Abstract: A machine for machining workpieces includes a machine frame (110, 120), a honing ring carrier (60) which is mounted on the machine frame and in which a honing ring or a honing ring blank is clampable and rotationally drivable about its central axis, and a workpiece spindle module (50) having a workpiece spindle (54), wherein a workpiece which is to be machined with the honing ring clamped in the honing ring carrier (60) is mountable in the region of a free end of the workpiece spindle (54). The machine further includes a grinding module (130) for profiling a honing ring as a result of grinding a honing ring blank, wherein the grinding module (130) is arranged in such a manner on the machine frame (110, 120) that a grinding wheel of the grinding module (130) can be positioned relative to the honing ring carrier (60) inside a truly three-dimensional space. The profiling of a honing ring and the honing of a workpiece can consequently be effected in the same clamping setup of the honing ring.

Abstract: A machine for honing gears comprises a workpiece spindle, the spindle axis of which is oriented vertically, wherein a workpiece to be machined is attachable in the region of a free end of the workpiece spindle, a honing ring carrier in which a honing ring for machining the workpiece attached to the workpiece spindle is clampable and is drivable in rotation about its central axis, and a machine frame on which the workpiece spindle and the honing ring carrier are mounted. The machine frame surrounds the honing ring carrier. The honing ring carrier is additionally mounted at two bearing points on the machine frame, said bearing points being substantially diametrically opposite one another with regard to the honing ring carrier, so as to be movable linearly along a horizontal axis which extends through the bearing points and so as to be movable in rotation about this axis. The machine has a simple and compact structure.

Abstract: The invention concerns a method for the machining of the tooth edges between an axially facing surface and the tooth flanks of a gear with a machining tool that has a toothed contour. For the material-removing cutting operation, the machining tool, rotating about the axis of its toothed contour, is brought into rolling engagement with the toothed workpiece under a crossing angle different from zero between the rotary axes of the machining tool and the toothed workpiece.

Abstract: A method and a device for the fine-machining of a toothed workpiece with a toothed finishing tool (10) which meshes with the workpiece in mutual tooth engagement are, for the purpose of producing conically modified tooth flanks, designed according to the invention in such a way that in the dressing process the finishing tool (10) and the dressing tool (11) are set at a position of reduced center distance (a) that is offset from a position of maximum center distance.

Abstract: Method and apparatus for lapping gears which includes an active torque system to substantially improve the lapping process with respect to run-out and other longer-term motion transmission errors without compromising tooth-to-tooth performance. Motion transmission error measurements provide the basis for calculating a corrective active torque component which is combined with conventional process torque to reduce or eliminate part run-out.

Abstract: An apparatus including a first spindle group for chucking a first gear, whereby the first gear is mountable on the first spindle group so that it is rotatable, and a second spindle group for chucking a second gear, whereby the second gear is mountable on the second spindle group so that it is rotatable. The apparatus further defining a first linear axis oriented to perform a first linear displacement of the first spindle group relative to the second spindle group; a second linear axis oriented to perform a second linear displacement of the first spindle group relative to the second spindle group; and at least one of a swivel axis oriented to perform pivoting of the first spindle group thereabout, and a swivel axis oriented to perform pivoting of the second spindle group thereabout.

Abstract: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.

Abstract: A mechanical device for lapping, and a method therefore, the device including: (a) a metal workpiece having a metal working surface; (b) a contact surface, disposed generally opposite the working surface, for moving in a relative motion to the working surface; (c) abrasive particles disposed between the contact surface and the working surface, and (d) a mechanism, associated with the working surface and/or the contact surface, for applying the relative motion, and for exerting a load in a substantially normal direction to the contact surface and the working surface, the contact surface for providing an at least partially elastic interaction with the plurality of abrasive particles, wherein, associated with the contact surface is a particulate additive, and wherein, upon activation of the mechanism, the relative motion under the load causes a portion of the abrasive particles to penetrate the working surface, and wherein the relative motion under the load effects incorporation of a portion of the particulate a

Abstract: An apparatus and method for polishing semiconductor wafers uses multiple polishing surfaces, multiple polishing heads and multiple wafer stations to sequentially polish the semiconductor wafers. The wafer stations includes at least one wafer load-unload station to transfer the semiconductor wafers between the wafer load-unload station and the polishing heads.

Abstract: A drag type wheel finishing machine. A spindle is connected to an output shaft of a drive motor secured to an upper platform of a frame structure. Arms are mounted adjacent to a lower end of the spindle. Upright members are joined to distal ends of the arms. Wheel mounting parts are mounted to lower ends of the upright members, and an abrasive polishing media bath is placed in the frame structure to be raised and lowered by a lift mechanism. The lift mechanism is configured such that the media bath can be guided by four columns and supported by four wires. One ends of the wires are connected to a distal end of a piston rod of a drag type hydraulic cylinder installed on the media bath such that, when the wires are simultaneously pulled via the piston rod, the media bath is raised.

Abstract: A method of CMP polishing of a semiconductor wafer is described that includes using a polishing pad on a platen/table with the polishing pad including a sub-pad containing pockets of magnetorheological fluid. The stiffness of the sub-pad is controlled by selectively applying a magnetic field at selective pockets containing magnetorheological fluid to change the viscosity of the magnetorheological fluid. The changing stiffness increases the polishing rate of the pad in the areas of the magnetic field.

Abstract: An assembly for holding a cylindrical workpiece for grinding, including a support frame having at least one support arm extending to initially hold the workpiece and operable to disengage from the workpiece during grinding, a tailstock slidably mounted on the support frame and operable to engage the proximal end of the workpiece, and a collet assembly mounted on the support frame and configured to receive and engage the distal end of the workpiece. The collet assembly includes a housing having an open proximal end, an open distal end, and an internal channel with an inner diameter. The internal channel extends along the length of the housing from the open proximal end to the open distal end and is adapted to slidingly receive a spindle. The spindle has a proximal end portion and a distal end portion. The proximal end portion includes a holding portion and the distal end extends from the distal end of the housing and is engagable with a drive mechanism.

Abstract: A method for polishing radially expandable surgical stents is disclosed where fluid abrasive media M flows over surfaces of the stent 10 causing the surfaces of the stent 10 to be polished and streamlined. The stent 10 is temporarily provided with cylindrical support ends 20, which are not radially expandable to support the stent 10 during the polishing process. An interior polishing fixture 100 is provided which has cylindrical chambers 135 therein adapted to receive a stent 10 therein. Fluid abrasive media M then flows into bores 108 in the fixture 100 leading to the cylindrical chambers 135 and adjacent the inner diameter surfaces of the stent 10. Surfaces of the stent 10 forming the outer diameter are polished by placing the stent 10 within an exterior polishing fixture 200 which has a cylindrical recess 220 therein.

Abstract: The present invention provides a method for processing such as deburring, polishing and washing of surfaces of slits of a workpiece, having slits with narrow width from outer surface toward inside, with high accuracy and high efficiency. Magnetic abrasive material is retained in a magnetic field formed between magnetic poles 3 and 4, and magnetic brushes 5 are formed. A workpiece 1 made of non-magnetic material and having slits 1f with narrow width is placed in said magnetic brushes 5, and by relatively vibrating said magnetic poles and said workpiece, surfaces of the slits are processed. It is more effective to tilt the slit surface with respect to the magnetic field after the slit surface is arranged in parallel to the magnetic field.

Abstract: A method for polishing radially expandable surgical stents is disclosed where fluid abrasive media M flows over surfaces of the stent 10 causing the surfaces of the stent 10 to be polished and streamlined. The stent 10 is temporarily provided with cylindrical support ends 20, which are not radially expandable to support the stent 10 during the polishing process. An interior polishing fixture 100 is provided which has cylindrical chambers 135 therein adapted to receive a stent 10 therein. Fluid abrasive media M then flows into bores 108 in the fixture 100 leading to the cylindrical chambers 135 and adjacent the inner diameter surfaces of the stent 10. Surfaces of the stent 10 forming the outer diameter are polished by placing the stent 10 within an exterior polishing fixture 200 which has a cylindrical recess 220 therein.

Abstract: The profiling tool (10) has a segment (12) of a worm thread. Its active zone (13) is coated with grains of hard material (16) and is crowned in cylinder sections coaxial to the tool axis (26). During profiling, the grinding spindle (2) and the tool (10) rotate synchronously. By appropriate correction of the coupling ratio by means of a CNC control when moving the tool (10) in axial direction of the grinding worm (2), the grinding worm flank (1) can be dressed with any desired topology. The method makes it possible to profile topologically modified grinding worms (2) at the grinding worm (2) rotational speed used for grinding, which was previously not possible.

Abstract: A method of polishing an object is disclosed. In one embodiment, the method comprises the steps of creating a polishing zone within a magnetorheological fluid; determining the characteristics of the contact between the object and the polishing zone necessary to polish the object; controlling the consistency of the fluid in the polishing zone; bringing the object into contact with the polishing zone of the fluid; and moving at least one of said object and said fluid with respect to the other. Also disclosed is a polishing device. In one embodiment, the device comprises a magnetorheological fluid, a means for inducing a magnetic field, and a means for displacing the object to be polished or the means for inducing a magnetic field relative to one another.

Abstract: A lapping compound mixing and supply system wherein lapping compound is recirculated to the mixing vessel when not supplied to the lapping chamber of a machine tool such as a gear lapping machine. Lapping compound is pumped at about a first range of pump speeds to the lapping chamber, however, when no lapping is being performed, lapping compound is pumped at about a second, decreased range of pump speeds through a recirculating conduit and introduced into the mixing vessel along the conical bottom surface of the vessel. The introduction of lapping compound in this manner, along with the action of an rotating impeller in the vessel, provides improved mixing of the lapping compound and homogenizes the temperature thereof.

Abstract: A method of polishing an object is disclosed. In one embodiment, the method comprises the steps of creating a polishing zone within a magnetorheological fluid; determining the characteristics of the contact between the object and the polishing zone necessary to polish the object; controlling the consistency of the fluid in the polishing zone; bringing the object into contact with the polishing zone of the fluid; and moving at least one of said object and said fluid with respect to the other. Also disclosed is a polishing device. In one embodiment, the device comprises a magnetorheological fluid, a means for inducing a magnetic field, and a means for displacing the object to be polished or the means for inducing a magnetic field relative to one another.

Abstract: A gear finishing apparatus includes a bed having a horizontally extending guide member and a vertically extending guide member, a grinding wheel support unit movable along the horizontally extending guide member and having a grinding wheel unit, a ring-shaped grinding wheel in the form of an internal gear rotatably supported on the grinding wheel head for rotation about a substantially vertical axis, a first actuator for moving the grinding wheel support unit along the horizontally extending guide member, a workpiece support unit movable along the vertically extending guide member, the workpiece support unit having a holding device for holding a gear blank having external gear teeth for rotation about a substantially vertical axis, a second actuator for moving the workpiece support unit along the vertically extending guide member to move the gear blank into and out of the grinding wheel, and a third actuator for rotating the grinding wheel to hone the gear teeth of the gear blank while the gear blank is being