Abstract: The invention relates to a method for detecting, controlling and automatically compensating pressure in a polishing process, including: detecting a pressure between a polishing wheel and a polished workpiece by a detection shaft or a moment generated on the detection shaft, and outputting the detected pressure or moment to a controller; comparing the detected pressure or moment with a preset pressure or moment and determining whether there is a difference between them; calculating a compensation feeding amount based on the difference and outputting an adjustment signal to an adjustment shaft based on the compensation feeding amount; and moving the adjustment shaft correspondingly based on the adjustment signal so as to drive the polishing wheel or the polished workpiece to move correspondingly to adjust a relative position between the polishing wheel and the polished workpiece so that the difference keeps consistent.

Abstract: A silicon carbide single crystal substrate includes a first main surface, a second main surface, and a circumferential edge portion. The second main surface is opposite to the first main surface. The circumferential edge portion connects the first main surface and the second main surface. The circumferential edge portion has a linear orientation flat portion, a first arc portion having a first radius, and a second arc portion connecting the orientation flat portion and the first arc portion and having a second radius smaller than the first radius, when viewed along a direction perpendicular to the first main surface.

Abstract: A finishing device for finish machining of a workpiece, in particular of a crankshaft or a camshaft, comprising a workpiece holder and a rotary drive for rotating the workpiece about the workpiece axis thereof, comprising at least one first finishing tool for machining a main bearing concentric to the workpiece axis and at least one second finishing tool for machining an additional bearing, wherein the finishing tools can be moved along a transport axis which extends via a working area defined by the workpiece holder so that the finishing tools can be moved into an additional area arranged outside the working area.

Abstract: An apparatus for loading and unloading a brush to and from a brush-arm assembly of an end-effector is disclosed. The apparatus comprises a base and a carriage, which is movable along an axis at least to a first position, a second position, or a third position relative to the base. The carriage comprises a brush receptacle, configured to prevent movement of the brush in a first direction, but not in a second direction, opposite to the first direction, when the brush is placed in the brush receptacle. The apparatus also comprises a stationary component, fixed relative to the base and configured to prevent movement of the brush-arm assembly in the second direction. Additionally, the apparatus comprises a linear actuator, configured to move the carriage.

Abstract: An automated polishing system includes a workbench, a transport unit and a polishing unit, wherein the transport unit is provided with a transport surface and a transport drive configured to drive the transport surface to move horizontally, and the polishing unit includes a supporting portion, a holding arm rotatably connected to the supporting portion, a holder connected to the holding arm, a horizontal drive configured to drive the supporting portion to move horizontally, a vertical drive configured to drive the supporting portion to move vertically, a horizontally rotating drive configured to drive the holding arm to rotate in a horizontal direction, a vertically rotating drive configured to drive the holder to rotate in a vertical direction, a polishing shaft, a polishing rotating device configured to drive the polishing shaft, and a polishing drive configured to drive the polishing shaft to move towards the holder for reciprocating motion.

Abstract: Ultrasonic polishing systems and methods of polishing brittle components for electronic devices using ultrasonic polishing systems are disclosed. The ultrasonic polishing system may include an ultrasonic driver and a polishing head operatively coupled to the ultrasonic driver. The ultrasonic drive may have a surface shape that corresponds to a non-planar feature formed in the brittle component. The ultrasonic polishing system may also include an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head. The ultrasonic driver may be configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.

Abstract: A method for performing grinding includes selecting a target wheel loading for wafer grinding processes, and performing a grinding process on a wafer. With the proceeding of the grinding process, wheel loadings of the grinding process are measured. The grinding process is stopped after the target wheel loading is reached. The method alternatively includes selecting a target reflectivity of wafer grinding processes, and performing a grinding process on a wafer. With a proceeding of the grinding process, reflectivities of a light reflected from a surface of the wafer are measured. The grinding process is stopped after one of the reflectivities reaches the target reflectivity.

