Rotary Work Holder Patents (Class 451/210)
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Patent number: 12121937Abstract: A system and method for cleaning disks includes a cleaning disk rotatably supported by a structural frame, the rotatable cleaning disk defining a plurality of holes, the plurality of holes carrying disks to be cleaned. The rotatable cleaning disk disposed between a first plurality of brushes and a second plurality of such that each of the first plurality of brushes and the second plurality of brushes contacting and agitating surfaces of the disks. A washing tank is supported by the structural frame and defines a reservoir of cleaning solution. At least a portion of the rotatable cleaning disk and the first and second pluralities of brushes are submerged in the cleaning solution. A blower forces heated air over the disks to be cleaned and removes cleaning solution from the disks, and a light source irradiates the disks to be cleaned for a predetermined amount of time.Type: GrantFiled: June 25, 2021Date of Patent: October 22, 2024Inventor: Robert Eugene Wood
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Patent number: 9481067Abstract: The present invention in one or more embodiments provides a roller tool for roughening a friction ring of a brake disk, the roller tool including a roller body including inner and outer ends and a casing surface positioned there-between, the inner end differing in cross-section dimension than the outer end, the casing surface including thereupon one or more protrusions for contacting the friction ring. The roller tool may further include a support frame supporting the roller body. The support frame may include a short leg connected to the outer end of the roller body and a long leg connected to the inner end of the roller body.Type: GrantFiled: September 18, 2014Date of Patent: November 1, 2016Assignee: FORD GLOBAL TECHNOLOGIES, LLCInventors: Gerhard Flores, Josef Koepp, Valeri Hartmann, Clemens Maria Verpoort
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Patent number: 9022837Abstract: A honing machine has at least one clamping unit that clamps a workpiece and has a rotary drive for the workpiece. A spindle unit has a stroke drive for an inner honing tool for inner honing of the workpiece. An outer honing device that is movable relative to the workpiece in an axial direction of the workpiece is provided. The outer honing device has several honing stones and an advancing device acting on the honing stones. The honing stones each are advanced in a radial direction relative to the workpiece. The advancing device has at least one linear drive for each one of the honing stones and a common drive motor for all of the linear drives.Type: GrantFiled: February 20, 2013Date of Patent: May 5, 2015Assignee: Gehring Naumburg GmbH & Co.Inventor: Günther Pöhlitz
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Publication number: 20140057535Abstract: A honing machine has at least one clamping unit that clamps a workpiece and has a rotary drive for the workpiece. A spindle unit has a stroke drive for an inner honing tool for inner honing of the workpiece. An outer honing device that is movable relative to the workpiece in an axial direction of the workpiece is provided. The outer honing device has several honing stones and an advancing device acting on the honing stones. The honing stones each are advanced in a radial direction relative to the workpiece. The advancing device has at least one linear drive for each one of the honing stones and a common drive motor for all of the linear drives.Type: ApplicationFiled: February 20, 2013Publication date: February 27, 2014Applicant: GEHRING NAUMBURG GMBH & CO.Inventor: GEHRING NAUMBURG GMBH & CO.
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Patent number: 8257151Abstract: A polishing device includes an outer barrel, an inner barrel, polishing members, and an actuator. The outer barrel defines a chamber and includes inner surfaces substantially parallel to a central axis of the outer barrel. Each of the inner surfaces defines a holding groove for holding a workpiece. The inner barrel is received in the chamber and includes a side surface substantially parallel to the central axis. The side surface defines installation grooves. Each polishing member includes an elastic piece, a polishing motor connected to a bottom of a corresponding installation groove by the elastic piece and received in the corresponding installation groove, and a polishing plate connected to the polishing motor and capable of being driven to rotate by the polishing motor. The actuator is configured for driving the outer barrel to spin and move back and forth along the central axis.Type: GrantFiled: October 31, 2010Date of Patent: September 4, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Shao-Kai Pei
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Publication number: 20120009851Abstract: An apparatus for grinding a cam having an outer surface with outwardly convex and outwardly concave portions has a frame and a main drive on the frame for holding the cam and rotating it about a main axis. A pair of drive motors having respective output axes generally diametrally flank the main axis. Respective carriages carrying the drive motors are shiftable on the frame radially of the main axis. One of the motors is shiftable into an inner position in which the main axis extends through the one drive motor. Respective grinding wheels are rotatable by the motors about the respective axes, and the wheel of the one motor is of substantially smaller diameter than the wheel of the other motor.Type: ApplicationFiled: June 29, 2011Publication date: January 12, 2012Inventor: Roland SCHMITZ
