Abstract: The disclosure describes devices, systems and methods relating to a transfer chamber for an electronic device processing system. For example, a robot can include a first mover configured to be driven by a platform of a linear motor, a support structure disposed on the first mover, a first robot arm attached to the first end of the support structure at a shoulder axis, and a first arm drive assembly. The first drive assembly can include a first pulley attached to a first end of the support structure and to the first robot arm at the shoulder axis, a second pulley attached to a second end of the support structure, a first band connecting the first pulley to the second pulley, and a second mover configured to be driven by the platform of the linear motor, where the second mover is connected to the first band, and where motion of the second mover relative to the first mover causes the first band to a) rotate the first pulley and the second pulley and b) rotate the first robot arm around the shoulder axis.

Abstract: A servo writer includes a writing head that writes a servo signal on a long magnetic tape that is traveling, a guide roller that is provided on an upstream side of a travel path with respect to the writing head and guides the traveling magnetic tape, and a polishing unit that is provided on an upstream side of the travel path with respect to the guide roller and polishes at least one edge of the traveling magnetic tape, in which the guide roller includes a flange that regulates the travel of the magnetic tape.

Abstract: The current invention proposes sharpening thin hardened metal blades with the hard turning process using a holder designed to hold the blades in a firm and stiff manner and a ceramic cutting tool held in a fixture. Generally, the cutting tool is held stationary in its fixture while the workpiece, in its holder, is rotated such that it repeatedly comes into controlled contact with the cutting tool. In sharpening operations such as proposed here, it is critical to (i) hold the workpiece firmly and rigidly, and (ii) position the cutting tool in a precise, predictable and reliable manner.

Abstract: The present disclosure relates to a contiguous compression wire sprang polishing apparatus that continuously polishes end surfaces of compression wise springs (10) by upper and lower chain conveyers 100 and 200 and grinding units 300.

Abstract: The machine for grinding sheet-like elements, particularly tiles and slabs made of ceramic material, natural stone, glass or the like, includes a base framework, means for advancing at least one sheet-like element on a movement plane (A) along an advancement direction (B), the sheet-like element being provided with a pair of opposite first sides to be ground and a front side transversal to the first sides and defining the advancement front of the sheet-like element, means for machining the first sides adapted to intercept the sheet-like element in the motion thereof along the advancement direction (B), means for square-positioning the sheet-like element on the movement plane (A) comprising at least one abutment element which defines at least two support points adapted to contact the front side for arranging it in a position orthogonal to the advancement direction (B).

Abstract: Proposed herein is a method for producing substrates, particularly those of synthetic quartz glass, while saving the substrate surface from killer defects without resorting to any large-scale apparatus and precision polishing plate, thereby reducing defects and improving yields more than in production with conventional facilities. The method for producing substrates by polishing, includes steps of placing substrate stocks individually in work holes formed in a carrier on a lower polishing plate, bringing an upper polishing plate into contact with the surface of the substrate stocks, with the surface of the substrate stocks being coated with an impact-absorbing liquid and the lower polishing plate being rotated, and rotating the upper and lower polishing plates, with the surface of the substrate stocks being accompanied by a polishing slurry.

Abstract: Cooling devices for use with electric submersible pump motors include a refrigerator attached to the end of the electric submersible pump motor with the evaporator heat exchanger accepting all or a portion of the heat load from the motor. The cooling device can be a self-contained bolt-on unit, so that minimal design changes to existing motors are required.

Abstract: Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units each having first support blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units each having second support blocks (215) for compressing downward upper portions of the compression line springs and thus supporting the compression line springs. The grinding units grind seat surfaces formed on opposite ends of the compression line springs that are moved by the upper and lower chain conveyors. A V-shaped depression (115a) is formed in each first support block so that each of the compression line springs is seated onto the corresponding V-shaped depression. A lower surface (215a) of the second support block that compresses the compression line springs has a planar structure.