Abstract: A system for spinal fusion includes a spacer, a plate, an attachment member, and a first temporary fixation screw. The spacer includes a first coupling aperture having a first thread with a thread pitch that is greater than or equal to one third of a depth of the first coupling aperture. The plate includes a first attachment aperture and second coupling aperture. The attachment member includes a mating thread that mates with the first thread. The attachment member is configured to couple the spacer and the plate when inserted through the second coupling aperture and rotated to engage the first thread of the first coupling aperture. The first temporary fixation screw is configured to attach the plate to a first vertebra when inserted through the first attachment aperture and driven into the first vertebra.

Abstract: A system for spinal fusion includes a spacer, a plate, an attachment member, and a first temporary fixation screw. The spacer includes a first coupling aperture having a first thread with a thread pitch that is greater than or equal to one third of a depth of the first coupling aperture. The plate includes a first attachment aperture and second coupling aperture. The attachment member includes a mating thread that mates with the first thread. The attachment member is configured to couple the spacer and the plate when inserted through the second coupling aperture and rotated to engage the first thread of the first coupling aperture. The first temporary fixation screw is configured to attach the plate to a first vertebra when inserted through the first attachment aperture and driven into the first vertebra.

Abstract: A numerical control device inputs a machining program to control an operation of a machine tool and outputs feedback data obtained as a result of the operation of the machine tool. The numerical control device includes a machining-program analysis unit that analyzes the machining program having a machining shape command to which a mark or a specific program command is attached and that outputs a marking instruction; a delay unit that delays the marking instruction until the feedback data indicating a result of an operation of the machine tool based on the machining shape command is obtained; and a feedback-data output unit that, when having detected the feedback data and the delayed marking instruction, executes, onto the feedback data, marking corresponding to the mark or the specific program command attached to the machining shape command and outputs the feedback data.

Abstract: A finishing device for finish-machining of a workpiece includes a force-generating device for generating a driving force, a force-transmitting arm and a pressing device for applying a working force to a finishing tool, and further a measuring device for measuring a deformation of a segment of the force-transmitting arm arranged in the force flux between the driving force and working force and/or for measuring a deformation force applied in the segment.

Abstract: A glass-plate working machine 1 is arranged such that while a cutting head 9 for forming a cut line on a glass plate 5 and a grinding head 10 for grinding a peripheral edge of the glass plate 5 bend-broken along the cut line are being moved simultaneously in parallel under numerical control, the cutting head 9 and the grinding head 10 respectively having angle control motors 46 and 49 are synchronously subjected to angular control about axes 39 perpendicular to the surface of the glass plate 5, and the cutting head 9 and the grinding head 10 are moved such that the orientation of a cutter wheel 52 is adjusted to a processing line, and the press contacting direction of a grinding wheel 64 of the grinding head 10 is kept in a normal direction with respect to a processing line of an edge of the glass plate 5.

Abstract: A polishing method includes simultaneously polishing two substrates, a first substrate and a second substrate, on the same polishing pad. A default overpolishing time is stored and an in-situ monitoring system monitors the two substrates. The in-situ monitoring system further determines a first polishing endpoint time and a second polishing endpoint time of the first and second substrates, respectively. The polishing method further includes calculating an overpolishing stop time where the overpolishing stop time is between the first polishing endpoint time plus the default overpolishing time and the second polishing endpoint time plus the default overpolishing time. Polishing of the first substrate is continued past the first polishing endpoint time and polishing of the second substrate is continued past the second polishing endpoint time. Polishing of both the first substrate and the second substrate is halted simultaneously at the overpolishing stop time.

Abstract: An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen.

Abstract: A glass-plate working machine 1 is arranged such that while a cutting head 9 for forming a cut line on a glass plate 5 and a grinding head 10 for grinding a peripheral edge of the glass plate 5 bend-broken along the cut line are being moved simultaneously in parallel under numerical control, the cutting head 9 and the grinding head 10 respectively having angle control motors 46 and 49 are synchronously subjected to angular control about axes 39 perpendicular to the surface of the glass plate 5, and the cutting head 9 and the grinding head 10 are moved such that the orientation of a cutter wheel 52 is adjusted to a processing line, and the press contacting direction of a grinding wheel 64 of the grinding head 10 is kept in a normal direction with respect to a processing line of an edge of the glass plate 5.

