Abstract: A post-process sizing control device is provided with origin compensation means for controlling a size measuring device to measure an actual size of a workpiece portion and for compensating the origin of a wheel head by a position compensation amount which corresponds to a difference between the actual size and a theoretical size derived from calculation and size measuring interval setting means for setting the number of workpieces which should be ground during the next size measuring interval which begins after the preceding origin compensation operation and ends with the next origin compensation operation. The size measuring interval setting means sets the number of workpieces which should be ground during the next size measuring interval, based on an average position compensation amount derived by dividing a position compensation amount for the last workpiece ground during the present size measuring interval by the number of workpieces ground during the present size measuring interval.

Abstract: Measuring apparatus (50) of geometrical parameters of cylinders, rolls and similar elements (11), used for the rolling of flat products operating on a machine for the grinding of said cylinders with an autonomous movement, i.e. with a movement independent of the translation movement of the grinding wheel or other parts, characterized in that it comprises at least four sensors (54, 55), situated on a surface orthogonal to the cylinder (11) or roll and in that at least two of said sensors are situated in opposite positions.

Abstract: A multi characterized CMP (Chemical Mechanical Polishing) pad structure includes a lower pad and an upper pad. The lower pad includes a lower central soft pad region and a lower peripheral soft pad region formed outwardly of the lower central soft pad region, with both the lower central soft pad region and the lower peripheral soft pad region being located in a same plane of the lower pad. The upper pad is disposed on the lower pad, and includes an upper central hard pad region and an upper peripheral soft pad region formed outwardly of the upper central hard pad region, both the upper central hard pad region and the upper peripheral soft pad region being located in the same plane of the upper pad. The lower peripheral soft pad region has a lower hardness factor relative to the lower central soft pad region, and the upper peripheral soft pad region has substantially the same hardness factor as the lower central soft pad region.

Abstract: A roll grinder system including a roll grinder bed of high dynamic stiffness, having a roll support and a grinding wheel support fixedly mounted to the roll grinder bed. The roll grinder bed is comprised of a monolithic epoxy granite block with a steel plate embedded in the top surface and a steel plate embedded in the bottom surface. The bed for the support for the roll being ground is rigidly affixed to the top plate. The bed for the traversing carriage of the grinding wheel head is also rigidly affixed to the top plate. A bed for the caliper is affixed to a lateral side of the block. The grinding wheel and the caliper traverse along the axis of the roll being ground. Vibration isolators are disposed below the bottom plate of the block.

Abstract: A semiconductor wafer dicing saw is controlled by monitoring blade exposure from a flange holding the blade during the wafer dicing process. As the wafer is cut and separated into discrete electronic chips, the dicing blade wears. As the blade is brought closer and closer toward the wafer during cutting, the blade exposure is continuously being reduced. The small dimensions, coolant flow, and close tolerances typical in the wafer dicing process, do not permit visual inspection. Excess blade wear and thus reduced exposure or flange clearance between the blade cutting edge and flange edge will cause damage to the wafer and blade by restricting coolant flow or by contact of the flange with the wafer.

Abstract: A microfinishing machine tool comprising an abrasive belt and reference and clamping shoes for the machining of a cylindrical surface of a workpiece. In order to perform a checking, in the course of machining, of dimensions and geometrical characteristics on the cylindrical surface, a detecting device comprises a support element coupled to a shoe in a central limited area and two pairs of gauging heads coupled to the support element for detecting diametral dimensions at two different cross sections of the cylindrical surface. The shoe comprises seats and openings for housing the detecting device.

Abstract: An annular workpiece having an inner peripheral surface and an outer peripheral surface at least one of which is centered on a workpiece axis is ground by supporting the workpiece hydraulically on a liquid layer in a support for rotation about the axis, rotating the workpiece about the axis, and engaging a grinding tool radially against the one surface and thereby removing material from the one surface. A plurality of measuring shoes are supported at angularly equispaced locations about the axis and are urged radially toward the one surface. A jet of liquid is projected from each of the shoes against the one surface such that the liquid forms a layer supporting the shoes on the one surface and merges with the liquid supporting the workpiece. The radial positions of the shoes are monitored relative to the axis and the removal of material from the one surface by the grinding tool is controlled, either by varying grinding force or stopping grinding altogether, in accordance with the monitored radial positions.

Abstract: A universal surface polishing assembly movable along the longitudinal axis of a workpiece including a pair of polishing arms with a surface grinding material affixed to each end of the polishing arms respectively, a regulated cylinder for actuating the polishing arms onto the machine component bearing surface, and a pair of stabilizing plates located directly adjacent the polishing arms for stabilizing the polishing arms during the microfinishing operation. The surface polishing assembly is designed to be adapted to various machines having means for workpiece rotation such as grinders, lathes, mills etc. Many different machine components that require microfinishing of various bearing surfaces can be finished in the present invention due to the manual indexing ability inherent in the slidable polishing assembly.