Abstract: Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units (110) and (110?) provided facing each other at positions spaced apart from each other. Each chain unit (110), (110?) includes first V-shaped blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units (210) and (210?) provided facing each other at positions spaced apart from each other. Each chain unit (210), (210?) includes second V-shaped blocks (215) for compressing downward upper portions of the compression line springs seated on the first V-shaped blocks (115) and thus supporting the compression line springs. The grinding units (300) grind seat surfaces formed on opposite ends of the compression line springs that are being moved by the lower chain conveyor and the upper chain conveyor.

Abstract: Disclosed is a wafer processing apparatus. The wafer processing apparatus includes a first surface plate on which a plurality of carriers is arranged, a first gear arranged at the central region of the first surface plate and engaged with the plurality of carriers, a second gear arranged around the edge region of the first surface plate and engaged with the plurality of carriers, a motor rotating the first surface plate in a first direction, a fixing hanger arranged opposite the first surface plate, and a second surface plate hung on the fixing hanger such that a clearance between the first surface plate and the second surface plate may be varied.

Abstract: Disclosed is a method for grinding a spring with high quality and high efficiency, comprising the steps as follows: firstly, at least one of an upper grinding wheel (1) and a lower grinding wheel (2) is configured to comprise an inner grinding wheel (21) and an outer grinding wheel (24), wherein the inner grinding wheel (21) is fitted in the outer grinding wheel (24); the inner grinding wheel (21) or the outer grinding wheel (24) is driven by a transmission mechanism, the inner grinding wheel (21) and the outer grinding wheel (24) rotating in opposite directions; after a complete spring is fed to a space between the upper grinding wheel (1) and the lower grinding wheel (2), the complete spring is moved back and forth in the plane of the grinding wheels; and then the upper grinding wheel (1) is moved downwardly such that two end faces of the spring are ground by the grinding wheels, and when the height of the ground spring meets the requirement, the upper grinding wheel (1) is stopped moving downwardly and is

Abstract: A method of simultaneous double-side polishing of at least one semiconductor material wafer includes disposing each wafer in a respective suitably dimensioned cutout in a carrier plate having a front and rear side. The at least one wafer is polished between an upper polishing plate covered with a first polishing pad and a lower polishing plate covered with a second polishing pad while supplying a polishing agent. The polishing agent is supplied on the front and rear side of the wafer through openings in the upper and lower polishing pads and the upper and lower polishing plates. Each polishing pad has an inner circular region and outer ring shaped region where the quantity of polishing agent emerging from openings in the working gap per unit time in the inner circular region of the polishing pad is different from the quantity that emerges from openings in the outer ring-shaped region.

Abstract: A horizontal double disc surface grinding machine of through field type wherein a plate work in vertical posture is induced between grinding wheels by V-belts and work guiding plates. A work falling prevention member is disposed in a work transfer area. The work falling prevention member is provided with an upper plate, a middle plate, and a lower plate, and the middle plate is inserted to a gap between V-belt single bodies.

Abstract: A grout removal tool includes a cover shaped to define a substantially enclosed interior cavity and a grinding assembly designed to simultaneously abrade grout from multiple, non-linear tile joints. The grinding assembly includes a motor-driven shaft that is rotatably coupled to the cover by a pair of ball bearings. The grinding assembly additionally includes two or more grinding elements that are axially mounted on the shaft in a spaced apart relationship, each grinding element including at least one disc-shaped grinding wheel. A vacuum attachment is externally mounted on the cover and is in communication with the interior cavity through a plurality of circular openings formed in the cover in direct alignment with the grinding elements. One end of the vacuum attachment is preferably connected to a vacuum device that forcibly withdraws and contains debris created during the grout grinding process.

Abstract: A tool sharpening assembly (100) suitable for sharpening cutting tools (140,350,366,546,562). In some embodiments, a wedge-shaped port is formed between a rotational first abrasive surface (160,262) and a stationary second abrasive surface (162,264) to sharpen a distal cutting edge (146) of a cutting tool (140,230,546). In other embodiments, a cooling mechanism (136,326,330,334,338) actively draws heat generated during a sharpening operation from a tool (140) and through a tool support structure (170,234,328,332) contactingly supporting the tool, in further embodiments, a rotatable abrasive slotted disc (364) comprises at least one inspection aperture (372) formed from an interior sidewall (390) with upper and lower leading and trailing edges (396,398,400,402) of non-uniform separation distance. In other embodiments, a cylindrical drum abrasive member (572) is provided with an associated stationary support plate (574).

