Abstract: A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.

Abstract: A machine featuring a treatment tool that grinds a surface to a desired profile, imparts a desired roughness to that surface, and removes contamination from the surface, the machine configured to control multiple independent input variables simultaneously, the controllable variables selected from the group consisting of (i) velocity, (ii) rotation, and (iii) dither of the treatment tool, and (iv) pressure of the treatment tool against the surface. The machine can move the treatment tool with six degrees of freedom.

Abstract: Embodiments of the present disclosure provide surface treatment tools, methodologies, and/or repaired turbomachine components. A surface treatment tool according to the present disclosure can include a lathe assembly having a lathe chuck for receiving a component thereon, wherein the lathe chuck rotates the component about a first axis of rotation, and wherein the component includes an exposed axial target surface; and a sander or burnishing tool coupled to the lathe assembly and including a sanding or burnishing surface thereon, coupled to a drive system, wherein the sanding or burnishing surface rotates about a second axis of rotation substantially non-parallel with the first axis of rotation, such that the sanding or burnishing surface selectively contacts the target surface of the component to yield a polished target surface.

Abstract: The present disclosure describes a sanding device that has a motor coupled to a base plate for inducing vibration in the base plate. Further, the sanding device has a face plate that is coupled to the base plate, and the face plate has a plurality of sleeves for receiving a respective plurality of columns. The columns rotate and move longitudinally within the sleeves. Further, each column moves independent of the other columns and each column have an abrasive surface on a sanding end for contacting a sanding surface.

Abstract: A wafer surface of a semiconductor wafer to be used as a device active region is mirror-polished, and an outer peripheral portion of the mirror-polished wafer surface is further polished, thereby forming an edge roll-off region between the device active region of the wafer surface and a beveled portion formed at the wafer edge. The edge roll-off region has a specific roll-off shape corresponding to an edge roll-off of the oxide film to be formed in a device fabrication process. Thus, a semiconductor wafer can be provided in which reduction in the thickness of an oxide film on the outer peripheral portion of the wafer in a CMP process can be prevented while maintaining high flatness of the wafer surface.

Abstract: A polishing head for polishing machines, in particular for polishing optical surfaces, has a polishing plate that is connected to a rotationally drivable drive shaft. The polishing plate is articulated to, and rotates with, the drive shaft. A ball hexagonal socket joint provides the articulated connection. Rotating by means of the articulated connection, the polishing plate can follow the surface of the workpiece to be processed, so that the polishing covering on the polishing plate always rests on a maximally large area on the surface of the workpiece.

Abstract: A process of machining outer joint parts (11) and inner joint parts (21) of constant velocity universal ball joints, which outer joint parts (11) and inner joint parts (21) each comprise a longitudinal axis and a number of ball tracks (12), wherein the ball tracks are each arranged circumferentially in pairs (121, 122), whose central track lines are positioned in planes (E1, E2, E3, E4) extending parallel relative to one another, wherein the pairs of ball tracks (12) are machined by rotating disc tools (16) whose axes of rotation (R) perpendicularly intersect the respective longitudinal axis at a distance from one another and are held and guided coaxially relative to one another.

Abstract: A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin ring, wherein the gear wheels or pin rings have a multiplicity of gear or pin arrangements which engage the teeth of the carrier discs during rolling, at least one of the pin arrangements having a guide which delimits movement of the margin of the carrier disc in at least one axial direction, the guide formed by a circumferential shoulder or a circumferential groove.

Abstract: A polishing head for polishing machines, in particular for polishing optical surfaces, has a polishing plate that is connected to a rotationally drivable drive shaft. The polishing plate is articulated to, and rotates with, the drive shaft. A ball hexagonal socket joint provides the articulated connection. Rotating by means of the articulated connection, the polishing plate can follow the surface of the workpiece to be processed, so that the polishing covering on the polishing plate always rests on a maximally large area on the surface of the workpiece.

Abstract: Embodiments of the invention comprise a machine adapted for polishing work pieces such as large silicon wafers. A wafer polishing machine in accord with the invention comprises a rotatable platen in a table base, above which is mounted a lid having a head moving assembly with four synchronously rotatable head assemblies. A motor and linkage connected to the head moving assembly imparts reciprocating linear motion to the head assemblies in a selected direction in a plane parallel to an upper surface of the platen. Embodiments of the invention produce a complex relative motion between a surface of a wafer to be polished and the platen. The complex relative motion, resulting from a combination of motions including rotation of the platen, rotation of the head assemblies, and translation of the head moving assembly, improves a uniformity of polish and a rate of polishing compared to wafer polishing machines known in the art.

Abstract: A polishing disc for a tool for the fine machining of optically active surfaces, particularly on spectacle lenses as workpieces, comprises a main body which has a center axis and on which there is fixed an intermediate layer which is softer than the main body and on which a polishing agent carrier rests. The intermediate layer has, with respect to the center axis, a radial inner region of substantially constant axial thickness and an adjoining radial outer region. The latter is formed or is fixed to the main body in a particular way so as to prevent the edge of the polishing disc from being imprinted on the machined surface of the workpiece in the form of very fine, scratch-like microstructures. Also proposed is a simple method which can be used to produce such a polishing disc.

