Abstract: A system for polishing the edge of a mobile device is shown and described. The system includes a robot arm which is configured to grab a mobile device. The robot arm is configured to position the mobile device against at least one polishing wheel of a polishing device using a desired force. The system further includes the use of at least one polishing compound. In some instances, the at least one polishing compound is automatically applied to the at least one polishing wheel. In many of these instances the polishing compound is applied at a specific force and for a specific amount of time, ensuring only a desired amount of compound is applied. The system is contained within a chamber having at least one door configured to allow access to the interior of the chamber.

Abstract: A lapping device for gear helix artifact with equal common normal by rolling method, use the rotary table to accurately control the angle between the lapping surface of whetstone and the axis of the base-circle cylinder to control the helix angle of base-circle about the involute helicoid. Use the whetstone driven component to drive the whetstone to make a high-precision linear motion in the vertical direction to adjust the position of the lapping surface of whetstone. The distance between the two lapping surface of whetstone is precisely adjusted by the gauge block to control the processing length of the three tooth common normal of the gear helix artifact. The invention provides a lapping device for gear helix artifact with equal common normal by rolling method, it conforms to the generation principle of the involute helicoid, and there is no machining principle error.

Abstract: A mid-frequency error-free machining method under a magneto-rheological polishing magic angle-step includes the following steps: measuring a magneto-rheological removal function, and determining a control accuracy of a machine tool; performing two-dimensional Fourier transform on the removal function, performing compensating filtering on a frequency spectrum based on the control accuracy of the machine tool, and analyzing a corresponding step at the lowest point of an amplitude of the two-dimensional frequency spectrum that undergoes filtering in a direction of a magic angle; planning a grid path under the given step on the basis of adjusting a direction of a machining path or a posture of a magneto-rheological polishing wheel to allow an included angle between the polishing wheel and the path kept to be at the magic angle; and finally, controlling the machining of the machine tool.

Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and when the slurry is brought into contact with a surface to be polished to bring the abrasive grains into contact with the surface to be polished, the slurry yields 0.13 or more in X-ray photoelectron spectroscopy as a ratio of the lowest valence among the plurality of valences of the metal.

Abstract: A three-dimensional scanning system, a scanning path planning method, and a three-dimensional scanning method are provided. The three-dimensional scanning system includes a control apparatus configured to determine a planned scanning path for a to-be-measured object based on a historical scanning path of an object type to which the current to-be-measured object belongs and according to a historical pose and a current pose of a rotary table carrying the to-be-measured object. The three-dimensional scanning system further includes a mechanical arm that includes a gripping end for gripping a scanner to drive the scanner to scan the to-be-measured object according to the planned scanning path under control of the control apparatus.

Abstract: The grinding unit includes a slide provided with a movement towards and away from the disc-shaped cutting blade. On the slide, at least a first grinding wheel and a second grinding wheel are arranged so as to act on a first flank and on a second flank of a cutting edge of the disc-shaped cutting blade. The first grinding wheel and the second grinding wheel are respectively carried by a first arm and by a second arm that are mounted so as to rotate around a respective rotation axis with respect to the slide (115) in order to move towards and away from the disc-shaped cutting blade. The first arm and the second arm are associated with angular locking members adapted to lock the first arm and the second arm in a respective operative angular position with respect to the slide.

Abstract: A method wherein a first workpiece (2, 40) is loaded to a spindle (30) of a workpiece processing machine with the first toothed workpiece having a predetermined design and being in a predetermined rotational load position. The first toothed workpiece is stock-divided and a machining position is determined based on the stock-dividing. The first toothed workpiece is rotationally adjusted to the machining position. The teeth (3, 42) of the first toothed workpiece are then machined and the first workpiece is removed from the spindle. A second toothed workpiece is loaded to the spindle of the workpiece processing machine. The second toothed workpiece has the same predetermined design and is in the same predetermined rotational load position as the first toothed workpiece. The second toothed workpiece is rotationally adjusted from the predetermined rotational load position to the machining position by the same adjustment amount as the first toothed workpiece.

