Abstract: The present disclosure provides a tray assembly having a dual-structure. The tray assembly comprises an upper tray and a lower tray. The lower tray is capable of being easily disengaged from the upper tray by use of a dovetail joint that allows the lower tray to slidably move relative to the upper tray. The tray assembly also utilizes magnets to reduce the use of mechanical joints. The combination of the magnets together with the dovetail joint provides a quick and efficient way of sliding the lower tray in and out from the upper tray. The lower tray having a collection region collects any external, foreign materials generated during a chemical mechanical polishing/planarizing process. After the cleaning process, the lower tray can be slid back into the upper tray for use.

Abstract: A machine and process for making a composite battery electrode with a conductive lead cast ribbon extending along and attached to a portion of a carbon fiber material. A lead ribbon may be continuously cast along a longitudinally elongate strip of carbon fiber material. The ribbon may be cast along an edge or edges of a longitudinally elongate strip of carbon fiber material.

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In one embodiment, the apparatus includes a polishing module, a retaining ring, wherein the retaining ring includes a protrusion on a radially outward edge, and a plurality of load pins disposed through the retaining ring.

Abstract: [Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.

Abstract: A grinding head includes: a guide rail; a first grinding assembly and a second grinding assembly which are located at two ends of the guide rail respectively and can move along the guide rail; and a number of filling assemblies, which are disposed between the first grinding assembly and the second grinding assembly, wherein dimensions and/or quantity of the filling assemblies are based on a width between the first grinding assembly and the second grinding assembly, wherein the filling assemblies can cooperate with the first grinding assembly and the second grinding assembly to form an entire grinding bottom face. The width of the bottom face of the grinding head can be adjusted so that the waste of grinding cloth due to grinding a thin display is panel surface by a grinding head with a wide bottom face can be avoided and the operating efficiency can be enhanced.

Abstract: A process of preparing a turbine rotor wheel, a repair tool for machining a turbine rotor wheel, and a turbine rotor wheel are disclosed. The process includes providing the turbine rotor wheel, the turbine rotor wheel having a dovetail slot, a cooling slot, and a dovetail acute corner formed by the dovetail slot and the cooling slot and removing a stress region from the dovetail acute corner. The repair tool permits removal of strained material while also reducing the operating stress of the feature. The turbine rotor wheel includes a machined portion resulting in lower stress for the turbine rotor wheel.

Abstract: Grinding machine with a machine bed, with a tool carriage that is linearly movable on the machine bed in a Y-axis, with a tool spindle, which is mounted in the tool carriage so as to rotate around an X-axis that is perpendicular to the Y-axis, and which can be rotationally driven, with an X-carriage that is linearly movable on the machine bed in the X-axis, with a Z-carriage that is linearly movable on the X-carriage with a Z-axis that is perpendicular to the X-axis and the Y-axis, and with a work piece jig, which is arranged on the Z-carriage so as to pivot around a B-axis, which is parallel to the Y-axis, and which is capable of rotating around its A-axis, which is perpendicular to the B-axis.

Abstract: A tool holder transmission structure of a stone chamfering machine which is mainly characterized in that a transmission motor is installed at downward offset position inside the frame of the stone chamfering machine, whereof the transmission gear installed on the spindle of the said motor is through the bottom cut slot of the centered convex block at side plate of the frame to engage with the bottom tool driven gear of the multi-axis tool holder, whereby through rotation of the tool holder, different tool driven gear can be changed to engage with the motor transmission gear. Therefore, it is particularly useful to select different tools for stone chamfering operation according to practical needs.

Abstract: The present invention discloses a workshop unit for use as a grinding center that includes a support frame having a drive motor and a multi-station tool mounted thereto. Particularly, the grinding center may be used for operations including but not limited to grinding, buffing, polishing, sanding, and cleaning. The multi-station tool includes a plurality of rotary tools, a power transfer system, and a rotary tool selecting system. The power transfer system operates through a plurality of pulleys each in communication with at least one rotary tool and the drive motor through a plurality of transmission links. The rotary tool selecting system, which includes one or more control shafts and a clutch system, allows each tool to be selectively and independently operated.

Abstract: A multispindle pedestal grinder includes: a head block, an indexable head rotatably supported by the head block, three spindles rotatably supported by the indexable head, the axes of rotation of the spindles being parallel to one another and to the axis of rotation of the indexable head, a source of rotating power such as an electric motor; and a belt drive selectively coupling only: a first one of the spindles to the source of rotating power when the indexable head is in a first index position; a second one of the spindles to the source of rotating power when the indexable head is in a second index position; and a third one of the spindles to the source of rotating power when the indexable head is in a third index position.

Abstract: A multi-spindle end effector is provided for a multiple axis robot. The multi-spindle end effector includes a plate housing having at least a pair of spaced-apart spindles mounted thereon. A servo-motor drivingly engages the spindles. A gear box steps down the RPMs of the motor to the desired RPM of the object to be rotated. A timing belt, which may be continuous, interlinks the first and second spindles so that the rotation of first spindle matches the rotation of the second spindle. An idler pulley may be employed to properly tension the belt.

Abstract: A parallel alignment device for chemical mechanical polishing using a plurality of carrier devices (123) rotatably coupled to a turret means. The apparatus (100) includes a turret and plurality of rotatable polishing surfaces (111) positioned around the turret. The apparatus also includes a plurality of carrier devices (123) rotatably coupled to the turret, where the carrier devices (123) are each adapted to hold a workpiece to be polished on at least one of the rotatable polishing surfaces. Each of the carrier devices is operably independently to each other during a process for chemical mechanical polishing.

Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes a polishing surfaces, such as pads mounted on respective platens, located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, for example oscillate radially within the rotatable support. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing.

Abstract: The invention concerns a device for sharpening of knives, which are mounted in the knife ring of a chip cutter and whose cutting edges run essentially parallel to the knife ring axis. Several grinding tools can be run intermittently and simultaneously in the direction of the knife ring axis in order to sharpen individual knives The knife ring stands still during the sharpening and is rotated around its own axis during the pauses between sharpening corresponding to the distribution of the knives over the periphery of the knife ring. Any grinding tool sharpens any knife in such a way that the desired total (amount of) removed grinding material is achieved with the last grinding tool in the peripheral direction of the knife ring.

Abstract: An apparatus for polishing semiconductor wafers and other workpieces that includes polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a carousel, which provides circumferential positioning of the heads relative to the polishing pads, and the wafer heads oscillate radially as supported by the carousel to sweep linearly across the respective pads in radial directions with respect to the rotatable carousel. Each polishing station includes a pad conditioner to recondition the polishing pad so that it retains a high polishing rate. Washing stations may be disposed between polishing stations and between the polishing stations and a transfer and washing station to wash the wafer as the carousel moves. A transfer and washing station is disposed similarly to the polishing pads.

Abstract: An abrasive machining assembly (10) wherein a worktable (14) is rotatably supported on a frame (12) for rotation about a table axis (A) and a plurality of platens (32) are supported on the worktable (14) with each of the platens (32) being adapted for supporting a workpiece to be machined by a machining disc (38) rotating about a tool axis (B). Each platen (32) is rotatably supported for rotation about a platen axis (C) which is radially spaced from the table axis (A) a different distance than the tool axis (B) whereby each of the platens (32) rotates about a platen axis (C) which is parallel to and offset from the tool axis (B) when positioned in the workstation.