Abstract: A method and an arrangement for determining the coordinates K of at least one point P1 on an edge of an optical lens, wherein the lens is held/can be positioned, by a retaining device, with the edge which is to be measured in an optical path of an optical micrometer, whereby the lens is held/can be positioned with the edge in the optical path, a coordinate Za is determined for the point P1, a variation of the relative position between the lens and the optical path is made, which is based on a pivotal axis S, a coordinate Zb is determined in the new position B for the point P1, and the coordinates Ya and Yb are determined.

Abstract: The head assembly of a floor burnisher is suspended by a main lift assembly and a fine adjustment assembly. The main lift moves the head assembly between a raised position in which the pad assembly is raised and tilted for access, and a lowered position in which the pad driver is suspended slightly above the floor, ready for use. The fine adjustment assembly permits the operator to control very accurately and conveniently the final operating pressure of the pad when the burnisher is turned on.

Abstract: A fixture for an automated connectorization system for processing fiber optic connectors. The fixture can include a first and second portions configured to hold the connectors. The first portion can include a plurality of clamps, each clamp being configured to clamp onto one of the connectors. The second portion can include a plurality of nests, each nest including an aperture configured to allow a ferrule of one of the connectors to extend therethrough. The second portion of the fixture is coupled to the first portion.

Abstract: A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface of the semiconductor wafer held by the wafer holding mechanism detecting opening of a bottom face of the groove during the back surface grinding process to determine timing for finishing the back surface grinding. The opening of the groove can be detected by means of a light sensor for detecting light passing through the groove or a microwave sensor for detecting a microwave passing through the groove. In addition, it is possible to suck air inside the groove so as to detect the opening of the groove by a pressure rise in the air inside the groove.

Abstract: Downfeed apparatus in a grinder controlling the grinding wheel down in fast, medium and slow speeds, and up in fast speed. It is fed down continuously in successive passes throughout the grinding operation, and at the end of the grinding, the grinding wheel continues through a spark-out mode at a constant level. A previous control program is held in a memory for later use in an identical operation on an identical workpiece. A monitor presents all steps taken in every mode and every step, and shows progress of movements enabling the operator to manually set and adjust the control apparatus simply and accurately by watching the monitor while making the adjustments. The monitor also continuously presents all movements in an automatic operation.

Abstract: An improved crank adapter mounts on the end of a milling machine worktable and enables the operator to adjust the worktable lateral position with a forward facing crank. This relieves the need for the operator to reach past the worktable end and manipulate a sidewards facing crank. The crank adapter mechanism includes a bevel gear mounted on the end of the worktable lead screw which engages a second bevel gear driven by a forward facing crank. The crank adapter mechanism can be mounted on either or both ends of the worktable after removal of the existing end plate or end plates.

Abstract: An apparatus and a method for processing lens peripheries which allow lenses to be properly fitted in a frame, i.e., which processes lenses with high dimensional accuracy. For this purpose, the lens periphery processing apparatus and method are designed to comprise an input device for inputting the configuration of lens frame portions of the eyeglasses frame which is a result of three-dimensional measurement, a calculation device for deriving peripheral lengths of the lens frame portions from the three-dimensional lens frame portion configuration inputted by the input device, a tapered edge curve determining device for determining a curve value defined by the locus of the tapered edge of each lens, and a computing device for computing the locus of the tapered edge of each lens which substantially coincides with the peripheral length of the associated lens frame portion which is obtained by the calculation device.