Hydraulically Driven Patents (Class 451/24)
  • Publication number: 20140342640
    Abstract: A polishing apparatus including a membrane including a pressure chamber and being configured to hold a wafer; a polishing portion including a polish pad contacting a polish surface of the wafer when polishing the wafer; a monitoring portion monitoring a state of inflation of the pressure chamber; and a controller controlling polishing of the wafer by the polishing portion based on a result of monitoring by the monitoring portion.
    Type: Application
    Filed: December 17, 2013
    Publication date: November 20, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Dai Fukushima, Jun Takayasu, Takashi Watanabe
  • Publication number: 20140220864
    Abstract: An object of the present invention is to improve the capability of lifting a substrate with the polishing performance of the substrate maintained. A polishing apparatus 100 includes a polishing table 110 to which a polishing pad 108 for polishing a substrate 102 is attached, a liquid feeding section configured to feed a liquid 109 to a polishing surface of the polishing pad 108, a top ring 116 configured to suck and convey the substrate 102 from the polishing surface, the substrate 102 being disposed on the polishing surface via the liquid 109 fed by the liquid feeding section, and a control section configured to inject a fluid (N2) into an internal area 109a of the liquid 109 interposed between the substrate 102 and the polishing pad 108.
    Type: Application
    Filed: February 5, 2014
    Publication date: August 7, 2014
    Applicant: EBARA CORPORATION
    Inventor: Toshikazu KAWAHARA
  • Publication number: 20110065361
    Abstract: A device for finish-machining of the optically effective surfaces of, in particular, spectacle lenses has a spindle shaft, which has a tool mount section and which is mounted in a spindle housing to be rotatable about a workpiece rotational axis (A). An electric rotary drive has a rotor and a stator by which the spindle shaft operatively connected with the rotor is drivable to rotate about the tool rotational axis. An adjusting device axially displaces the tool mount section with respect to the spindle housing in the direction of the tool rotational axis (linear movement Z). The rotor and the stator are arranged coaxially with the spindle shaft, wherein at least the rotor together with the spindle shaft is axially displaceable with respect to the spindle housing in the direction of the tool rotational axis by the adjusting device.
    Type: Application
    Filed: September 14, 2010
    Publication date: March 17, 2011
    Applicant: Satisloh AG
    Inventors: Bernd Schüssler, Udo Fiedler, Holger Schäfer, Steffen Wallendorf
  • Patent number: 7125477
    Abstract: Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: October 24, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Paul Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine Manens, Rashid Mavliev, Stan Tsai
  • Patent number: 7074111
    Abstract: To prepare a surface with a surface preparation device, an apparatus including a mount, a platform, and a suspension system is utilized. The mount supports and positions the surface preparation device. The platform moves the apparatus. The suspension system is disposed between the mount and the platform and controls an amount of force pressing the mount towards the surface. The suspension system and mount are operable to position the surface preparation device in contact with the surface.
    Type: Grant
    Filed: September 23, 2003
    Date of Patent: July 11, 2006
    Assignee: The Boeing Company
    Inventors: Paul J. Cecil, Roger G. Rae, Daniel R. Healy, Elton R. Rice, Edward O. Jorgenson, Brian S. Hughey
  • Patent number: 6976906
    Abstract: A chemical mechanical planarization (CMP) system is provided. The system includes a polishing surface and a platen disposed along an underside of the polishing surface. A retaining ring surrounds the platen. The retaining ring includes a lower annular sleeve and an upper annular sleeve moveably disposed over the lower annular sleeve. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.
