Abstract: A machining apparatus machines an end face of a tapered roller with a grinding wheel. The machining apparatus includes a support mechanism configured to support the tapered roller, a wheel unit on which the grinding wheel is mounted, and a base configured to support the wheel unit so that the wheel unit is swivelable about a center line in a vertical direction. A machining point where the grinding wheel is brought into contact with the end face of the tapered roller supported by the support mechanism is located on an extension of the center line serving as a swivel center of the wheel unit.

Abstract: A device and a method for processing, in particular edge processing, an optical lens, wherein the device has a measuring system, a processing system, a loading system, an unloading system, an intermediate conveyor, and a belt conveyor. The loading system is arranged between the measuring system and the processing system. The unloading system is arranged on the opposite side of the processing system. A lens that is to be processed is picked up and oriented at the optical reference point that is determined by the measuring system in order to determine as precisely as possible the blocking point for the subsequent processing. The loading system and unloading system each have a linearly movable swiveling system with linearly movable suction devices arranged therein. The processing system is designed for the simultaneous processing of two lenses.

Abstract: A method of cleaning deposited material from a molding surface (10) of a mold (1) for forming ophthalmic lenses, including bringing a cleaning head (20) into contact with the molding surface (10), the rotational axis (22) of the cleaning head (20) being arranged normal to the molding surface (10), rotating (220) the cleaning head (20) around the rotational axis (22) while maintaining the contact between the cleaning head (20) and the molding surface (10), moving the cleaning head (20) to perform a precession motion (110) around a central normal (11) on the molding surface (10), while rotating (220) the cleaning head (20) around the rotational axis (22) and while maintaining the contact between the cleaning head (20) and the molding surface (10). During the precession motion (110) the rotational axis (22) includes an inclination angle (?1,?2) with the central normal (11) on the molding surface (10).

Abstract: The present invention in one or more embodiments provides a roller tool for roughening a friction ring of a brake disk, the roller tool including a roller body including inner and outer ends and a casing surface positioned therebetween, the inner end differing in cross-section dimension than the outer end, the casing surface including thereupon one or more protrusions for contacting the friction ring. The roller tool may further include a support frame supporting the roller body. The support frame may include a short leg connected to the outer end of the roller body and a long leg connected to the inner end of the roller body.

Abstract: A chemical mechanical polishing (abbreviated as CMP) conditioner comprises a bottom substrate, an intermediate substrate and a diamond film The intermediate substrate is provided on the bottom substrate. The intermediate substrate comprises a hollow portion, an annular portion surrounding the hollow portion, and at least one projecting ring projecting out of the annular portion away from the bottom substrate. The projecting ring comprises a plurality of bumps arranged to be spaced apart from each other along an annulus region. The bumps are extended in a radial direction of the intermediate substrate. The diamond film is provided on the intermediate substrate. The diamond film is allowed for conforming to the bumps, so as to form a plurality of the abrasive projections.

Abstract: A polishing device for polishing curved lens faces of optical lenses has a workpiece holder for receiving an optical lens and a polishing tool. The polishing tool has a support element, an elastic substructure and a curved polishing surface on the elastic substructure. The polishing tool, with the polishing surface, is driven in a rotating manner about a rotation axis, the workpiece holder being driven in a rotating manner about a first axis, in order to rotate the optical lens. A distance between the workpiece holder and the polishing tool is adjustable along a second axis. An offset between the workpiece holder and the polishing device is adjustable along a third axis, which is aligned transversely in relation to the first axis. A pitch angle between the rotation axis and the first axis is adjustable by tilting about a fourth axis. A method of operating the device is also disclosed.

Abstract: An apparatus for replacing a polishing table, which is used in a polishing apparatus for polishing a substrate such as wafer, is disclosed. The polishing table replacement apparatus (10) is used for removing a polishing table (3) from a polishing apparatus (1). This polishing table replacement apparatus (10) includes a crane (10) configured to move the polishing table (3) vertically and horizontally, a table stage (14) on which the polishing table (3) can be placed, and a table-stage tilting mechanism (15) configured to tilt the table stage (14).