Abstract: The present invention provides a conveying device including a transfer mechanism including: a belt portion configured to support a non-pattern surface of a glass plate and transfer the glass plate in a conveying direction; and a pattern surface supporting water guide arranged at a position opposed to the belt portion and configured to apply predetermined water pressure to a pattern surface of the glass plate, wherein the transfer mechanism is configured such that: the glass plate is pressed against the belt portion by water pressure of the pattern surface supporting water guide; and the glass plate is sandwiched between the pattern surface supporting water guide and the belt portion in a state where the pattern surface of the glass plate is in a non-contact state, the conveying device being capable of stably transferring the glass plate without making scratches on the pattern surface of the glass plate.

Abstract: Methods for holding a workpiece with a hydrostatic pad are disclosed herein. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.

Abstract: A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a carrier having a hole configured to house the work, and a fixing member that contacts and fixes the work located in the hole.

Abstract: A polishing apparatus to simultaneously polish both surfaces of a work, and includes a pair of stools rotating in opposite directions, a pair of detecting units to detect rotation rates of the stools, a pressurizing unit to compress the work between the pair of the stools, a slurry supply unit to supply a slurry to the stools, and a control unit to reduce, when determining that a frictional force between the polishing surface and the work exceeds a threshold, at least one of a load applied by the pressurizing unit, the rotation rate of the stools, and a supply amount of the slurry.

Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.

Abstract: Simultaneous double-side grinding of a plurality of semiconductor wafers involves positioning each wafer freely in a cutout of one of plural carriers which rotate on a cycloidal trajectory, wherein the wafers are machined between two rotating ring-shaped working disks, each disk having a working layer of bonded abrasive, wherein the form of the working gap between working layers is determined during grinding and the form of the working area of at least one disk is altered such that the gap has a predetermined form. The wafers, during machining, may temporarily overhang the gap. The carrier is optionally composed only of a first material, or is completely or partly coated with the first material such that during machining only the first material contacts the working layer, and the first material does not reduce the machining ability of the working layer.

Abstract: A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.

Abstract: In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps of: changing a rotational speed of at least one of the sun gear, the internal gear, an upper polishing plate and a lower polishing plate; measuring rotation torque of a driving motor of at least one of the sun gear and the internal gear; detecting the minimum rotation torque measured in the measuring step; and adjusting the rotational speed of at least one of the sun gear, the internal gear, the upper polishing plate and the lower polishing plate so as to make the rotation torque thereof equal to the minimum rotation torque or running rotation torque, the running rotation torque being greater by a prescribed value than the minimum rotation torque.

Abstract: A method for beveling a thin glass plate by simultaneously grinding an edge of the glass using multiple abrasive cup wheels, wherein the edge of the glass plate is extended from the fixturing device. The extension of the glass plate allows the glass plate to bend in response to forces applied by the abrasive cup wheels, thereby reducing the sensitivity of the grinding process to variations in position of the abrasive wheels. The axes of rotation of the abrasive wheels are separated by a distance selected to prevent deflection in the glass plate caused by a first abrasive wheel to influence the deflection in the glass plate caused by a second (adjacent) abrasive wheel.

Abstract: A grinding apparatus for machining a workpiece (6), including an apparatus frame (2) supporting a grinding station (3) with a number of grinding heads (4) with associated grinding elements (5) arranged such that the grinding elements (5) are in contact with one surface (7) of the workpiece at the passage of the workpiece through the grinding apparatus (1), and an endless conveying means (8) for the grinding heads (4), and a roller table (9) for supporting the workpiece (6), where the grinding apparatus (1) includes a further grinding station (10) with grinding heads (4) arranged such that the grinding elements (5) are in contact with the opposite surface (11) of the workpiece at the passage of the workpiece across the roller table (9), where the roller table includes a first (12) and a second set of rollers (13), and where there is an interspace (14) between two set of rollers (12, 13), allowing passage of the workpiece between the two set of rollers (12, 13), wherein spacing (15) between individual rollers (

