Abstract: Disclosed is an apparatus for processing a lens edge. The apparatus comprises: a wheel-shaft-moving rotating member whose one end is fixed to a fixing frame by a moving-shaft, for moving pivotally about the moving-shaft; a wheel-shaft mounted on the other end of the wheel-shaft-moving rotating member, for moving pivotally with the wheel-shaft-moving rotating member and for being rotated by driving a wheel-rotating motor; and a cutter for processing the lens edge into a form of a step/incline shape, the cutter being coupled to one end of the wheel shaft to move with the wheel-shaft to contact the lens edge, and rotated with the wheel shaft to cut the surface of the lens, and the cutter comprising a rotating body inserted into the wheel-shaft to rotate with the wheel-shaft, and at least one cutting projection formed on the circumference of the rotating body to cut the edge and the periphery of the lens.

Abstract: A method of conducting a material removal operation using a grinding system including moving an abrasive article relative to a workpiece, detecting a change in a dimension of the abrasive article during moving, and reducing resonance vibrations in the grinding system.

Abstract: A bench grinder safety and monitoring system for maintaining worker safety while using a bench grinder having a contactor wheel, a tool rest proximate the contactor wheel defining a tool rest gap and having a tongue guard proximate the contactor wheel defining a tongue guard gap. The system includes a first optical sensor situated within in the tool rest gap having an emitter portion coupled to the tool rest adjacent a first side of the contactor wheel and a receiver portion coupled to the tool rest adjacent a second side of the contactor wheel, the emitter portion configured to project a beam of light across the tool rest gap toward the receiver portion. A controller in data communication with the receiver portion of the first optical sensor, is configured to determine if the light beam is received by the receiver portion and, if so, to de-energize the motor.

Abstract: A grinding engine includes a work spindle; a work chuck cooperated with the work spindle; a grind spindle; a grind wheel cooperated with the grind spindle; and a plurality of alignment adjustment systems positioned relative to and around the grind spindle, wherein adjustment from any one of the alignment adjustment systems is configured to cause a change in alignment between the work spindle and the grind spindle.

Abstract: A method of grinding wafers includes determining thickness variations in a wafer; determining incremental adjustments to spindle alignment based on best fit predictions of wafer shaper; and implemented the incremental adjustments to spindle alignment of a grind module.

Abstract: A method of grinding spring ends of helical compression springs is carried out using a numerically controlled spring end grinding machine having a grinding unit, a loading unit and a control unit that controls the loading unit and the grinding unit. The grinding unit has a pair of grinding wheels including two rotatable grinding wheels between which is formed a grinding space. The loading unit has at least one loading plate substantially rotatable axially parallel to the grinding wheels and has a plurality of out-of-axis spring receptacles, each to receive a helical compression spring.

Abstract: A modular sensing system architecture. A sensing system includes multiple planes that are in electrical communication. A power plane provides a power source and a communications module that can be optical and/or electrical in nature. The power source can be upgraded using optical power delivered over an optical fiber. The sensing system can also both transmit/receive data over the optical fiber. A processing plane provides memory and processing power. The processing plane can be updated/upgraded via the communications module or the optical fiber. A sensor plane includes multiple sensors. The architecture enables sensor planes to be interchangeable while still having communication with other planes of the sensor. The processing plane can be updated to accommodate different sensor configurations.

Abstract: A polishing apparatus is provided for optimizing a polishing profile in consideration of even such parameters as the temperature on the surface of an object to be polished, and the thickness of a polishing pad, in addition to a polished amount. The polishing apparatus for polishing the object to be polished under control of a control unit CU has at least two pressing sections, and comprises a top ring which can apply an arbitrary pressure to the object to be polished from each of the pressing sections, a measuring device IM for measuring a polished amount of the object to be polished, and a monitoring device SM for monitoring the object to be polished for a polishing condition. The control unit CU forces the polishing apparatus to polish the object to be polished in accordance with a simulation program for setting processing pressures required to optimize a polishing profile of the object to be polished to the top ring based on the output of the measuring device IM and the output of the monitoring device SM.

Abstract: A machine tool for machining a part by on-head and continuous grinding tool profiling includes a part holder support driven into rotation by first driving means around a first axis in a vertical plane, a machining system provided with a grinding tool for machining the part, and a knurl for profiling the grinding tool. The first driving means are incorporated into a cradle driven into rotation by second driving means along a second axis perpendicular to the vertical plane. The machining system includes a bearing structure translationally mobile along three axes equipped with a main spindle for rotating the grinding tool, and a rotating device bound to the bearing structure and provided with a secondary spindle integral with the knurl moving around the axis of rotation of the grinding pool.

Abstract: In general, techniques are described that allow an abrasive manufacturing process to achieve a controlled performance parameter, e.g., an amount of material removal, without requiring the use of feedback controls within the abrasive manufacturing process. For example, a system includes a machine to abrade a workpiece with an abrasive article, and a controller to control the application of the abrasive article to the workpiece by the machine to achieve a substantially constant cut rate for the abrasive article. The controller controls one or more process variables in accordance with an open-loop mathematical model that relates the cut rate of the abrasive article to an application force of the abrasive article to achieve controlled material removal. For example, a constant rate of cut can be achieved or a fixed amount of material can be removed while abrading one or more workpiece in accordance with the model.

Abstract: A method comprising determining a polishing profile produced by a polishing tool and manufacturing a process layer with a surface profile prior to polishing operations based upon the determined polishing profile of the polishing tool.

Abstract: A voltage is applied between a cylindrical cutting grindstone 2 that rotates about a vertical axis Y and a cylindrical truing grindstone 6 that rotates about a horizontal axis X. The vertical outer surface 2a and the horizontal lower surface 2b of the cutting grindstone are trued by a plasma discharge. Then without applying the voltage, the cutting grindstone 2 is trued mechanically by the truing grindstone 6, and while the outer periphery and lower surface of the cutting grindstone are dressed electrolytically, the outer periphery and lower surface are made to contact a workpiece 1 and process a micro-V groove. This method makes it possible to produce an immersion grating with a high resolution using hard, brittle materials such as germanium, gallium arsenide and lithium niobate.

Abstract: A polishing mechanism for treating a vehicle bumper incorporating with a multi-shaft robot is disclosed. A polishing wheel is rotationally attached to an end of the robot. A rotational positioning device is provided for positioning the bumper in a position within a working range of the robot. The positioning device includes a pair of racks, a main shaft rotationally arranged between the racks and capable of being positioned to a desired angle, a carrying rack arranged on the main shaft, and a plurality of holding devices arranged on the carrying rack for fixedly holding the bumper in position. A detecting device is provided for checking the worn-out of the polishing wheel for adjusting an optimum distance between the polishing wheel and the bumper. The assembly further includes a piloting gauge attached to the robot for determining an appropriate distance between the polishing wheel and the bumper.

Abstract: A polishing mechanism for treating a vehicle bumper incorporating with a multi-shaft robot is disclosed. A polishing wheel is rotationally attached to an end of the robot. A rotational positioning device is provided for positioning the bumper in a position within a working range of the robot. The positioning device includes a pair of racks, a main shaft rotationally arranged between the racks and capable of being positioned to a desired angle, a carrying rack arranged on the main shaft, and a plurality of holding devices arranged on the carrying rack for fixedly holding the bumper in position. A detecting device is provided for checking the worn-out of the polishing wheel for adjusting an optimum distance between the polishing wheel and the bumper. The assembly further includes a piloting gauge attached to the robot for determining an appropriate distance between the polishing wheel and the bumper.

Abstract: A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof, determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser against the polishing cloth while the turntable and the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.

Abstract: The present invention is directed to semiconductor processing operations, and, more particularly, chemical mechanical polishing operations. The present invention is comprised of a method for qualifying new polishing pads used in a polishing tool without the necessity of polishing test wafers.

Abstract: A gage for a thrufeed centerless grinder for post process gaging of a work piece in which the gage is mounted for movement so as to track along a moving work piece as it is moved along a path of travel from the grinder. The gage is movable in two directions mutually orthogonal to the path of travel of the work piece as it exits the grinder so as to track along the cross-section of the moving work piece enabling the gage to measure the work piece diameter. Movement of the gage is provided for by rotation about two axes wherein the gage motion is an arcuate direction having substantial vector components in the mutual orthogonal directions to the work piece path of travel.

Abstract: A dressing method comprises the steps of rotating a rotary dresser at a high speed for dressing a surface of the grindstone, previous to contact of the rotary dresser with the surface of the grindstone, and detecting a rotational vibration caused by a bearing adapted to support the rotary dresser in rotation, by use of a vibration sensor for detecting a contact vibration having a specific frequency band generated when the rotary dresser in rotation comes into contact with the grindstone. Providing that the rotational vibration has been detected, an output signal from the vibration sensor is judged to be active, allowing the grindstone to be dressed. Prior to the execution of the dressing, failures in the vibration sensor and other deficiencies are detected. After dressing grindstone, a workpiece is ground and a load of a grindstone axle motor is detected to determine if dressing was positively performed.