Abstract: A precision machining apparatus is structured such that a feed-screw mechanism and an actuator are mounted on a second mount which supports a rotating device that rotates a wheel, and grinding is performed while appropriately adjusting the amount of movement of the second mount in a rough grinding stage through an ultra-precision grinding stage. A posture control device is interposed between a first mount and a rotating device that rotates a grinding target body. The thickness and evenness of the grinding target body are measured by an optical probe and the measurement results are sent to a computer. A feedback command is then sent to the posture control device to reduce the difference between target values and the measurement values and posture control is performed accordingly.

Abstract: An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen.

Abstract: A polishing machine for optical elements, comprising: a spindle arranged to rotationally drive an optical element; a polishing tool mobile relative to the spindle; wherein the polishing machine further comprises a platform mounted on top of a work chamber, the work chamber comprising the spindle, and the platform holding a body on which is mounted the polishing tool.

Abstract: The present invention relates to a tire assembling-disassembling tool for use in a tire assembling-disassembling machine arranged to rotatable support a tired wheel or wheel rim, said tool being cantilever supported on a respective guide member of the tire assembling-disassembling machine, said tool extending parallel to the axis of rotation of the wheel and comprising a tool-carrying arm slidable mounted on said guide member, and at least one nail-shaped member having a first end thereof constrained to said supporting arm so to be able to made roto-translational movements with respect thereto, and the other free end hook-shaped with back facing said wheel rim.

Abstract: The present invention relates to a grinding apparatus for grinding an out-of-round trunnion tire for a rotating kiln. The present invention is mounted on a trunnion roller such that a tracking wheel and a grinder are in tangent with the out-of-round trunnion tire. The mounting bracket supports a means for angling the grinder so that it is in tangent with the out-of-round tire and making it round. The grinder is part of a grinder head assembly which is mounted on the angling means. The grinder head assembly includes the grinder, a housing and a drive mechanism. The drive mechanism includes a motor which drives the grinder wheel so that it grinds the trunnion tire back into round.

Abstract: To prevent a blowout nozzle from colliding with a workpiece due to a trouble of a backpressure sensor so as to avoid damage to the workpiece in a processing apparatus provided with a backpressure sensor, the backpressure sensor is formed capable of being freely moved at the blowout nozzle thereof in the air blowout direction and in the direction opposite thereto, and provided with a free-movement detecting sensor adapted to detect an actual free-movement of the blowout nozzle.

Abstract: Provided is a grinding machine comprising a carrier adapted to raise or lower, the carrier including a V-shaped groove across its top and a forward pad at either side, a spindle unit including an inverted L-shaped mounting plate, and a fine tilting adjustment mechanism comprising first, second, third, and fourth screw type fastening units for fastening horizontal and vertical portion of the mounting plate at the carrier. Each screw of the fastening units is spaced from the carrier by a peripheral gap. The gaps are adapted to allow the horizontal or vertical portion of the mounting plate and thus the spindle unit to either tilt to the left or right or tilt to the front or rear with respect to the carrier in response to unfastening the screws and loosening adjustment screws of the fastening units.

Abstract: A kiln tire grinder for grinding an out-of-round kiln tire comprising a grinding belt head assembly having a rotatable grinding belt and an x-y positioning table for positioning the rotating grinding belt assembly against a kiln tire. The rotating grinding belt assembly includes a drive assembly for rotating the grinding belt and a frame assembly for urging the grinding belt against the out-of-round kiln tire. The operator adjusts the rotating grinding belt head assembly against the out-of-round tire and then engages a drive motor which rotates the grinding belt. The rotating grinding belt is then urged against the kiln tire with a pressure that is adjustably controlled.

Abstract: Apparatus for removing material from a workpiece is described, in which the apparatus comprises means for advancing an abrasive tool towards the workpiece to bring an abrasive surface of the tool into contact with the surface of the workpiece, means for moving the abrasive surface relative to the workpiece to remove material from the workpiece, means for detecting a load applied to the tool by the workpiece, and means for controlling the rate of advancement of the abrasive tool towards the workpiece depending on the magnitude of the detected load.