Abstract: A device for polishing metallic workpiece surfaces. The device includes a tool holder which can be exchangeably fitted into a rotationally driven working spindle of a program-controlled milling machine, and a polishing tool, which is fastened in the tool holder. The device also includes a tool shank and a polishing head at the free end thereof, and is coupled to a polishing agent supply which arrives at the effective surface of the polishing head. The tool shank contains a chamber, which can admit a pressure medium and is at least partially filled with the polishing agent, wherein this chamber is in connection with the polishing head by way of a channel and wherein the polishing head has polishing agent permeable material or it contains passages for the polishing agent that is forced out of the chamber.

Abstract: A multilayer chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate.

Abstract: A chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate.

Abstract: An object of the present invention is to improve the capability of lifting a substrate with the polishing performance of the substrate maintained. A polishing apparatus 100 includes a polishing table 110 to which a polishing pad 108 for polishing a substrate 102 is attached, a liquid feeding section configured to feed a liquid 109 to a polishing surface of the polishing pad 108, a top ring 116 configured to suck and convey the substrate 102 from the polishing surface, the substrate 102 being disposed on the polishing surface via the liquid 109 fed by the liquid feeding section, and a control section configured to inject a fluid (N2) into an internal area 109a of the liquid 109 interposed between the substrate 102 and the polishing pad 108.

Abstract: A method of chemical mechanical polishing a substrate is provided, including: providing a substrate; providing a chemical mechanical polishing pad, comprising: a polishing layer having a composition and a polishing surface, wherein the composition of polishing layer is selected to exhibit an initial hydrolytic stability; coupled with a sustained hydrolytic instability; a rigid layer having a top surface and a bottom surface; a hot melt adhesive interposed between the base surface of the polishing layer and the top surface of the rigid layer; wherein the hot melt adhesive bonds the polishing layer to the rigid layer; a pressure sensitive platen adhesive layer having a stack side and a platen side; wherein the stack side of the pressure sensitive platen adhesive layer is adjacent to the bottom surface of the rigid layer; and, creating dynamic contact between the polishing surface and substrate to polish a surface of the substrate.

Abstract: A tool-support apparatus for attachment to a grinding machine, in particular to a wet grinding machine, which has at least one grinding disc arranged on a rotatably drivable grinding-disc shaft and a machine frame or housing in which the grinding-disc shaft is supported. The tool-support apparatus has a tool-support, which can be secured on a machine frame or housing of the grinding machine, for the support during the grinding process of a tool that is to be ground, and an arresting apparatus for securing the tool support on the machine frame or housing. The tool-support can be secured on the machine frame or housing in such a way that it can be swivelled about the grinding-disc shaft or about a swivel axis parallel to the grinding-disc shaft and can be arrested by way of the arresting apparatus in a plurality of angular positions.

Abstract: A chemical-mechanical polishing (CMP) apparatus for manufacturing a semiconductor device. The apparatus includes: a spin chuck for supporting and rotating a semiconductor wafer; a polisher comprising a polishing pad for planarizing a surface of the semiconductor wafer, the polisher moving along the surface of the semiconductor wafer by a polishing arm; and a polisher supporting device for supporting the polisher and maintaining the polisher in a horizontal state, while polishing an edge part of the surface of the semiconductor wafer, in order to improve polishing uniformity of a center part and the edge part of the semiconductor wafer. Accordingly, polishing uniformity of the center part and edge part of the semiconductor wafer may be improved, and a height of the polisher supporting device may be optimized according to a polishing degree. Also, the polisher may be easily supported, wear and tear of the support head may be minimized, and the support head may function as a conditioner.

Abstract: A method and system for resurfacing one or more lacrosse balls is provided. The system includes a container, a rotatable member, and a motor. The container is configured to hold the one or more lacrosse balls. The rotatable member includes an abrasive surface configured to scuff the lacrosse balls while in the container, The motor includes a drive shaft coupled to the rotatable member and configured to facilitate rotation of the rotatable member. With this arrangement, the lacrosse balls are positioned over the abrasive surface such that, upon rotation of the rotatable member the abrasive surface scuffs the lacrosse balls to, thereby, resurface the balls.

Abstract: The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.