Abstract: An elastic polishing tool that comes into contact with a surface to be polished of a lens and rotates to polish the surface, includes: an elastic polishing body which has a cylindrical shape and whose shape can be changed according to the surface to be polished; and a polishing pad that is adhered to one surface of the elastic polishing body opposite to the surface to be polished of the lens, wherein the polishing pad has a diameter larger than the length of an arc of the elastic polishing body in a cross section including a rotation axis of the elastic polishing tool.

Abstract: Methods and apparatus for end effectors for performing surface lapping using a robotic system are provided. In one embodiment, a lapping system includes a robotic arm and a pneumatic end effector unit. The pneumatic end effector unit includes a first base attached to the robotic arm, a second base, a lapping pad attachable to the second base, and a pneumatic piston system coupled between the first and second bases. An abrasive pad is attached to the lapping pad with a layer of pitch. The pneumatic piston system includes a piston chamber, a piston being slideably received within the piston chamber, and a component for controlling air pressure within the piston chamber. A slurry system introduces a slurry compound into one of the second base or the lapping pad.

Abstract: A tool (10) is disclosed for fine machining of optically active surfaces (F), with a base body (12) that can be attached to a tool spindle of a machine tool, and an elastic membrane (14) that has a machining section (16) to which connects a gaiter section (18) by means of which the membrane is attached to the base body such that it can be rotated therewith. The base body and the membrane delimit a pressure medium chamber (20) which via a channel (22) can be optionally pressurized with a pressure medium in order to apply a machining pressure via the machining section during machining of the optically active surface. A guide element (24) guided longitudinally mobile on the base body is actively connected with the machining section so that the machining section can be moved in the longitudinal direction of the guide element and held in the transverse direction to the guide element, although under an elastic deformation of the gaiter section it is tilt-mobile in relation to the guide element.

Abstract: In a hand power tool for surface machining, with a vibrating plate, which is suspended on a housing by vibrating elements, and with an electromotively driven eccentric drive, which is contained in the housing and sets the vibrating plate into an orbital oscillating motion, in order to produce a housing that is rather flat and short, which can be manually controlled in the same way as a grasping block, the coupling point is situated between the eccentric drive and the vibrating plate, close to the front edge of the vibrating plate, while the elastic vibrating elements engage the vibrating plate close to the opposite edge of the vibrating plate.

Abstract: To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining work of the object to be machined, specifically a correcting mechanism for deforming the object to be machined together with a jig holding the object to be machined is provided in a machining apparatus. The correcting mechanism includes a base, a plurality of levers provided at first ends with pins, a shaft fixed to the base for rotatably supporting the levers, and a plurality of correcting drive means coupled to second ends of said levers for pivoting the levers to the shaft to thereby pivoting the pins.

Abstract: When electric elements are formed on a ceramic bar or the like, the positional displacement of the respective elements occurs due to a division exposing process or the like. An object of the present invention is to provide a device and a method which unify the non-polished portion of the respective elements by conducting polishing while a complicated deformation or the like is given to the ceramic bar. To achieve this object, the ceramic bar or like is held by using a jig, and a plurality of loads are applied to portions of the jig where the ceramic bar or the like is held, to thereby deform the ceramic bar or the like and polish the element in that state. In this situation the load applied points are disposed so as to avoid the boundaries of the division exposure.

Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.

Abstract: The invention relates to a method and device for grinding fluted tools (10) that have an essentially circular envelope curve, in particular, for grinding spiral fluted tools. The device provided with a steady for guiding the tool to be ground comprises a guideway (8) with at least two inner lateral faces. The lateral faces each extend in planes in a manner that is essentially parallel to the longitudinal axis of the tool to be ground and they form an angle for accommodating the tool to be ground, whereby the tool to be ground rests each time with at least two circumferential points (a11, a12) of its essentially circular envelope curve at least on two of the inner lateral faces of the guideway. In order to carry out the inventive method, a tool to be ground is appropriately clamped and pressed into the guideway by means of at least one grinding wheel (41) while the flutes are ground.

Abstract: A lapping tool for localized optical polishing of a workpiece, the tool having a flexible working surface and being characterized by means for selectively varying the pressure applied, in use, on the workpiece by different regions of the tool working surface whereby to vary the effective area of contact with the workpiece. A method of optical polishing and optical workpiece using a lapping tool whose maximum working surface area is substantially smaller than the workpiece, comprising determining the path to be travelled by the tool across the workpiece, and determining the pressure and effective area of contact of the tool on the workpiece, in order to achieve the next stage of polishing, and then driving the tool over that path while dynamically varying the said applied pressure and effective contact area.