Abstract: A knife sharpener comprises a base, a motor, a grinding wheel assembly, a rotary shaft and a spring. The working channel between the edge of the grinding disc and the grinding awl is automatically adjustable to accommodate different blade of different thickness. When the knife sharpener performs grinding operation, the grinding wheel assembly can simultaneously grind both cutting sides of the knife. In addition, the knife can be clamped firmly through the three contacting points of the grinding disc, the grinding awl, and the cutting edge, so that the operation of knife grinding can be successfully performed.

Abstract: A method for the simultaneous double-side grinding of a plurality of semiconductor wafers, involves a process wherein each semiconductor wafer lies such that it is freely moveable in a cutout of one of a plurality of carriers caused to rotate by means of a rolling apparatus and is thereby moved on a cycloidal trajectory, wherein the semiconductor wafers are machined in material-removing fashion between two rotating working disks, wherein each working disk comprises a working layer containing bonded abrasive. The method according to the invention makes it possible, by means of specific kinematics, to produce extremely planar semiconductor wafers.

Abstract: In a machine for processing the edges and outer surfaces of flat workpieces, including a machine frame with a workpiece support surface 12 and at least one dressing head 14 with a work tool carrier, which work tool carrier is rotatably supported on the machine frame for rotation about a first axis perpendicular to the workpiece support surface 12 and is driven by a drive, and which work tool carrier carries at least two work tools 32 rotatably supported eccentrically to the first axis on the work tool carrier each for rotation about a second axis perpendicular to the workpiece support surface 12, and each of which tools is connected with a planet gear 44 which stands in meshing drive engagement with a sun gear 26 coaxial to the first axis so that each circulating work tool carrier defines an effective circle 46 of its work tools 32, with at least two dressing heads 14 being so arranged next to one another that the effective circles 46 of their work tools 32 overlap, with the movement of the work tool carriers

Abstract: A dressing device for sharpening or conditioning of a blade or the like includes one or more disk pairs each having a pair of disks respectively presenting a plurality of ribs. The disks are oriented in face-to-face relationship with the ribs thereof in meshed, intercalated relationship to thereby create circumferential dressing openings. The ribs are configured to create sharpened edge on a knife blade or the like.

Abstract: A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned between the hydrostatic pads. At least one sensor measures a distance between the workpiece and the respective sensor for assessing nanotopology of the workpiece. In a method of the invention, a distance to the workpiece is measured during grinding and used to assess nanotopology of the workpiece. For instance, a finite element structural analysis of the workpiece can be performed using sensor data to derive at least one boundary condition. The nanotopology assessment can begin before the workpiece is removed from the grinder, providing rapid nanotopology feedback. A spatial filter can be used to predict the likely nanotopology of the workpiece after further processing.

Abstract: Devices and systems are provided, that entrain ambient air within a primary stream of pressurised air, for use in a variety of applications including aircraft, buildings and other stationary structures. The ambient air is drawn through an air treatment such a filter before entrainment within the primary stream. The combined streams are then delivered to a ventilation system, an air curtain or other suitable recipient of treated, thermally conditioned air. The systems include air curtain systems and ventilation systems for aircraft and other vehicles.

Abstract: A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned between the hydrostatic pads. At least one sensor measures a distance between the workpiece and the respective sensor for assessing nanotopology of the workpiece. In a method of the invention, a distance to the workpiece is measured during grinding and used to assess nanotopology of the workpiece. For instance, a finite element structural analysis of the workpiece can be performed using sensor data to derive at least one boundary condition. The nanotopology assessment can begin before the workpiece is removed from the grinder, providing rapid nanotopology feedback. A spatial filter can be used to predict the likely nanotopology of the workpiece after further processing.