Abstract: A grinder equipped with a curved motion mechanism to process a working piece to form a double-envelope structure includes a grinding wheel, a driving shaft, a track bracket and a holder. The grinding wheel includes a grinding edge which has a grinding zone in contact with the working piece. The driving shaft drives the grinding wheel spinning. The track bracket holds the driving shaft and is movable in a curved motion against the holder. The driving shaft is coupled with the track bracket via a middle section and driven by the curved motion to tilt against the holder and oscillate about the grinding zone of the grinding wheel as an oscillation center. Thus the invention can process the working piece at varying angles to form a worm with the double-envelope structure and improve process precision.

Abstract: A surface polishing system leaving a surface free from streaks and swirls after the application of a polishing composition into a painted metallic surface includes a polish applicator having a vibrating motion attached to a pad assembly covered with a supersoft 100% polyester material and a polishing composition of 15-30% by weight of high purity aluminum oxide having a particle size of no greater than 0.3 micron or 300 nanometer and 3-20% by weight of calcined alumina comprising at least 70% ?-aluminum oxide (Al2O3) with a low calcination degree and a primary crystal size of less than 1 micron, the combined high purity aluminum oxide and calcined alumina having a total concentration of 30-40% by weight of the polishing composition.

Abstract: A bowling ball surface treatment device for abrading, polishing or cleansing a bowling ball includes a housing, a ball displacing unit movably mounted to the housing for holding the bowling ball in a rotatable manner and for reciprocatingly displacing the bowling ball between a temporary waiting region and a surface treatment region, a surface treatment disc for supporting and spinning the bowling ball in the surface treatment region, the surface treatment disc having a surface treatment element for making frictional contact with the bowling ball, a temporary support disc for temporarily supporting the bowling ball in the temporary waiting region when the bowling ball is moved out of the surface treatment region, and a disc drive unit for rotatingly driving the surface treatment disc and the temporary support disc.

Abstract: A bowling ball surface treatment apparatus is designed to uniformly abrade and polish a bowling ball. The apparatus includes a housing and a ball movement guider provided inside the housing for guiding movement of a bowling ball and confining the bowling ball within a limited surface treatment area, and a surface treatment disc arranged below the ball movement guider for supporting, rotating and revolving the bowling ball. The surface treatment disc has a disc shaft and a surface treatment element for abrading or polishing the bowling ball. The apparatus further includes a disc rotating device for rotating the surface treatment disc about a disc center axis and a disc revolving device for rotatably holding the disc shaft of the surface treatment disc and for causing the surface treatment disc to make revolving movement around a sun axis offset from the disc center axis.

Abstract: The invention relates to a tool-support apparatus for attachment to a grinding machine (1), in particular to a wet grinding machine, which has at least one grinding disc (3) arranged on a rotatably drivable grinding-disc shaft (2) and a machine frame or housing (4) in which the grinding-disc shaft (2) is supported. The tool-support apparatus has a tool-support (5, 6, 7), which can be secured on a machine frame or housing (4) of the grinding machine (1), for the support during the grinding process of a tool that is to be ground, and an arresting apparatus (8) for securing the tool support (5, 6, 7) on the machine frame or housing (4). The invention is distinguished in that the tool-support (5, 6, 7) can be secured on the machine frame or housing (4) in such a way that it can be swivelled about the grinding-disc shaft (2) or about a swivel axis (10) parallel to the grinding-disc shaft (2) and can be arrested by way of the arresting apparatus (8) in a plurality of angular positions.

Abstract: A honing method and honing control device suitable for the honing having a large processing area is provided. The honing control device includes a grinder and an expansion member for disposition in a processing hole of a workpiece. The amount of an expanding movement when the grinder contacts the inner surface of a gauge hole via the expansion member is stored as a target expansion amount by inserting a honing head into the gauge hole having the same size as a target processing diameter of a master gauge. Then, a honing of an inner surface of the processing hole is performed by inserting the honing head within a processing hole of a workpiece moving the grinder towards an outer side of a diametrical direction by the expansion member installed within the honing head to rotate the honing head. The honing is completed when the amount of the expanding movement of the grinder reaches a target expansion amount established by the master gauge.

Abstract: The present invention relates particularly to an oscillating grinding machine. The grinding machine comprises a driving motor (3) surrounded by a body (3), and a drive shaft (4) cooperating with the driving motor. The drive shaft comprises a grinding head (5) that constitutes a support for a grinding product (8). The drive shaft (4) is arranged in two pieces and comprises a main shaft (11) and an eccentric shaft (10) arranged rigidly thereto. The eccentric shaft comprises a center line (12) that assumes an angle (?) against a corresponding center line (13) of the main shaft, and thus the grinding head (5) will assume an eccentric placement in relation to the main shaft (11). Thus, the grinding head is arranged to oscillate in a substantially spherical plane provided by the rotation of the main shaft and the eccentricity and inclination of the eccentric shaft in relation to the main shaft.