Abstract: A surface grinding method is provided by which grinding striations are produced so that the striations can fully be removed by a polish-off amount less than required in a conventional way in mirror polishing following surface grinding using an infeed type surface grinder, in which two circular tables, opposite to each other, which are driven and rotate independently from each other, are arranged so that the peripheral end portion of one table coincides with an axial center of a rotary shaft of the other table all time, the two circular tables being located so as to be shifted sideways from each other; not only is a grinding stone held fixedly on an opposite surface of the one table, but the wafer is fixed on an opposite surface of the other table; the two tables are rotated relatively to each other; and at least one table is pressed on the other while at least one table is relatively moved in a direction, so that a surface of the wafer is ground, wherein the surface of the wafer is ground while controlling a

Abstract: An apparatus for chemimechanically polishing a substrate by the steps of causing a chuck to hold the substrate having a metal film or devices such that the surface of a metal film or an insulating film of the substrate is caused to face upwards, pressing the surface of a polishing pad bonded to a joining plate pivotally borne by a spindle shaft having the axis arranged to be perpendicular to the substrate on the surface of the substrate, while supplying polishing solution to a boundary between the surfaces of the pad and the substrate, rotating the chuck holding the substrate and the polishing pad, and reciprocating the polishing pad horizontally on the surface of the substrate so that at least a portion of the metal film or the insulating film is removed.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.

Abstract: This invention provides an improved machine for finishing the edges of glass or other brittle materials. The machine is distinguished by its few moving parts, and its ease of maintenance. The edge-finishing machine includes a main conveyor section including two toothed main belts that grip and convey the glass or other material to be finished past grinding or polishing wheels, or other means for finishing the edges of the material. These main conveyor belts are synchronously driven, each by a separate motor or other power transmission unit. The main conveyor section of the machine also includes means to tension the main belts, preferably including non-rotating returns made from durable, low-friction material such as ultra-high molecular weight plastic.

Abstract: Disclosed is a polishing method including the step of: polishing a surface of a member to be polished by rotating and sliding an abrasive wheel holding fixed abrasive grains on the surface of the wheel while supplying free abrasive grains to the surface of the member to be polished; wherein the abrasive wheel is formed by binding the fixed abrasive grains with a soft binder and a pore forming agent. This polishing method is effective to obtain a high flatness of a polished surface and improve surface characteristics of the polished surface, and also to obtain a high continuous-workability by stably keeping a polishing ability for a long period of time.

Abstract: A method and apparatus for sharpening tools, particularly hand instruments used in dental care. The apparatus includes a fixed base (19) and a rotary plate (14) fitted thereon, a grinding stone (10) pivoted on an axle (11), and a motor (20) for rotating the grinding stone. According to the invention, adjacent to the circumference (10') or the side surface (10") of the grinding stone is fitted a sharpening support (30) which is supported on the rotary plate (14) and on which the instrument to be sharpened rests during sharpening. The rotary plate (14) is arranged rotatively round an axis (41) between the instrument to be sharpened and the sharpening support (30) or through a point in proximity with the contact point.

Abstract: Equipment for the grinding of material samples includes a console and a frame structure. A turntable is mounted on the console and frame structure, with the turntable having a material sample holding portion capable of releasably holding a plurality of material samples thereon. At least one vertically movable grinding spindle is arranged above the turntable. A mechanism is further provided for laterally oscillating the turntable relative to the console and frame structure as well as relative to the at least one vertically movable grinding spindle. A programmable control unit is connected with the turntable, movable grinding spindle and mechanism for laterally oscillating the turntable for controlling grinding.

Abstract: A grinding method and apparatus having a position aligning mechanism to correctly achieve the centering of each work on a work table and locate an orientation flat part of each work at a predetermined position, and a displacing mechanism for reciprocally slidably displacing a top ring and the work table in order to assure that the center of each work is positionally aligned with the center of each top ring at an original position after completion of the centering of each work on the work table and the locating of the orientation flat part, and subsequently, centering each top ring with the gravitational center of each work so as to cancel a positional offset state prior to holding the work with the top ring to thrust the work against the grinding or polishing surface. The invention also includes a polishing method and apparatus in which both of a top ring and a rotary disc are reciprocally slidably displaced to improve the polishing efficiency of the device.

Abstract: A wafer polishing apparatus has a wafer chuck for holding a wafer with a surface to be polished directed upward, the wafer chuck being rotatable by a wafer chuck rotation motor; a pair of nozzles for supplying slurries used as polishing solutions to the wafer; and a polishing head for holding a polishing cloth pad which is smaller in diameter than the wafer. The polishing head is rotated in the same direction as the wafer chuck by a polishing head rotation motor and is also reciprocally moved along the surface of the wafer to be polished by an arm driving motor. The wafer polishing apparatus also has a polishing head load adjusting air cylinder for pressing the polishing cloth pad against the wafer by way of the polishing head.

Abstract: To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining work of the object to be machined, specifically a correcting mechanism for deforming the object to be machined together with a jig holding the object to be machined is provided in a machining apparatus. The correcting mechanism includes a base, a plurality of levers provided at first ends with pins, a shaft fixed to the base for rotatably supporting the levers, and a plurality of correcting drive means coupled to second ends of said levers for pivoting the levers to the shaft to thereby pivoting the pins.