Abstract: An automatic grinding apparatus includes: a grinding wheel configured to grind a workpiece; a support configured to support the workpiece; a feeding device configured to change a relative position between the grinding wheel and the workpiece; and a control device configured to, before processing using the grinding wheel is started, calculate a range in which the grinding wheel and the support are relatively moved on the basis of information on positions of the workpiece and the grinding wheel detected by a first detector, a second detector, and a third detector, move the grinding wheel or the support by performing numerical control with respect to the feeding device, and automatically start the processing using the grinding wheel.

Abstract: A device is adapted to be coupled to a conveyor system and recondition at least one chain of the conveyor system. The device includes a base and at least one attachment element coupled to the base. The attachment element is adapted to detachably couple the device to the conveyor system. At least one reconditioning element is coupled to the base, and the reconditioning element is adapted to engage and recondition the chain as the chain moves relative to the reconditioning element. At least one biasing element is coupled to the reconditioning element, and the biasing element urges the reconditioning element away from the base and into engagement with the chain.

Abstract: A board cleaning apparatus is provided which removes foreign substances sticking to the surface of a board for fabricating precast concrete articles using a brush which rotates in a horizontal direction, and in which a suction duct is provided to suck dust particles generated when the foreign substances are removed. The board cleaning apparatus includes a feeder unit that feeds a board, a power generator that generates power, and a power transmission that transmits power generated by the power generator, wherein a brush is disposed at a lower end portion of the power generator in a vertical direction from the board.

Abstract: A device is adapted to be coupled to a conveyor system and recondition at least one chain of the conveyor system. The device includes a base and at least one attachment element coupled to the base. The attachment element is adapted to detachably couple the device to the conveyor system. At least one reconditioning element is coupled to the base, and the reconditioning element is adapted to engage and recondition the chain as the chain moves relative to the reconditioning element. At least one biasing element is coupled to the reconditioning element, and the biasing element urges the reconditioning element away from the base and into engagement with the chain.

Abstract: A grinder includes a rotatable disk to be pressed to a workpiece; a plurality of grinding bodies provided on one principal surface of the disk so as to cross a circumferential direction of the disk, each having a grinding stone chip on a side contacting the workpiece; and support devices, each supporting each of the grinding bodies so that the grinding stone chip swings with respect to the principal surface. Each support device supports each grinding body at a position at which an abrasion amount of the grinding stone chip is made uniform when the disk is rotated while being pressed to the workpiece so that a pressure to be applied to the grinding stone chip on an outer peripheral side of the disk becomes smaller than a pressure to be applied to the grinding stone chip on an inner peripheral side of the disk.

Abstract: A pressure detection device includes a pressure detector, a bearing member, at least two guiding rods passing through the bearing member and connecting with the pressure detector, at least two elastic elements sleeving on the at least one guiding rod and resisting between the bearing member and the pressure detector for transferring forces from the bearing member to the pressure detector.

Abstract: A CNC system for effecting a finishing treatment of a surface, including: a mechanical assembly having a mechanical arm, adapted to move within at least two controllable axes of motion; a shoe arrangement, adapted to connect to an end of the arm and having at least one flexible surface finishing pad; and a drive mechanism adapted to drive the arm; a controller; a communication arrangement adapted to deliver communication signals between the controller and the mechanical assembly; and a positioning system providing the controller with positioning information with respect to the mechanical assembly, the system configured whereby the arm is responsive to the controller, the mechanical assembly adapted to urge the working surface against a workpiece surface, whereby a pressure is delivered thereto, the mechanical assembly including a controllable spring arrangement disposed and adapted to contribute to an overall mechanical compliance, normal to the working surface, of the mechanical assembly, the spring arrangem

Abstract: A device for finish-machining of the optically effective surfaces of, in particular, spectacle lenses has a spindle shaft, which has a tool mount section and which is mounted in a spindle housing to be rotatable about a workpiece rotational axis (A). An electric rotary drive has a rotor and a stator by which the spindle shaft operatively connected with the rotor is drivable to rotate about the tool rotational axis. An adjusting device axially displaces the tool mount section with respect to the spindle housing in the direction of the tool rotational axis (linear movement Z). The rotor and the stator are arranged coaxially with the spindle shaft, wherein at least the rotor together with the spindle shaft is axially displaceable with respect to the spindle housing in the direction of the tool rotational axis by the adjusting device.