Abstract: A novel polisher for chemical mechanical planarization process is described. The polisher design can have many variations. For process development and consumable evaluation, the CMP process can be performed on a single die or a section of the wafer. The size of testing wafer can be as small as 2? and as large as 18?. Furthermore, several variations can characterize the slurry for their static etch rate, dynamic etch rate, material removal rate, and viscosity in a single experiment. For production level wafer processing, Chemical Mechanical Polishing of all dies on the wafer surface is achieved by using multi-armed polishing heads or a single polishing head with small piece of a pad at the bottom of the head. The within wafer uniformity can be easily controlled and the equipment can be easily scaled up or down. This inventive design may translate to significant cost reduction for wafer processing at production level as well as evaluation of consumables at research and development level.

Abstract: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.

Abstract: An apparatus for manufacturing a liquid crystal display (LCD) device includes a table receiving an LCD panel thereon, a first grinding part grinding a surface of the LCD panel to a first surface roughness, a second grinding part grinding the surface of the LCD panel grinded to the first surface roughness to a second surface roughness, wherein the second surface roughness is smoother than the first surface roughness, and a polishing part polishing the surface of the LCD panel which is grinded to the second surface roughness.

Abstract: A polishing head for polishing machines, in particular for polishing optical surfaces, has a polishing plate that is connected to a rotationally drivable drive shaft. The polishing plate is articulated to, and rotates with, the drive shaft. A ball hexagonal socket joint provides the articulated connection. Rotating by means of the articulated connection, the polishing plate can follow the surface of the workpiece to be processed, so that the polishing covering on the polishing plate always rests on a maximally large area on the surface of the workpiece.

Abstract: The present invention relates particularly to an oscillating grinding machine. The grinding machine comprises a driving motor (3) surrounded by a body (3), and a drive shaft (4) cooperating with the driving motor. The drive shaft comprises a grinding head (5) that constitutes a support for a grinding product (8). The drive shaft (4) is arranged in two pieces and comprises a main shaft (11) and an eccentric shaft (10) arranged rigidly thereto. The eccentric shaft comprises a centre line (12) that assumes an angle (?) against a corresponding centre line (13) of the main shaft, and thus the grinding head (5) will assume an eccentric placement in relation to the main shaft (11). Thus, the grinding head is arranged to oscillate in a substantially spherical plane provided by the rotation of the main shaft and the eccentricity and inclination of the eccentric shaft in relation to the main shaft.

Abstract: A polishing tool that includes: an arbor with a shank having a first cylindrical axis; an offset cylinder extending from the shank, the offset cylinder having a second cylindrical axis, the first cylindrical axis being offset from the second cylindrical axis and parallel thereto, the offset cylinder terminating at a distal end thereof with a support surface that is angled in a range of from about 1° to about 20° from perpendicular to the first and second cylindrical axes; and a toroidal polishing head supported on the support surface, rotation of the shank causing an oscillating rotational movement of the toroidal polishing head.

Abstract: The present invention relates to an anti-vibration arrangement (10) for a power sander (1) which comprises a housing (2), a motor (4) arranged in the housing (2), a rotary drive shaft (11), a first outer or ring-shaped pad surface (16) for attaching a first sanding paper (8) and a second inner or circular pad surface (22) for attaching a second sanding paper (9). The anti-vibration arrangement (10) serves to transfer energy from the motor (4) to the pads (16, 22) with out-of-phase motions to dynamically compensate for inertial and friction forces. For this purpose, twin cams (18a, 18b) are fixed on the rotary drive shaft (11). The cams (18a, 18b) rotate the central axes (15, 21) of the pads (16, 22) about the rotary drive shaft axis (12) with a phase differential of typically 180°.