Abstract: A chemical mechanical polishing (CMP) apparatus includes a plate that holds a substrate, a pad assembly unit comprising a pad support device, a positioning device, and a rotation device operatively connected to the pad assembly unit. The pad support device comprises a plurality of support plates to which pad pieces of a polishing pad can be attached. The positioning device can move at least one of the plurality of support plates in a direction along a surface of the semiconductor substrate to be polished. Further, the CMP apparatus can control the polishing amount along any portion of a surface of a wafer to be polished.

Abstract: A pad conditioner coupling (58) holds an end effector (57) for abrading a polishing media surface. Pad conditioning planarizes the polishing media surface, removes particulates, and roughens the polishing media surface to promote the transport of polishing slurry. Pad conditioner coupling (58) comprises shoulder screws (50), polymer bearings (51), a static plate (52), a wave spring (54), and a floating plate (55). Wave spring (54) is placed between static plate (52) and floating plate (55). The shoulder screws (50) connect through the static plate (52) and fasten to the floating plate (55) to hold the wave spring (54) in a preloaded condition. The polymer bearings (51) prevent the shoulder screws (50) from contacting the static plate (52). Wave spring (54) allows the floating plate (55) to move in a non-parallel position to the static plate (52) for angular compensation in the pad conditioning process.

Abstract: A centerless grinder 1 according to the present invention comprises a bed 108, a grinding wheel spindle stock 101, a regulating wheel spindle stock 102, a work rest 103, and the like. The grinding wheel spindle stock 101 and the regulating wheel spindle stock 102 are respectively moved toward and away from each other by feed devices 10, 10. The feed devices 10, 10 respectively comprise feed screws 11, 11 each having one end fixed to the work rest 103. Nuts 12, 12 are respectively retained in the grinding wheel spindle stock 101 and the regulating wheel spindle stock 102 in threading engagement with the feed screws 11, 11 so that axial movements thereof along the feed screws 11 are restricted and rotational movements thereof about axes thereof are permitted. The nuts 12, 12 are respectively rotated by driving motors 15, 15.

Abstract: A linear drive mechanism for chemical mechanical polishing includes a substrate carrier and support system which employs at least one linear motor to drive the substrate carrier through polishing motions. An additional driver for driving at least a portion of the carrier in directions perpendicular to the motions supplied by the linear motor(s) is also included. A clamping flexure is provided to selectively lock the substrate carrier in a vertical position. The substrate carrier, in one embodiment is mounted to a vertical driver via a column. The column is guided by spiral flexures to prevent motion in directions normal to vertical. An air mount is provided to support the majority of the mass of the substrate carrier, so that only a small force need be applied by the additional driver for movements in the vertical direction. Another, linear drive mechanism is described as using a “Sawyer motor” for both polishing motions as well as vertical force application.

Abstract: A cutting machine comprises a chucking means for holding the semiconductor wafer that is to be cut, a cutting means for cutting the semiconductor wafer held on the chucking means, a first moving means for moving the chucking means relative to the cutting means in a moving direction perpendicular to the center axis of the chucking means, and a second moving means for moving the cutting means relative to the chucking means in a direction of depth of cutting which is the direction of center axis of the chucking means. The cutting machine further comprises a thickness detecting means for detecting the thickness of the workpiece held on the chucking means, and a control means for controlling the motion of the second moving means depending upon the thickness of the workpiece detected by the thickness detecting means and for setting the position of the cutting means in the direction of depth of cutting relative to the chucking means thereby to set the depth of cutting the workpiece by the cutting means.

Abstract: A polishing wheel is pushed up and down in the Z-axis direction owing to a wafer surface shape. And the polishing amount depends on the height of protrusions on a wafer surface. Where a spindle is a rigid body in the Z-axis direction, the pressing force of the polishing wheel caused by vertical movement of a tool varies depending on the position on a wafer and hence polishing is not performed uniformly To solve this problem, the spindle is provided with a Z-axis parallel leaf spring mechanism. Push-up and push-down actions of the polishing wheel are absorbed by displacement of the parallel leaf spring mechanism. This enables uniform polishing. Since the tool can be hardened, the flatness can also be improved.

