Abstract: A centerless cylindrical grinding machine, for through-feed and in-feed grinding of various workpieces (8), has a first driven positioning axis XS for a grinding spindle head (2) with a grinding wheel (1) and a second driven positioning axis XR, running parallel to the positioning axis XS, for a regulating spindle head (4), with a regulating wheel (3). The positioning axes XS and XR are arranged perpendicular to the rotation axes (5, 6) or the grinding wheel (1) and the regulating wheel (3). A workpiece support (7) on a carriage (12) and an inner- or outer-acting wheel-true device (9) are arranged between the grinding spindle head (2) and the regulating spindle head (4). During operation, the grinding spindle head (2), the regulating spindle head (4), the workpiece support (7) and the wheel-true device (9) are located within a safety housing (15).

Abstract: Chemical mechanical polishing (CMP) systems and methods are provided herein. One aspect of the present subject matter is a polishing system. One polishing system embodiment includes a platen adapted to receive a wafer, and a polishing pad drum that has a cylindrical, or generally cylindrical, shape with a length and an axis of rotation along the length. The polishing pad drum is adapted to rotate about the axis of rotation along the drum length. The polishing pad drum, the platen, or both the polishing pad drum and the platen are adapted to be linearly moved to polish the surface of the wafer using the rotating polishing pad drum. The polishing pad drum and the platen are adapted to be operably positioned a predetermined minimum distance from each other as the polishing pad drum and the platen pass each other due the linear motion.