Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract: The invention relates to a device for dressing a grinding wheel, comprising a sleeve to hold a corundum rod laterally and to guide it along its longitudinal axis, a ram to apply constant thrust force onto the corundum rod held in place and guided in the sleeve, to bring it into contact with the grinding wheel, means of rigidly connecting the ram shaft to the end of the corundum rod, and linear guide means for the sleeve for translating the corundum rod parallel to the axis of the grinding wheel while keeping the rod pressed against the grinding wheel with a constant force. Application to a centerless grinder in which the grinding wheel is used to grind nuclear fuel pellets.

Abstract: A superfinishing machine and a superfinishing method which can perform axially uniform finishing on a logarithmically crowned surface formed on an inner peripheral surface of an annular member in a short time, and an outer ring of a bearing having a raceway surface superfinished by the superfinishing method, are provided. A superfinishing machine 1 includes a linearly reciprocating mechanism 40 configured to linearly reciprocate a grinding stone 3 held by a pressing section 30, along a plane B touching a generatrix of the logarithmically crowned surface, and in a direction C inclined by a given angle ? with respect to a center axis O of an outer ring 10.

Abstract: The present invention relates to a method for performing in-process compensating a machining operation on a workpiece, wherein the compensation process includes generating a control signal representative of magnitude of a contact force exerted on a cutting tool in a normal direction in relation to a machining surface of the workpiece, determining a compensation parameter value based on the control signal, and compensating the machining operation based on the compensation parameter value. The present invention also relates to corresponding machine arrangement for performing a machining operation on a workpiece, such as a hard turning process.

Abstract: A polishing apparatus includes a stage configured to hold a substrate, a stage-rotating mechanism configured to rotate the stage, and a polishing head configured to polish a periphery of the substrate held by the stage. The polishing apparatus also includes a controller configured to control operations of the stage, the stage-rotating mechanism, and the polishing head, an image-capturing device configured to capture an image of the periphery of the substrate through at least one terminal imaging element arranged so as to face the periphery of the substrate, an image processor configured to process the image captured by the image-capturing device, and a liquid ejector configured to eject a light-transmissive liquid toward the periphery of the substrate to fill a space between the periphery of the substrate and the terminal imaging element with the liquid.

Abstract: A device for finish-machining of the optically effective surfaces of, in particular, spectacle lenses has a spindle shaft, which has a tool mount section and which is mounted in a spindle housing to be rotatable about a workpiece rotational axis (A). An electric rotary drive has a rotor and a stator by which the spindle shaft operatively connected with the rotor is drivable to rotate about the tool rotational axis. An adjusting device axially displaces the tool mount section with respect to the spindle housing in the direction of the tool rotational axis (linear movement Z). The rotor and the stator are arranged coaxially with the spindle shaft, wherein at least the rotor together with the spindle shaft is axially displaceable with respect to the spindle housing in the direction of the tool rotational axis by the adjusting device.

Abstract: A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.

Abstract: A structure for deburring a ball is provided. The structure includes an arm, a gear structure for changing the effective length of the arm, and a cam structure for changing the effective angular position of the arm. A finger having an abrasive surface reciprocates on the arm. A ball is placed in a rotating holder and positioned in effective position for the abrasive surface to contact and remove at least one burr on the ball.

Abstract: Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.

Abstract: Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two of which are independently controllable, located with respect to the base and the moving belt such that a corresponding plurality of pressure zones are defined to provide pressure between the moving belt and the top surface of the substrate.

Abstract: The invention relates to a machine and process for grinding dies, in which the work axis (CO) of the plate (2.1) in which the die (1) to be machined is anchored is controlled at all the points of its angular movement, allowing the interpolation of the movements of this work axis (CO) with those of an axis of rotation (BO) and with those of respective axes (X and Z), such that the machines has four axes of interpolation, which allows machining dies (1) with their inner or outer diameter rounded or non-rounded and with their transition between these diameters and the side faces constant or variable by means of a single grinding process.