Abstract: The description deals with a facility for dressing of a grindstone (1) for grinding of a running surface structure of a ski, which facility consists of a rotating drive (7) for the grindstone (1), of a dresser (2) adjustable to the circumferential surface of the grindstone (1) and equipped with at least one cutting insert, and of a feed drive (6) for the axially parallel relative movement of the dresser (2) against the grindstone (1). To create favorable construction features it is suggested to provide a controlling system (8) for the feed drive (6) and/or the rotating drive (7), equipped with a control program memory (9) selectable via an input unit (10) and with an evaluation circuit (12) connected to the control program memory (9) for the program-sensitive definition of the position-dependent switching points for the rate of the feed drive (6) and/or the rotating drive (7).

Abstract: A polishing wheel is pushed up and down in the Z-axis direction owing to a wafer surface shape. And the polishing amount depends on the height of protrusions on a wafer surface. Where a spindle is a rigid body in the Z-axis direction, the pressing force of the polishing wheel caused by vertical movement of a tool varies depending on the position on a wafer and hence polishing is not performed uniformly. To solve this problem, the spindle is provided with a Z-axis parallel leaf spring mechanism. Push-up and push-down actions of the polishing wheel are absorbed by displacement of the parallel leaf spring mechanism. This enables uniform polishing. Since the tool can be hardened, the flatness can also be improved.

Abstract: An apparatus for removing a thin film of material from a portion (23) of a sheet of fabric (22) and its method of operation, includes a grinder wheel (19) spaced from a nip roller (29) which is carried by an arm (32). The initial spacing between the grinder wheel (19) and the nip roller (29) is established by an adjusting mechanism (37) which pivots the arm (32), that spacing being determined by the expected thickness of the fabric (22). Pinch rollers (27) move the fabric (22) through the space, and a thickness-sensing wheel (44) rides on the fabric (22) upstream of the nip roller (29). Upon a change in the thickness of the fabric (22), a sensing arm (45) which carries the sensing wheel (44) pivots which, through a link arm (54), pivots a regulator arm (61) which carries a follower roller (70) that rides on the arm (32). Such allows the nip roller (29) to move toward or away from the grinder wheel (19) dependent on the thickness of the fabric (22) sensed by the movement of the sensing wheel (44).

Abstract: A chemical mechanical polisher includes a substrate carrier and support system which employs at least one motor to drive the substrate carrier through polishing motions. An additional driver for driving at least a portion of the carrier in directions perpendicular to the motions supplied by the motor(s) is also included. A clamping flexure is provided to selectively lock the substrate carrier in a vertical position. The substrate carrier, in one embodiment is mounted to a vertical driver via a column. The column is guided by spiral flexures to prevent motion in directions normal to vertical. An air mount is provided to support the majority of the mass of the substrate carrier, so that only a small force need be applied by the additional driver for movements in the vertical direction. Another drive mechanism is also described which provides both polishing motions as well as vertical force application.

Abstract: Chemical mechanical planarization (CMP) of semiconductor wafers presents a harsh abrasive and chemical environment for equipment used in a polishing process. Prior art translation mechanisms are prone to failure due to corrosion and require maintenance that exposes the polishing process to contamination from lubricants. A translation mechanism (31) requiring no lubrication is designed to have maintenance at intervals greater than a CMP tool. The translation mechanism (31) includes a housing (32) and a moveable mount (33). The housing (32) and the moveable mount (33) are made of hardened stainless steel which is impervious to the CMP environment. Bearing shafts (39) buffer a threaded shaft (36) from side loading on the moveable mount (33). Polymer bearings (51) connected to moveable mount (33) provide a low friction contact surface to bearing shafts (39). A polymer translation nut (41) connects to the moveable mount (33) and is threaded onto the threaded shaft (36).

Abstract: Both an apparatus and method for truing and dressing a grinding wheel with a constant tangentially dressing force is provided. The apparatus includes a rotatable diamond dressing roll, an engagement assembly including a servo-motor for forcefully engaging the dressing roll against the peripheral work surface of the grinding wheel, a sensor for sensing the force of engagement between the dressing roll and the grinding wheel, and a microprocessor connected to both the sensor and the power supply for the servo-motor for modulating both the voltage and polarity of a DC current connected to the servo-motor so that the engagement assembly presses the diamond dressing roll against the grinding wheel with a constant force during the entire dressing operation.