    Type: Grant
    Filed: October 7, 2003
    Date of Patent: December 20, 2005
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, David Wei, Yehiel Gotkis
  • Patent number: 6974362
    Abstract: A balancing method and apparatus is used for dynamically balancing an out of balance condition in a rotating body caused by resistance forces acting tangentially to the body. A device having a rotatable component and automatic or dynamic balancing includes a housing, a shaft rotatably mounted in the housing, the shaft supporting the component near one end of the shaft, at least one counterweight fixedly mounted on the shaft and at least one automatically adjusting balancer mounted on the shaft. The automatically adjusting balancer includes one or more compensating masses contained to move about a path relative to the shaft to compensate for variable imbalanced forces acting on the component.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: December 13, 2005
    Assignee: SKF Autobalance Systems AB
    Inventors: Hans Lindell, Joakim Jönsson, Volker Wendt, Paul Wierzba
  • Patent number: 6964599
    Abstract: Disclosed herein is a holding device, which includes a volumetrically controllable material and a volume controller in operable communication with that material. The volume controller is configured to subject the material to a condition that causes a physical change in volume of the material without a change in mass of the material. The volumetric change causes the holding power. Further disclosed herein is a method for creating a lower than atmospheric pressure between a volumetrically controllable fixed mass material and a separate object. The method includes introducing to the material an increase condition calculated to volumetrically increase the material without changing the mass of the material. The separate object is then brought to contact the material following which a decrease condition calculated to volumetrically decrease the material without changing the mass of the material is introduced to the material.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: November 15, 2005
    Assignee: Gerber Coburn Optical, Inc.
    Inventors: Alex Incera, Jeff Murray, Robert Shanbaum
  • Patent number: 6949009
    Abstract: A kiln tire grinder for grinding an out-of-round kiln tire comprising a grinding belt head assembly having a rotatable grinding belt and an x-y positioning table for positioning the rotating grinding belt assembly against a kiln tire. The rotating grinding belt assembly includes a drive assembly for rotating the grinding belt and a frame assembly for urging the grinding belt against the out-of-round kiln tire. The operator adjusts the rotating grinding belt head assembly against the out-of-round tire and then engages a drive motor which rotates the grinding belt. The rotating grinding belt is then urged against the kiln tire with a pressure that is adjustably controlled.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: September 27, 2005
    Inventors: Martin A. Gardzinski, Donato L. Ricci
  • Patent number: 6926589
    Abstract: The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: August 9, 2005
    Assignee: ASM Nutool, Inc.
    Inventors: Douglas W. Young, Brett E. McGrath, Yuchun Wang
  • Patent number: 6905394
    Abstract: An apparatus and a method for polishing a row bar including magnetic head sliders. A lapping surface plate is rotatable, and a housing is movable above the lapping surface plate. A jig is secured to the housing for holding the row bar. The jig is formed by an elongated rigid member having a plurality of holes and an elongated elastic member fixed to the rigid member. An air cylinder presses the whole row bar, and a pressing devices individually presses portions of the elastic member corresponding to magnetic head sliders of the row bar through the holes of the rigid member. A portion of the elastic member is deformed to press a portion of the row bar in response to a change in the measured resistance of ELG resistance elements in the row bar.
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: June 14, 2005
    Assignee: Fujitsu Limited
    Inventors: Koji Sudo, Yoshiaki Yanagida
  • Patent number: 6852002
    Abstract: This invention relates to apparatus and methods for z-axis control and collision detection and recovery for waterjet and abrasive-jet cutting systems. In one embodiment, an apparatus includes a linear rail, a slide member coupleable to a cutting head and slideably coupled to the linear rail, at least one actuator having a first end coupled to the slide member and a second end fixed with respect to the linear rail, a position sensor, and a controller. The actuator provides an adjustable support force that supports the weight of the cutting head, allowing the cutting head to be controllably positioned at a desired height above the workpiece. The actuator may include a pneumatic cylinder, or alternately, a linear motor.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: February 8, 2005
    Assignee: Flow International Corporation
    Inventors: Jonathan M. Stewart, Thomas Pesek, Volker Kern, Chien Chou Wu, Daniel Chin, Felice M. Sciulli
  • Patent number: 6712670
    Abstract: An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: March 30, 2004
    Assignee: Lam Research Corporation
    Inventors: Anthony de la Llera, Xuyen Pham, Andrew Siu, Tuan A. Nguyen, Tony Luong
  • Patent number: 6709315
