Abstract: A method and apparatus for testing rolling resistance of a mattress by rolling a cylindrical weight across at least a portion of the mattress and measuring torque of the cylindrical weight moving across the mattress. The apparatus is preferably automated and preferably continuously measures torque as the cylinder is continuously moved across the mattress at a constant speed.

Abstract: The present application provides a device for detecting wheel hop, comprising a synchronous clamping and centering mechanism, a synchronous rotating mechanism and a hop detecting mechanism. According to the structure and size of a wheel to be detected, a first servo motor and a second servo motor control the detection wheel in the hop detector to move within a specific plane, the detection wheel is in contact with a bead seat of the wheel, and the synchronous rotating mechanism drives the wheel to rotate; and the detection wheel is driven to rotate by the friction between the detection wheel and a bead seat of the wheel, and the hop detector detects the hop amount of the bead seat of the wheel when the wheel rotates and transmits the data to a computer processing system.

Abstract: A tire pre-conditioning system includes a first mandrel, a second mandrel spaced apart from the first mandrel, and a controller in communication with the first mandrel and the second mandrel. The first mandrel is fixedly attached to a first shaft and including a first tapered sidewall. The second mandrel is fixedly attached to a second shaft and including a second tapered sidewall. The controller is operable to axially move the first mandrel and the second mandrel toward one another until the first and second tapered sidewalls are opposing respective beads of a tire, and supply pressurized fluid into an internal cavity of the tire to inflate the tire. The inflating causing the beads to move relative to the mandrels while contacting the opposing respective tapered sidewalls to burnish the beads of the tire.

Abstract: The present invention provides a wheel deburring device, consisting of a frame, a motor, a guide rail, a swing plate, a cylinder, a servo electric cylinder and a hairbrush and the like. When in use, the device provided by the present invention can adjust the angle of the hairbrush according to the shape of the back cavity of the wheel spoke to adapt to hubs of any style, and the deburring effect is very ideal; and meanwhile, the device has the characteristics of high degree of automation, advanced process, safe and stable performance, etc.

Abstract: A gear or profile grinding machine and a method for operating such a machine, especially for grinding of pre-geared or pre-profiled workpieces, wherein the machine includes at least one tool spindle which can receive at least one grinding tool, and at least one workpiece spindle which is movably arranged at a carrier element and which can be driven up to the tool spindle for an at least temporary cooperation of the workpiece with the grinding tool by at least one drive. To enhance the precision of the machine at growing workpieces with simple measures, at least one mass is arranged at or in the carrier element, which is arranged movable at or on a guiding element by a drive element, wherein the mass is permanently free from any contact with another machine part and/or workpiece part and/or tool part.

Abstract: A method of measuring wear rate in an actual rubber tire. A section of rubber is cut out of an actual tire below the surface of the tire. The cut out section is attached to the surface of a first wheel. An abrasive substance is attached to the surface of a second wheel. The two wheels are rotated for a predetermined time, in opposite directions, in contact with each other, at uneven rates resulting in some slippage between the surfaces of the two wheels. The wear rate of the rubber tire is measured based on the changes in the cut section over time, in much less time and using less resources than required by conventional wear measurement methods.

Abstract: A method of removing electrical runout from a measurement surface of a rotatable machine shaft is disclosed. The method includes providing a sensor adjacent to the measurement surface of the rotatable machine shaft, rotating the rotatable machine shaft, measuring a combined runout of the measurement surface, determining an angular location of one or more local valleys on the measurement surface, and re-working the measurement surface at the angular location of the one or more local valleys. Re-work may be by polishing at the one or more local valleys. Various alternative methods are disclosed, as are other aspects.

Abstract: The present invention relates to a grinding machine for grinding a workpiece, in particular cams, with a grinding wheel having a profile with a grinding region running substantially parallel to the axis of rotation of the grinding wheel and at least one profile section which does not run parallel to the axis of rotation of the grinding wheel, a control unit for controlling the grinding process, wherein the control unit is configured in such a manner that, with reference to position information on positions of edges of the workpiece in the direction of the longitudinal axis of the workpiece, the edges of the workpiece are successively deburred or chamfered by the at least one profile section of the grinding wheel during or after the grinding of the workpiece.