Abstract: A sizing and finishing machine includes a mechanism for rotating an associated workpiece and a first microfinishing belt for selectively contacting the associated workpiece. The belt has a maximum grit size of 60 microns. A structure is provided for rotatably holding the first microfinishing belt and a housing is provided on which the structure is mounted. A mechanism moves the first housing and hence the first microfinishing belt toward and away from the associated workpiece. The mechanism is timed to the rotation of the associated workpiece to maintain a substantially constant pressure of the first microfinishing belt on the associated workpiece. If desired, a second microfinishing belt mounted separately on a second housing can be provided with the two housings and their respective belts being separately controlled. The force exerted by the microfinishing belt on the associated workpiece is limited to a pressure of less than approximately 25 psi.

Abstract: A wheel-head feed mechanism for a grinder comprising a base and a wheel head which is guided by a linear guide section provided on the base and rotatably supports a grinding wheel via a wheel spindle driven by a motor. The wheel-head feed mechanism includes feed screw mechanism composed of a screw shaft and a nut unit engaged with the screw shaft, the feed screw mechanism advancing and retracting the wheel head with respect to a workpiece, and servomotor for rotating one of the screw shaft and the nut unit. The screw shaft is offset from the linear guide section toward the wheel spindle. The nut unit includes a radial hydrostatic bearing section for supporting the root of a male thread of the screw shaft in the radial direction of the screw shaft by hydrostatic pressure, as well as a thrust hydrostatic bearing section for supporting the flanks of the male thread of the screw shaft in the axial direction of the screw shaft by hydrostatic pressure.

Abstract: A grinding machine for grinding a wafer includes a pressure sensing grinding wheel having a disk portion, an annular portion depending from the disk portion that includes a plurality of cavities, a grinding tooth disposed in each cavity, and a pressure sensor disposed in each cavity between the tooth and the disk portion. The pressure sensor provides a signal indicative of the pressure applied by the grinding wheel against the wafer to a controller. Based on the signal received, the controller provides control signals to the drive motor and to a feed rate mechanism to maintain optimum grinding action. A method for grinding a wafer includes the steps of receiving a pressure signal from the grinding wheel and changing the feed rate in response to the pressure signal. The controller can also receive, and use for control purposes, additional inputs indicative of the current draw of a drive motor and of the rotational speed of a spindle shaft attached to the grinding wheel.

Abstract: A table for cutting, grinding or otherwise machining a frangible workpiece includes a conveyor for receiving, supporting and selectively moving the workpiece on the table and a carriage mounted for moving both parallel to the centerline of the table and perpendicular to the centerline of the table. A machine tool for machining the workpiece, such as a cutting head or grinding head, is mounted on the carriage above the conveyor. A first linear motor mechanism is mounted below the conveyor in an area protected from the machining environment for moving the carriage parallel to the centerline of the table. A second linear motor mechanism moves the carriage perpendicular to the centerline.

Abstract: Equipment for the grinding of material samples includes a console and a frame structure. A turntable is mounted on the console and frame structure, with the turntable having a material sample holding portion capable of releasably holding a plurality of material samples thereon. At least one vertically movable grinding spindle is arranged above the turntable. A mechanism is further provided for laterally oscillating the turntable relative to the console and frame structure as well as relative to the at least one vertically movable grinding spindle. A programmable control unit is connected with the turntable, movable grinding spindle and mechanism for laterally oscillating the turntable for controlling grinding.

Abstract: A lapping method and device for lapping magnetic heads to provide an air bearing surface with improved surface quality including increased smoothness, reduced rolloff, and reduced recession. The lapping machine includes a lapping plate having a grinding surface, a linear motion mechanism for moving the ABS over the grinding surface in a first, linear direction, and a micro-advance mechanism for controllably advancing the workpiece over the grinding surface in a second direction that is preferably perpendicular. The lapping method comprises affixing the unfinished magnetic head proximate to the lapping plate and depositing an abrasive slurry on the grinding surface. An initial rough lapping stage is performed, including moving the grinding surface so that the workpiece is lapped to a first predetermined target specification.