Abstract: A method of strengthening a component made of a metallic material. The method includes subjecting the component to a mechanical grinding process incorporating a relative motion between a tool and the component forming a gradient structure on the surface of the component, resulting in increased tensile strength of the component. A method of strengthening a component made of a TWIP steel. The method includes subjecting the component made of TWIP steel to a mechanical grinding process incorporating a relative motion between a tool and the component forming a gradient structure containing a surface nanolaminate layer, a shear band layer, and an inner deformation twinned layer, resulting in increased tensile strength of the component. A component made of a TWIP steel containing a gradient structure with a surface nanolaminate layer, a shear band layer, and a deformation twinned layer.

Abstract: A method of conditioning a polishing pad includes receiving information on a roughness of the polishing pad from a first sensor. The method further includes conditioning the polishing pad using a conditioner. The method further includes detecting the roughness of the polishing pad following the conditioning. The method further includes repeating the conditioning in response to the detected roughness of the polishing pad being outside of a threshold roughness range.

Abstract: A method of conditioning a polishing pad includes positioning a conditioning head to bring a conditioning pad into contact with a polishing surface of a polishing pad. The method further includes generating a first pressure signal using a first pressure sensor based on a force being applied to the polishing surface by the conditioning pad. The method further includes generating a surface condition signal using an optical scanner. The method further includes adjusting the positioning of the conditioning pad in response to at least one of the first pressure signal or the surface condition signal.

Abstract: A gear machining support device supports machining when a tooth of a gear is machined on a workpiece by relatively moving the workpiece and a machining tool while synchronizing rotations of the workpiece and the machining tool around respective center axis lines thereof. The gear machining support device includes: a target modification amount storage unit configured to store target modification amounts of at least two of modification elements of a tooth surface shape of the tooth of the gear, the modification elements including crowning, bias, a helix angle, a pressure angle, and a tooth profile roundness; and a correction amount determination unit configured to determine a correction amount of a machining control element during a machining operation such that the at least two of modification elements approximate the respective target modification amounts stored in the target modification amount storage unit.

Abstract: Provided are a forming method for an arc spring, capable of easily and surely locating bearing faces on both end faces of a semi-finished product in predetermined positions, the bearing faces having lengths within permissible ranges in a circumferential direction. For a semi-finished product prior to curving an axis, it is determined whether circumferential lengths of bearing faces on both end faces are respectively within the permissible ranges based on end face image information of the both end faces imaged in an axial direction prior to the curving, a circumferential rotational position of the semi-finished product capable of respectively locating the bearing faces within the predetermined positions is specified using the end face image information, and the semi-finished product is rotated to the specified rotational position, and the wedge part is sequentially driven into inter-wires of the semi-finished product to deform the semi-finished product.

Abstract: An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning disk against the polishing surface, an in-situ polishing pad thickness monitoring system, and a controller. The controller is configured to store data associating each of a plurality of conditioner disk products with a respective threshold value, receive an input selecting a conditioner disk product from the plurality of conditioner disk products, determine a particular threshold value associated with the selected conditioner disk product, receive a signal from the monitoring system, generate a measure of a pad cut rate from the signal, and generate an alert if the pad cut rate falls beyond the particular threshold value.

Abstract: A multi-wheel grinder tool that is comprised of a support platform, a motor, a grinder portion, a pulley system, a set of four pad drivers, a set of four square bearing housings, a set of four pad holders, a set of pins and a plurality of pads. The multi-wheel grinder tool is used polish edges of counter tops.

Abstract: A method is provided and includes: measuring a surface profile of a polishing pad; obtaining a reference profile of the polishing pad; comparing the surface profile of the polishing pad with the reference profile to generate a difference result; determining a conditioning parameter value according to the difference result; and conditioning the polishing pad using the conditioning parameter value.

Abstract: Provided is an automatic grinding apparatus, comprising a grinding wheel, a support, a feeding device, a control device, a first detector, a second detector, a third detector, and a fourth detector, wherein the control device is further configured to, before processing using the grinding wheel is started, calculate a range in which the grinding wheel and the support are relatively moved on the basis of information on positions of a surface of a workpiece and an outer peripheral end portion and an end surface of the grinding wheel detected by the first detector, the second detector, the third detector, and the fourth detector, to move the grinding wheel or the support by controlling the feeding device, and to automatically start the processing using the grinding wheel.

Abstract: A method for the chip-producing machining of a gear wheel workpiece in a machine uses a cutting tool having at least two geometrically defined cutting edges, which produce material in chip form on the gear wheel workpiece during chip-producing machining. The chip-producing machining is defined by method parameters. The method includes computer-assisted analysis of the production of chips on the multiple cutting edges of the cutting tool and computer-assisted ascertainment of relative forces which will occur on the multiple cutting edges of the cutting tool during the production of chips. The method further includes optimizing the chip-producing machining to prevent the relative forces from exceeding a predetermined limiting value or reaching a limiting range. The optimization step includes providing adapted method parameters by modifying at least one of the method parameters. Chip-producing machining of the gear wheel workpiece is performed using the adapted method parameter(s).

Abstract: Systems and methods for controlling device performance variability during manufacturing of a device on wafers are disclosed. The system includes a process platform, on-board metrology (OBM) tools, and a first server that stores a machine-learning based process control model. The first server combines virtual metrology (VM) data and OBM data to predict a spatial distribution of one or more dimensions of interest on a wafer. The system further comprises an in-line metrology tool, such as SEM, to measure the one or more dimensions of interest on a subset of wafers sampled from each lot. A second server having a machine-learning engine receives from the first server the predicted spatial distribution of the one or more dimensions of interest based on VM and OBM, and also receives SEM metrology data, and updates the process control model periodically (e.g., to account for chamber-to-chamber variability) using machine learning techniques.

Abstract: In a surface grinding method in which a grinding wheel is dressed with a dressing board on a chuck table by advancing the grinding wheel from a dressing start position and a workpiece on the chuck table is ground by advancing the grinding wheel, the dressing start position is calculated by measuring a thickness of the dressing board and a thickness of the grinding wheel, and the grinding start position is calculated by measuring the thickness of the grinding wheel after the dressing of the grinding wheel with the dressing board.

Abstract: A method for conditioning a polishing pad, which is configured to polish a wafer and attached to a rotatable discoid turntable, by using a conditioning head, the method being characterized by: moving the conditioning head in a radial direction of the turntable to perform the conditioning while rotating the polishing pad attached to the turntable by rotation of the turntable; and controlling a rotational speed of the turntable and a moving speed of the conditioning head in the radial direction of the turntable in correspondence with a distance of the conditioning head from a center of the turntable. Consequently, the method for conditioning a polishing pad which enables appropriately conditioning an entire polishing surface of the polishing pad can be provided.

Abstract: A sample preparation saw (10) has a base (130, 146, 14, 47), a housing (12, 76), a saw (10) assembly (30, 58) mounted to the base (130, 146, 14, 47), a dressing assembly (58), a sample clamping assembly (100) mounted to the base (130, 146, 14, 47), and a reservoir assembly (30, 58). The saw (10) assembly (30, 58) includes a blade assembly (30) with a rotating blade (24). The blade assembly (30) is movable along x-, y- and z-axes by at least two drives (27, 36). The dressing assembly (58) is operable to dress the rotating blade (24). The sample clamping assembly (100) includes a rail (102), a sample mount (104) removably positioned on the rail (102) and a saddle (106) operable to hold a sample. The reservoir assembly (30, 58) is operable to recirculate a rinse fluid sprayed on the rotating blade (24), and includes a basin (178) having a pump (180) and a series of weirs (188A, 188).

Abstract: The present invention relates to a CMP apparatus having a polishing pad surface property measuring device for measuring surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer.

Abstract: A method for raising a polishing pad for polishing a silicon wafer, wherein a polishing pad made of foamed urethane resin is attached to a polishing machine, after dressing is performed, dummy polishing is performed, after processing to remove the polishing residues that have built up in the polishing pad by the dummy polishing is then performed, an amount of polishing residues in the polishing pad is measured, and a rise of the polishing pad subjected to the dummy polishing is judged based on the measured amount of polishing residues. As a result, a method for raising a polishing pad can improve the particle level in the polishing pad life early stage.

Abstract: An apparatus for controlling a movement of a grinding wheel of a semiconductor wafer grinding system includes: an interface to obtain a feedback signal including grinding force information indicating a force applied to a semiconductor wafer by the grinding wheel; and a control module to generate a control signal for controlling the movement of the grinding wheel based on the grinding force information. The control module generates the control signal to trigger a forward movement of the grinding wheel according to a desired velocity profile during the grinding, if the grinding force information indicates that a force applied by the grinding wheel is below a force threshold. The control module generates the control signal to trigger a movement of the grinding wheel slower than the desired velocity profile during the grinding, if the grinding force information indicates that the force applied by the grinding wheel is above the force threshold.

Abstract: An apparatus for machining a cylindrical workpiece has a hollow spindle with a driving center on its tip end. The hollow spindle is rotationally journaled within a spindle unit. A tail stock spindle, with a centering center on its tip end, is rotationally supported and axially movable within a centering unit. A shaft-like kelly is non-rotationally and axially movably supported within an inner bore of the spindle. A drive rotates the spindle. Cylinders axially drive the kelly and the tail stock spindle, respectively. The spindle, the tail stock spindle and the cylinders are arranged on the same axial line. The cylindrical workpiece is sandwiched between the driving center and the centering center. An outer circumferential surface of the workpiece is finish machined while rotating the workpiece under a condition where the kelly engages the workpiece within an inner bore of the workpiece.

Abstract: Methods for machining may include: (a) providing a bevel gear on a workpiece spindle of a machine, the gear having a tooth having a head, (b) rotationally driving the gear about an axis of the spindle, (c) providing a first machining tool on a tool spindle of the machine, (d) machining the gear by means of the first machining tool, (e) providing a grinding tool as a second machining tool on the tool spindle or on a further spindle, (f) driving the grinding tool to rotate about a tool axis of the tool spindle, wherein the grinding tool comprises a concave machining region that has a ring shape and is arranged concentrically in relation to the tool axis, and (g) advancing the grinding tool in relation to the gear to bring the machining region into chip-removing operational connection with an edge in a region of the head to produce a chamfer on the edge by grinding.

Abstract: A contactless, and accurate device and methods of use thereof are provided to calibrate and verify the calibration of a robotic arm and associated attachments. The device uses a laser gauge for calibrating and subsequently verifying the calibration of the robotic arm, digitizer, or robotic tools. An optical transmitter, in communication with an optical receiver is fixed nearly perpendicular to a second optical transmitter in communication with a second optical receiver that form two optical micrometers that are offset a small distance, forming a small gap, d, to create a measuring void having two distinct non-intersecting measurement planes. One measurement plane measures the position and size of an object in a first axis direction and the other measurement plane measures the position and size of an object in a second axis direction. The position and size of an object is measured within the measuring void in both axial directions.

Abstract: The present invention relates to a method and system for treatment of a surface of a metallic material component, the method comprising the steps: electro-spark treating the surface of the metallic component by means of an electro-spark electrode, wherein the metallic material is a basically ferritic, perlitic and/or austenitic steel and the method creates a thin layer with martensitic microstructures at the surface of the metallic material component. Serpentines and quartz can be incorporated by an additional step as well as the surface randomly structured by this.

Abstract: A machine tool includes a spindle retaining a tool, a spindle motor, a feed device relatively moving a workpiece and a tool with a feed motor, a spindle motor control unit, and a feed motor control unit. In a method of machining a workpiece with the machine tool, the spindle motor control unit continuously varies a rotational speed of the spindle in a periodic or non-periodic manner with a predetermined amplitude with respect to a target rotational speed. The feed motor control unit continuously varies a relative moving speed between the tool and the workpiece in synchronization with the spindle motor such that a ratio of the rotational speed of the spindle to the moving speed does not become constant at least in a predetermined time zone in which a spindle speed reaches a maximal value and a predetermined time zone in which the spindle speed reaches a minimal value.

Abstract: Methods and processes for forming semiconductor devices with reduced yield loss and failed dies are provided. One method includes, for instance: obtaining a wafer after at least one fabrication processing; taking first r, ?, z measurements of the wafer after the at least one fabrication processing; performing at least one second fabrication processing; taking second r, ?, z measurements of the wafer after the at least one second fabrication processing; and analyzing the second r, ?, z measurements with respect to the first r, ?, z measurements. A process includes, for instance: obtaining a wafer with a substrate and at least one first device positioned on the substrate; taking first measurements in a r, ?, z coordinate system; forming at least one second device over the substrate; taking second measurements in the r, ?, z coordinate system; and analyzing the second measurements with respect to the first measurements.

Abstract: A method of manufacturing a honeycomb structure includes providing a honeycomb body having a first contour extending between opposing first and second ends and chamfering a corner of the first end in a radial and axial direction toward the first contour to form a second contour. The method further includes removing material in an axial direction toward the second face to form a third contour, chamfering a corner of the third contour in a radial and axial direction toward the second end to form an end contour, and removing material in an axial direction toward the first face to form a fourth contour. Removing material to form the fourth contour substantially removes the second contour and the end contour.

Abstract: Disclosed is a method for the electrochemical machining of a workpiece, in which at least one electrode is situated adjacent to a surface to be machined and current pulses are generated in pulsed operation to ablate material from the workpiece. Before and/or at the beginning and/or during the electrochemical ablation, data of the current pulses are registered and analyzed to identify a starting phase or a transient phase comparable to a starting phase and/or to regulate the spacing of the electrode to the surface to be machined and/or the current flow during a starting phase or a transient phase comparable to a starting phase.

Abstract: A deburring device includes a deburring tool for removing burrs from an object, a robot for moving an object or the tool, a force sensor for detecting force acting on the tool, and a visual sensor for detecting a position of a burr portion of the object. According to the deburring device, information regarding shape data of the burr portion and a posture of the tool is obtained beforehand based on three-dimensional data of the object. Based on the shape data and the posture of the tool, a robot program is created. In accordance with an actual burr portion detected by the visual sensor, the robot program is replaced as necessary. During the deburring, the robot is controlled according to the force control by using a detected value from the force sensor.

Abstract: A polishing apparatus having a polishing pad surface property measuring device that is capable of measuring surface properties of a polishing pad in a state where a liquid film exists on the polishing pad is disclosed.

Abstract: A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a matrixical arrangement of protrusions that have a layer of poly crystalline diamond on at least their top surfaces. The protrusions may have varying shapes and elevations and may comprise a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface.

Abstract: A substrate holding apparatus holds a substrate and presses the substrate against a polishing pad. The substrate holding apparatus includes a top ring configured to hold the substrate and press the substrate against the polishing pad, a vertical movement mechanism configured to vertically move the top ring, a torque detector configured to detect a torque of the vertical movement mechanism when the top ring is being lowered or being lifted by the vertical movement mechanism, and a controller in which a torque of the vertical movement mechanism when the top ring is brought into contact with a surface of the polishing pad at the time of a pad search is preset as a torque limit value. The controller calculates a torque correction amount from the torque detected by the torque detector and a preset reference value, and corrects the torque limit value by using the torque correction amount.

Abstract: An apparatus for grinding a substrate includes a stage part configured to support a substrate thereon, a grinding part, a camera part, a replacing part and a control unit. The grinding part includes a grinding wheel configured to grind an edge of the substrate. The camera part is configured to take a picture of the grinding wheel, analyze the picture of the grinding wheel and generate information about the grinding wheel. The replacing part includes a spare grinding wheel and is configured provide the spare grinding wheel to the grinding part or pick up the grinding wheel from the grinding part. The control unit is configured to receive the grinding wheel information from the camera part and offset compensate a position of the grinding wheel on the basis of the grinding wheel information or communicate with the replacing part to replace the grinding wheel on the basis of the grinding wheel information.

Abstract: A device for phasing a threaded grinding stone is phased with respect to a workpiece or a disk dresser prior to the engagement of the threaded grinding stone with the workpiece or with the disk dresser during grinding or dressing. In performing this phasing, it is detected, by means of an AE fluid sensor provided to a grinding stone head which rotatably supports the threaded grinding stone, whether the threaded grinding stone has had contact with the workpiece or the disk dresser. Subsequently, on the basis of the phase of the threaded grinding stone at the time when contact was detected, the threaded grinding stone is positioned in a phase where the aforementioned engagement is feasible.

Abstract: A truing device of a grinding machine includes: a truer that corrects a shape of a grinding wheel; a swivel table that supports the truer such that the truer is swivelable about a swivel axis Ac; detecting means for directly detecting a distance from a truing edge position of the truer, which contacts the grinding wheel during correction of the shape of the grinding wheel, to a swivel center O of the swivel table; and control means for controlling the truing edge position of the truer with respect to the grinding wheel based on the distance L detected by the detecting means to true the grinding wheel.

Abstract: The invention relates to a device and method for using same for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad is selectively controlled to contact the pattern belt, thereby urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: A personal computer has correction coefficients (?) for tooth-profile error correction and correction coefficients (?) for meshing position correction which are set for each number of times a shaving cutter is sharpened, and for each cutter feature of the shaving cutter. Target tooth-profile data (Do), tooth-profile error data (?D) which is the difference between the target tooth-profile data (Do) and measured tooth-profile data (Dm), and the correction coefficient (?) and the correction coefficient (?) captured in correspondence with the number of times sharpening is performed, and the cutter features are applied to an equation Dcc=Do+?·?D+? to find aimed tooth-profile data (Dcc). Shaving-cutter tooth-profile data (ds) is found from the aimed tooth-profile data (Dcc). Thus, the shaving cutter can be sharpened appropriately even when the outer diameter and tooth thickness of the shaving cutter are reduced by sharpening the shaving cutter.

Abstract: A core grinding wheel that has a grinding layer on an outer periphery of a core is used. An ultrasonic wave is output from an ultrasonic sensor to the grinding layer via grinding fluid. An ultrasonic measuring device control unit calculates a thickness of the grinding layer on the basis of a sonic velocity in the grinding layer and an arrival time difference between a reflected wave from a surface of the grinding layer and a reflected wave from a surface of the outer periphery of the core. A grinding process and a truing process are controlled on the basis of an outside diameter of the grinding wheel, which is calculated on the basis of the measured thickness of the grinding layer and an outside diameter of the core.

Abstract: Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.

Abstract: Provided are a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof. The conditioner includes a disk holder, a piston rod, a housing, and a load sensor. The disk holder secures a conditioning disk that finely cuts a surface of the platen pad. The piston rod delivers a normal force to the disk holder. The housing covers at least a portion of the piston rod. The load sensor is installed to receive the normal force that the piston rod delivers to the piston rod and measuring the normal force.

Abstract: Disclosed is a substrate polishing method capable of minimizing a difference of polishing amounts between a center portion and a rim portion of a large scale plate during a plate polishing process.

Abstract: Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life. Additionally, a method may include dressing the chemical mechanical polishing pad with the dresser; vibrating, in a direction substantially parallel to a working surface of the pad, a member selected from the pad, the dresser, a wafer being polished by the pad, or any combination thereof, to minimize a mechanical stress on the pad, dresser, wafer, or combination thereof.

Abstract: In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.

Abstract: A truing device of a grinding machine includes: a truer that corrects a shape of a grinding wheel; a swivel table that supports the truer such that the truer is swivelable about a swivel axis Ac; detecting means for directly detecting a distance from a truing edge position of the truer, which contacts the grinding wheel during correction of the shape of the grinding wheel, to a swivel center O of the swivel table; and control means for controlling the truing edge position of the truer with respect to the grinding wheel based on the distance L detected by the detecting means to true the grinding wheel.

Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.