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Patent number: 7963823Abstract: A machining machine with an upper rotatingly drivable machining disc, the annular machining plane of which has a machining coating and is facing a lower machining plane, wherein the machining planes form a machining gap between each other. Plural rotor discs are arranged in the gap, which accommodate workpieces in recesses and which can be brought into rotation by means of a roll-off device, wherein the workpieces move along a cycloid path, wherein plural sensor elements for acquiring at least one machining parameter are arranged in the upper machining disc, distributed across its cross section, the sensor elements are each one coupled to an active or passive RFID chip and a reading device is assigned to the upper machining disc for reading out the RFID chips.Type: GrantFiled: March 12, 2008Date of Patent: June 21, 2011Assignee: Peter Wolters GmbHInventor: Harald Fischer
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Patent number: 7785173Abstract: A superfinishing system and method, wherein an abrasive is employed to process a workpiece, and wherein the system simultaneously mounts a plurality of workpieces in a diagonal turret, or mounts a plurality of different types of workpieces in a plurality of chucks for different operations thereon, or performs a plurality of different operations on the same workpiece without remounting. The system improves throughput by allowing flexibility in the operation and multitasking.Type: GrantFiled: February 27, 2006Date of Patent: August 31, 2010Assignee: Supfina Machine Co.Inventor: Norbert Klotz
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Publication number: 20080318494Abstract: A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.Type: ApplicationFiled: June 20, 2007Publication date: December 25, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tien-Chen Hu, Jung-Sheng Hou, Chun-Chin Huang
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Patent number: 7223159Abstract: A centerless cylindrical grinding machine, for through-feed and in-feed grinding of various workpieces (8), has a first driven positioning axis XS for a grinding spindle head (2) with a grinding wheel (1) and a second driven positioning axis XR, running parallel to the positioning axis XS, for a regulating spindle head (4), with a regulating wheel (3). The positioning axes XS and XR are arranged perpendicular to the rotation axes (5, 6) or the grinding wheel (1) and the regulating wheel (3). A workpiece support (7) on a carriage (12) and an inner- or outer-acting wheel-true device (9) are arranged between the grinding spindle head (2) and the regulating spindle head (4). During operation, the grinding spindle head (2), the regulating spindle head (4), the workpiece support (7) and the wheel-true device (9) are located within a safety housing (15).Type: GrantFiled: September 3, 2001Date of Patent: May 29, 2007Inventors: Urs Tschudin, Libor Sedlacek
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Chemical mechanical planarization (CMP) system and method for preparing a wafer in a cleaning module
Patent number: 7077731Abstract: A method for preparing a wafer in a cleaning module is described. In this method, slurry is dispensed onto a surface of a wafer. Next, a chemical mechanical planarization (CMP) operation is conducted in the cleaning module by contacting a surface of a brush with the surface of the wafer. Subsequently, a cleaning operation is conducted in the cleaning module. A CMP pad and a CMP system also are described.Type: GrantFiled: December 22, 2003Date of Patent: July 18, 2006Assignee: Lam Research CorporationInventor: Xiuhua Zhang -
Patent number: 6884154Abstract: In a process for polishing the chamfered peripheral part of a wafer using a polishing cloth while supplying a polishing slurry in order to improve productivity of the process by reducing a polishing time, at least two steps of polishing processes are performed in sequence. The process comprises a first polishing process to polish a particular part, e.g. the part corresponding to the {110} plane of a peripheral part of the wafer and a second polishing process in which the whole part of a peripheral part of the wafer is polished for finishing by means of varying a hardness of the polishing clothes and/or a particle size of abrasives in the slurry such as the hardness of the polishing cloth in the second polishing process being softer than that of in the first polishing process and a particle size of abrasives in the slurry in the second polishing process being finer than that of in the first polishing process.Type: GrantFiled: February 21, 2001Date of Patent: April 26, 2005Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Kazutoshi Mizushima, Nakaji Miura, Yasuhiro Sekine, Makoto Suzuki, Kazuya Tomii
