Abstract: A robot system comprises a robotic end effector including first, second and third abrasion tools having backing pads in a triangular arrangement.

Abstract: A portable and transportable die cavity modifying machine having a base carrying a carriage adjustable along one axis, e.g., a generally horizontal axis, and a machining head adjustable along another axis, e.g., a generally vertical axis, for modifying a die cavity of a stamping die in a manner that prevents blank or slug pulling during stamping press operation. The machine includes a grinder that can be pneumatically powered having a grinding bit used to precisely machine a slug retention groove in a die cavity defining surface (sidewall) of a die cavity formed in a stamping die. The machine has an angularly adjustable head carrying the grinder enabling adjustment of the angle of the groove relative to die cavity defining surface enabling the groove to be angled relative to the direction of a punch entering the die cavity during stamping.

Abstract: A pressing device (50) for pressing cutting means onto circumferential surfaces (12) of substantially cylindrical workpiece portions (13) during a finishing operation is provided for pressing the cutting means onto a circumferential surface with a pressing force over a contact angle. The pressing device is steplessly adaptable for the machining of workpiece portions of differing diameters that have a diameter difference of at least 0.1 mm.

Abstract: One or more high angle grinding units are supported by a carriage mountable on the underside of a rail grinding vehicle. Each grinding unit is attached to the carriage in a manner enabling controllable movement of the grinding units laterally, vertically, and angularly, with respect to the rails, so that a grinding stone rotated by the grinding unit can be operated to grind between a railhead and a closely adjacent rail structure to reform the gauge side of the railhead and the field side of the closely adjacent structure.

Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

Abstract: A triangular pad of the type shown in FIG. 5(a) which has circular tip ends is used as the polishing pad. This shape corresponds to the concept of partially cutting the outer edge of the polishing pad in order to shorten the contact time of the polishing pad and wafer at the outer circumference of the wafer regardless of the swing speed. As shown in the figure, a circular bored part with a diameter of 50 mm is provided in the center of such a polishing pad. By using this polishing pad and dividing the swing width into ten, it is possible to keep the product of the integrated value of the relative linear velocity, the integrated value of the pressure, and the integrated value of the contact time at various points within the wafer surface within ±30% of the mean value in each swing width under feasible swing conditions. Thus, the use of such a polishing pad makes it possible to perform uniform polishing.

Abstract: The polishing machine processes a workpiece put on table of body by four-directional control and is provided with a pair of columns. It comprises: first carrying unit having both ends fixed to pair of columns and having carrying part mounted on upper side; a second carrying unit being fixed to the carrying part in the direction orthogonal to the first carrying unit; third carrying unit being fixed to one end of the second carrying unit in the direction orthogonal to the second carrying unit; a tool head unit being mounted to lower side of the third carrying unit to be inclinable at predetermined angle by a tilting unit rotating at a constant angle and having driving means for rotating a polishing tool mounted at one side; and automatic constant pressure regulating means providing a predetermined virtual pressure with respect to the polishing tool mounted on the tool head unit.

Abstract: A method and apparatus for the sharpening of blades, particularly the blades of a lawnmower are provided. In the present invention, a blade sharpening apparatus with a supporting base comprises a blade retention and positioning mechanism, a blade sharpening mechanism and a guide rod for directing the blade sharpening mechanism laterally across the width of the apparatus. In a preferred embodiment of the present invention, the blade retention and positioning mechanism includes a hand operated crank for rotating the blade support means. Rotation of the blade support means allows for the proper positioning of the blade with respect to the sharpening mechanism so as to generate the correct sharpening angle for the sharpening of the blade. In such embodiment, the sharpening mechanism may be a lightweight, portable grinder mounted onto a supporting plate for movement along and rotation about a guide rod mounted to said supporting base of the apparatus.

Abstract: An edge grinding unit for machines for working the edges of plates in general and of glass sheets in particular comprising at least at one rim of a plate being worked, a grinding wheel which is accommodated in a carousel element provided with a rotatable cage formed by a plurality of circumferentially distributed rollers. The edge grinding unit further comprising an arm for supporting the grinding wheel which provides, for the grinding wheel, a first oscillation axis and a second oscillation axis which are spaced one another and are substantially perpendicular to the advancement plane of the plate.

Abstract: A swinging device for a sanding device, is disclosed. The swinging device has a swinging element, having mounted with a bi-axle motor, mounted to a sanding module, and the bi-axle motor synchronously drives a driving structure mounted to the swinging element, and the driving structure is provided with a shaft rod having an eccentric post, and the eccentric post is mounted to a limiting rod of the sanding module for limiting purpose, thus, when the bi-axle motor is initiated, the shaft rod is synchronously driven, and the eccentric post is used for limiting purpose. The entire swinging device causes the sanding module to produce a reciprocating swinging, and the sanding belt produces a tangential sanding effect.

Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

Abstract: There is disclosed a barrel-polishing apparatus comprising a polishing medium bath with polishing mediums received therein, a base, an arm mounted on the base, and a workpiece attachment device mounted on a distal end portion of the arm and adapted to attach a workpiece to the arm, wherein the polishing mediums are caused to flow within the polishing medium bath by an appropriate device and a pressing plate for pressing the polishing mediums is mounted on the polishing medium bath. A barrel-polishing method is also disclosed.

Abstract: A surface polishing machine for polishing a workpiece, the machine including a body member adapted to be positioned adjacent the workpiece and having first and second pivot means spaced apart from each other, a pair of polishing arms, each pivotable on a pivot means, each arm having a first end adapted to receive a surface grinding means for finishing the workpiece and a second end, an actuating means connected to the respective second ends of the first and second polishing arms for moving the arms about the first and second pivot means from respective treatment enabling positions adjacently spaced from the workpiece to respective treatment positions wherein the surface grinding means engages the workpiece, whereby the actuating means forces the respective second ends of the first and second polishing arms away from each other thereby producing a grinding pressure at the surface grinding means of each respective first and second polishing arms, a rolling support member for pivotably supporting and horizontall

Abstract: An apparatus is disclosed for linearly displacing a rotatable spindle relative to an object. The apparatus includes a support that is connectable to the spindle such that translation of the spindle relative to the support in a first direction is restrained, a rotatable shaft which is connected to the support such that translation of the shaft relative to the support in the first direction is restrained, and a rotational drive system rotatably connected to the shaft and rotatably connectable to the spindle, to transmit rotational drive from the spindle to the shaft. The apparatus also includes a contact piece eccentrically mounted to the shaft, wherein the contact piece has a contact surface thereon for contact with the object. Rotation of the shaft varies a distance, measured in the first direction, between the support and a portion of the contact surface contacting the object, such that the spindle is linearly displaceable relative to the object.

Abstract: An outer surface of a cam on a camshaft extending along a camshaft axis is honed by continuously rotating the camshaft about its axis, holding a grinding stone adjacent the cam with a surface of the stone directed radially inward at the cam surface, urging the grinding stone radially of the axis against the stone and thereby pressing the cam surface radially inward against the cam surface for contact of the stone surface along a line with the cam surface, and continuously displacing the stone surface in a direction generally tangential of the camshaft axis and thereby continuously moving the contact line between the cam and stone surfaces. Thus the contact line between the stone and the cam will move continuously, so that wear will not be concentrated in one location and the stone will not wear to fit in surface contact on the cam. The cam surface includes a part-cylindrical base region coaxial with the camshaft and a lobe region projecting radially outward from and joined to the base region.