Abstract: Fine abrasive machining of a part includes providing a tool having a plurality of successive portions configured and arranged so that each preceding portion provides a coarser abrasive machining while each subsequent portion provides a final abrasive machining, and providing a relative movement of the abrasive tool relative to the part so that first a portion of the tool configured a coarser abrasive machining machines a part and thereafter a portion of the tool configured for a finer machine provides abrasive machining of the part.

Abstract: Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid containing an oxidizing agent is supplied to the end surface of the wafer.

Abstract: A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

Abstract: An apparatus for planarizing a workpiece has a web with a face which is positioned adjacent the workpiece during planarization. At least one tension assembly is configured to maintain tension of the web. An orbiting assembly is configured to orbit the web relative to the workpiece. The apparatus for planarizing a workpiece may include first and second polishing surfaces where the first polishing surface has a substantially horizontal web with a face which is positioned adjacent the workpiece during the planarization process. The apparatus may also have a rotatable carousel and at least two workpiece carriers suspended from the carousel. Each of the carriers is configured to carry a workpiece and press the workpiece against one of the polishing surfaces while causing relative motion between the workpiece and the polishing surface. An apparatus for planarizing a workpiece which includes a plurality of polishing stations is also disclosed.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

Abstract: A fiber optic polishing apparatus including a support system, a polishing sub-assembly coupled to the support system including a plurality of pads, and a fixture to hold a plurality of fiber optic connectors. The fixture is positioned adjacent to the plurality of pads so that an end surface of each of the plurality of fiber optic connectors is held in contact with a corresponding pad. A drive mechanism is coupled to the support system to move the fixture to polish the end surface of each of the plurality of fiber optic connectors. Each of the plurality of pads may travel independently in a vertical direction. The polishing sub-assembly may further include a web polishing film, a fluid injection module configured to direct water onto the film, and a rinsing module to rub against a face of each of the plurality of fiber optic connectors to remove debris.

Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

Abstract: A process and device for machining by abrasive belt, on a part 1 with an axis of rotation, of a non-cylindrical bearing surface 2, two portions of the same running abrasive belt 14, which are spaced apart from each other in the longitudinal direction of the belt, using two independent support components 12, preferably activated by two jacks 8 mounted on a common carrier 4, along two contact zones spaced apart angularly around the axis of rotation of the part, are applied against the bearing surface 2. The application is particularly suited for cam surfaces of cam shafts.

Abstract: A chemical mechanical polishing (CMP) apparatus is provided. The CMP apparatus includes a first roller situated at a first point and a second roller situated at a second point. The first point is separate from the second point. Also included in the apparatus is a polishing pad strip having a first end secured to the first roller and a second end secured to the second roller. The first roller and the second roller are configured to reciprocate so that the polishing pad strip oscillates at least partially between the first point and the second point.

Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.

Abstract: An apparatus for planarizing a workpiece has a web with a face which is positioned adjacent the workpiece during planarization. At least one tension assembly is configured to maintain tension of the web. An orbiting assembly is configured to orbit the web relative to the workpiece. In another exemplary embodiment, an apparatus for planarizing a workpiece includes at least a first and a second polishing surfaces. The first polishing surface has a substantially horizontal web with a face which is positioned adjacent the workpiece during the planarization process. The apparatus also has a rotatable carousel and at least two workpiece carriers suspended from the carousel. Each of the carriers is configured to carry a workpiece and press the workpiece against one of the polishing surfaces while causing relative motion between the workpiece and the polishing surface. In another exemplary embodiment, an apparatus for planarizing a workpiece includes a plurality of polishing stations.

Abstract: A polishing apparatus has a top ring for holding a workpiece to be polished and a polishing table movable relative to the top ring. The polishing table has a polishing surface for polishing the workpiece held by the top ring. The polishing apparatus further has a polishing liquid supply device for supplying a polishing liquid to the polishing surface. At least one of the top ring and the polishing table reciprocates linearly in a first direction. The workpiece can be polished uniformly by the polishing surface because at least one of the top ring and the polishing table reciprocates linearly in the first direction.

Abstract: An object such as an electronic device can be favorably lapped by a method composed of preparing a lapping machine having a longitudinal or circular lapping board equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board and a supporting means arranged adjacently to the lapping board; placing the object on the lapping board via abrasive grains and further on the supporting means; and activating the ultrasonic oscillation-applying device to apply elliptical vibration to the lapping board whereby the object is caused to rotate on an axis thereof and lapped.

Abstract: A substrate processing apparatus according to the present invention has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

Abstract: The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.

Abstract: A fluid bearing polishing apparatus for carrying a polishing member for chemical mechanical polishing includes a fluid supply and a fluid dispensing structure to support the polishing member. A method of polishing a workpiece includes supporting a polishing member on a fluid bearing between a first end of the polishing member and a second end of the polishing member and moving the polishing member to polish the workpiece. The fluid bearing has a curved portion at which plane of travel of the polishing member changes from a first plane to a second plane. Advantages of the invention include smooth belt motion in all desired directions of movement.

Abstract: A superfinishing method of a tapered roller bearing, including the steps of: rotating an outer ring of the tapered roller bearing about a center axis thereof; inserting a straight-shaped superfinishing stone from a front face of outer ring; and slidingly contacting a leading end face of the superfinishing stone with a taper-shaped raceway surface formed in an inner peripheral surface of the outer ring to thereby superfinish the raceway surface. The superfinishing stone is inclined outwardly of the front face of outer ring with respect to a vertical line of the raceway surface.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

Abstract: A linear polisher for polishing a substrate that always provides a fresh abrasive surface for polishing and a method for linear polishing a substrate are described. In the linear polisher, a length of a polishing pad is supported on a pair of rollers which are driven by a motor means for either intermittently or continuously advancing the pad during a polishing process. A vibration generator which is connected to the polishing pad through an adaptor provides lateral, or vibration in a transverse direction of the pad throughout the polishing process. The present invention novel linear polisher enables substantially constant removal rate to be achieved throughout the pad life of a polishing pad without deterioration such as that normally seen in a conventional rotary or linear CMP apparatus. Optionally, a rotatable substrate holder is utilized to further improve the polishing uniformity of the linear polishing apparatus.

Abstract: A processing system and method for processing a workpiece is generally provided. In one embodiment, the system includes a processing module and a substrate transfer shuttle. The processing module includes a polishing surface and at least one polishing head disposed above the polishing surface. The substrate transfer shuttle is movable between at least a first position and a second position where the second position is disposed adjacent the polishing head. At least one nest is disposed therein to receive and align the substrate. The nest also facilitates transfer of the workpiece to the processing head.

Abstract: An apparatus for simultaneously polishing wafers including at least a first and a second web of polishing media. At least two polishing heads are provided on a carrier coupled to a drive system such that one polishing head positions a wafer against the first web and a second polishing head positions a second wafer against the second web. The drive system imparts a programmed polishing motion or pattern to the polishing heads.

Abstract: A thrustwall surface polishing tool for use with a power means for rotating a workpiece about an axis for treating a workpiece thrustwall surface.

Abstract: Generally, a method and apparatus for retaining a web of polishing material is provided. In one embodiment, an apparatus for retaining a web of polishing material includes a platen that has a first clamp and a second clamp disposed on opposite sides of the platen. A top surface of the platen is adapted to support the web of polishing material in an orientation having the web's edges disposed approximate the first and second sides of the platen. The first and second clamps are actuated to laterally tension the web therebetween.

Abstract: Apparatus and method for edging an ophthalmic lens comprises a spindle on which a lens is removably positioned and set rotating to engage with a web of abrasive material which is secured at only one end thereof. The free end of the web is allowed to dangle and is also preferably set into an oscillating, vertical movement which edges both the anterior and posterior surfaces of the lens adjacent the lens periphery to thereby smooth the periphery of the lens.

Abstract: An invention is disclosed for improved performance in a CMP process using a pressurized membrane as a replacement for a platen air bearing. In one embodiment, a platen for improving performance in CMP applications is disclosed. The platen includes a membrane disposed above the platen, and a plurality of annular bladders disposed below the membrane, wherein the annular bladders are capable of exerting force on the membrane. In this manner, zonal control is provided during the CMP process.