    Abstract: An automatic feed system 10 is provided for advancing a hydraulically powered work head into a workpiece being cut. A hydraulic fluid powered work head motor 40 drives a diamond drill cutting tool 46 or other cutting tool to cut the workpiece, such as concrete G. Hydraulic pressure in an inlet line 42 feeding hydraulic fluid to the work head motor 40 is monitored to detect when high torque and hence high wearing forces are experienced by the diamond cutting tool 46. A feed motor 30 or other advance is provided to feed the diamond cutting tool 46 into the workpiece. A valve 50 is provided which is pressure sensitive and controls the feed rate of the feed motor 30 in response to pressure in the inlet line 42 delivering hydraulic fluid to the work head motor 40. In this way, a feed rate of the bit 46 or other cutting tool into the workpiece is reduced when high stress conditions exist on the cutting surface of the diamond drill cutting tool 46 or other cutting tool.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: March 23, 2004
    Inventor: John D. Ward
  • Patent number: 6685536
    Abstract: The invention relates to a method for grinding convex running surfaces and exact outside diameters on undulated workpieces. In a clamping, a first convex running surface is ground on a discoid partial section of an undulated workpiece during a first grinding operation while using a first grinding wheel that comprises at least one concave lateral surface. A second grinding wheel is used to grind a desired outside diameter on the discoid partial section as well as on other partial sections of the undulated workpiece during a second grinding operation.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: February 3, 2004
    Assignee: Erwin Junker Maschinenfabrik GmbH
    Inventor: Erwin Junker
  • Patent number: 6669533
    Abstract: The grinding machine comprises a grinding head with a rotary abrasive tool, carried by a chassis equipped, at its ends, with rollers for running and guiding on the rail that is to be ground. A balancing assembly, resting on the other rail of the track, is mounted to pivot on the chassis, also provided with an orientable maneuvering arm. To rotate the grinding tool, an internal combustion engine is fixed to a support articulated to the balancing assembly, the horizontal output shaft of the engine being connected by a transmission assembly to the grinding head. The machine makes it possible to grind the profile of the head of the rail through an angle of 180° while at the same time avoiding excessive inclination of the engine.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: December 30, 2003
    Assignee: Societe Turripinoise de Mecanique SA
    Inventor: Maurice Huboud-Peron
  • Publication number: 20030236056
    Abstract: An apparatus for polishing a wafer includes a polishing station having a platen on which a polishing pad is installed, a polishing head having a membrane that contacts a surface of the wafer, the membrane securing the wafer and pressuring the wafer against the polishing pad, wherein the polishing station includes a transfer stage for loading the wafer on or unloading the wafer from the polishing head, and wherein the transfer stage includes a pedestal on which the wafer is placed and a fluid supply part for supplying a fluid into a boundary region between the wafer and the membrane to reduce a surface tension between the wafer and the membrane. Preferably, the apparatus further includes a stopper for preventing the wafer placed on the pedestal from being lifted up along with the membrane when the wafer is unloaded from the polishing head onto the pedestal.
    Type: Application
    Filed: June 9, 2003
    Publication date: December 25, 2003
    Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Hyun-Sung Lee
  • Patent number: 6656024
    Abstract: A retaining ring is provided. The retaining ring includes a lower annular sleeve having a base. The base has an inner sidewall and an outer sidewall extending therefrom. The lower annular sleeve has at least one hole defined therein. An upper annular sleeve is moveably disposed over the lower annular sleeve. The upper annular sleeve has a top, that has at least one hole defined therein. The top has an inner sidewall and an outer sidewall extending therefrom. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: December 2, 2003
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, David Wei, Yehiel Gotkis
  • Patent number: 6648731
    Abstract: A polishing pad conditioning apparatus in a chemical mechanical polishing apparatus, wherein the conditioning apparatus includes a conditioning plate which maintains a predetermined relative velocity with respect to the polishing pad, extends from a center region near a rotation center of the polishing pad to a peripheral region near an edge of the polishing pad, and has a polishing portion with polishing particles embedded into its bottom surface, a force generating portion for applying a force to the conditioning plate so that the conditioning plate presses against the polishing pad with pressure that varies according to position on the polishing pad, and conditions the polishing pad by relative linear velocity and pressure with respect to the polishing pad, and a supporting portion for supporting the force generating portion. Therefore, fast and uniform conditioning of a polishing pad can be achieved.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: November 18, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Sang-hoon Shin
  • Patent number: 6638138
    Abstract: An arrangement of grinding modules in a track grinder wherein a radial mismatch in narrow track bend radii can be considered in an exact manner without occurrence of constraining forces, enabling reprofiling to be reproduced in a simple manner. The arrangement provides a grinding tool with five degrees of freedom. Each grinding module is accommodated in an at least approximately vertical manner with a frame and in an at least horizontally manner on the frame with a holder. A housing in the holder is pivotably arranged around a shaft that is at least approximately parallel to the track to be ground. The grinding tool in the housing can be adjusted in a rectangular manner in relation to the track to be ground.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: October 28, 2003