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Patent number: 6811465Abstract: In a method of grinding a component such as a cam, a reduction in the finish grinding time is achieved by rotating the component through only a single revolution during a final grinding step and controlling the depth of cut and the component speed of rotation during that single revolution, so as to maintain a substantially constant specific metal removal rate during the final grinding step. The headstock (12) velocity can vary between 2 and 20 rpm during a single revolution of the cam during the final grinding step, with the lower speed used for grinding the flanks and the higher speed used during the grinding of the nose and base of the cam. Using a grinding machine (10) having 17.5 kw of available power for rotating the wheel, and cutting a grinding wheel in the range 80-120 mm diameter, typically the depth of cut lies in the range of 0.25 to 0.5 mm.Type: GrantFiled: April 26, 2002Date of Patent: November 2, 2004Assignee: UNOVA U.K. LimitedInventor: Daniel Andrew Mavro-Michaelis
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Publication number: 20030220057Abstract: A grinding device includes a rotary grinding wheel having an annular grinding surface, a first grinding seat located in front of the grinding wheel, a sleeve disposed rotatably within a through hole in the first grinding seat, an abrasion measuring device for measuring amount of flank portions of a drill bit to be ground, and a tubular holding unit for holding releaseably the drill bit therein. The holding unit is sleeved on the drill bit, is disposed initially in the abrasion measuring device so as to fix position of the drill bit within the holding unit, and is then transferred into the first grinding seat for grinding the flank portions of the drill bit.Type: ApplicationFiled: October 15, 2002Publication date: November 27, 2003Inventor: Cheng-Fu Lin
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Patent number: 6341999Abstract: A method for glass substrate chamfering using a metal-bonded outer-surface grindstone 12 for simultaneously processing the end surface and the oblique surfaces of the outer periphery of a doughnut-like glass substrate 1 with a circular hole 1a at the center thereof, and a metal-bonded inner-surface grindstone 14 for simultaneously processing the end surface and the oblique surfaces of the inner periphery are provided; the outer-surface grindstone and the inner-surface grindstone simultaneously grind end surfaces and oblique surfaces of the outer and inner peripheries of the glass substrate, and during grinding, the outer-surface grindstone is sharpened by dressing it electrolytically, and the inner-surface grindstone is sharpened by an electrolytic dressing when not processing as the glass substrate is being replaced.Type: GrantFiled: September 26, 2000Date of Patent: January 29, 2002Assignees: Riken, Utksystem Corporation, The Nexsys CorporationInventors: Hitoshi Ohmori, Muneaki Asami, Akihiko Uzawa, Sadamasa Shigitani
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Patent number: 6336847Abstract: A chip saw in which chips are brazed onto the peripheral edge thereof is clamped, and is rotated while bringing a rotational brush into contact with a honing-subjected portion of the peripheral edge. A liquid, which has dustproof oil and abrasive powder, provided with abrasive properties is supplied to a part in which the rotational brush is in contact with the honing-subjected portion. Therefore, the work efficiency of honing process is improved, and sawdust is not generated. This makes it possible to easily take countermeasures against environmental problems and effectively use resources. In addition, the liquid can be easily recycled.Type: GrantFiled: June 2, 2000Date of Patent: January 8, 2002Assignee: Kabaushiki Kaisha TriggerInventors: Chikara Miyazaki, Tsutomu Ichikawa
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Patent number: 6261160Abstract: A polishing apparatus comprises a rotating table intermittently rotating through 120°0 increments; three polishing drums and three work-holding means 12 provided on the rotating table; a handling means for unloading a processed work from the work-holding means at a handling position and supplying an unprocessed work to the work-holding means at the same position; and a work-inverting means for inverting a work, the front-plane-side edge of which has been polished, at a front-plane edge polishing position.Type: GrantFiled: September 4, 1998Date of Patent: July 17, 2001Assignee: Speedfam Co., Ltd.Inventor: Shunji Hakomori
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Patent number: 6227952Abstract: A method for creation of a surface from a rough blank for spectacles is which is suitable for both brittle-hard materials and for plastics uses makes use of a disk-shaped, rotation-symmetrical tool of relatively large diameter, by means of which the material to be taken off the rough blank is removed with high grinding or milling efficiency in at least two work steps—a plunge-cut step and a shaping step with material removed along a spiral path. The outcome of the last work step is a machining path traveling in a spiral from the outside to the inside with low residual apex height and relatively large apex spacing. The resulting surface needs only slight fine-grinding and polishing aftertreatment. As an option, both a rim machining step adapted to the form of the eyeglass frame and a work step faceting the rim of the eyeglasses can be integrated into the method. Furthermore, tools are proposed for carrying out the grinding and milling process.Type: GrantFiled: June 10, 1999Date of Patent: May 8, 2001Assignee: Loh Optikmaschinen AGInventors: Joachim Diehl, Ronald Lautz, Karl-Heinz Tross
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Patent number: 6220927Abstract: An eyeglass lens grinding apparatus is used for processing an eyeglass lens based on processing data obtained from target lens configuration data indicative of an eyeglass frame shape. In the eyeglass lens grinding apparatus, a lens is rotated while being subjected to processing by a grinding wheel group. The grinding wheel group has intermediate and accurate finishing processing wheels respectively formed with a plurality of beveling groove each for forming a bevel on a periphery of a lens. The intermediate and accurate finishing processing wheels are controlled to finish the lens by selectively and consecutively using the beveling grooves.Type: GrantFiled: November 23, 1998Date of Patent: April 24, 2001Assignee: Nidek Co., Ltd.Inventors: Toshiaki Mizuno, Hirokatsu Obayashi
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Patent number: 6106373Abstract: This application relates to a grinding machine which is capable of performing two controlled grinding operations simultaneously on a rotating workpiece.Type: GrantFiled: April 2, 1997Date of Patent: August 22, 2000Inventor: Mario Fabris
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Patent number: 5716256Abstract: A subject lens is held by two chuck shafts, which are rotated synchronously by pulse motors during a grinding operation. A group of grinding wheels are mounted on each of rotary shafts of right and left lens grinding parts. The rotary shafts are disposed on opposite sides of the chuck shafts. A desired grinding wheel for each processing is selected by moving the rotary shaft vertically. To grind the subject lens, the rotary shafts are moved independently by pulse motors toward the rotation axis of the chuck shafts based on lens frame shape data in the case of rough processing.Type: GrantFiled: July 12, 1996Date of Patent: February 10, 1998Assignee: Nidek Co., Ltd.Inventors: Toshiaki Mizuno, Ryoji Shibata, Masahiko Kobayashi, Yoshinori Matsuyama, Hirokatsu Ohbayashi, Masakazu Funakura
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Patent number: 5658189Abstract: A slide table is slidably supported on the slide stage which is moved by a guide screw. The slide table is connected with the slide stage by means of pressurization means. A rotatable wafer table is provided on the slide table. A grinding wheel for chamfering is used. The pressurization means is locked, so that the slide table is kept locked to the slide stage. A wafer set on the slide table is moved toward the grinding wheel, and an edge of the wafer is chamfered. A grinding wheel for polishing is used. The pressurization means is not locked, so that the slide table can be slide on the slide stage. A wafer set on the slide table is moved toward the grinding wheel, and an edge of the wafer is polished.Type: GrantFiled: September 12, 1995Date of Patent: August 19, 1997Assignee: Tokyo Seimitsu Co., Ltd.Inventor: Takeshi Kagamida
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Patent number: 5609512Abstract: An apparatus and method for honing, sharpening or grinding a curved peripheral cutting surface of a slicer blade are provided. Included is the use of one of a set of interchangeable cams that generally follows the curved shape of the blade cutting surface, whether same has a constant radius or varying radii. In order to minimize downtime and sanitation operations, the honing is accomplished off-line of the slicer equipment. Preferably, the slicer blade remains perfectly flat during honing, and the movement of one or more honing or grinding wheels is closely controlled so as to provide honed or ground cutting edges which are of substantially uniform width throughout their respective peripheries. Honing is accomplished in accordance with objectively measured sharpness standards by which superior sharpness levels are attained.Type: GrantFiled: January 9, 1995Date of Patent: March 11, 1997Assignee: Kraft Foods, Inc.Inventors: Terry L. Holmes, Gary R. Skaar, Larry C. Gundlach, Dennis G. Flisram
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Patent number: 5607348Abstract: An apparatus for grinding a disc brake disc having opposite surfaces, the apparatus comprising: a free-standing support; a pair of rotors, at least one of which is a grinding rotor, the rotors attached to the support to extend in spaced relation at opposite sides of a disc for grinding at least one face of the disc, wherein at least one rotor is pivotally attached to the support and can be moved toward and away from the disc independent of the other rotors; adjustment means attached to the support to allow adjustment of the angle of at least one rotor in relation to a face of the disc; and drive means to rotate at least one of the rotors.Type: GrantFiled: June 7, 1995Date of Patent: March 4, 1997Inventor: Francisco R. Lopez
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Patent number: 5392567Abstract: A method of removing a portion of a cord that is exposed on the side surface of a power transmission belt. The method consists of the steps of providing an endless power transmission belt having inside and outside surfaces, laterally oppositely facing side surfaces, and a cord exposed on at least a part of one of the side surfaces. The belt is run in an endless path. The cord that is exposed on the part of the one side surface is ground as the belt is run without grinding the entirety of the one side surface of the belt. The invention is also directed to an apparatus for carrying out the above method and a power transmission belt having a portion of at least one of its side surfaces cut out/ground where a cord was exposed.Type: GrantFiled: May 21, 1992Date of Patent: February 28, 1995Assignee: Mitsuboshi Belting Ltd.Inventors: Takaji Nagai, Toshiki Sawauchi, Mitsuhira Ishihara