Abstract: A grinding apparatus and a grinding system capable of efficient and superior grinding performance prevent the falling of a belt during the grinding of an edge surface thereof. The apparatus includes two rotating bodies 31 and 32 each having segment brushes 4, 4, . . . attached in the circumferential direction at the edge thereof. The rotating bodies 31 and 32 are rotated in the same direction. The tip of the segment brushes 4, 4, . . . is opposed to one edge surface of a belt b stretched between a driving roller 21 and a driven roller 22. The segment brushes 4 of the two rotating bodies enter toward the belt b at appropriate locations on the one edge surface, such that the falling of the belt can be prevented. A grinding apparatus 1 includes a grinder 3 consisting of the rotating bodies 31 and 32, and a holder consisting of the rollers 21 and 22 and a casing 23 by which the rollers are rotatably supported.

Abstract: A surface grinding machine for a sintered rare earth magnetic alloy wafer comprises a pair of disk-shaped grindstones that face each other across a prescribed gap to be rotatable in opposite directions about their center axes. The grinding surfaces of the pair of grindstones and the center axe inclination of one grinding stone are configured to form a planar grinding region A wherein a portion of both of the grinding surfaces of the pair of grindstones lie parallel with a constant intervening gap therebetween. Other portions of the grinding surfaces of the grindstones constitute a wedge-like opening region B that becomes more narrow toward the planar grinding surface A. A feeder to feed the wafers from the wedge-like opening region B toward the planar grinding region A is provided in order to grind both surfaces of the wafers at the planar grinding.

Abstract: Finishing a seal assembly as a unit is proposed, which prevents alignment of the end gaps of the annular body and the annular ring of the seal assembly, provides the ability to manufacture the seal assembly to very low tolerances, and establishes virtually perfect parallelism between the upper and lower surfaces of the seal assembly. A finishing process is characterized by lapping a seal assembly as an assembled unit with a lapper using gritted oil as a polishing medium.

Abstract: A dressing device (10,90) for sharpening or conditioning of a blade (18) or the like includes one or more disk pairs (36–40,108), each having a pair of disks (52,54,110,112) respectively presenting a series of circumferentially spaced, projecting teeth (64) with openings (66) therebetween. The disks (52,54,110,112) are oriented in face-to-face relationship with the teeth (64) thereof in meshed, intercalated relationship to thereby create circumferential dressing openings (76,122). The dressing surfaces (74) of the teeth (64) are of arcuate, concave configuration so as to create a desirable gothic-arch edge on a blade (18) or the like.

Abstract: Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid crystal display panel. The present invention includes a first grinding unit grinding edges of short or long sides of the unit liquid crystal display panel in a normal mode and a second grinding unit grinding the edges of the short or long sides of the unit liquid crystal display panel that are not ground by the first grinding unit in the normal mode or grinding the edges of the long and short sides of the unit liquid crystal display panel in an emergency mode.

Abstract: A tool for polishing knife's edges, the tool (1) comprising two oppositely positioned and co-rotating rings of elongate honing studs (10), extended at intersecting directions forming an angle (?) wherein the knife's edge is inserted to be straightened by the rotating polishing tool.

Abstract: For the machining of a workpiece (18) rotating about a workpiece axis, a first abrasive tool (20), which rotates about a first tool axis, and the workpiece (18) are advanced towards one another, in order to machine a first workpiece face in a first abrasive operation. Further, a second abrasive tool (54), which rotates about a second tool axis (56), is advanced towards the workpiece (18), in order to machine a second workpiece face in a second abrasive operation. The two workpiece faces are designed rotationally symmetrically with respect to the workpiece axis and are arranged adjacently to one another in such a way that a sharp, burr-free, circular transition edge is formed between them. The two abrasive operations are controlled in such a way that they are terminated at the same time.

Abstract: A method and apparatus for a circular grinding of a workpiece having first and second workpiece faces which are rotationally symmetrical with respect to the workpiece axis and which form a circular transition edge between them are provided. The workpiece rotating about its axis and a grinding wheel rotating about a grinding-wheel axis are advanced towards one another. During grinding, an auxiliary abrasive tool, which rotates about an auxiliary-tool axis and has a plane abrasive surface arranged at right angles to the auxiliary-tool axis, is pressed against the workpiece in such a way that the abrasive surface is arranged in a tangential plane to the second workpiece face and touches the second workpiece face along a contact line. The plane abrasive surface projects in the direction of the contact line away from the second workpiece face beyond the transition edge.

