Abstract: A grinder selection device includes: an input unit that inputs a grinding condition for a workpiece as a grinding target of grinding machining including at least the geometry of the workpiece and vibration data indicating vibration of a grinding machine, and grinder information about one or more grinders as grinder candidates to be used for the grinding machining; a learned model acquired through supervised learning using training data containing input data and label data, the input data containing an arbitrary grinding condition for a workpiece as a grinding target of grinding machining by an arbitrary grinding machine including at least the geometry of the workpiece and vibration data indicating vibration of the grinding machine, and grinder information about an arbitrary grinder, the label data being data indicating the adequacy or inadequacy of a combination between the grinding condition and the grinder information about the grinder; and a judgment unit.

Abstract: A scroll fluid machine includes a main body and a motor unit. The main body unit configured to compress a fluid. The motor unit configured to drive the main body unit. The main body unit and the motor unit are connected via the eccentric portion. The main body casing and the motor cover are fastened with a fastening member. The motor unit includes a main bearing that is fixed to an inside of the motor cover by a flange. The main bearing is configured to support the shaft and is located between the flange and an end bracket on an opposite side of the main body unit with respect to the flange.

Abstract: The present invention relates to a chamfered silicon carbide substrate which is essentially monocrystalline, and to a corresponding method of chamfering a silicon carbide substrate. The silicon carbide substrate (100) comprises a main surface (102) and a circumferential end face surface (114) which is essentially perpendicular to the main surface (102), and a chamfered peripheral region (110), wherein a first bevel surface (106) of the chamfered peripheral region (110) includes a first bevel angle (a1) with said main surface (102), and wherein a second bevel surface (108) of the chamfered peripheral region (110) includes a second bevel angle (a2) with said end face surface (114), wherein, in more than 75% of the peripheral region, said first bevel angle (a1) has a value in a range between 20° and 50°, and said second bevel angle (a2) has a value in a range between 45° and 75°.

Abstract: In a cam grinding method, a common surface of a first cam and a second cam is acquired in a common surface setting step. In a first common surface grinding step performed after a first cam grinding step, traverse movement of a grinding wheel is performed such that the grinding wheel is aligned with an area from the first cam to the second cam while the first cam and the second cam are rotated, and the common surface is ground. In a second common surface grinding step performed after a second cam grinding step, traverse movement of the grinding wheel is performed such that the grinding wheel is aligned with an area from the second cam to the first cam while the first cam and the second cam are rotated, and the common surface is ground.

Abstract: A cam grinding method using a cam grinding device includes: an intermediate-cam lift-data generating step of, based on first lift data of a first cam and second lift data of a second cam, generating imaginary intermediate cam lift data of a spline curve that contains profiles of both cams; a first cam grinding step of grinding the first cam; a second cam grinding step of grinding the second cam; and an intermediate-cam grinding step of removing an unground portion generated at a boundary portion between the first cam and the second cam by plunge grinding or spark-out grinding on the basis of the intermediate-cam lift data after the second cam grinding step.

Abstract: A chamfering apparatus including chamfering part for removing notch, cleaning part for cleaning and drying wafer, and chamfered-shape measuring part for measuring chamfered shape, each of chamfering and cleaning part, and chamfered-shape measuring part including rotatable stage for holding wafer and control unit for controlling rotational positions of rotatable stage and wafer, rotatable stage having reference position serving as reference of rotational positions at beginning of rotation, wherein wafer is held wherein rotational position of wafer at beginning of rotation relative to reference position is at same rotational position on all rotatable stages, and control unit to control rotational position of wafer to be at predetermined position at beginning and end of rotation.

Abstract: A finishing device includes a finishing belt, a finishing belt holding device, a first drive configured to rotationally drive a workpiece about a workpiece axis, and a second drive configured to oscillate the workpiece and the finishing belt relative to another along the workpiece axis. The finishing belt holding device has a holding section configured to hold a portion of the finishing belt. The portion has an active area configured to finish a circumferential workpiece surface. The portion extends in a plane which is vertical when referring to the direction of gravity and extends in a horizontal direction when referring to the direction of gravity and when viewing in the running direction of the finishing belt. The finishing device includes a workpiece holding device defining a workpiece holding axis which is vertical when referring to the direction of gravity.