Abstract: An apparatus for grinding an elongated workpiece having a plurality of outer surfaces of revolution all centered on a common workpiece axis has a frame and means such as a headstock and tailstock for rotating the workpiece about the workpiece axis. Two grinders on the frame diametrally flank the workpiece axis and are displaceable radially of the workpiece axis. They each have a respective set of axially spaced grinding wheels. Actuator means serves for displacing the grinders in respective diametrally opposite directions for engaging the grinding wheels with the surfaces of the rotating workpiece grinder. The axial spacing and dimensions of the wheels correspond to the axial spacing and dimensions of the surfaces such that all the surfaces of the workpiece can be ground simultaneously.

Abstract: A parallel mechanism adapted to control at least one of pivotal movement and linear movement of a link head having three degrees of freedom. The parallel mechanism has four actuators for driving the link head, and link groups which have four links connected to the four actuators, respectively, and each of which is connected to the link head. A rotation joint interposed between each of the link groups and the link head is made a linear joint which is connected to the link head so as to be relatively movable in one axis direction with respect to the link head.

Abstract: A honing method and honing control device suitable for the honing having a large processing area is provided. The honing control device includes a grinder and an expansion member for disposition in a processing hole of a workpiece. The amount of an expanding movement when the grinder contacts the inner surface of a gauge hole via the expansion member is stored as a target expansion amount by inserting a honing head into the gauge hole having the same size as a target processing diameter of a master gauge. Then, a honing of an inner surface of the processing hole is performed by inserting the honing head within a processing hole of a workpiece moving the grinder towards an outer side of a diametrical direction by the expansion member installed within the honing head to rotate the honing head. The honing is completed when the amount of the expanding movement of the grinder reaches a target expansion amount established by the master gauge.

Abstract: A tile cutting machine includes a tool support assembly having at least one rail with a rail bearing associated therewith for selective movement there along. The rail bearing includes a housing having a bore therethrough. A plurality of slots are located in the housing adjacent the bore. The slots receive an axle pin having a wheel thereon to provide a roller bearing. Portions of the wheels extend into the bore and ride along an outer surface of the rail when it is received in the bore.

Abstract: A device is disclosed for grinding reel type mower bedknives and blades of rotary type and reel type mowers. The device is capable of manually relief grinding reel blades on an intact mower, and in various stages of disassembly, to a bare reel stripped of its housing, with virtually any relief angle. The device can manually and semiautomatically spin grind a reel type mower reel while the reel is attached to the complete mower or if the reel and supporting structure are removed to a bench, with no further disassembly required. The device can manually grind the front face of a reel type mower bedknife while the bedknife remains attached to the reel housing and can grind the front and top face of a bedknife when it is removed. It can also grind rotary type blades and a variety of other straight edged tools.

Abstract: To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

Abstract: In one embodiment, a method of sharpening reel blades on a lawnmower reel includes positioning a grinding wheel in contact with the reel, rotating the grinding wheel about an axis of rotation, linearly translating the grinding wheel along a longitudinal path. and rotating the reel about its longitudinal axis. The axis of rotation of the grinding wheel is transverse to a longitudinal axis of the reel.

Abstract: A method and device for grinding a saw chain (26), the saw chain (26) being clamped in a position suitable for grinding. A rotating grinding disc (11) is manually transferred from an inactive position to an active position. Grinding of a cutter link (39) of the saw chain (26) is effected when the grinding disc (11) has assumed its active position. Further, the transfer of the grinding disc (11) from the inactive position to the active position is effected by a rectilinear movement that is carried out by rolling contact.