Abstract: Machine for machining using abrasive belts circular workpieces supported by at least one pair of parallel rollers. To pass the workpieces under the machining station(s) 6, the support rollers 16 driven in rotation are moved in translation parallel to their axes. The rollers 16 are preferably mounted on a table 13 mobile in translation which can also carry means 19 for positioning the workpieces to be machined.

Abstract: A chemical mechanical polishing (CMP) apparatus is provided. A first roller is situated at a first point and a second roller situated at a second point, such that the first point is separate from the second point. A polishing pad strip is also included and has a first end secured to the first roller and a second end secured to the second roller in a web handling arrangement. The polishing pad strip is configured to provide a surface onto which a substrate to be polished is lowered. Preferably, the polishing pad strip is a fixed abrasive pad and is configured to receive chemicals or DI water so as to facilitate a removal of material from a surface of the substrate.

Abstract: A thrustwall surface polishing tool for use with a power means for rotating a workpiece about an axis for treating a workpiece thrustwall surface.

Abstract: Generally, a method and apparatus for retaining a web of polishing material is provided. In one embodiment, an apparatus for retaining a web of polishing material includes a platen that has a first clamp and a second clamp disposed on opposite sides of the platen. A top surface of the platen is adapted to support the web of polishing material in an orientation having the web's edges disposed approximate the first and second sides of the platen. The first and second clamps are actuated to laterally tension the web therebetween.

Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or, finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film or they may be attached to one another along abutting edges with or without the backing film.

Abstract: A polishing apparatus comprises a top ring for holding a workpiece to be polished, and a polishing table movable relatively to the top ring. The polishing table has a polishing surface for polishing the workpiece held by the top ring. The polishing apparatus further comprises a polishing liquid supply device for supplying a polishing liquid to the polishing surface. At least one of the top ring and the polishing table reciprocates linearly in a first direction. The workpiece can be polished uniformly by the polishing surface because at least one of the top ring and the polishing table reciprocates linearly in the first direction.

Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

Abstract: Disclosed is a chemical mechanical polishing(“CMP”) apparatus. The present invention provides a CMP apparatus having a rotatable wafer holder in which a wafer is fixed. At a bottom of the wafer holder, a pair of driving roller is arranged and the respective rollers are rotated by motors. A polishing wire is winded between the respective driving rollers, the polishing wire is stuck to the wafer fixed at the wafer holder and the polishing wire moves in a linear reciprocal movement. Meanwhile, guide-rollers for providing tension with the polishing wire are arranged at outer portions of the respective driving rollers thereby winding both ends of the polishing wire at the respective guide-rollers. Further, a height adjusting member for is arranged at bottom portions of the polishing wire thereby adjusting the height of the polishing wire owing to a rise of the height adjusting member.

Abstract: A burnishing tape apparatus includes pads that press the burnishing tape against the surfaces of the disk to be burnished. The pads are mounted on pad holders that are biased to press the pads against both sides of the disk. Tape guides are used to apply tension to the burnishing pad when the pads are moved away from the disk. When the pads are away from the disk tape guides hold the burnishing tape away from the pads so that the burnishing tape may be indexed without damaging or dislodging the pads. As the pads are moved into contact with the disk, the tape guides release the tension on the burnishing tape while the centering guides ensure that the burnishing tape is centered on the pads. By releasing tension on the burnishing tape, the pads are permitted to press the approximate center of the burnishing tape against the surfaces of the disk without deforming in an uncontrolled manner.

Abstract: Apparatus for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a pad and polishing tape combination in contact with a rotating and oscillating disk surface to completely remove the random scratches previously formed by a polishing step. The apparatus facilitates the application of a specially designed, extremely fine alumina slurry composition without producing similar size circumferential scratches at the high surface speeds.

Abstract: A method of truing a grinding wheel includes the steps of providing a material containing a metallic material selected from the group consisting of metals in groups IVA, VA and VIA of the periodic table and alloys thereof, rotating a grinding wheel having a treatment surface to be trued, and contacting the material with the treatment surface of the grinding wheel.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film.