Abstract: A tire measurement system includes a computer with various memory/media elements for storing raw and transformed tire measurement data (e.g., a data set of measured radial or lateral run-out values) as well as software in the form of computer-executable instructions, which are executed by a processor to filter selected run-out values within the obtained data set that spike above adjacent measurements, identify selected ones of the filtered run-out values that lie on a convex hull surrounding the entire set of values, and perform interpolation of the identified selected ones of the run-out values that lie on the convex hull to obtain a final data set of filtered run-out measurements. Similar steps can be performed on an inverted data set to better detect sidewall deformation features such as sidewall depressions.

Abstract: A form tap includes a shank having a shank length and a thread portion that extends along at least a portion of the shank length. The thread portion includes a finishing portion and a chamfer portion. Each of the finishing portion and the chamfer portion include a plurality of threads and each thread has a crest and a root. The plurality of threads of both the finishing portion and the chamfer portion are spaced apart at a constant pitch, such that a crest-to-crest distance between adjacent threads remains constant along the entire thread portion.

Abstract: A precision machining method enabling grinding with high accuracy is provided. The method includes a first step of producing an intermediate ground workpiece by roughly grinding a workpiece (a) with a diamond grinding wheel (b), and a second step of producing a final ground workpiece by grinding the intermediate ground workpiece with a grinding wheel for CMG. In the first step, feed of the rotator (6b) and the base (3) is controlled in multiple stages with different feed speeds according to control based on the amount of movement, and in the second step, movement of the rotator (6b) and the base (3) is controlled with a constant pressure or in multiple stages having different constant pressures.

Abstract: In one aspect, a process for roll grinding employs a grinding wheel that is porous and permeable. In another aspect, a process for grinding mill rolls includes dressing the grinding wheel as the wheel traverses the surface of a mill roll. Other aspects relate to a system, e.g., a mill roll grinding machine, or parts thereof, in which a dressing tool contacts the wheel as the wheel grinds the surface of the mill roll. In specific examples, the wheel and a rotary dressing tool are maintained in contact as the wheel traverses the surface of the mill roll.

Abstract: A device for fine or finest processing of a rotationally symmetric work piece surface of a work piece (14), with a drive mechanism (12) for driving the work piece (14) around an axis of rotation (16), two guidance mechanisms (20, 22) acting in radial directions with respect to the axis of rotation (16) and at least one tool (38) acting in a radial direction, and a pressing mechanism (42) for pressing the work piece (14) against the drive mechanism (12), wherein the work piece (14) can be disposed between the drive mechanism (12) and the pressing mechanism (42). The pressing mechanism (42) acts in a pressing plane (74) that is offset from the axis of rotation (16) towards a space (78) in which the guidance mechanisms (20, 22) are disposed.

Abstract: An apparatus, system and method for cleaning a substrate edge include a composite applicator that cleans bevel polymers deposited on wafer edges using frictional contact in the presence of fluids. The composite applicator includes a support material and a plurality of abrasive particles distributed within and throughout the support material. The composite applicator cleans the edge of the wafer by allowing frictional contact of the plurality of abrasive particles with the edge of the wafer in the presence of fluids, such as liquid chemicals, to cut, rip and tear the bevel polymer from the edge of the wafer.

Abstract: The present invention relates to a grinding wheel truing tool, its manufacturing method, and a truing apparatus, a method for manufacturing a grinding wheel and a wafer edge grinding apparatus using the same. The grinding wheel truing tool of the present invention compensates a groove of a fine-grinding wheel for fine-grinding a wafer edge, and includes a truer having an edge of the same angle as a slanted surface of the groove of the fine-grinding wheel and a cross-sectional shape corresponding to a cross-sectional shape of the groove. The present invention uses the truing tool to easily process the groove of the grinding wheel for fine-grinding the wafer edge.

Abstract: The present invention is a method for producing a semiconductor wafer, comprising: at least a double-side polishing step; and a chamfered-portion polishing step; wherein as a first chamfered-portion polishing step, at least, a chamfered portion of the wafer is polished so that a chamfered surface of each of main surface sides in the chamfered portion is in contact with a polishing pad; then the double-side polishing is performed; as a second chamfered-portion polishing step, at least, the chamfered portion of the wafer is polished so that an end surface of the chamfered portion is in contact with a polishing pad and so that both main surfaces of the wafer are not in contact with a polishing pad. Thereby, when a semiconductor wafer is produced, scratch and such generated in the chamfered portion in a double-side polishing process can be removed and, excessive polishing in a peripheral portion of a main surface can be prevented from being caused in polishing a chamfered portion.

Abstract: The present invention provides a method for manufacturing a bonded wafer, which includes at least the steps of bonding a bond wafer and a base wafer, grinding an outer peripheral portion of the bonded bond wafer, etching off an unbonded portion of the ground bond wafer, and then reducing a thickness of the bond wafer, wherein, in the step of grinding the outer peripheral portion, the bonded bond wafer is ground so as to form a groove along the outer peripheral portion of the bond wafer to form an outer edge portion outside the groove; and in the subsequent step of etching, the outer edge portion is removed together with the groove portion of the bond wafer to form a terrace portion where the base wafer is exposed at the outer peripheral portion of the bonded wafer. Thus, it is possible to provide a method for manufacturing a bonded wafer, which can reduce the number of dimples formed in a terrace portion of a base wafer upon removing an outer peripheral portion of a bonded bond wafer.

Abstract: This invention comprises methods, devices, and systems for buffing, to repair and restore all types of compact discs. The restoration is essentially accomplished by interaction of rotating buffers with a compact disc on a rotating platform. For added effectiveness certain chemicals are added to the rotating buffers. The portable system is fully automatic such that an operator can perform other functions. The device also includes plurality of timers and indicators as well as a convenient carrying handle. The CD Buffing Unit allows the restoration and maintenance of all known CD Media, DVDs, single or double sided, including 3-inch discs with the use of a 3-inch adapter.

Abstract: To provide a plating removing apparatus for 3-piece wheels, which can easily and neatly remove plating at the welding planned portion of the superimposed part of the inner rim and the outer rim. A plating removing apparatus that removes plating of a welding planned portion R in a three-piece wheel having the inner rim 2B, the outer rim 2A, and a disk, comprises a support means 11 that rotatably supports the outer rim 2A, at least three holding rollers 34 that hold the rim supported by the support means 11 from the outer circumferential side, a rotation drive means 67 that rotates and drives the outer rim 2A held by the holding rollers 34, and a grinding means that grinds the welding planned portion R on the outer circumferential surface of the rim 2A by an abrasive cloth/paper 13 and removes plating the welding planned portion R.

Abstract: The present invention relates to a method for reprofiling wheel disks (7) or brake disks of a railway wheel or wheelset (6), rotatably mounted in bearing housings (9), by machining using a machine tool (12), which is designed to be portable, a wheel disk (7) of the railway wheel or the wheelset (6) being pressed against backup rolls (16) on its circumference by a clamping element (14, 15), which engages on at least one bearing housing (9), at least one of the backup rolls setting the railway wheel or the wheelset (6) into rotation, while simultaneously a tool (20) machines one of the wheel (7) or brake disks. The invention also relates to a machine tool (12) for carrying out the method.

Abstract: A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

Abstract: The present invention relates to an apparatus for sharpening a circular blade. The sharpening apparatus is adapted to be positioned adjacent a power-driven sharpening wheel at an angle. The sharpening apparatus includes an angularly adjustable tool holder for angularly positioning the circular blade against the power-driven sharpening wheel. The sharpening apparatus of the present invention also includes a blade holder that quickly and easily locks the circular blade into place for sharpening and releases the blade after sharpening is complete. The present invention provides a reasonably safe and efficient sharpening apparatus for circular blades that provides uniform, high quality sharpening of one-sided and two-sided blades of varying circumferences.

Abstract: A method for directional force correction of pneumatic tires that simultaneously corrects radial and tangential force exerted by the tire. The method allows for the correction of tangential force regardless of the rotational direction of the tire. This invention accomplishes this end through an improved force correction technique, wherein at least two rotary grinders are employed. In the inventive method, the rotational direction of one grinder is reversed in relation to the rotational direction of the other grinder(s). Therefore, at least one grinder will engage the tire in an “up-grinding” manner, and at least one grinder will engage the tire in a “down-grinding” manner. The result is that across the width of the tire's tread surface, some tread blocks will have a “heel-to-toe” appearance, while others will appear “toe-to-heel.” The effect is that, no matter what direction the tire is rotating while in use on an automobile, tangential force variation has been reduced.

Abstract: A dust collection and removal system for use in conjunction with a tire uniformity machine includes a grinding wheel shroud having a vacuum aperture therein. The vacuum aperture is connected to a vacuum source. An air nozzle is centrally mounted in the vacuum aperture. The air nozzle is connected to a source of pulsed air thereby allowing a blast of air to be directed at the tire surface during or immediately after grinding to dislodge dust particles adhered to the tire. The dislodged dust particles are then removed via the vacuum. A related method of collecting and removing dust includes mounting a vacuum hose adjacent to the grinding face, mounting an air nozzle in the center of the vacuum hose, directing a blast of air toward the tire surface via the nozzle, and removing and collecting the dislodged dust particles via the vacuum hose.

