Tool Wear Compensation Patents (Class 451/21)
  • Patent number: 10259092
    Abstract: An apparatus for machining a cylindrical workpiece has a hollow spindle with a driving center on its tip end. The hollow spindle is rotationally journaled within a spindle unit. A tail stock spindle, with a centering center on its tip end, is rotationally supported and axially movable within a centering unit. A shaft-like kelly is non-rotationally and axially movably supported within an inner bore of the spindle. A drive rotates the spindle. Cylinders axially drive the kelly and the tail stock spindle, respectively. The spindle, the tail stock spindle and the cylinders are arranged on the same axial line. The cylindrical workpiece is sandwiched between the driving center and the centering center. An outer circumferential surface of the workpiece is finish machined while rotating the workpiece under a condition where the kelly engages the workpiece within an inner bore of the workpiece.
    Type: Grant
    Filed: December 3, 2016
    Date of Patent: April 16, 2019
    Assignee: NTN Corporation
    Inventor: Wataru Mizogaki
  • Patent number: 10252360
    Abstract: Methods for machining may include: (a) providing a bevel gear on a workpiece spindle of a machine, the gear having a tooth having a head, (b) rotationally driving the gear about an axis of the spindle, (c) providing a first machining tool on a tool spindle of the machine, (d) machining the gear by means of the first machining tool, (e) providing a grinding tool as a second machining tool on the tool spindle or on a further spindle, (f) driving the grinding tool to rotate about a tool axis of the tool spindle, wherein the grinding tool comprises a concave machining region that has a ring shape and is arranged concentrically in relation to the tool axis, and (g) advancing the grinding tool in relation to the gear to bring the machining region into chip-removing operational connection with an edge in a region of the head to produce a chamfer on the edge by grinding.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: April 9, 2019
    Assignee: KLINGELNBERG AG
    Inventor: Hastings Wyman
  • Patent number: 10247545
    Abstract: A contactless, and accurate device and methods of use thereof are provided to calibrate and verify the calibration of a robotic arm and associated attachments. The device uses a laser gauge for calibrating and subsequently verifying the calibration of the robotic arm, digitizer, or robotic tools. An optical transmitter, in communication with an optical receiver is fixed nearly perpendicular to a second optical transmitter in communication with a second optical receiver that form two optical micrometers that are offset a small distance, forming a small gap, d, to create a measuring void having two distinct non-intersecting measurement planes. One measurement plane measures the position and size of an object in a first axis direction and the other measurement plane measures the position and size of an object in a second axis direction. The position and size of an object is measured within the measuring void in both axial directions.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: April 2, 2019
    Assignee: THINK SURGICAL, INC.
    Inventor: Gibson Elliot
  • Patent number: 10151008
    Abstract: The present invention relates to a method and system for treatment of a surface of a metallic material component, the method comprising the steps: electro-spark treating the surface of the metallic component by means of an electro-spark electrode, wherein the metallic material is a basically ferritic, perlitic and/or austenitic steel and the method creates a thin layer with martensitic microstructures at the surface of the metallic material component. Serpentines and quartz can be incorporated by an additional step as well as the surface randomly structured by this.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: December 11, 2018
    Assignee: LONGEVITY ENGINEERING SA
    Inventors: Valentin Kislov, Stanislav Kislov
  • Patent number: 10137555
    Abstract: A machine tool includes a spindle retaining a tool, a spindle motor, a feed device relatively moving a workpiece and a tool with a feed motor, a spindle motor control unit, and a feed motor control unit. In a method of machining a workpiece with the machine tool, the spindle motor control unit continuously varies a rotational speed of the spindle in a periodic or non-periodic manner with a predetermined amplitude with respect to a target rotational speed. The feed motor control unit continuously varies a relative moving speed between the tool and the workpiece in synchronization with the spindle motor such that a ratio of the rotational speed of the spindle to the moving speed does not become constant at least in a predetermined time zone in which a spindle speed reaches a maximal value and a predetermined time zone in which the spindle speed reaches a minimal value.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: November 27, 2018
    Assignees: THE UNIVERSITY OF TOKYO, DMG Mori Co., Ltd.