Abstract: A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.

Abstract: In a vertical type of double disc surface grinding machine, an object of this invention is to enable simple adjustment of a parallelism between a grinding surface of a lower grinding wheel and a work end face clamped by a clamping jig of a rotary table, even when a grinding wheel spindle axis is disordered. The vertical type of double disc surface grinding machine is equipped with a pair of grinding wheels 2 & 3 opposing each other in vertical direction and fixed to a pair of vertical grinding wheels 4 & 5 and a rotary table 15 holding a work W and supplying it to a grinding position A1 located between the grinding wheels 2 & 3, and provided on the rotary table 15 with a work clamping jig 17 including a rotary shaft 63 which clamps the work W at a specified position and makes it spin itself.

Abstract: A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.

Abstract: A double surface grinding method for a vertical type of double disc surface grinding machine in which upper and lower ground surfaces of a work like a disc brake are ground simultaneously. The entire vertical moving stroke of the grinding wheel includes an idle feed stroke in which the wheel moves at a specified idle feed speed from the waiting position to a detection start position before contacting with the ground surface; a detection stroke in which the wheel moves at a detection speed lower than the idle feed speed from the detection start position to a detection end position after contacting with the ground surface then the wheel detects a grinding start position; and a grinding stroke in which the wheel moves at a grinding speed from the grinding start position to a grinding end position.

Abstract: A sharpener includes a motor driven shaft with at least one slidably mounted sharpening assembly consisting of a supporting hub structure mounted by its central bore hole on the shaft. The hub structure supports a symmetrically shaped rotating surface containing an ultra fine abrasive material. The rotating surface is pressed with a force of less than 0.2 lb. by a spring action to make sustained rotating abrading contact with a facet of a knife positioned by a knife guide to align the facet into contact with the surface containing the abrasive materials.

Abstract: A method and apparatus for automatically loading and unloading wafer crystals to and from a double-sided polishing machine of the type having an upper and a lower polishing plate, runner disks with reception openings for the wafer crystals, and a drive to move runner disks to a predetermined loading and unloading position. The position of the centers of the reception openings in a runner disk located in the loading position is measured and stored by means of an optical identification system. A gripping means of a robot arm is successively oriented towards the measured center positions of the reception openings, and the position of the centers of the individual openings is determined and stored by first and second optical identification systems. The individual wafer crystals are tilted while being inserted by the gripping means of the loading arm into the reception openings.

Abstract: There is provided an apparatus for polishing a substrate, including (a) a polishing pad formed with a plurality of through-holes through which polishing material is supplied to a surface of the polishing pad, (b) a level block on which the polishing pad is mounted, and (c) a rotatable carrier for supporting a substrate thereon, the carrier being positioned in facing relation with the level block, the level block being rotatable around a rotation axis thereof with the rotation axis being moved along an arcuate path, and causing the polishing pad to make contact with the substrate for polishing the substrate, the polishing pad having a first ring-shaped region concentric thereto where no through-holes are formed. For instance, the first ring-shaped region has a width greater than 10%, but smaller than 95% of a radius of the polishing pad. The apparatus enhances uniformity in polishing a substrate.

Abstract: Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid crystal display panel. The present invention includes a first grinding unit grinding edges of short or long sides of the unit liquid crystal display panel in a normal mode and a second grinding unit grinding the edges of the short or long sides of the unit liquid crystal display panel that are not ground by the first grinding unit in the normal mode or grinding the edges of the long and short sides of the unit liquid crystal display panel in an emergency mode.

Abstract: A double side grinding apparatus comprises a pair of grinding wheels (4), work rotating device (1) and moving device (2).

Abstract: Method for abrading a work piece with a fixed load including a first abrading process in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted in order to apply first pressure to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate and a second abrading process in which the pressure of the cylinder chamber is readjusted in order to to apply second pressure which is higher than the first pressure to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate.