Internal Patents (Class 451/180)
  • Patent number: 6241590
    Abstract: An abrasive machine for grinding material from an outer surface of a workpiece. The machine includes a rotationally driven casing having an opening at one axial end thereof. The opening is defined by an annular edge which constitutes a grinding wheel. A shaft is disposed within the casing and forms a space whose center axis is offset from the center axis of the casing. Disposed within the space and supported by the shaft is a clamping mechanism which holds the workpiece within the plane of the annular edge. By turning the shaft relative to the casing, the clamping mechanism and the workpiece will be moved toward or away from the path of travel of the annular edge, due to the eccentric relationship between the casing and the space.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: June 5, 2001
    Assignee: Lidkoping Machine Tools AB
    Inventor: Mats Heijkenskjöld
  • Patent number: 6234879
    Abstract: A method and apparatus for polishing chamfers made along the periphery of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60° to transfer the wafers.
    Type: Grant
    Filed: March 20, 1996
    Date of Patent: May 22, 2001
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Fumihiko Hasegawa, Tatsuo Ohtani, Yasuyoshi Kuroda
  • Patent number: 6203410
    Abstract: A reamer with adjustable expansion/contraction and a bore finishing machine comprising the reamer. The reamer has a rotation shaft that is externally operable and a grinding section. The grinding section is cylindrically shaped, and has a plurality of axially-extending slits in its peripheral wall and a tapered inner surface. The rotation shaft is connected via threaded sections to a sliding shaft, which is in turn connected to a diameter expansion member consisting of a tapered cone fitted into the tapered inner surface of the grinding section. When the rotation shaft is operated to rotate, the rotational motion is converted into linear motion of the slide shaft due to a guide pin and a guide hole. The linear motion moves the diameter expansion member back and forth inside the grinding section, thereby contracting/expanding the outer diameter of the grinding section mechanically and precisely. The bore finishing machine has a hollow main rotation spindle, and a rotation spindle inside the same.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: March 20, 2001
    Assignees: Kabushiki Kaisha Takezawa Seiki, Kuraki Co., Ltd.
    Inventors: Junichi Tanaka, Toshiyuki Nomoto, Eiji Takezawa
  • Patent number: 6152812
    Abstract: A punching machine for cutting glass having a punch body comprises a hollow punch holder on a top side of the punch body; a hollow punch on a bottom side of the punch body having a cavity on a front end and a circumferential portion with a plurality of sand formed thereon surrounding an outer surface of the cavity an elastic member; and a knockout pin provided through the punch holder and the punch having one end urged against one end of the elastic member in the punch holder and the other end extended downwardly from the cavity in a stored position; whereby as the circumferential portion is cutting through a glass surface, the knockout pin is urging against a portion of glass until the portion is separated from the glass completely.
    Type: Grant
    Filed: July 8, 1999
    Date of Patent: November 28, 2000
    Assignee: Chunghwa Pictures Tubes, Ltd.
    Inventors: Wen-Chih Sung, Huo-Chen Tsai
  • Patent number: 5961382
    Abstract: A new PIPE BEVELER for ATTACHING TO A ROTARY SAW FOR PRODUCING THIRTY DEGREE BEVELS ON PIPES. The inventive device includes a coupling plate adapted for coupling with respect to a rotary saw. A receiving collar having a generally frustoconical configuration is integral with the coupling plate. An abrasive material is disposed around an internal periphery of the receiving collar for grinding pipes into a bevel of thirty degrees.
    Type: Grant
    Filed: July 21, 1997
    Date of Patent: October 5, 1999
    Inventor: Mark Stoloski
  • Patent number: 5899795
    Abstract: A pipeline and tubular structure renovation apparatus facilitates rapid and economical removal of protrusions into the interior of pipelines and other tubular structures, particularly gas pipelines having excess weld or devices such as nipples, etc. The apparatus consists of a generally cylindrical carriage mounted on wheels or skids which substantially center the apparatus within a pipeline; a clamping device to clamp the carriage in position; and a centrifugal tool head which may perform grinding, cleaning, polishing and other operations. Grinding may be accomplished in both radial and plunge cutting modes. The apparatus is robust and of simple and economical construction Weld removal speed is considerably faster than that achieved by conventional precision grinding tools.
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: May 4, 1999
    Inventor: G. Gregory Penza
  • Patent number: 5803794
    Abstract: The combined grinding machine for internal spline includes three grinding heads for processing a bore of internal spline parts. The machine clamps a workpiece and at the same time can finish grind during the bore and spline operation and boring one of its end faces. The machine has a grinding head for boring and grinding head for a side boring a spline installed in a main sliding plate which moves on a vertical shaft of the machine body. The machine has a rotary table installed in a removable working table driven by a motor unit. Both the working table and the grinding head for the spline end face are located in the machine body. The machine demonstrates high efficiency, high precision, and low equipment investment. The machine saves time for aligning and clamping procedures.
    Type: Grant
    Filed: February 7, 1994
    Date of Patent: September 8, 1998
    Inventor: Xu Xian Hua
  • Patent number: 5800252
    Abstract: An improved honing method and device connected to a source of pressurized fluid for machining a wall of a bore hole or similar interior of a workpiece. The honing device includes a tool mandrel connected in a cantilevered arrangement to a machine for rotating machining operations. A rigid honing member is secured to the tool mandrel, and configured such that the effective diameter of the substantially rigid abrasive outer surface of the honing member can be uniformly and precisely varied in a radial direction relative to the longitudinal axis of the tool in response to pressure on the interior surface of the honing member. A fluid distribution system formed in the tool mandrel in a predetermined arrangement is in fluid communication with the source of pressurized fluid, and includes a pressure chamber that is configured to apply fluid pressure to the interior surface of the honing member.
    Type: Grant
    Filed: September 3, 1996
    Date of Patent: September 1, 1998
    Assignee: Makino Inc.
    Inventor: Gregory Aaron Hyatt
  • Patent number: 5709591
    Abstract: An injection molded disposable honing tool is made by an injection molding process. The tool has an elongated rectangular base from which projects an elongated section which may be somewhat smaller. The elongated section terminates in a working face. The entire tool may incorporate abrasive therein homogeneously or simply the elongated section which terminates in the working face. A shot of a plastic melt such as nylon is formed with abrasive mixed homogeneously which is then injected into a mold. For higher cost abrasive, a two shot process may be used with one shot being abrasive free. Alternatively, an abrasive-free insert may be placed in the mold before the abrasive mix is injected. The surface of the working face may be formed to act as a working face of closely packed fingers by placing patterns in the mold surface forming the working face, or subsequently cutting the working face, or a combination of both.
    Type: Grant
    Filed: July 7, 1995
    Date of Patent: January 20, 1998
    Assignee: Jason, Inc.
    Inventors: R. Brown Warner, Joseph P. Gaser
  • Patent number: 5630749
    Abstract: The invention relates to an apparatus for the mechanical removal of deposits on welding electrodes. Welding electrodes have to be cleaned after a certain number of welding operations due to deposits. Therefore an apparatus is provided which is essentially subdivided into two subassemblies, namely a machining head and a holding device in the form of a stand or pedestal, which can be installed universally and in any position. The apparatus is characterized by a simple construction of a pneumatic motor which is an integral part of the apparatus. The pneumatic motor rotor is housed in a rotary manner in the machining head, which also contains the gear and the holder for the abrading tool to clean the welding electrodes.
    Type: Grant
    Filed: August 30, 1995
    Date of Patent: May 20, 1997
    Inventors: Walter Koch, Kai Meermann
  • Patent number: 5591065
    Abstract: The present invention relates to a method for dressing a hone of a honing wheel which is used for honing a gear to be finished. A dressing tool is brought into contact with the honing wheel under a predetermined constant contact pressure and during the reciprocal feed of the dressing tool. The amount of the contact pressure is maintained constant so as to gradually increase the in-feed of the honing wheel. This is useful in decreasing the number of transverse feeds of the dressing tool.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: January 7, 1997
    Assignees: Aisin Seiki Kabushiki Kaisha, Nachi-Fujikoshi Corp.
    Inventors: Sadao Mizuno, Akinori Hoshino, Akira Muraoka, Hiroyuki Takahashi
  • Patent number: 5571040
    Abstract: A method and device are adapted for detecting and controlling the flexure of a flat ring blade member of a slicing machine in which a workpiece is placed in the blade member, and a relative movement is rendered between the blade member being rotated and a workpiece in a radial direction of the blade member to produce a wafer of the workpiece. An axial load acting between the workpiece and the blade member is detected. A flexure amount of the blade member is calculated on the basis of the axial load detected. The flexure of the blade member is corrected on the basis of the flexure amount calculated.
    Type: Grant
    Filed: December 15, 1993
    Date of Patent: November 5, 1996
    Assignee: Toyo Advanced Technologies Co., Ltd.
    Inventors: Keishi Kawaguchi, Tatsumi Hamasaki, Yoshihiro Tadera, Kunio Matsuda
  • Patent number: 5554063
    Abstract: A centerless grinding machine comprises a stationary disk, a following disk, and a shoe, which cooperate to hold and rotate a workpiece. The following disk is mechanically loaded to the bias towards the stationary disk and the shoe so that the workpiece is secured between an outer circumference of the disks and the shoe. A diameter detector detects an outside diameter of the workpiece by detecting a displacement of the following disk by the workpiece. From this information, a controller controls an X-Z grinder to grind an inner surface of the workpiece. This grinding is in response to the outside detector detected by the diameter detector. As a result, the inner diameter can be machines to closer tolerances than are available in the outer diameter.
    Type: Grant
    Filed: August 3, 1994
    Date of Patent: September 10, 1996
    Assignee: Bryant Grinder Corporation
    Inventors: Lawrence I. Millay, Richard E. Crossman
  • Patent number: 5547415
    Abstract: A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.
    Type: Grant
    Filed: June 7, 1993
    Date of Patent: August 20, 1996
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Fumihiko Hasegawa, Tatsuo Ohtani, Yasuyoshi Kuroda
  • Patent number: 5524604
    Abstract: A method and apparatus for slicing semiconductor wafers. An inner peripheral cutting edge has a doughnut-shaped blade with electro-deposited diamond grains. The blade is attached to a moving trestle. The moving trestle moves along rails located on both sides of the inner peripheral cutting edge and is driven by instruction signals from a control section. A workpiece is placed within the inner peripheral cutting edge and rotated about the axis thereof by a motor. The motor is mounted on a beam member and is driven by instruction signals from the control section. With this arrangement, the inner peripheral cutting edge is rotated in the direction of arrow A. Then, the moving trestle moves in the direction of arrow B by the control section and the workpiece is pressed against a grindstone on the inner peripheral cutting edge cutting the workpiece by a predetermined value.
    Type: Grant
    Filed: July 8, 1993
    Date of Patent: June 11, 1996
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventor: Katsuo Honda
  • Patent number: 5404678
    Abstract: A wafer chamfer polishing apparatus with a rotary circular dividing table, wherein the vacuum pump for pneumatically activating the wafer suction cups is mounted on an integral part of the rotary circular dividing table and the drive motors for dynamically activating the wafer suction cups are installed on an independent stationary body.
    Type: Grant
    Filed: June 7, 1993
    Date of Patent: April 11, 1995
    Inventors: Fumihiko Hasegawa, Tatsuo Ohtani, Yasuyoshi Kuroda