    Inventors: Michael Luddeneit, Wilfried Scherf
  • Patent number: 6612904
    Abstract: A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: September 2, 2003
    Assignee: Lam Research Corporation
    Inventors: Robert G. Boehm, John M. Boyd
  • Patent number: 6607426
    Abstract: A dresser unit including a dresser 20 and a driving shaft 21 for rotationally driving the dresser 20 is operatively mounted to a dresser supporting mechanism so that the dresser unit can be moved up and down freely with respect to the dresser supporting mechanism, wherein a piston-cylinder mechanism 40 is installed between the dresser unit and the dresser supporting mechanism for pushing up the dresser unit by an upward force of fluid pressure, and a fluid at a predetermined pressure level is supplied to the piston-cylinder mechanism 40 from a compressed air source 67 via a pressure control unit 65, the compression force applied to a turntable 10 by the dresser is precisely controlled and adjusted based on a balance between the own weight of the dresser unit and the upward force exerted by the piston-cylinder mechanism 40.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: August 19, 2003
    Assignee: Ebara Corporation
    Inventor: Hiroo Suzuki
  • Publication number: 20030139115
    Abstract: An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.
    Type: Application
    Filed: December 27, 2001
    Publication date: July 24, 2003
    Applicant: LAM RESEARCH CORPORATION
    Inventors: Anthony de la Llera, Xuyen Pham, Andrew Siu, Tuan A. Nguyen, Tony Luong
  • Patent number: 6572446
    Abstract: A pad conditioning assembly includes a conditioner head with an end effector movable into contact with a polishing pad,a plurality of downwardly-projecting movable conditioning elements disposed at a bottom of the end effector; and a compliant backing member disposed above and adjacent the conditioning elements, wherein forces applied by the compliant backing member are transferred to the movable conditioning elements to move the conditioning elements. In one aspect, a pressurization circuit applies a pressure from a pressure source to the compliant backing member to flex the compliant backing member against the movable conditioning elements.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: June 3, 2003
    Assignee: Applied Materials Inc.
    Inventors: Thomas H. Osterheld, Manoocher Birang, Robert D. Tolles, Steven Zuniga, Charles C. Garretson
  • Publication number: 20030092359
    Abstract: The polishing machine for stone materials comprises: a conveyor belt for the slabs or strips to be polished, a beam made to oscillate on at least two transverse, fixed frames above the said conveyor, at least one oscillating mechanism, a number of polishing heads, aligned on the said beam and oscillating with it, a device for detecting the shape and/or dimensions of the slabs or strips, positioned upstream of the working area, a process and control calculator for the polishing machine, and has, positioned parallel to the said first beam a second beam, also equipped with a number of polishing heads aligned transversely with the polishing heads of the said first beam, and made to oscillate synchronously with it, by means of adjustable coupling devices, that enable the distance between the rows of polishing heads on the said first beam and second beam to be varied.
    Type: Application
    Filed: September 13, 2002
    Publication date: May 15, 2003
    Inventor: Luigi Pedrini
  • Patent number: 6540586
    Abstract: This invention relates to apparatus and methods for collision detection and recovery for waterjet and abrasive-jet cutting systems. In one embodiment, an apparatus includes a first mount member coupleable to a controllably positionable mounting portion of the cutting system, and a second mount member coupleable to the cutting head and disengageably or movably coupled to the first mount member. Embodiments of the inventions may also have a sensing circuit having at least one first conductive element disposed on the first mount member and at least one second conductive element disposed on the second mount member. In the event of a collision between the cutting head and an obstruction, the second mount member disengages from or moves with respect to the first mount member to prevent breakage of the cutting head. This movement causes the first and second conductive elements to touch, signaling a collision and shutting down one or more internal systems.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: April 1, 2003
    Assignee: Flow International Corporation
    Inventor: Felice M. Sciulli
  • Patent number: 6533640
    Abstract: An ultra high pressure abrasive waterjet cutting apparatus for cutting nuclear reactor structural components is described. The cutting apparatus includes an ultra high pressure abrasive waterjet (UHP) cutting nozzle, movably coupled to a single axis manipulator, and a collection hood. The manipulator and the collection hood are coupled to a support frame and are configured to be positioned inside adjacent openings of a nuclear reactor top guide or core plate so that the cutting nozzle is in alignment with the collection hood. The manipulator includes a linear frame, a nozzle support plate movably coupled to the linear frame, and a motor operatively coupled to the nozzle support plate. The collection hood includes an elongate collection chamber having an elongate opening located so that the opening is in alignment with the cutting nozzle.