Abstract: A method for subaperture polishing includes determining a first portion of a sample to be polished disproportionately compared to a second portion of the sample. Based on the determination of the first portion, a sweep frequency that is a first rate of lateral motion for a polishing pad is selected to be substantially equal to an integer multiple of a rotation frequency that is a rate of rotation for the sample. The method further includes rotating the polishing pad at the polishing frequency, rotating the sample at the rotation frequency, and polishing the sample using the polishing pad while rotating the polishing pad and the sample.

Abstract: Blade sharpener apparatus and method for ice resurfacing machines which can include a tabletop for laying a longitudinal blade from an ice resurfacing machine thereon in a stationary position. A moveable carrier assembly attached to the table includes a drill press power head that can be lowered from a raised position so that a rotatable stone sharpening wheel is laid against the edge of the blade needing to be resharpened. A stabilizing guide can slide against a lower surface of the table under the blade while the sharpening stone wheel rolls across the longitudinal blade. The sharpening stone carrier wheel can sharpen the blade within minutes in a single pass. Liquid can continuously cool the blade sharpening, and can be recycled for reuse. The invention can sharpen other blades such as but not limited to paper cutting blades, and the like.

Abstract: Blade sharpener apparatus and method for ice resurfacing and paper cutting machines includes a table for laying a longitudinal blade in a stationary position thereon. A moveable carrier assembly attached to the table has a drill press power head that is lowered from a raised position so that a rotatable sharpening wheel is positioned at a selected angle against the edge of the blade. A stabilizing guide can slide under the table while the sharpening wheel and an additional guide wheel rolls across the longitudinal blade. Liquid can continuously cool the blade sharpening, and can be recycled for reuse. Another embodiment eliminates the rotating guide wheel, and attaches the carrier to the table so that only the rotating wheel contacts the blade. A hinge can support the carrier, and be adjustable by a rotatable bolt type member to different sharpening angles. A threaded guide rod can be rotated in place along the table so that a mateable threaded portion on the carrier can move along the guide rod.

Abstract: In a chip collecting apparatus for a tip dresser of the present invention, a chip pickup case mounted on a dresser main body is divided into an upper case and a lower case, and the lower end of an arm admission port formed in the upper case is opened downward. During teaching operation, the lower case is rotated to open the lower end of the upper case, through which the insertion of a first gun arm into a lower chamber can be visually checked, and thus an electrode tip provided at the end thereof and a dressing body for dressing the end of the electrode tip are guided such that the central axes thereof conform to each other.

Abstract: A polishing method with a polishing apparatus includes an electrode constituted as a plurality of electrode elements, a device of driving the electrode, and dielectric abrasive particles disposed between the electrode and a workpiece. Polishing pressure is applied to the particles by a Coulomb force generated when an alternating-current voltage is applied to the electrode.

Abstract: Apparatus for sharpening a razor blade with a motor actuated sharpening member mounted in a housing with a slot for receiving the razor head and a cradle assembly for engaging the distal end of the razor handle to hold the razor head in the slot. A carriage assembly holds the sharpening member opposite to the slot with its sharpening surface engaging the cutting edge of a razor blade secured in the razor head. A drive assembly driven by a motor operated by a timing circuit causes repetitive movement of the sharpening surface for a predetermined period of time.

Abstract: A method of polishing an object is disclosed. In one embodiment, the method comprises the steps of creating a polishing zone within a magnetorheological fluid; determining the characteristics of the contact between the object and the polishing zone necessary to polish the object; controlling the consistency of the fluid in the polishing zone; bringing the object into contact with the polishing zone of the fluid; and moving at least one of said object and said fluid with respect to the other. Also disclosed is a polishing device. In one embodiment, the device comprises a magnetorheological fluid, a means for inducing a magnetic field, and a means for displacing the object to be polished or the means for inducing a magnetic field relative to one another.

Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.

Abstract: A vane groove grinding apparatus for compressor cylinder including a compressor cylinder holding means the compressor cylinder being provided with an inner hole and a vane groove extending radially outwardly from the inner hole, sliders being movable along a center line of the inner hole and at a right angled direction to the vane groove, a grinding disk holder facing one open side of the inner hole and a support for locking the holder facing another open side of the inner hole both being disposed on a slider adjacent to the compressor cylinder, when the grinding disk is inserted in the vane groove a distal end of the grinding disk holder is firmly engaged in the support.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: A polishing machine comprise a support unit for horizontally supporting a work piece at an outer peripheral edge thereof, to be freely rotatable with a central axis thereof serving as a center of the rotation, a rotation driving unit for driving rotation of the work piece with the central axis thereof serving as a center of the rotation, a polishing plate provided to be opposite to a surface of the work piece and reciprocate along a direction of a diameter of the work piece, and pressed onto the surface of the work piece at a predetermined force and polishing cloth provided between the polishing plate and the surface of the work piece.

Abstract: A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

Abstract: An automotive vehicle body can be sanded with a robotic sanding (polishing) disk that is carried on a robotic head, such that the sanding disk has a relatively constant unit pressure on the vehicle surface as the head moves the sanding disk along the vehicle surface. An automatic supply mechanism can be employed to periodically remove a worn sanding disk from the head, and replace the worn sanding disk with a new sanding disk.

Abstract: A method for creating and maintaining a substantially perfect figure eight polishing pattern for polishing fiber optic connectors and similarly configured industrial components. The method is capable of simultaneously performing this figure eight polishing pattern on the multiplicity of such connectors and components. Moreover, the specific embodiment disclosed includes a computer program that controls the method. By simultaneously polishing a minimum of forty-eight fiber optic connectors, or similarly configured industrial components, with a polish being better than any now capable of being obtained by the prior art, this invention enables the output of polished fiber optic connectors and similarly configured industrial components to be increased three to four fold over currently employed polishing method while significantly reducing the cost of such polishing.

Abstract: An apparatus for creating and maintaining a substantially perfect figure eight polishing pattern for polishing fiber optic connectors and similarly configured industrial components. The apparatus is capable of simultaneously performing this figure eight polishing pattern on the multiplicity of such connectors and components. Moreover, the specific embodiment disclosed includes a computer program that controls the apparatus. By simultaneously polishing a minimum of forty-eight fiber optic connectors, or similarly configured industrial components, with a polish being better than any now capable of being obtained by the prior art, this invention enables the output of polished fiber optic connectors and similarly configured industrial components to be increased three to four fold over currently employed polishing apparatus while significantly reducing the cost of such polishing.

Abstract: A chemical-mechanical planarization (CMP) process is provided whereby cyclical pressure means varies the force against the wafer and polishing pad during the planarizing operation with the planarizing pad specially defined to have a relaxation time which is correlated with the force cycle so that the planarizing is enhanced. The relaxation time of the pad is greater than the downward an/or upward force cycle time on the wafer or pad and provides a planarizing process wherein the height of the pad during planarization is intermediate between a decompressed pad position and a compressed pad position typically encountered in a conventional CMP process.

Abstract: A method and to an apparatus for polishing a gravure roller, and for removing the chromium plating thereof, wherein the roller has a metallic shell galvanically covered by a copper layer having a pattern and a protective chromium plating. The method includes the steps of hitting the chromium plating with blunt bodies associated with a first rotating disk, thereby removing the chromium plating, which is broken and removed through the elastic collapsing of the underlying copper layer when the blunt bodies hit the chromium plating; and smoothing the copper layer by means of a second rotating disk provided with abrasive members. The apparatus includes an ammeter circuit for controlling the pressure exerted by the disk on the roller surface.

Abstract: A method and apparatus for finishing a workpiece surface using MR fluid is provided wherein the workpiece is positioned near a carrier surface such that a converging gap is defined between a portion of the workpiece surface and the carrier surface; a magnetic field is applied substantially at said gap; a flow of stiffened MR fluid is introduced into said converging gap such that a work zone is created in the MR fluid to form a sub-aperture transient finishing tool for engaging and causing material removal at the portion of the workpiece surface; and the workpiece or the work zone is moved relative to the other to expose different portions of the workpiece surface to the work zone for predetermined time periods to selectively finish said portions of said workpiece surface to predetermined degrees.

Abstract: This invention consists of a process to create and maintain a perfect Figure 8 polishing pattern for polishing fiber optic connector end faces and the apparatus used to perform this process simultaneously on a multiplicity of fiber optic connectors, and similarly configured industrial components.

Abstract: A chemical mechanical polishing apparatus includes a rotating plate on which a substrate is received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be varied to control the rate of material removed by the pad.

Abstract: A liquid crystal (LC) panel cleaning device of the present invention includes a work table and a terminal seat located above the work table. While the cleaning device is in operation, the terminal seat sustains a terminal portion included in an LC panel against a pressure acting on the terminal portion. The terminal seat is connected to ground. This successfully protects the terminal portion from damage and prevents devices built in the panel from being damaged by static electricity.

Abstract: Equipment for the grinding of material samples includes a console and a frame structure. A turntable is mounted on the console and frame structure, with the turntable having a material sample holding portion capable of releasably holding a plurality of material samples thereon. At least one vertically movable grinding spindle is arranged above the turntable. A mechanism is further provided for laterally oscillating the turntable relative to the console and frame structure as well as relative to the at least one vertically movable grinding spindle. A programmable control unit is connected with the turntable, movable grinding spindle and mechanism for laterally oscillating the turntable for controlling grinding.

Abstract: An electric drive motor with a small size and large rotary torque is used as a driving device for a grinding wheel of a grinding device. The motor such as an AC servo motor is encased in a casing to protect it from humidity, high temperature, scattered oil, etc. The atmosphere in the casing is controlled to protect the motor. The pressure, temperature and humidity in the casing are controlled by introducing dried air into the casing.

Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.

Abstract: A grinding method and apparatus having a position aligning mechanism to correctly achieve the centering of each work on a work table and locate an orientation flat part of each work at a predetermined position, and a displacing mechanism for reciprocally slidably displacing a top ring and the work table in order to assure that the center of each work is positionally aligned with the center of each top ring at an original position after completion of the centering of each work on the work table and the locating of the orientation flat part, and subsequently, centering each top ring with the gravitational center of each work so as to cancel a positional offset state prior to holding the work with the top ring to thrust the work against the grinding or polishing surface. The invention also includes a polishing method and apparatus in which both of a top ring and a rotary disc are reciprocally slidably displaced to improve the polishing efficiency of the device.

Abstract: A wafer polishing apparatus has a wafer chuck for holding a wafer with a surface to be polished directed upward, the wafer chuck being rotatable by a wafer chuck rotation motor; a pair of nozzles for supplying slurries used as polishing solutions to the wafer; and a polishing head for holding a polishing cloth pad which is smaller in diameter than the wafer. The polishing head is rotated in the same direction as the wafer chuck by a polishing head rotation motor and is also reciprocally moved along the surface of the wafer to be polished by an arm driving motor. The wafer polishing apparatus also has a polishing head load adjusting air cylinder for pressing the polishing cloth pad against the wafer by way of the polishing head.

Abstract: A grinding machine comprises a table movably disposed on a fixed base to undergo reciprocal movement relative to the fixed base along a reciprocating axis. A first shaft is rotatably disposed on the table to undergo rotation relative to the table about a first axis extending perpendicular to the reciprocating axis. A workpiece holder is connected to the first shaft for rotation therewith. A workpiece having a work surface is connected to the workpiece holder for rotation therewith. A second shaft is rotatably supported for rotation about a second axis extending at an inclination angle to the first axis, and is supported for reciprocal movement towards and away from the workpiece along the second axis. A grinder having a grinding surface is connected to the second shaft for rotation therewith and for reciprocal movement of the grinding surface towards and away from the work surface of the workpiece.