhesion of the paint to the surface of the golf ball.

Abstract: Embodiments of methods and apparatus in accordance with the present invention provide a chemical mechanical planarization (CMP) process that provides single or multiple polishing pads to have a different rotational velocity, applied pressure and oscillation frequency on the surface of the substrate to address and compensate for the WIW (with-in-substrate) and WID (with-in-die) non-uniformities in planarization ability. The velocity of each polishing pad is adjustable providing a closer match to the substrate surface velocity over a particular zone to yield a linear velocity on the surface of the substrate.

Abstract: This invention relates to a vibrating abrasive cleaning apparatus and method which is powered by at least one electric motor specially fabricated to the cleaning container assembly mounted on a rigid square tubing frame on one side by compression springs, on the opposite side by tension springs. The compression springs and tension springs have a different spring rate which produces better rolling of the media and therefore, faster circulation and cleaning. The specially fabricated electric motor attached to the cleaning container provides for enhanced oscillation and much greater cleaning capabilities thereby reducing the cleaning time. The entire vibrating assembly sits on a base and has a lid operated by a cable and counterweight for ease in loading the container for oscillation of the parts.

Abstract: An apparatus and process of surface finishing golf balls prior to painting is provided. The apparatus and process make use of nylon loops as a finishing material that is used to abrade the surface of adjacent moving golf balls. Optionally, the abrading process between the nylon loops and the surface of the golf balls may be carried out in the presence of a continuous stream of water. As water is removed from the processing equipment, the removed water carries with it abraded material. The process provides for improved adhesion of the paint to the surface of the golf ball.

Abstract: This invention concerns a machine for the drying, polishing and burnishing cutlery and other metal tableware. It consists of a tank suspended upon a base and moved by a vibrating device, having a treatment channel (15) designed to receive a drying material and the articles for treatment. The treatment channel (15) rises in a spiral from an entrance chute at the loading mouth to an exit passage or chute for the articles and has, in a transverse cross-section, a U-shaped bottom (22) defined by a substantially cylindrical concave surface and, lengthways, by a series of straight segments (23) which alternate with and are joined to curved segments (24), without sharp edges or corners. Ideally, the channel has a steeper gradient towards the exit.

Abstract: A method of CMP polishing of a semiconductor wafer is described that includes using a polishing pad on a platen/table with the polishing pad including a sub-pad containing pockets of magnetorheological fluid. The stiffness of the sub-pad is controlled by selectively applying a magnetic field at selective pockets containing magnetorheological fluid to change the viscosity of the magnetorheological fluid. The changing stiffness increases the polishing rate of the pad in the areas of the magnetic field.

Abstract: A chemical mechanical planarization (CMP) apparatus includes a bath of an aqueous solution. A first holder, which is configured to support a wafer, is disposed within the bath. A first spindle is configured to rotate the first holder. A second holder, which is rotated by a second spindle, is disposed above the first holder. The second holder supports a planarization media, which is disposed within the bath. The planarization media is oriented to face the surface of the first holder on which the wafer is to be supported. The planarization media can be a pad containing polyurethane or a substrate having an overlying abrasive film. The CMP apparatus also can include a system for recirculating and reconditioning the aqueous solution. A method for performing a CMP process also is described.

Abstract: An arrangement and method for precision machining of rotationally symmetrical, disk or ring-shaped components. The arrangement includes a container which is open at the top and mounted such that it is able to vibrate. An unbalanced rotor causes the container to vibrate in a rotation-induced manner and has a drive. The container is filled with an abrasive substance including a multitude of abrasive bodies and a liquid. A device for fixing the component is also arranged in the container which has a rotationally symmetrical shape and is arranged in line with a vertical axis. The container also includes a rigid fixing device for horizontally positioning the component.

Abstract: A centrifugal barrel finishing apparatus centrifugally polishing, grinding or otherwise finishing workpieces includes a revolving member mounted on a first rotatable shaft so as to be rotated with the first shaft, a barrel mounted to be rotated about a second shaft, the barrel having both axial ends, a stopper mounted on the second shaft so as to be abutted against one axial end side of the barrel, and a fluid pressure cylinder including a piston and mounted on the second shaft so that the piston pushes the other axial end side of the barrel so that the barrel is held between the stopper and the cylinder.

Abstract: There is disclosed a barrel-polishing apparatus comprising a polishing medium bath with polishing mediums received therein, a base, an arm mounted on the base, and a workpiece attachment device mounted on a distal end portion of the arm and adapted to attach a workpiece to the arm, wherein the polishing mediums are caused to flow within the polishing medium bath by an appropriate device and a pressing plate for pressing the polishing mediums is mounted on the polishing medium bath. A barrel-polishing method is also disclosed.

Abstract: Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate comprises a counter-electrode and a pad positioned between a substrate and the counter-electrode and a pad positioned between a substrate and the counter-electrode. A dielectric insert is positioned between the counter-electrode and the substrate. The dielectric insert has a plurality of zones, each zone permitting a separate current density between the counter-electrode and the substrate. In another embodiment, an apparatus for polishing a substrate that include a conductive layer comprises a counter-electrode to the material layer. The counter-electrode comprises a plurality of electrically isolated conductive elements. An electrical connector is separately coupled to each of the conductive elements.

Abstract: The invention relates to a method for protecting an underwater surface (3) against pollution due to fouling, in particular a metal surface, upon which a coating (4) is applied, whereby the coating (4), in the presence of water, is brushed or polished smooth with at least one brush (8) having brushes (9) made of synthetic material in which a grinding agent (10) is embedded. In the coating (4), glass flakes (5) are embedded to which silver is bonded.