    Type: Grant
    Filed: December 14, 1999
    Date of Patent: March 18, 2003
    Assignee: General Electric Company
    Inventors: Fred Charles Nopwaskey, Hsueh-Wen Pao, Gary Allen Boortz
  • Publication number: 20030045211
    Abstract: A polishing head for polishing machines, in particular for polishing optical surfaces, has a polishing plate that is connected to a rotationally drivable drive shaft. The polishing plate is articulated to, and rotates with, the drive shaft. A ball hexagonal socket joint provides the articulated connection. Rotating by means of the articulated connection, the polishing plate can follow the surface of the workpiece to be processed, so that the polishing covering on the polishing plate always rests on a maximally large area on the surface of the workpiece.
    Type: Application
    Filed: August 2, 2002
    Publication date: March 6, 2003
    Inventor: Christoph Kuebler
  • Publication number: 20020090885
    Abstract: A flange connection is adapted for interconnecting a rotary spindle and a substantially ring-formed member in such a manner that the ring-formed member is well centered about the axis of the spindle. The spindle has a surface which is well centered about the axis of the spindle and the ring-formed member has an axially projecting sleeve-shaped flange. The flange has in its inner envelope surface an annular bulge that is arranged to enclose and engage the spindle surface centered about the spindle axis.
    Type: Application
    Filed: December 20, 2001
    Publication date: July 11, 2002
    Inventor: Volker Wendt
  • Patent number: 6390888
    Abstract: A grinder pressing device, wherein either the bottom part of a cylinder main body (10) of an air cylinder (1) in a vertical posture or a piston rod (11) is fixed to a fixed plate (2) and the other one is fixed to a movable plate (3) disposed under the fixed plate (2), either a guide table (G2) or a guide (G1) is mounted on the movable table (3) and the other one is mounted on the outer peripheral surface of the cylinder main body (20) and the guide plate (G2) is guided on the guide (G1) in a vertical direction under the rolling frictional condition through balls and, in the air cylinder (1), a coefficient of friction between the outer peripheral walls of a piston (12) and the piston rod (11) and the structural wall of the cylinder main body (10) is set lower by a metal seal so as to support the piston rod (11) by a ball bush movably in forward and backward directions over an extensive distance, a grinder (G) being mounted on the movable plate (3) and air pressures in upper and lower cylinder chambers (13 and
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: May 21, 2002
    Assignees: Nitta Corporation
    Inventors: Yuji Amano, Yasuhiro Hayakawa
  • Patent number: 6379214
    Abstract: This invention relates to apparatus and methods for z-axis control and collision detection and recovery for waterjet and abrasive-jet cutting systems. In one embodiment, an apparatus includes a linear rail, a slide member coupleable to a cutting head and slideably coupled to the linear rail, at least one actuator having a first end coupled to the slide member and a second end fixed with respect to the linear rail, a position sensor, and a controller. The actuator provides an adjustable support force that supports the weight of the cutting head, allowing the cutting head to be controllably positioned at a desired height above the workpiece. The actuator may include a pneumatic cylinder, or alternately, a linear motor.
    Type: Grant
    Filed: August 25, 1999
    Date of Patent: April 30, 2002
    Assignee: Flow International Corporation
    Inventors: Jonathan M. Stewart, Thomas Pesek, Volker Kern, Chien Chou Wu, Daniel Chin, Felice M. Sciulli
  • Patent number: 6375542
    Abstract: The present invention relates to an improved spindle unit. The spindle unit includes a body, an external shaft placed into the body and rotating on bearings relative to the body, and an internal shaft placed into the external shaft and coupled thereto. The spindle unit further includes front and rear static journal bearings and a thrust bearing between the external and internal shafts. Flow control valves are provided which have their outlets connected to recesses communicating with the rear and front journal bearings. Operation of the valves in response to measured parameters controls the position of the internal shaft relative to the rotation axis of the external shaft. This is accomplished by controlling the flow of fluid to recesses associated with the front and rear journal bearings. By controlling the position of the internal shaft, one can insure that a workpiece attached to the internal shaft is automatically centered.