Abstract: Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for polishing a workpiece includes determining an estimated frequency of serial defects in a workpiece, pressing the workpiece against a polishing pad and moving the workpiece relative to the pad. The method further includes vibrating the workpiece and/or the pad at a frequency that is greater than the estimated frequency of the serial defects. In one aspect of this embodiment, determining the estimated frequency of serial defects can include: determining a relative velocity between the workpiece and the polishing pad; estimating the length of a mark on the workpiece; estimating the time a particle in a planarizing solution is in contact with the workpiece; and estimating the number of cracks in the workpiece.

Abstract: A ferrule polishing control machine has a ferrule type input part for selecting one type of ferrule from various ferrule types stored in a computer. A ferrule end face shape input part selects one type of ferrule end face shape from various types of ferrule end face shapes stored in the computer. A connector type input part selects one type of connector from various connector types stored in the computer. A ferrule polishing number input part selects from ferrule polishing numbers stored in the computer a number of ferrules to be mounted on a polishing jig for a polishing operation. A transmitting part selects polishing pressure information stored in the computer in accordance with polishing information inputted from the ferrule type input part, the ferrule end face shape input part, the connector type input part, and the ferrule polishing number input part, and transmits the polishing pressure information to a ferrule polishing machine.

Abstract: An apparatus for polishing a substrate with an optical surface. The apparatus contains a polishing pad and and a device for oscillating the polishing pad while simultaneously contacting it with at least 90 percent of said optical surface.

Abstract: The powered oscillated hand tool is provided having a housing and a drive unit contained in the housing having a first drive shaft 7 and a bearing 15 mounted eccentrically relative to the first drive shaft 7. A second drive shaft 14 extends from the bearing 15 and mountable thereon is a mounting platen 90 which is secured by means of one or more flexible legs 80 to the housing. The mounting platen 90 has coupling means 95 which are securable with corresponding coupling means on a first sanding platen 20 which is secured against free rotation about the second drive shaft when mounted thereon.

Abstract: An exposure method according to the present invention includes a first step of forming on a substrate an alignment mark including a concave and convex pattern; a second step of forming a coat over said alignment mark and the other area on said substrate; a third step of flattening said coat; and a fourth step of applying a photosensitive material on said coat flattened by said third step and projecting a mask pattern thereto. The alignment mark is formed by said concave and convex pattern arranged with a pitch which is smaller than the predetermined value between adjacent convex portions having a width of not less than a predetermined value.

Abstract: End face polishing apparatus and method that allow the eccentricity of curvature of an end face of a rod-shaped member to be reduced and the cost to be reduced by efficient use of a lapping sheet, so that the polishing efficiency is improved. In an end face polishing apparatus that polishes a rod-shaped member mounted at a polishing fixture by pressing the rod-shaped member against a lapping member mounted at a polishing plate rotatably and rock-ably supported at the main body of the apparatus, the polishing fixture is secured to a first virtual disk having a prescribed diameter and the lapping member is driven to move relative to the polishing fixture so that the first virtual disk moves along the circumference of a second virtual disk as it rotates, and the second virtual disk moves along the circumference of a third virtual disk as it rotates.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: A lapping tool for localized optical polishing of a workpiece, the tool having a flexible working surface and being characterized by means for selectively varying the pressure applied, in use, on the workpiece by different regions of the tool working surface whereby to vary the effective area of contact with the workpiece. A method of optical polishing and optical workpiece using a lapping tool whose maximum working surface area is substantially smaller than the workpiece, comprising determining the path to be travelled by the tool across the workpiece, and determining the pressure and effective area of contact of the tool on the workpiece, in order to achieve the next stage of polishing, and then driving the tool over that path while dynamically varying the said applied pressure and effective contact area.

Abstract: An exposure method according to the present invention includes a first step of forming on a substrate an alignment mark including a concave and convex pattern; a second step of forming a coat over said alignment mark and the other area on said substrate; a third step of flattening said coat; and a fourth step of applying a photosensitive material on said coat flattened by said third step and projecting a mask pattern thereto. The alignment mark is formed by said concave and convex pattern arranged with a pitch which is smaller than the predetermined value between adjacent convex portions having a width of not less than a predetermined value.

Abstract: A structure and method for polishing a device include oscillating a carrier over an abrasive surface (the carrier bringing a polished surface of the device into contact with the abrasive surface, the oscillating allowing a portion of the polished surface to periodically oscillate off the abrasive surface), optically determining a reflective measure of a plurality of locations of the polished surface as the portion of the device oscillates off the abrasive surface and calculating depths of the locations of the polished surface based of the reflective measure.

Abstract: A polishing head comprises a casing with abrasive segments attached thereto made to oscillate on radial shafts driven by a ring with vertical eccentric rotary motion. The ring is coupled to a first eccentric and to a crown gear is fixed to the casing while a pinion is coupled with rotational motion to a second eccentric connected to the structure of the machine. A plurality of pins are mounted on eccentric planetary gears coupled with rotational motion to the ring and to the body of the head with a further pair of crown and pinion gears provided in which the first crown gear is rigidly connected to a second pinion and rotates with it on the second eccentric. The first pinion is rigidly connected to the said first eccentric, concentrically with the axis of the head and the second crown gear is rigidly connected to the housing of the polishing head concentrically with the axis of the head.

Abstract: An automotive vehicle body can be sanded with a robotic sanding (polishing) disk that is carried on a robotic head, such that the sanding disk has a relatively constant unit pressure on the vehicle surface as the head moves the sanding disk along the vehicle surface. An automatic supply mechanism can be employed to periodically remove a worn sanding disk from the head, and replace the worn sanding disk with a new sanding disk.

Abstract: A wave beveling machine is disclosed which produces a wave bevel on a glass work piece. The machine includes a feed path that is adapted to receive a glass work piece and which includes a plurality of spaced-apart treatment heads adjacent the feed path and adapted to sequentially engage the edge region of the work piece as the work piece is moved along the feed path. Each of the plurality of heads includes at least one contact region adapted to contact the edge region of the work piece, and one or more of the heads is adapted to abrade glass from the edge region when in contact with the edge region. The machine further includes a treatment head positioning system adapted to cause the contact regions of the plurality of heads and the edge region of the work piece to be engaged and cyclically moved in an oscillating path with respect to each other to produce the wave bevel on the edge region. The machine may further include one or more conveyors that support and move the work piece along the feed path.

Abstract: Methods and apparatuses for evenly polishing the entire polishing surface of a sample are described. One polishing apparatus of the present invention comprises: a platen having an upper surface upon which the sample surface is to be polished; a sample holder disposed opposite to the platen's upper surface, at least one of the platen and the sample holder being rotated about a first axis to effect polishing; a positioning means for changing the distance between the sample holder and the platen in response to a control signal; and a controller providing said control signal to the positioning means to control the operation of the positioning means during a polishing cycle, wherein the controller causes the positioning means to change the distance intermittently during the polishing cycle.

Abstract: An exposure method according to the present invention includes a first step of forming on a substrate an alignment mark including a concave and convex pattern; a second step of forming a coat over said alignment mark and the other area on said substrate; a third step of flattening said coat; and a fourth step of applying a photosensitive material on said coat flattened by said third step and projecting a mask pattern thereto. The alignment mark is formed by said concave and convex pattern arranged with a pitch which is smaller than the predetermined value between adjacent convex portions having a width of not less than a predetermined value.

Abstract: A technique for mounting polishing pads to a platen in chemi-mechanical semiconductor wafer polishing apparatus is disclosed. A lower pad is mounted to the platen, and is trimmed to the size of the platen. An upper pad is mounted to the lower pad, and is sized so that an extreme outer edge portion of the upper pad extends beyond the trimmed outer edge of the lower pad. The outer edge portion of the upper pad is deformed downwardly, towards the lower pad. In this manner, polishing slurry is diverted from the pad-to-pad interface. Additionally, an integral annular lip can be formed on the front face of the upper pad, creating a reservoir for slurry to be retained on the face of the upper pad for enhancing residence time of the polishing slurry prior to the slurry washing over the face of the upper pad.

Abstract: A device for smoothing or polishing stone, of the type comprising at least two carrying segments for flat grindstones or bricks. These segments are driven with oscillatory movement so as to cause the grindstones or bricks to operate along a generatrix when the device is driven in rotation during smoothing or polishing. The drive for the flat grindstones (16) or bricks in oscillation comprises an intermittent flow or a continuous flow with variable flow rate, of a fluid, which can be a liquid or gas. The fluid flow can be a flow of water or of equivalent cooling liquid, so as to ensure simultaneously the lubrication in the course of polishing and the driving in oscillation of the carrying segments (12).

Abstract: A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.