    Inventors: Hiroshi Fujimoto, Satoshi Fukagawa, Shinji Ishii, Yuki Terada
  • Patent number: 10103070
    Abstract: Methods and processes for forming semiconductor devices with reduced yield loss and failed dies are provided. One method includes, for instance: obtaining a wafer after at least one fabrication processing; taking first r, ?, z measurements of the wafer after the at least one fabrication processing; performing at least one second fabrication processing; taking second r, ?, z measurements of the wafer after the at least one second fabrication processing; and analyzing the second r, ?, z measurements with respect to the first r, ?, z measurements. A process includes, for instance: obtaining a wafer with a substrate and at least one first device positioned on the substrate; taking first measurements in a r, ?, z coordinate system; forming at least one second device over the substrate; taking second measurements in the r, ?, z coordinate system; and analyzing the second measurements with respect to the first measurements.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: October 16, 2018
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Dongsuk Park, Wangkeun Cho, Wen Hua Cheng
  • Patent number: 10000031
    Abstract: A method of manufacturing a honeycomb structure includes providing a honeycomb body having a first contour extending between opposing first and second ends and chamfering a corner of the first end in a radial and axial direction toward the first contour to form a second contour. The method further includes removing material in an axial direction toward the second face to form a third contour, chamfering a corner of the third contour in a radial and axial direction toward the second end to form an end contour, and removing material in an axial direction toward the first face to form a fourth contour. Removing material to form the fourth contour substantially removes the second contour and the end contour.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: June 19, 2018
    Assignee: Corning Incorporated
    Inventor: Kevin Eugene Elliott
  • Patent number: 9790615
    Abstract: Disclosed is a method for the electrochemical machining of a workpiece, in which at least one electrode is situated adjacent to a surface to be machined and current pulses are generated in pulsed operation to ablate material from the workpiece. Before and/or at the beginning and/or during the electrochemical ablation, data of the current pulses are registered and analyzed to identify a starting phase or a transient phase comparable to a starting phase and/or to regulate the spacing of the electrode to the surface to be machined and/or the current flow during a starting phase or a transient phase comparable to a starting phase.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: October 17, 2017
    Assignee: MTU AERO ENGINES AG
    Inventors: Dirk Ruhlig, Markus Boxhammer
  • Patent number: 9724801
    Abstract: A deburring device includes a deburring tool for removing burrs from an object, a robot for moving an object or the tool, a force sensor for detecting force acting on the tool, and a visual sensor for detecting a position of a burr portion of the object. According to the deburring device, information regarding shape data of the burr portion and a posture of the tool is obtained beforehand based on three-dimensional data of the object. Based on the shape data and the posture of the tool, a robot program is created. In accordance with an actual burr portion detected by the visual sensor, the robot program is replaced as necessary. During the deburring, the robot is controlled according to the force control by using a detected value from the force sensor.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: August 8, 2017
    Assignee: Fanuc Corporation
    Inventor: Yihua Gu
  • Patent number: 9669515
    Abstract: A polishing apparatus having a polishing pad surface property measuring device that is capable of measuring surface properties of a polishing pad in a state where a liquid film exists on the polishing pad is disclosed.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: June 6, 2017
    Assignees: Ebara Corporation, Kyushu Institute of Technology
    Inventors: Hisanori Matsuo, Yoshihiro Mochizuki, Keisuke Suzuki, Takahiro Tajiri, Souichirou Ichioka
  • Patent number: 9616547
    Abstract: A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a matrixical arrangement of protrusions that have a layer of poly crystalline diamond on at least their top surfaces. The protrusions may have varying shapes and elevations and may comprise a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: April 11, 2017
    Assignee: Entegris, Inc.