    Type: Grant
    Filed: August 15, 2000
    Date of Patent: April 23, 2002
    Assignee: Moore Tool Company Incorporated
    Inventor: Leonid Kashchenevsky
  • Patent number: 6358118
    Abstract: A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: March 19, 2002
    Assignee: Lam Research Corporation
    Inventors: Robert G. Boehm, John M. Boyd
  • Patent number: 6358114
    Abstract: A lapping tool for localized optical polishing of a workpiece, the tool having a flexible working surface and being characterized by means for selectively varying the pressure applied, in use, on the workpiece by different regions of the tool working surface whereby to vary the effective area of contact with the workpiece. A method of optical polishing and optical workpiece using a lapping tool whose maximum working surface area is substantially smaller than the workpiece, comprising determining the path to be travelled by the tool across the workpiece, and determining the pressure and effective area of contact of the tool on the workpiece, in order to achieve the next stage of polishing, and then driving the tool over that path while dynamically varying the said applied pressure and effective contact area.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: March 19, 2002
    Assignee: Optical Generics Limited
    Inventors: David Douglas Walker, Richard George Bingham, Sug-Whan Kim, Keith Ernest Puttick
  • Publication number: 20020016133
    Abstract: Grinding machine (1) comprising a first wheelhead (4) for machining flat surfaces and a second wheelhead (10) for machining workpieces (3) such as broaches. The first wheelhead (4) is slidably mounted on a vertical column (6) and has a slide (7) on its underside. The second wheelhead (10) is rotatable about its own axis and is slidably mounted on said slide (7). When the first wheelhead (4) is in its working position, the second wheelhead (10) is placed away from the workpiece (3) on the slide (7) in its rest position (A), and, when the second wheelhead (10) is in its working position (B), said second wheelhead (10) is placed next to the workpiece (3), angularly oriented in order to carry out the helical machining.
    Type: Application
    Filed: July 12, 2001
    Publication date: February 7, 2002
    Inventors: Raul Alberdi, Salvador Aznal, Alejandro Arrieta
  • Patent number: 6287170
    Abstract: An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surface of the carrier adapted to support a bar for lapping. The actuator adapted to actuate the carrier at the spaced actuation points and including a plurality of actuation members movably actuated via pressure supplied to the actuation members. The actuation members are supported in spaced staggered relation in chambers in a manifold. The actuation members are spaced relative to the spaced actuation points and are supported relative to the manifold to provide precision actuation for incrementally adjusting the profile of the carrier.
    Type: Grant
    Filed: February 9, 1998
    Date of Patent: September 11, 2001
    Assignee: Seagate Technology LLC
    Inventors: Shanlin Hao, Lars Halvar Ahlen, Edward Michael Erickson
  • Patent number: 6264534
    Abstract: An automotive vehicle body can be sanded with a robotic sanding (polishing) disk that is carried on a robotic head, such that the sanding disk has a relatively constant unit pressure on the vehicle surface as the head moves the sanding disk along the vehicle surface. An automatic supply mechanism can be employed to periodically remove a worn sanding disk from the head, and replace the worn sanding disk with a new sanding disk.
    Type: Grant
    Filed: March 25, 1999
    Date of Patent: July 24, 2001
    Assignee: Ford Global Technologies, Inc.
    Inventors: James Robert Panyard, Scott Louis Radabaugh, Thomas Eric Pearson, Ronald Rene Wiggle
  • Patent number: 6241578
    Abstract: A carrier device is adapted for use in a polishing apparatus with a turntable having a polishing surface. The carrier device includes a carrier for carrying an article to be polished and a control device operatively associated with the carrier. The control device includes an actuator operable to cause the carrier to urge the article against the polishing surace of the turntable to polish the article, a sensor operatively associated with the actuator and operable to sense a pressure as applied to the article when the article is urged against the polishing surface of the turntable and a control unit operatively associated with the actuator and the sensor so as to monitor the pressure during a polishing operation. The control unit is operable to control operation of the actuator in response to the pressure as monitored so as to keep the pressure at a target level and halt the polishing operation when the pressure is deviated from a predetermined range over a predetermined period of time.