Abstract: A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

Abstract: Method to identify and remove machine contributions from tire uniformity measurements made on a tire uniformity machine by synchronizing and averaging together multiple measurements of tire uniformity made on a single test tire that is re-mounted between measurements in a randomly determined orientation relative to a rim reference mark on the rim of the tire uniformity machine. A cross-correlation function is calculated for each measurement relative to the first measurement, and an angular shift is determined from each cross-correlation function. The angular shifts are used to synchronize the measurements so that they can be averaged together. The resulting average test tire uniformity data has both machine contribution and random measurement noise minimized. An average machine contribution data set is determined by synchronizing and subtracting the average test tire uniformity data from each test tire uniformity measurement data set, then averaging together the resulting data sets.

Abstract: Disclosed is a grinding fluid supply device of a lens grinding apparatus. The grinding fluid supply device includes first grinding fluid supply means for supplying a grinding fluid in a tangent direction of a circular grinding wheel, which has a grinding surface formed on its circumferential surface, with an interval above a grinding surface and allows an upper portion and a rear side portion of the grinding surface to be covered with a curtain of the grinding fluid spaced from the grinding wheel when a processed lens is subjected to a grind processing with the grinding surface of the grinding wheel by rotatively driving the grinding wheel around an axis; and second grinding fluid supply means for insufflating the grinding fluid to the grinding surface.

Abstract: In a method of grinding side end surfaces of substrates, spacers are interposed between the substrates to form a stack of the substrates and the spacers. The spacers are slightly smaller in size than the substrates. The stack of the substrates and the spacers are ground by a rotatable brush or pad on the side end surfaces of the substrates so as to smooth chamfered portions of the substrates together with the side end surfaces.

Abstract: Methods and apparatus for predicting tire uniformity, preferably a harmonic component of force variation for a production tire, preferably when operating at a high speed, and also method and apparatus for manufacturing tires and controlling the manufacturing of tires in response to quality control based on a comparison of a production tire's predicted uniformity versus predetermined criteria. A production tire's predicted tire uniformity is determined by a calculation using transfer functions applied to production tire measurement data from factory floor testing equipment which includes a factory floor balance checker and a factory floor tire uniformity machine. The transfer functions are determined by calculations involving a combination of measurements on a tire sample which preferably comprises one or more tires of the same construction as the production tire for which predictions are desired.

Abstract: A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.

Abstract: A semi-conductor wafer (12) has its inclined edge flanks polished by a grooved wheel (16) of synthetic plastics material, while a jet (20) of polishing slurry, which may comprise colloidal silica, is fed downwards into the zone of contact between the wheel and the wafer. The wheel (16) is preferably rocked or oscillated laterally such that a constant polishing force is alternatively applied to each flank of the wafer (12). The wheel may be mounted in a buffer store to which the wafers are transported from a grinding station which grinds the edge flanks.

Abstract: Method and device for polishing an edge of a work is disclosed, wherein a rubber wheel 6 containing abrasives is rotated in a plane normal to a surface of a work 5 in a form of a thin plate having an edge 5a to be polished. A spindle portion 8 holding the rubber wheel such that the rubber wheel is driven to rotate in a plane normal to the surface of the work. A mount portion 4 for mounting the work 5 thereon such that the work 5 is movable straight with respect to the rubber wheel 6 in a plane normal to the plane in which the rubber wheel 6 is rotated. Elastic means 9 is provided to urge the spindle portion 8 and the work mounting portion 4 in a direction so as to bring the rubber wheel 6 and the edge 5a of the work 5 in contact with each other, wherein one of the spindle portion 8 and the mount portion 4 is movable toward and away from the other during polishing operation.

Abstract: An outer edge ring of a semiconductor wafer is polished to prevent delamination and peeling-off of at least one layer of material deposited near the outer edge of the semiconductor wafer during fabrication of integrated circuits. The semiconductor wafer is mounted on a wafer chuck, and the wafer chuck holding the semiconductor wafer is rotated such that the semiconductor wafer rotates. A polishing pad is moved toward the semiconductor wafer as the semiconductor wafer is rotating. The polishing pad has a polishing surface that faces and contacts the outer edge ring of the semiconductor wafer as the polishing pad is moved toward the semiconductor wafer to polish the outer edge ring of the semiconductor wafer. The outer edge ring has the at least one layer of material that is polished off by the polishing surface of the polishing pad.

Abstract: This invention relates to an improved apparatus and method for finish machining brake components. The apparatus includes an electrode ring adapted to be secured to a rotatable shaft. The electrode ring includes at least one plurality of circumferentially spaced apart electrodes adapted to be electrically connected to a power supply. Each one of the at least one plurality of electrodes are arranged adjacent each other around the circumference of the electrode ring. The apparatus further includes a positioning mechanism for positioning a rotating, electrically grounded rotor adjacent the electrode ring until sparks are formed between the electrode ring and the rotor. The sparks vaporize a portion of the rotor surface thereby creating a finished surface on the rotor having the desired dimensions.

Abstract: A polishing apparatus comprises a rotating table intermittently rotating through 120°0 increments; three polishing drums and three work-holding means 12 provided on the rotating table; a handling means for unloading a processed work from the work-holding means at a handling position and supplying an unprocessed work to the work-holding means at the same position; and a work-inverting means for inverting a work, the front-plane-side edge of which has been polished, at a front-plane edge polishing position.

Abstract: Method to identify and remove machine contributions from tire uniformity measurements made on a tire uniformity machine by averaging one or more measurements of tire uniformity from a single test tire to calculate an average machine contribution signal, and then subtracting the average machine contribution signal from a tire uniformity measurement signal for a production tire to provide a corrected tire uniformity measurement for the production tire.

Abstract: Method and device for polishing an edge of a work is disclosed, wherein a rubber wheel 6 containing abrasives is rotated in a plane normal to a surface of a work 5 in a form of a thin plate having an edge 5a to be polished. A spindle portion 8 holding the rubber wheel such that the rubber wheel is driven to rotate in a plane normal to the surface of the work. A mount portion 4 for mounting the work 5 thereon such that the work 5 is movable straight with respect to the rubber wheel 6 in a plane normal to the plane in which the rubber wheel 6 is rotated. Elastic means 9 is provided to urge the spindle portion 8 and the work mounting portion 4 in a direction so as to bring the rubber wheel 6 and the edge 5a of the work 5 in contact with each other, wherein one of the spindle portion 8 and the mount portion 4 is movable toward and away from the other during polishing operation.

Abstract: A technique for polishing metal objects such as, for example, those made of aluminum, stainless steel, and brass is described. The technique employs a metal-polishing apparatus which includes a double-jointed arm assembly and a table assembly. The arm assembly includes a brush assembly, a handle, and an actuating device. The double-jointed nature of the arm assembly advantageously allows an operator to effectively polish a detailed and ornate metal object. The table assembly has a frame, a rotatable table-top assembly, and a mechanism for securing the object. The metal object to be polished is placed on the table-top assembly and allowed to rotate with respect to the frame. The technique also relates to the preparation, polishing, and post-polishing methods employed with the metal-polishing apparatus. The present technique enables aluminum, brass, and stainless steel objects to be effectively polished, and therefore refurbished, by removing a significant amount of damage (i.e.

Abstract: A lapping tool has an elongate shank mechanically coupled to a platform, having a generally planar working surface, by a universal joint comprising a ball and socket. A cavity is provided for entrapping grinding paste. Normally, the parts are made of electrically conductive materials so that current can be passed from the shank via the working surface to surface of a workpiece that is to be polished.

Abstract: A method for correcting the balance of a pneumatic tire mounted in a tire uniformity machine modified for balance screening such tires. After balance screening of the tires, tires which are unacceptably imbalanced are maintained at the second rotational speed of the balance screening routine. A grinding wheel is brought to the position of maximum radial and/or lateral deflection causing tire material to be removed from deflected portions of the tire. The tire is once again balance checked and if the balance is still unacceptable, the grinder is advanced an incremental unit of distance toward the center of the tire, more tire material is removed, and the balance is again checked. The steps of advancing the grinder, removing material, and checking the tire imbalance are performed until the tire is found to have acceptable static and couple imbalance.

Abstract: A wafer to be chamfered is supported in such a manner as to rotate and to move in the X-axis direction and the Y-axis direction which are perpendicular to one another, and a periphery grinding wheel is rotatably placed on the Y-axis. To chamfer a circular part of the wafer, the circular part of the wafer is pressed against the rotating periphery grinding wheel, and then, the wafer is rotated. To chamfer an orientation flat of the wafer, the orientation flat of the wafer is pressed against the rotating periphery grinding wheel, and then, the wafer is fed in the X-axis direction.

Abstract: A tire grinding apparatus includes at least one support arm pivotally connected to a base. A pair of grinding wheels are rotatably carried by the support arm and are adapted to engage the outer surface of a tire. The grinding wheels are disposed such that one of the grinding wheels is a leading grinding wheel and the other is a trailing grinding wheel. The grinding wheels rotate in opposite directions. The grinding wheels are partially disposed in a hood that is in fluid communication with a vacuum source. A source of pressurized air is in fluid communication with a blower head that is disposed between the grinding wheels such that it directs pressurized air against the surface of the tire being ground. The pressurized air removes dust from the tread grooves and sipes of the tire where it is collected by the hood and removed from the hood from the vacuum system. The position of the trailing wheel is adjustable with respect to the leading grinding wheel and the support arm.

Abstract: An automated apparatus for testing a plurality of sample wheels includes a grindstone, a first programmable servo motor coupled to the grindstone, a plurality sample wheels disposed about a circumference of the grindstone, and a second programmable servo motor coupled to each of the plurality of sample wheels. In addition, the automated apparatus also includes a controller that outputs a first control signal to the first programmable servo motor and a second control signal to the second programmable servo motor to provide a variable slip ratio between the grindstone and the plurality of sample wheels. The controller includes a simulator that simulates a plurality of road conditions and varies the plurality of slip ratios to simulate the plurality of road conditions.

Abstract: An apparatus for the chemical-mechanical polishing of wafers has a rotating disk provided with a polishing body, a supply device for a polishing fluid and a holding device for the wafer. An axis of the disk runs parallel to the surface of the wafer. A cylindrical edge surface of the disk is provided with the polishing body in such a way that a trench with a specific cross section can be made in the wafer.

Abstract: An apparatus (96) and method for reconditioning the protective coating (14) of a digital recording disc (10) is provided. The apparatus (96) includes a turntable (98) configured to receive the non-data center section (17) of the digital disc (10), a brake (100) for controlling the rotation speed of the turntable (98) and the disc (10), a turntable support (102) for attaching the turntable (98) to a base (104), a buffing element (52), a motor (54) for rotating the buffing element (52), a buffing element support (58) for attaching the buffing element (52) to the base (104), and a protective housing (106).

Abstract: A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.

Abstract: In a device for microfinishing both sides of disklike workpieces with plane and/or spherical surface, two tool spindles with two tools are provided on two orbit spindles; the two tools engage the two face-end surfaces of the workpiece. The tool spindles revolve, spaced apart by a certain distance, around the axes of the two orbit spindles. In this way, excellent micrographs and excellent grinding results are attained.

Abstract: When a face portion of a CRT glass panel is polished by fixing the glass panel on a rotating table and pushing a rotating cylindrical drum type polishing tool, which is supported by a supporting frame, to the face portion, the supporting frame is swung around a pivotal point so as to swing the polishing tool along an arc line on the face portion of the glass panel, and the polishing tool is moved reciprocately in a horizontal direction in association with an angle of rotation of the glass panel. Therefore, the face portion is polished while the distance between the rotation axis of the polishing tool and the center of the glass panel is changed. Since deflection of wearing of the polishing tool is decreased, the service life is prolonged, and further efficiency of polishing is improved.

Abstract: Wheels of rail vehicles are trued while the wheels are kept rotating about a wheel center of rotation that is continuously corrected to keep the center of rotation in a fixed position in response to eccentricities a wheel may have, especially in its outer circumference. For this purpose, a sensor for each wheel of two wheels forming a set senses a respective excursion of a center of rotation of each wheel being trued in a set to provide respective excursion signals which are supplied to a central processing unit that provides control signals to a power drive for wheel guide rollers which support the wheel set to be trued. The power drive applies wheel position adjusting force components, preferably directed radially relative to the respective wheel rotational axis in response to the control signals from the central processing unit whereby the excursions are compensated and the wheel rotation center is kept in a fixed position.

Abstract: A slide table is slidably supported on the slide stage which is moved by a guide screw. The slide table is connected with the slide stage by means of pressurization means. A rotatable wafer table is provided on the slide table. A grinding wheel for chamfering is used. The pressurization means is locked, so that the slide table is kept locked to the slide stage. A wafer set on the slide table is moved toward the grinding wheel, and an edge of the wafer is chamfered. A grinding wheel for polishing is used. The pressurization means is not locked, so that the slide table can be slide on the slide stage. A wafer set on the slide table is moved toward the grinding wheel, and an edge of the wafer is polished.