Abstract: A centerless grinder assembly for machining elongate workpieces and method of operating same are disclosed. The centerless grinder comprises a work wheel for removing stock from an associated workpiece, a regulating wheel arranged to cooperate with the work wheel in removing the stock from the workpiece and a support device arranged between the work wheel and a regulating wheel for supporting the workpiece during machining operations.

Abstract: An electric drive motor with a small size and large rotary torque is used as a driving device for a grinding wheel of a grinding device. The motor such as an AC servo motor is encased in a casing to protect it from humidity, high temperature, scattered oil, etc. The atmosphere in the casing is controlled to protect the motor. The pressure, temperature and humidity in the casing are controlled by introducing dried air into the casing.

Abstract: The present invention relates to a system for measuring a grinding force between a workpiece and a grinding wheel during the operation of a computer controlled grinding machine. A force transducer is mounted on a drive screw assembly between a moveable slide and a motor used to control movement of the slide. The force transducer generates a control signal that is conditioned and received by a digital signal processor, which instructs a machine controller to perform grinding operations in response to the measured force.

Abstract: This invention provides a clean and inexpensive apparatus and method of rapidly grinding an edge of a sheet of glass. The method involves: locating a sheet of glass on a support surface, lifting a sheet by a rotatable support which is movable along two axes, lifting the sheet by a rotatable support, moving the sheet along the first axis to a predetermined height, moving the sheet along the second axis until the sheet makes contact with the grinding wheel, translating the sheet to maintain contact with the grinding wheel while the glass is rotated, and replacing the glass on a support surface after the entire periphery of the glass is ground. Also disclosed is an apparatus for performing this method.

Abstract: A centerless grinder assembly for machining elongate workpieces is disclosed. The centerless grinder comprises a work wheel for removing stock from an associated workpiece, a regulating wheel arranged to cooperate with the work wheel in removing the stock from the workpiece and a support device arranged between the work wheel and a regulating wheel for supporting the workpiece during machining operations. The centerless grinder assembly may also include a slidable sensor bank spaced from the work wheel and the regulating wheel for detecting at least the position of the workpiece during machining operations and for generating signals corresponding to the detected position of the workpiece. The slidable sensor bank may be selectively adjustable to a desired distance away from the work wheel and the regulating wheel to permit versatility in machining workpieces having various lengths.

Abstract: An improved mechanism for applying a controlled load to a specimen being polishing in an automatic polishing machine including a tension spring for exerting a downward load which is transmitted to the specimen to press the same against an abrasive polishing member, and a stepper motor connected by a plurality of mechanical elements to one end of the tension spring whereby through use of a microprocessor the stepper motor may be operated to control the load applied to the specimen.

Abstract: A method and apparatus is disclosed for texturizing magnetic storage disks. The disk texturizing apparatus utilizes a combination of servomotors for rotating the disk and oscillating the disk towards and away from a texturizing media. The servomotors are controlled by a closed-loop control system which monitors and synchronizes the angular and linear position of the disk. Through such control, the disk rotation speed may be modulated in conjunction with the linear oscillation, thereby allowing a higher degree of triangularity in the texturization pattern. A pattern generation system and a graphical user interface for specifying, modeling, generating, modifying and displaying disk texturizing patterns are also disclosed. The texturizing pattern may be displayed in polar plot and linear plot form so that the user can more easily visualize and design the texturizing pattern.

Abstract: The apparatus, especially a grinding machine, comprises a frame (14) on which two working planes (A, B) are used, at least two oscillating elements (11, 12) disposed on one of the planes and each including at least one tool device (15, 16), at least one further tool device disposed on the other plane, and at least one means for generating oscillating motion (20) whereby a reciprocating movement can be generated at the level of each of the oscillating elements, so that the resultant of the vectors representing the dynamic forces associated with the movement of each of the oscillating elements is substantially equal to zero. There is then little or no induced vibration.