Abstract: In a swivel device, a swivel head provided with a plurality of tool spindles thereon is mounted on a support base to be turnable about a swivel shaft being upright on the support base. An annular space portion is formed between the support base and the swivel head in coaxial relation with the swivel shaft. The tool spindles each mounting a grinding wheel are arranged on the swivel head to extends in a horizontal plane which crosses the annular space portion at about a mid position in the vertical direction of the annular space portion. A direct drive motor is built in the annular space portion so that a driving center of the direct drive motor is at almost the same height as the horizontal plane including the axes of the grinding wheels. Thus, the swivel device can lower the positions of the rotational axes of the grinding wheels and is rigid against inclination caused by grinding resistance acting on the grinding wheels.

Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.

Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing.

Abstract: A cylindrical grinder includes a workpiece support section adapted to support a generally cylindrical workpiece and rotate the workpiece about a rotational axis, and a wheel head adapted to support and rotate a grinding wheel. The wheel head is moved relative to the workpiece support section, along a first direction parallel to a rotational axis of the workpiece and along a second direction perpendicular to the first direction in order to grind an outer surface of the workpiece. The wheel head is turnable relative to the workpiece so that a rotational axis of the grinding wheel can be tilted within a plane substantially passing through the rotational axis of the grinding wheel and the rotational axis of the workpiece, within a range extending across a reference plane perpendicular to the rotational axis of the workpiece. Further, link-type parallel link mechanisms for moving the grinding wheel are disclosed.

Abstract: There is provided at least one of a moving device for moving a graining brush in the width direction of aluminum web and a turning device for turning the graining brush so that the graining brush can be placed obliquely against a transporting direction of the aluminum web. By moving the graining brush periodically in the width direction of the aluminum web, the entire graining brush uniformly comes into contact with the aluminum web. By turning the graining brush to place it obliquely against the transporting direction of the aluminum web, the entire graining brush can always come into contact with the aluminum web. Accordingly, the abrasion in the bristles of the graining brush is maintained uniform.

Abstract: A method for creation of a surface from a rough blank for spectacles is which is suitable for both brittle-hard materials and for plastics uses makes use of a disk-shaped, rotation-symmetrical tool of relatively large diameter, by means of which the material to be taken off the rough blank is removed with high grinding or milling efficiency in at least two work steps--a plunge-cut step and a shaping step with material removed along a spiral path. The outcome of the last work step is a machining path traveling in a spiral from the outside to the inside with low residual apex height and relatively large apex spacing. The resulting surface needs only slight fine-grinding and polishing aftertreatment. As an option, both a rim machining step adapted to the form of the eyeglass frame and a work step faceting the rim of the eyeglasses can be integrated into the method. Furthermore, tools are proposed for carrying out the grinding and milling process.

Abstract: An abrasive apparatus adopted to abrade a curved surface of workpiece includes: an abrading head including an abrading tip having a substantially spherical outer surface and a rotating shaft supporting the abrading tip, the abrading head being positioned to face the curved surface; a thrust moving mechanism for relatively moving the abrading head and the curved surface; a lateral moving mechanism for relatively moving the abrading head and the curved surface; a pivotal moving mechanism for relatively moving the abrading head and the curved surface pivotally around a center point; and a controller for controlling the abrading head, the thrust moving mechanism, the lateral moving mechanism and the pivotal moving mechanism synchronously so that the abrading tip contacts and presses the curved surface at any point thereon with a substantially constant pressure in a direction consistent with a normal line thereat.