    Type: Grant
    Filed: July 21, 1999
    Date of Patent: June 5, 2001
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Nobuyuki Takada
  • Patent number: 6220931
    Abstract: A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: April 24, 2001
    Assignee: Nippei Toyama Corporation
    Inventors: Kenichiro Nishi, Mitsuru Nukui, Kazuo Nakajima, Shirou Murai, Toyotaka Wada
  • Patent number: 6217411
    Abstract: A polishing apparatus includes a rotatable polishing pad having a polishing surface, a carrier for carrying an article to be polished and a support for stationarily supporting the carrier in such a manner that the article carried by the carrier is engaged with the polishing surface. A universal joint is provided between the carrier and the support. A sensor device senses a friction force generated between the article and the polishing surface as the polishing pad is rotated and imposed on the carrier. A pressing device has a plurality of pushers arranged around the joint to apply pressures to the carrier towards the polishing pad.
    Type: Grant
    Filed: March 26, 1999
    Date of Patent: April 17, 2001
    Assignee: Ebara Corporation
    Inventors: Hirokuni Hiyama, Yutaka Wada, Kazuto Hirokawa, Hisanori Matsuo
  • Patent number: 6213850
    Abstract: A method and apparatus is provided for producing raw edge belts. Plural square-cut ring-shaped belts are suspended across a main spindle roller and a tension roller, and while the belts are made to run circularly, the belts are ground into V-section belts to produce raw edge belts. The ring-shaped belts are roughly ground on the main spindle roller section into belts of an almost V-form section by a rough grindstone having V-forms in its peripheral. The roughly-ground ring-shaped belts are thereafter subjected to finish polishing with a finish grindstone.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: April 10, 2001
    Assignee: Bando Kagaku Kabushiki Kaisha
    Inventors: Seiji Hashino, Noboru Hasegawa
  • Patent number: 6203401
    Abstract: A device for superfinishing of ground surfaces of workpieces has a finishing block, which can be displaced by means of a drive device in a plane which is orthogonal with respect to the surface to be worked and is pivotable in this plane. By means of this it is possible to create a device of relatively small structural size, by means of which any arbitrary surfaces of workpieces can be treated.
    Type: Grant
    Filed: August 31, 1998
    Date of Patent: March 20, 2001
    Assignee: Supfina Grieshaber GmbH & Co.
    Inventor: Wilfried Weber
  • Patent number: 6196897
    Abstract: The present invention relates to an automatic lapping method for lapping a work piece and a lapping apparatus using the same. The lapping apparatus laps a work piece by moving the mounting base 103 relatively to a lapping plate 104. On a coarse processing step, the lapping plate 104 is controlled with high speed as detecting a remaining amount for lapping the work piece. Then, on a fine processing step, said lapping plate 104 is controlled with low speed by detecting that the remaining amount h for lapping said work piece has reached to a predetermined amount H0. Thereby, it becomes possible to continuously execute the coarse processing and the fine processing in one lapping apparatus.
    Type: Grant
    Filed: October 24, 1997
    Date of Patent: March 6, 2001
    Assignee: Fujitsu Limted
    Inventors: Koji Suto, Kazuo Yokoi, Yoshiaki Yanagida, Motoichi Watanuki, Tomokazu Sugiyama
  • Patent number: 6159071
    Abstract: Disclosed is an improved semiconductor wafer grinding apparatus comprising at least wafer holding means and wafer grinding means. The wafer holding means comprises a holder having a wafer-gripping surface for sucking and holding a selected semiconductor wafer and liquid bearing means for rotatably supporting the holder. The liquid bearing means has inclination control means formed therein, and the inclination control means includes discrete inclination controlling areas for suspending the holder at upper and lower levels. Each inclination controlling area has flow rate control means connected thereto. The parallelism of the wafer-gripping surface relative to the wafer grinding means is assured by controlling the flow rate of the liquid to each inclination controlling area.