Abstract: A glass-plate working apparatus includes a glass-plate supporting portion 20a of a feed conveyor 7, a glass-plate supporting portion 20b of a cutting section 2, a glass-plate supporting portion 20c of a bend-breaking section 4, a glass-plate supporting portion 20d of a grinding section 3, and a glass-plate supporting portion 20e of a discharge conveyor 8; a cutting head 9, a bend-breaking device 66, and a grinding head 10 for processing glass plates 5 which are respectively supported by the supporting portions 20b, 20c, and 20d; and a transporting device 89 for transporting the glass plate 5 on the supporting portion 20a onto the supporting portion 20b, the glass plate 5 on the supporting portion 20b onto the supporting portion 20c, the glass plate 5 on the supporting portion 20c onto the supporting portion 20d, and the glass plate 5 on the supporting portion 20d onto the supporting portion 20e, respectively.

Abstract: A method of grinding an ingot for use in manufacturing a semiconductor or solar wafer is disclosed. The method includes providing an ingot including four flat sides and four rounded corner portions, each corner portion extending between an adjacent pair of the flat sides, and grinding a plurality of planar facets on each corner portion, each planar facet of the corner portion joined to an adjacent facet at a juncture and oriented such that each corner portion has a substantially arcuate shape. A wafer and ingot are also disclosed.

Abstract: A skate blade sharpening system includes a clamp for retaining a skate blade in a sharpening position during a sharpening operation, with a centerline of the sharpening position having a first predetermined location relative to a first visual reference feature. A grinding wheel contacts the skate blade during sharpening and is mounted for rotation on a motor arm. A centerline of the grinding wheel has a second predetermined location relative to a second visual reference feature carried by the motor arm. An adjustment mechanism is used to move the motor arm transversely during an alignment operation to vary relative position between the grinding wheel and the sharpening position across a range that includes an aligned position in which the centerline of the grinding wheel is aligned with the centerline of the sharpening position. The aligned position is indicated by alignment of the first visual reference with the second visual reference feature.

Abstract: A system and method for evaluating characteristics of an S-cam are provided. The inventive method includes the step of obtaining angle values and displacement values indicative of an angle of rotation of the S-cam and displacement of a cam follower caused by rotation of a lobe of the S-cam. The method further includes the step of determining a profile for the lobe of the S-cam responsive to the angle values and the displacement values. The method further includes the steps of computing a deviation of the profile from a desired profile for the lobe of the S-cam and determining a rate of change in the deviation of the profile. In addition, the system and method may evaluate characteristics such as the concentricity of the S-cam and power transfer characteristics of the S-cam.

Abstract: An apparatus for grinding edges of rigid materials including a support member, an upper grinding element rotatably mounted relative to the support member, a bearing affixed to the upper grinding element, a lower grinding element rotatably mounted relative to the support member, and an insert element removably affixed around the bearing and interposed between the support member and one of the upper and lower grinding elements. The insert element is of an annular configuration and has an outer diameter less than an outermost diameter of the grinding elements. The insert element is interchangeable with various other insert elements.

Abstract: An apparatus and method for honing, sharpening or grinding a curved peripheral cutting surface of a slicer blade are provided. Included is the use of one of a set of interchangeable cams that generally follows the curved shape of the blade cutting surface, whether same has a constant radius or varying radii. In order to minimize downtime and sanitation operations, the honing is accomplished off-line of the slicer equipment. Preferably, the slicer blade remains perfectly flat during honing, and the movement of one or more honing or grinding wheels is closely controlled so as to provide honed or ground cutting edges which are of substantially uniform width throughout their respective peripheries. Honing is accomplished in accordance with objectively measured sharpness standards by which superior sharpness levels are attained.

Abstract: A method and apparatus is provided for chamfering a notch of a wafer by controlling the operation of a disc shaped rotational grandstone by means of a profiling control mechanism, including a holding and rotation mechanism for rotating the wafer around the central axis normal to a principal surface of the wafer within a predetermined range of angle; a reference plate having a diameter and a thickness the same as a similar enlargement of the wafer and a chamfering guide surface the same as a similar enlargement of a surface to be formed on the notch by the chamfering at the same enlargement factor as the reference plate; and a disc having a predetermined diameter and a predetermined thickness.