    Inventors: Joseph Smith, Andrew Galpin, Christopher Wargo
  • Patent number: 9550268
    Abstract: A substrate holding apparatus holds a substrate and presses the substrate against a polishing pad. The substrate holding apparatus includes a top ring configured to hold the substrate and press the substrate against the polishing pad, a vertical movement mechanism configured to vertically move the top ring, a torque detector configured to detect a torque of the vertical movement mechanism when the top ring is being lowered or being lifted by the vertical movement mechanism, and a controller in which a torque of the vertical movement mechanism when the top ring is brought into contact with a surface of the polishing pad at the time of a pad search is preset as a torque limit value. The controller calculates a torque correction amount from the torque detected by the torque detector and a preset reference value, and corrects the torque limit value by using the torque correction amount.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: January 24, 2017
    Assignee: Ebara Corporation
    Inventor: Hiroyuki Shinozaki
  • Patent number: 9199355
    Abstract: An apparatus for grinding a substrate includes a stage part configured to support a substrate thereon, a grinding part, a camera part, a replacing part and a control unit. The grinding part includes a grinding wheel configured to grind an edge of the substrate. The camera part is configured to take a picture of the grinding wheel, analyze the picture of the grinding wheel and generate information about the grinding wheel. The replacing part includes a spare grinding wheel and is configured provide the spare grinding wheel to the grinding part or pick up the grinding wheel from the grinding part. The control unit is configured to receive the grinding wheel information from the camera part and offset compensate a position of the grinding wheel on the basis of the grinding wheel information or communicate with the replacing part to replace the grinding wheel on the basis of the grinding wheel information.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: December 1, 2015
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Inho Lee, Hwankyeong Jeong, Jinwoo Kim, Goangyoung Park, Sanghoon Back, Eehyun An
  • Patent number: 8944885
    Abstract: A device for phasing a threaded grinding stone is phased with respect to a workpiece or a disk dresser prior to the engagement of the threaded grinding stone with the workpiece or with the disk dresser during grinding or dressing. In performing this phasing, it is detected, by means of an AE fluid sensor provided to a grinding stone head which rotatably supports the threaded grinding stone, whether the threaded grinding stone has had contact with the workpiece or the disk dresser. Subsequently, on the basis of the phase of the threaded grinding stone at the time when contact was detected, the threaded grinding stone is positioned in a phase where the aforementioned engagement is feasible.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: February 3, 2015
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Yoshikoto Yanase, Kazuyuki Ishizu, Tomohito Tani
  • Patent number: 8920211
    Abstract: A truing device of a grinding machine includes: a truer that corrects a shape of a grinding wheel; a swivel table that supports the truer such that the truer is swivelable about a swivel axis Ac; detecting means for directly detecting a distance from a truing edge position of the truer, which contacts the grinding wheel during correction of the shape of the grinding wheel, to a swivel center O of the swivel table; and control means for controlling the truing edge position of the truer with respect to the grinding wheel based on the distance L detected by the detecting means to true the grinding wheel.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: December 30, 2014
    Assignee: JTEKT Corporation
    Inventors: Yoshio Wakazono, Tetsuro Furuhata, Hisanobu Kobayashi
  • Publication number: 20140349551
    Abstract: The invention relates to a device and method for using same for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad is selectively controlled to contact the pattern belt, thereby urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.
    Type: Application
    Filed: August 8, 2014
    Publication date: November 27, 2014
    Inventors: ROBERT BRYAN BOGGS, JOSEPH SHANNON MILLER, MICHAEL SCOTT STANDRIDGE, JASON RICHARD SHAW
  • Publication number: 20140342639
    Abstract: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.
    Type: Application
    Filed: May 30, 2014
    Publication date: November 20, 2014
    Applicant: SHAW INDUSTRIES GROUP, INC.
    Inventors: ROBERT BRYAN BOGGS, JOSEPH SHANNON MILLER, MICHAEL SCOTT STANDRIDGE, JASON RICHARD SHAW
  • Patent number: 8790156
    Abstract: A personal computer has correction coefficients (?) for tooth-profile error correction and correction coefficients (?) for meshing position correction which are set for each number of times a shaving cutter is sharpened, and for each cutter feature of the shaving cutter. Target tooth-profile data (Do), tooth-profile error data (?D) which is the difference between the target tooth-profile data (Do) and measured tooth-profile data (Dm), and the correction coefficient (?) and the correction coefficient (?) captured in correspondence with the number of times sharpening is performed, and the cutter features are applied to an equation Dcc=Do+?ยท?D+? to find aimed tooth-profile data (Dcc). Shaving-cutter tooth-profile data (ds) is found from the aimed tooth-profile data (Dcc). Thus, the shaving cutter can be sharpened appropriately even when the outer diameter and tooth thickness of the shaving cutter are reduced by sharpening the shaving cutter.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: July 29, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Yoshikoto Yanase, Ryuzo Hayashi
  • Patent number: 8784156
    Abstract: A core grinding wheel that has a grinding layer on an outer periphery of a core is used. An ultrasonic wave is output from an ultrasonic sensor to the grinding layer via grinding fluid. An ultrasonic measuring device control unit calculates a thickness of the grinding layer on the basis of a sonic velocity in the grinding layer and an arrival time difference between a reflected wave from a surface of the grinding layer and a reflected wave from a surface of the outer periphery of the core. A grinding process and a truing process are controlled on the basis of an outside diameter of the grinding wheel, which is calculated on the basis of the measured thickness of the grinding layer and an outside diameter of the core.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: July 22, 2014
    Assignee: JTEKT Corporation
    Inventors: Makoto Tano, Yoshio Wakazono
  • Patent number: 8758085
    Abstract: Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: June 24, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Sivakumar Dhandapani, Asheesh Jain, Charles C. Garretson, Gregory E. Menk, Stan D. Tsai
  • Patent number: 8662956
    Abstract: Provided are a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof. The conditioner includes a disk holder, a piston rod, a housing, and a load sensor. The disk holder secures a conditioning disk that finely cuts a surface of the platen pad. The piston rod delivers a normal force to the disk holder. The housing covers at least a portion of the piston rod. The load sensor is installed to receive the normal force that the piston rod delivers to the piston rod and measuring the normal force.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: March 4, 2014
    Assignees: Samsung Electronics Co., Ltd., K.C. Tech Co., Ltd.
    Inventors: Keon Sik Seo, Jae Phil Boo, Dong Soo Kim, Ja Cheul Goo, Chan Woon Jeon, Jnn Ho Ban
  • Publication number: 20130149939
    Abstract: Disclosed is a substrate polishing method capable of minimizing a difference of polishing amounts between a center portion and a rim portion of a large scale plate during a plate polishing process.
    Type: Application
    Filed: January 29, 2013
    Publication date: June 13, 2013
    Applicant: LG Chem, Ltd.
    Inventor: LG Chem, Ltd.
  • Publication number: 20130122784
    Abstract: Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life. Additionally, a method may include dressing the chemical mechanical polishing pad with the dresser; vibrating, in a direction substantially parallel to a working surface of the pad, a member selected from the pad, the dresser, a wafer being polished by the pad, or any combination thereof, to minimize a mechanical stress on the pad, dresser, wafer, or combination thereof.
    Type: Application
    Filed: October 30, 2012
    Publication date: May 16, 2013
    Inventor: Chien-Min Sung
  • Patent number: 8408965
    Abstract: In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.
    Type: Grant
    Filed: October 12, 2009
    Date of Patent: April 2, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Doyle E. Bennett, Thomas H. Osterheld
  • Publication number: 20120329368
    Abstract: A truing device of a grinding machine includes: a truer that corrects a shape of a grinding wheel; a swivel table that supports the truer such that the truer is swivelable about a swivel axis Ac; detecting means for directly detecting a distance from a truing edge position of the truer, which contacts the grinding wheel during correction of the shape of the grinding wheel, to a swivel center O of the swivel table; and control means for controlling the truing edge position of the truer with respect to the grinding wheel based on the distance L detected by the detecting means to true the grinding wheel.
    Type: Application
    Filed: June 8, 2012
    Publication date: December 27, 2012
    Applicant: JTEKT Corporation
    Inventors: Yoshio WAKAZONO, Tetsuro FURUHATA, Hisanobu KOBAYASHI
  • Patent number: 8337279
    Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: December 25, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Sivakumar Dhandapani, Stan D. Tsai, Daxin Mao, Sameer Deshpande, Shou-Sung Chang, Gregory E. Menk, Charles C. Garretson, Jason Garcheung Fung, Christopher D. Cocca, Hung Chih Chen
  • Patent number: 8298043
    Abstract: Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: October 30, 2012
    Inventors: Chien-Min Sung, Yang-Liang Pai
  • Patent number: 8277279
    Abstract: A method for processing a work-piece is disclosed herein. The method includes the step of removing material from a work-piece to a predetermined depth with a tool that changes size. The method also includes the step of passing the tool across the work-piece in one or more passes during the removing step such that a cutting depth into the work-piece changes during a particular pass. Each pass is defined by a pass depth. The method also includes the step of maintaining a substantially constant chip thickness during the removing step. The method also includes the step of selectively maximizing one of a feed rate and a pass depth of material removal at the expense of the other during the removing step to minimize the time of the passing step.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: October 2, 2012
    Assignee: Rolls-Royce Corporation
    Inventor: Mark Iain Pilkington
  • Patent number: 8231431
    Abstract: The present invention generally relates to an edge deletion module positioned within an automated solar cell fabrication line. The edge deletion module may include a grinding wheel device for removing material from edge regions of a solar cell device and cleaning the edge regions of the solar cell device after removing the material. The edge deletion module may also include an abrasive element, a portion of which is ground as it is periodically, laterally advanced toward the grinding wheel device. A controller is provided for controlling the operation and function of various facets of the module.
    Type: Grant
    Filed: January 23, 2009
    Date of Patent: July 31, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Dhruv Gajaria, Zhiyong Li, Gopalakrishna B. Prabhu, Yacov Elgar, John Visitacion, Yong Liu, Jeffrey S. Sullivan, Salvador Umotoy, Tai T. Ngo, Michael Marriott, Peter Crundwell, Vinay Shah, Ho Gene Choi, Dennis C. Pierce
  • Patent number: 8231430
    Abstract: The present invention is a wafer production method at least comprising a chamfering step of chamfering a wafer sliced from an ingot using a grindstone for chamfering, and a step of obtaining a product wafer thinner than the chamfered wafer by performing at least one or more than one of the following processes on the chamfered wafer: flattening, etching, and polishing, the method at least comprising a correction step of chamfering a dummy wafer equivalent in thickness to the product wafer, measuring the chamfered dummy wafer for its chamfered shape, and correcting the shape of the grindstone for chamfering based on the measured chamfered shape of the dummy wafer, at least before the chamfering step, thereby chamfering the wafer sliced from the ingot using the grindstone for chamfering having its shape corrected. Thus, it is possible to provide a wafer production method allowing a product wafer with a desired chamfered shape to be obtained in a short period of time.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: July 31, 2012
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventor: Tadahiro Kato
  • Patent number: 8221191
    Abstract: A CMP apparatus is provided with a polishing pad, a film thickness sensor for measuring a thickness of a film being polished on a wafer via the polishing pad, a polishing pad thickness measuring unit for measuring the thickness of the polishing pad, a dresser for dressing the polishing pad, and a polishing control unit for switching polishing conditions in response to a fact that an output value from the film thickness sensor has exceeded a threshold value. The polishing control unit has a memory unit for storing a threshold value corresponding to the thickness of the polishing pad after dressing when the polishing pad is dressed.
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: July 17, 2012
    Assignee: Elpida Memory, Inc.
    Inventor: Toru Matsuzaki
  • Patent number: 8136379
    Abstract: This invention provides an apparatus for manufacturing a helical part by feeding a wire W toward a pointing tool 21 and pushing the wire W against the pointing tool 21 to forcibly wind the wire. The apparatus comprises: a feed roller 12 for feeding the wire W toward the pointing tool 21; a wire feeding motor 111 for rotatably driving the feed roller; a grindstone tool unit 30, which holds a discoid grindstone 31 rotatable and movable, for cutting the wire W by the rotating discoid-grindstone 31; and a CPU 100 for controlling the wire feeding motor 111 and grindstone tool unit 30 to move the discoid grindstone 31 on a plane which is substantially perpendicular to a coil growing direction of the helical part and to cut the wire W in a direction which is substantially perpendicular to the coil growing direction.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: March 20, 2012
    Assignee: Kabushiki Kaisha Itaya Seisaku Sho
    Inventor: Ichiro Itaya
  • Patent number: 8123593
    Abstract: A lapping or polishing machine includes a material having a first finishing surface to process a surface of a work item, a measuring tool to measure a contour of the first finishing surface, and a conditioning tool having a second finishing surface to process the first finishing surface to reduce a difference between the measured contour and a desired contour of the first finishing surface.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: February 28, 2012
    Assignee: Zygo Corporation
    Inventor: Douglas Martin Hoon
  • Patent number: 8096853
    Abstract: The method of the invention provides a capability for accurately and uniformly determining the sizes of bores of workpieces, both pre- and post-process, to improve process control, particularly compensation for tool or stone wear and other factors, and process data collection. The present method makes all required bore measurements, including those in both the workpiece bore and the calibration ring or sample workpiece bore, with the honing tool, under controlled static, non-honing conditions, including expanding the tool in the bores in a predetermined manner, such as at a predetermined rate. The method of the invention has utility for honing multiple workpieces to a finished size with a single tool, and also for multiple spindle applications.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: January 17, 2012
    Assignee: Sunnen Products Company
    Inventors: David M. Moehn, Daniel R. Cloutier, Timothy P. Hoth
  • Patent number: 8070556
    Abstract: A method of grinding a ferrous roll may include: rotating a grinding wheel on a machine spindle to form a rotating grinding wheel; rotating a ferrous roll to form a rotating roll surface; bringing the rotating grinding wheel into contact with the rotating roll surface; traversing the rotating grinding wheel across an axial roll length of the rotating roll surface; and grinding the roll surface while varying at least one or both of a grinding wheel rotational speed and a said mill roll rotational speed at an amplitude of +/?1 to 40% with a period of 1 to 30 seconds.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: December 6, 2011
    Assignee: Diamond Innovations, Inc.
    Inventors: Kris V. Kumar, Biju Varghese
  • Patent number: 8065031
    Abstract: Change in a torque waveform is monitored while removing continuously-varied periodic noise in real time, and the change in the torque waveform caused purely by the wafer state is detected by separating noise components while removing the noise not caused by the wafer state such as drift noise caused by dressing conditions and the polishing pad state, thereby reliably detecting a polishing end point with high precision when polishing is finished. A polishing end point detection device utilizing torque change for analyzing periodic components in data by subjecting Fourier transformation to the measured data, and calculating moving average processing time for removing periodic noise components based on the analyzed periodic components, and correcting the waveform by performing averaging process based on the moving average processing time calculated in real time for the data, and detecting the polishing end point of a predetermined film based on a change in the corrected torque waveform.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: November 22, 2011
    Assignee: Tokyo Seimitsu Co., Ltd
    Inventors: Takashi Fujita, Satoshi Hasegawa, Shinji Osada, Soushi Yamada, Takuji Atarashi
  • Patent number: 8043870
    Abstract: In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: October 25, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Antoine P. Manens, Wei-Yung Hsu, Hichem M'Saad
  • Patent number: 8025555
    Abstract: A method and apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilizes a vacuum capability to pull waste material out of the polishing pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port. The apparatus also includes a force adjustment system for providing measurement and control of the force applied by the conditioning disk to the polishing pad.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: September 27, 2011
    Assignee: TBW Industries Inc.
    Inventor: Stephen J. Benner
  • Patent number: 7997955
    Abstract: A method for the circumferential interior treatment of pipe elbows, including a step of positioning a working member within a pipe elbow and moving the working member along a portion of a length of the pipe elbow between selected working positions, while concurrently manipulating the pitch and rotational positioning of the pipe elbow to maintain a concentric rotation of the pipe elbow about the working member.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: August 16, 2011
    Assignee: Bradken Canada Ltd
    Inventor: Fred Harmat
  • Patent number: 7988533
    Abstract: A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a central passage to an outer edge. A reduced profile for the main radial flutes is provided adjacent to the outer edge. A plurality of secondary radial flutes is provided extending from the outer edge, but not in communication with either the central passage or the main radial flutes.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: August 2, 2011
    Assignee: TCG International Inc.
    Inventors: Jonathan P. Thomas, Keith A. Beveridge, Chad James Olson, David Osland
  • Patent number: 7927186
    Abstract: In the production of a glass substrate for magnetic disk, the present invention provides a method for producing a glass substrate for magnetic disk including a step of polishing a main surface of a circular glass substrate using a polishing pad made of a foamed resin while feeding a polishing liquid containing an abrasive, in which a polishing pad made of a foamed resin having an international rubber hardness of 45 IRHD or less, the hardness being measured at a dry state before contact with a slurry by the M method defined in JIS K6253, is used as a starting polishing pad and polishing is started after a polishing surface of the starting polishing pad is subjected to a dressing treatment to adjust the pad so that an open pore area ratio is 8% or more and an average circle equivalent diameter of open pores is 10 ?m or more, in order to suppress an increase in roll-off in the polishing step of the main surface of the circular glass plate.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: April 19, 2011
    Assignee: Asahi Glass Company, Limited
    Inventors: Mizuho Ishida, Kara Yoshida
  • Patent number: 7901267
    Abstract: A method and apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilizes a vacuum capability to pull waste material out of the polishing pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port. The apparatus also includes a force adjustment system for providing measurement and control of the force applied by the conditioning disk to the polishing pad.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: March 8, 2011
    Assignee: TBW Industries, Inc.
    Inventor: Stephen J. Benner
  • Patent number: 7846006
    Abstract: A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: December 7, 2010
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
  • Patent number: 7846007
    Abstract: A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: December 7, 2010
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
  • Patent number: 7828626
    Abstract: Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface.
    Type: Grant
    Filed: October 9, 2008
    Date of Patent: November 9, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Paul D. Butterfield, Sen-Hou Ko
  • Patent number: 7749050
    Abstract: Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: July 6, 2010
    Inventors: Chien-Min Sung, Yang-Liang Pai
  • Patent number: 7747336
    Abstract: One element is taken from a machined shape. When the element is a straight line element, whether or not the distance D between the start point and the end point of the element in a direction orthogonal to the axis of rotation of the workpiece is equal to or greater than a preset value Ds is determined. In addition, whether or not an angle A that the straight line element makes with the Z-axis is equal to or greater than a preset angle Aa is determined. When the distance D is equal to or greater than the preset value Ds and the angle A is equal to or greater than the preset angle Aa, a program is created with the cutting direction reversed from the profile direction.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: June 29, 2010
    Assignee: FANUC Ltd.
    Inventors: Hideaki Maeda, Shinya Nakamura, Akira Horiuchi
  • Patent number: 7722437
    Abstract: A polishing pad used in a CMP step in the manufacture of a semiconductor integrated circuit device is relatively expensive; thus, it is necessary to avoid a wasteful exchange of the pad. Accordingly, it is important to measure the abrasion amount of this pad precisely. However, in ordinary measurement thereof through light, the presence of a slurry hinders the measurement. In measurement thereof with a contact type sensor, a problem that pollutants elute out is caused. In a CMP step in the invention, the height position of a dresser is measured while the dresser operates, thereby detecting the abrasion amount or the thickness of a polishing pad indirectly. In this way, the time for exchanging the polishing pad is made appropriate.
    Type: Grant
    Filed: May 8, 2008
    Date of Patent: May 25, 2010
    Assignee: Renesas Technology Corp.
    Inventor: Yoshinori Ito
  • Patent number: 7666064
    Abstract: Semiconductor wafers are processed so as to remove material on one or both sides by means of at least one grinding tool, with coolant supplied into a contact region between the semiconductor wafer and the at least one grinding tool, characterized in that the coolant flow rate is set as a function of a grinding tooth height of the at least one grinding tool and this coolant flow rate is reduced as the grinding tooth height decreases.
    Type: Grant
    Filed: June 17, 2008
    Date of Patent: February 23, 2010
    Assignee: Siltronic AG
    Inventors: Joachim Junge, Robert Weiss
  • Patent number: 7575503
    Abstract: A method and apparatus for conditioning polishing pads that utilize an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilize a vacuum capability to pull waste material out of the conditioning pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port, the apparatus may also include self-contained flushing means and a piezo-electric device for vibrating the pad conditioning apparatus.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: August 18, 2009
    Assignee: TBW Industries, Inc.
    Inventor: Stephen J. Benner