    Type: Grant
    Filed: June 18, 1999
    Date of Patent: December 12, 2000
    Assignee: Disco Corporation
    Inventors: Yutaka Koma, Motomi Kitano, Takashi Kouda
  • Patent number: 6152804
    Abstract: A work W is rotated on a lower grinding wheel 13 provided on a work support base 11. Both surfaces of the work W are simultaneously subjected to grinding process by an upper grinding wheel 24 provided on a grinding shaft 22 of a grinding head 21 and the lower grinding wheel 13. The work W is applied with a pressure force of a primary load through the grinding shaft 22 by a piston rod 36 of a primary pneumatic cylinder 35 which is operated by a first air pressure. The work W is also applied with a pressure force of a secondary load through a lever member 43 by a piston rod 46 of the secondary pneumatic cylinder 45 which is operated by a second air pressure higher than the first air pressure. By adjusting the second air pressure, the pressure force is controlled.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: November 28, 2000
    Assignee: System Seiko Co., Ltd.
    Inventor: Shinichi Okuyama
  • Patent number: 6146241
    Abstract: Methods and apparatuses for evenly polishing the entire polishing surface of a sample are described. One polishing apparatus of the present invention comprises: a platen having an upper surface upon which the sample surface is to be polished; a sample holder disposed opposite to the platen's upper surface, at least one of the platen and the sample holder being rotated about a first axis to effect polishing; a positioning means for changing the distance between the sample holder and the platen in response to a control signal; and a controller providing said control signal to the positioning means to control the operation of the positioning means during a polishing cycle, wherein the controller causes the positioning means to change the distance intermittently during the polishing cycle.
    Type: Grant
    Filed: November 12, 1997
    Date of Patent: November 14, 2000
    Assignee: Fujitsu Limited
    Inventors: Michael G. Lee, Solomon I. Beilin
  • Patent number: 6086452
    Abstract: A method for correcting the radial run-out and radial force variation of a pneumatic tire (12) with a tire uniformity machine (10). The tire is rotated at a high speed and radial run-out is measured. A center grinder assembly (24) is incrementally advanced into contact with sections of the tire having intrinsic radial run-out until all values of radial run-out about the tread circumference are within an acceptable value of radial run-out. In addition to the advancement of the center grinder assembly (24), top and bottom tread shoulder grinders (40A, 40B) may be advanced into contact with sections of the tire having phase adjusted lateral run-out. The extent of the advancement of the shoulder grinders into contact with the tread shoulders of the tire is dictated by a control signal generated by a computer program from the initial measurements of radial run-out.
    Type: Grant
    Filed: October 29, 1998
    Date of Patent: July 11, 2000
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: George Jeffrey Lipczynski, Gino Salvador Vicini, John Michael Maloney
  • Patent number: 5961379
    Abstract: A tool grinding machine which can grind the cutting edge of a punch without disassembling the punch body from the punch assembly and further can grind the cutting edge of the upper surface shoulder portion of the die. Further, the punch and die of various shapes can be ground easily by selecting an appropriate previously stored operation mode determined according to grinding conditions. The tool grinding machine includes a rotary table 33 rotatably disposed on a slider 29 supported on a base 3 movable in the right and left direction; and a grinding tool 53 disposed axially away from the rotary table and rotatable and movable in an axial direction of the rotary table 33, for grinding workpiece fitted on the rotary table 33.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: October 5, 1999
    Assignee: Amada Metrecs Company, Limited
    Inventor: Kazuyuki Uchida
  • Patent number: 5916009
    Abstract: A wafer pressurizing apparatus capable of improving the polishing accuracy of a wafer while excluding influences on a pressure sensor of a rotational force and a horizontal force created during a wafer polishing operation. The apparatus includes a carrier (1) adapted to rotate about its own axis of rotation while maintaining a surface of the wafer (200) in contact with a surface plate (210), a cylinder (300) for urging the carrier (1) against the surface plate (210), a pressure sensor in the form of a load cell (LS) for sensing an urging force applied to the wafer (200) and generating a corresponding output signal (V), and a controller (6) for controlling the urging force of the cylinder based on the output signal (V) from the load cell (LS).
    Type: Grant
    Filed: August 27, 1997
    Date of Patent: June 29, 1999
    Assignee: Speedfam Co., Ltd.
    Inventors: Shigeto Izumi, Hatsuyuki Arai
  • Patent number: RE37622
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: April 2, 2002
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi