Rotary Disk Patents (Class 451/259)
  • Patent number: 10654146
    Abstract: The present disclosure includes charging members for charging abrasive particles into the surface of a lapping plate. The charging members include one or more channels to permit abrasive slurry to flow through when the charging member is in contact with the lapping plate.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: May 19, 2020
    Assignee: Seagate Technology LLC
    Inventors: Mihaela Ruxandra Baurceanu, Ricky Ray Anderson, Andrew David Habermas, Chea Phann
  • Patent number: 10646976
    Abstract: There is furnished a working tool comprising a rotating shaft (6), a polishing plate (3) mounted on the shaft, an expandable elastomer sheet (4) attached to the polishing plate (3), an abrasive cloth (5) attached to the elastomer sheet (4), and means for pressing the elastomer sheet (4) at a plurality of positions under respective predetermined different pressures such that a lower surface of the abrasive cloth (5) is deformed to the desired inverted convex shape in accordance with differences of pressing force applied to the elastomer sheet (4) at the plurality of positions. A substrate is produced by bringing the inverted convexly deformed surface of the abrasive cloth (5) in contact with a substrate stock, and rotating and moving the working tool for polishing the substrate over a selected area.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: May 12, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoko Ishitsuka, Atsushi Watabe, Masaki Takeuchi
  • Patent number: 10350724
    Abstract: A method includes polishing a wafer on a polishing pad, performing conditioning on the polishing pad using a disk of a pad conditioner, and conducting a heat-exchange media into the disk. The heat-exchange media conducted into the disk has a temperature different from a temperature of the polishing pad.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: July 16, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kei-Wei Chen, Chih Hung Chen
  • Patent number: 10287890
    Abstract: The present invention provides an apparatus and method for processing a component surface by abrading the component surface using an abrasive surface. The apparatus comprises an abrasive surface which is rotatable about an axis extending parallel to said component surface. A support is provided for moving the abrasive surface or the component surface along a computer-generated toolpath and for applying a force between the abrasive surface and the component surface. The support increases the force between the abrasive surface and the component surface from a minimum force to a maximum force as the distance along the toolpath increases to maintain constant material removal from the component surface.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: May 14, 2019
    Assignee: ROLLS-ROYCE plc
    Inventors: Richard Andreou, Wee Kin Teo, Arthur Wee
  • Patent number: 9999957
    Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: June 19, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun-Seok Choi, Chang-Gil Ryu, Geun-Young Song, Ki-Yeon Chu, Jin-Suk Hong
  • Patent number: 9103656
    Abstract: A method for cleaning a skid of a surface roughness tester including the skid provided with a skid aperture in a vertical direction, and a stylus disposed in the skid aperture of the skid and capable of moving in the vertical direction, wherein the surface roughness tester measures surface roughness of an object by moving the skid along a surface of the object. The method includes removing a foreign substance existing in a gap between the skid aperture and the stylus after measuring the surface roughness of the object.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: August 11, 2015
    Assignee: MITUTOYO CORPORATION
    Inventors: Sadayuki Matsumiya, Nobuyuki Hama
  • Publication number: 20150105005
    Abstract: A chemical mechanical polishing system is provided. The chemical mechanical polishing system includes a platen, a load cup, a hub, a first polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup, and a second polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup the second arm rotatable independently from the hub.
    Type: Application
    Filed: October 9, 2014
    Publication date: April 16, 2015
    Inventors: Steven M. ZUNIGA, Chih Hung CHEN, Jay GURUSAMY
  • Patent number: 8986073
    Abstract: A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: March 24, 2015
    Assignees: Tyco Electronics Corporation, Tyco Electronics Raychem GmbH
    Inventors: Ladislaus Kehl, Terry Edward Frye
  • Publication number: 20150079881
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Application
    Filed: August 21, 2014
    Publication date: March 19, 2015
    Inventors: Toru MARUYAMA, Hisanori MATSUO, Yasuyuki MOTOSHIMA
  • Publication number: 20150056892
    Abstract: Disclosed is a polishing pad for chemical-mechanical polishing. The polishing pad has a porous interface and a substantially non-porous bulk core. Also disclosed are related apparatus and methods for using and preparing the polishing pad.
    Type: Application
    Filed: August 14, 2014
    Publication date: February 26, 2015
    Inventors: Robert VACASSY, George FOTOU
  • Publication number: 20150031273
    Abstract: A planarization device includes a planarization pad and a pad conditioner over the planarization pad. The pad conditioner includes a rotatable plate having a lower surface separated from an upper surface of the planarization pad by a predetermined distance and at least one nozzle opening on the lower surface of the rotatable plate.
    Type: Application
    Filed: July 23, 2013
    Publication date: January 29, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Hui-Wen TING
  • Publication number: 20140287661
    Abstract: A pressure module and two polishing fixture modules are herein disclosed for fiber optic polisher, or polishing machine. Said pressure module further includes an adjustable spring between a top turntable and a bottom turntable, which are kinematically connected and driven by at least three pair of drive-pins and drive-bushes. Said pressure module is able to apply an adjustable pressure from bottom of the polishing fixture module. So the Fixture Module could not be floating in the pressure direction and maintain stationary when polishing machine is working. Two different quick-release mechanisms for a flexure polishing fixture module were invented for holding and releasing fiber ferrules or connectors during the polishing process controlled by sets of magnets. It's easy to work, and to protect the fixture flexure from the un-proper torque applied by different operators. The current invention is an improvement over our previous invention.
    Type: Application
    Filed: March 21, 2013
    Publication date: September 25, 2014
    Applicant: Princetel Inc.
    Inventors: Hong ZHANG, Boying B. ZHANG
  • Publication number: 20140273766
    Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Shou-Sung Chang, Takashi Fujikawa, Hung Chih Chen, Paul D. Butterfield
  • Publication number: 20140273765
    Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Shou-Sung Chang, Takashi Fujikawa, Hung Chih Chen, Paul D. Butterfield
  • Patent number: 8795031
    Abstract: An apparatus and method for removing a portion of material from the surface of a ceramic include a table with a rotatable wheel thereon. A pad is disposed on the rotatable wheel such that the pad can remain on the rotatable wheel as the wheel is rotated but is removable from the wheel when not in use. A recrystallized silicon carbide disk is disposed on the pad having sufficient friction to remain on the pad as the wheel and pad are rotated but is removable from the rotatable wheel and pad when not in use.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: August 5, 2014
    Assignee: Saint-Gobain Ceramics & Plastics, Inc.
    Inventor: Gerald A. Wagner
  • Patent number: 8747190
    Abstract: A grout removal tool includes a cover shaped to define a substantially enclosed interior cavity and a grinding assembly designed to simultaneously abrade grout from multiple, non-linear tile joints. The grinding assembly includes a motor-driven shaft that is rotatably coupled to the cover by a pair of ball bearings. The grinding assembly additionally includes two or more grinding elements that are axially mounted on the shaft in a spaced apart relationship, each grinding element including at least one disc-shaped grinding wheel. A vacuum attachment is externally mounted on the cover and is in communication with the interior cavity through a plurality of circular openings formed in the cover in direct alignment with the grinding elements. One end of the vacuum attachment is preferably connected to a vacuum device that forcibly withdraws and contains debris created during the grout grinding process.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: June 10, 2014
    Inventor: Mark Smith
  • Publication number: 20140127975
    Abstract: A robotic surface treatment device includes at least two wheels, at least two electric motors, wherein one electric motor is connected to one corresponding wheel via a motor shaft, at least two treatment pads, wherein at least one treatment pad is attached to a bottom surface of a corresponding wheel, a main controller positioned on top of and in connection with drive controllers positioned on top of each electric motor, a plurality of sensors integrated in the main controller, and a rechargeable battery connected to the main controller. At least one treatment fluid tank may be positioned on the robotic surface treatment device, and at least one treatment fluid tube may extend from a bottom surface of the treatment fluid tank to a bottom surface of the robotic surface treatment device. The sensors may be laser or acoustic sensors configured to create a boundary line for a treatment area.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 8, 2014
    Applicant: Deming Systems LLC
    Inventors: Uday S. Roy, Vishal P. Sheth, Prithwi S. Roy, Shibani Saha, Mohar Roy
  • Patent number: 8702477
    Abstract: A construction of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: April 22, 2014
    Assignee: Toho Engineering
    Inventors: Tatsutoshi Suzuki, Eisuke Suzuki
  • Publication number: 20140057536
    Abstract: A grinding apparatus includes a table, a grinding disk assembled on the table, three support plates for supporting workpieces, three weights, and a mechanism to suspend and lower any of the weights over the grinding disk. The three support plates are assembled on the table and located upon the grinding disk. The lifting mechanism includes a drive cylinder, a board member, a connecting member connecting the drive cylinder and the board member, and three fastening members rotatably attached to the board member, for hooking the weight blocks. The drive cylinder drives the board member bringing with the weight blocks to move towards the support plates until the weight blocks loaded on the support plates, to increase a grinding force.
    Type: Application
    Filed: June 5, 2013
    Publication date: February 27, 2014
    Inventors: XU GONG, BING YU, JIAN-PING JIN
  • Patent number: 8655480
    Abstract: An automated filler production method includes obtaining gap measurement data by measuring a gap between component parts of a structure, delivering the gap measurement data to a data collector function, monitoring incoming filler requirements, updating solid model definitions of the filler, creating portable Machine Control Data (MCD) using the gap measurement data in the form of the updated solid model, delivering the MCD to a filler machining center and machining a filler from a filler substrate using the MCD, while providing status updates as the data progresses through the filler machining process.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: February 18, 2014
    Assignee: The Boeing Company
    Inventors: David Odendahl, Michael Parent, Alan Glasscock, Craig Charlton, Peter Bui, Loren Fiske, Danny Lee Beaman
  • Publication number: 20140038495
    Abstract: A method and system for resurfacing one or more lacrosse balls is provided. The system includes a container, a rotatable member, and a motor. The container is configured to hold the one or more lacrosse balls. The rotatable member includes an abrasive surface configured to scuff the lacrosse balls while in the container, The motor includes a drive shaft coupled to the rotatable member and configured to facilitate rotation of the rotatable member. With this arrangement, the lacrosse balls are positioned over the abrasive surface such that, upon rotation of the rotatable member the abrasive surface scuffs the lacrosse balls to, thereby, resurface the balls.
    Type: Application
    Filed: March 15, 2013
    Publication date: February 6, 2014
    Inventors: Eugene M. McNall, Charles W. McNall
  • Patent number: 8579562
    Abstract: A tool holder (10) for a tool which can rotate about an axis of rotation (D) comprises a clamping shank (18) which, in an end shank region, has a clamping formation (14) with an accommodating opening (16) which is central in relation to the axis of rotation (D) and is intended for accommodating a retaining shank of the tool, there being provided, on the lateral circumference of the accommodating opening (16), at least one clamping surface for securing the retaining shank of the tool with press-fit action. According to the invention, on an axial section which forms an axial bracing section (VA), the tool holder (10) has a bracing arrangement (20) which, at least during operation of the tool holder (10), subjects the tool holder (10) to a bracing force (Vk) with a bracing force component (Vk) acting in the axial direction.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: November 12, 2013
    Assignee: Franz Haimer Maschinenbau KG
    Inventors: Franz Haimer, Josef Haimer, Hermann Kopp
  • Patent number: 8574035
    Abstract: A polishing device for polishing optical lenses having a tiltable base part for directly or indirectly receiving a polishing plate, which base part is connected to a polishing spindle having an axis of rotation D in order to be rotationally driven, wherein a rotary joint for supplying a polishing agent is provided, which rotary joint is at least partly arranged opposite said polishing spindle, relative to the base part, and a coupling element is provided by means of which the rotary joint can be detachably push-fitted or clipped onto a polishing spindle. A method for polishing selected zones of aspherical lenses which are not rotationally symmetric using a polishing plate which is guided by a polishing spindle so as to be tiltable, wherein during polishing, a polishing agent is introduced between said polishing plate and the lens via a rotary joint arranged between said polishing spindle and said polishing plate.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: November 5, 2013
    Assignee: Schneider GmbH & Co. KG
    Inventors: Gunter Schneider, Helwig Buchenauer, Klaus Krämer, Ulf Börner
  • Publication number: 20130273717
    Abstract: The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput.
    Type: Application
    Filed: April 17, 2012
    Publication date: October 17, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien Ling Hwang, Yi-Li Hsiao, Bor-Ping Jang, Hsin-Hung Liao, Lin-Wei Wang, Chung-Shi Liu
  • Publication number: 20130237133
    Abstract: A grinder equipped with a curved motion mechanism to process a working piece to form a double-envelope structure includes a grinding wheel, a driving shaft, a track bracket and a holder. The grinding wheel includes a grinding edge which has a grinding zone in contact with the working piece. The driving shaft drives the grinding wheel spinning. The track bracket holds the driving shaft and is movable in a curved motion against the holder. The driving shaft is coupled with the track bracket via a middle section and driven by the curved motion to tilt against the holder and oscillate about the grinding zone of the grinding wheel as an oscillation center. Thus the invention can process the working piece at varying angles to form a worm with the double-envelope structure and improve process precision.
    Type: Application
    Filed: March 6, 2012
    Publication date: September 12, 2013
    Inventors: Shi-Duang CHEN, Tay-Cheng Kuo
  • Publication number: 20130217310
    Abstract: A wafer processing equipment, for use in operations of cutting and grinding wafers, comprises a driving device and at least one processing wheel. The driving device has a spindle extending therefrom, which can be fitted with a locking member. The processing wheel is coupled to the spindle of the driving device. The processing wheel defines a through hole at a center thereof, whereby the spindle of the driving device can be inserted through the through hole of the processing wheel to be fitted with the locking member, so that the processing wheel can be securely coupled to the spindle. The processing wheel can be selected to be a cutting wheel or a grinding wheel. As such, only one set of wafer processing equipment is adequate in performing both of cutting and grinding operations, thereby reducing the working space required for processing wafers and lowering the manufacturing cost.
    Type: Application
    Filed: February 21, 2012
    Publication date: August 22, 2013
    Inventor: CHIH-HAO CHEN
  • Publication number: 20130189908
    Abstract: An edger machine for treating a floor and other surfaces has a housing with a motor and a deck. The motor has a drive shaft extending into an upper deck section of the deck. A pulley is positioned forward of the drive shaft, and a drive belt connects the drive shaft to the pulley. The pulley is constructed to mount a resurfacing disc in a lower deck section of the deck. A pair of guide wheels is mounted on an upper surface of the lower deck section adjacent the upper deck section. The guide wheels are rotatable about a vertical axis and positioned such that the wheels can roll against a vertical surface.
    Type: Application
    Filed: January 23, 2012
    Publication date: July 25, 2013
    Applicant: Onfloor Technologies, L.L.C.
    Inventors: Timothy A. Strickland, Seth Kacur
  • Publication number: 20130183890
    Abstract: A processing apparatus including a holding unit having a holding surface for holding a platelike workpiece and a processing unit for processing the workpiece held by the holding unit. The processing unit includes a processing wheel opposed to the holding surface of the holding unit, a wheel mount having a supporting surface for detachably supporting the processing wheel, a rotating shaft connected to another surface of the wheel mount opposite to the supporting surface, a housing for rotatably supporting the rotating shaft, a mount cover provided on the housing so as to cover the wheel mount with a predetermined gap defined between the mount cover and the wheel mount, the mount cover having a cleaning water inlet communicating with the predetermined gap, and a cleaning water source connected to the cleaning water inlet.
    Type: Application
    Filed: December 11, 2012
    Publication date: July 18, 2013
    Applicant: DISCO CORPORATION
    Inventor: Disco Corporation
  • Patent number: 8439725
    Abstract: With a method for the production of a precise prefabricated concrete part, especially in the form of a sleeper or a plate for a fixed track for rail-guided vehicles, the prefabricated concrete part is ground at the functionally relevant points to the predetermined size by means of a grooved roller. The device for this is a grinding machine with a grooved roller to grind the prefabricated concrete part at functionally relevant points to a predetermined size. The grooved roller is made of a wear resistant material, especially silicon carbide.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: May 14, 2013
    Assignee: Max Bogl Bauunternehmung GmbH & Co. KG
    Inventor: Stefan Bögl
  • Publication number: 20130090040
    Abstract: The rotary platens used here for high speed lapping are light in weight and low in mass inertia to allow fast acceleration and deceleration of the platens. The use of cast aluminum materials that are adhesively bonded together provides very rigid platens that have precision-flat surfaces that are dimensionally stable over long periods of time. Use of hardened spherical bead coatings on the surfaces of the platens provides wear-resistant coatings that are easy to apply and to maintain. The platens are constructed using ribs that provide very substantial stiffness and yet are light in weight which allows relatively small motors to be used to drive the platens. Platens are also constructed where the platen mass center is offset a very small distance from the center of rotation of the spherical-action bearings that support the platens to prevent dynamic distortion of the platen abrasive surface due to platen out-of-balance forces.
    Type: Application
    Filed: October 25, 2011
    Publication date: April 11, 2013
    Inventor: Wayne O. Duescher
  • Publication number: 20130072096
    Abstract: The present disclosure relates to an internal gear grinding machine having a grinding arm at which a grinding spindle is arranged and having a measuring head, wherein the measuring head advantageously includes a measuring sensor. Furthermore, in accordance with the present disclosure, the measuring head is movable from a grinding position into a measuring position via a linear guide.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 21, 2013
    Applicant: LIEBHERR-VERZAHNTECHNIK GMBH
    Inventor: Christian Hoerner
  • Publication number: 20130072095
    Abstract: The present disclosure relates to an internal gear grinding machine with a grinding arm, on which a grinding spindle is arranged, and with an adjustable coolant nozzle, wherein the coolant nozzle is adjustable via a drive.
    Type: Application
    Filed: September 12, 2012
    Publication date: March 21, 2013
    Applicant: LIEBHERR-VERZAHNTECHNIK GMBH
    Inventor: Christian Hoerner
  • Publication number: 20130065493
    Abstract: A method of monitoring a thickness of a conductive film on a substrate during polishing of the substrate with use of an eddy current sensor is provided. This method includes: polishing the conductive film by pressing the substrate against a polishing surface on the rotating polishing table; obtaining output signal of the eddy current sensor during polishing; calculating an amount of output adjustment of the eddy current sensor using the output signal obtained when the substrate is not present above the eddy current sensor; with use of the amount of output adjustment, correcting the output signal obtained when the substrate is present above the eddy current sensor; and monitoring the thickness of the conductive film based on the corrected output signal.
    Type: Application
    Filed: July 31, 2012
    Publication date: March 14, 2013
    Inventor: Taro TAKAHASHI
  • Publication number: 20130052921
    Abstract: Edges of panels, such as glass panels, are ground and polished using grinder wheels that are cooled and lubricated with a coolant. A coolant deflector is utilized to help prevent coolant, which may contain panel particles or abrasives, from entering between the panel and a conveying mechanism that transports the panel.
    Type: Application
    Filed: August 29, 2012
    Publication date: February 28, 2013
    Inventor: Daniel Burgard
  • Publication number: 20130029567
    Abstract: An apparatus for machining an elongated workpiece with a tool a support column having a generally planar and vertical front wall and a pair of generally planar, parallel, and vertical side walls projecting rearward from respective outer edges of the front wall. A workpiece holder on the front wall can hold the workpiece forward of the front wall in a vertical orientation. A vertical guide secured to one of the side walls carries a vertical slide shiftable along the vertical guide. A front horizontal guide on the vertical slide forward of the front wall from the guide carries tool holder shiftable in the front horizontal guide on the vertical slide forward of the front wall and is adapted to hold the tool.
    Type: Application
    Filed: July 23, 2012
    Publication date: January 31, 2013
    Inventor: Norbert HESSBRUEGGEN
  • Publication number: 20130023188
    Abstract: A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.
    Type: Application
    Filed: July 21, 2011
    Publication date: January 24, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Hsiu Wei, Kei-Wei Chen, Ying-Lang Wang, Chun-Ting Kuo
  • Publication number: 20130005224
    Abstract: A floor care machine is provided that includes a replaceable floor care element that is quickly and easily attached and detached. To attach the floor care element, an operator positions the floor care element under a motor and lifts the element up to a motor interface. The motor interface aligns with a complementary interface of the floor care element.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 3, 2013
    Applicant: Karcher North America, Inc.
    Inventors: Todd Leifheit, Steven Tucker
  • Publication number: 20120315826
    Abstract: The present disclosure discloses a device for measuring physical parameters of a slurry used in a chemical mechanical polishing apparatus and measuring method using the same. The chemical mechanical polishing apparatus comprises a polishing head, a rotary table, a polishing platen and a polishing pad having a through-hole. The device for measuring physical parameters of slurry comprises: a sensor disposed in the polishing platen and adapted to contacted the slurry via the through-hole of the polishing pad for measuring the physical parameters of the slurry; a converter disposed in the rotary table and coupled to the sensor for converting a measuring signal of the sensor into a standard electrical signal; and a processing unit coupled to the converter for acquiring the standard electrical signal to calculate physical parameters of the slurry.
    Type: Application
    Filed: June 7, 2011
    Publication date: December 13, 2012
    Inventors: Xinchun Lu, Dewen Zhao, Yongyong He, Jianbin Luo
  • Publication number: 20120276822
    Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
    Type: Application
    Filed: March 1, 2012
    Publication date: November 1, 2012
    Inventors: Kuo-Len LIN, Chen-Hsiang Lin, Jui-Ho Liu, Chih-Hung Cheng, Ken Hsu
  • Patent number: 8267743
    Abstract: A polishing head for use in a polishing machine for optical surfaces, having an axis of rotation and a base body having a holding structure intended to be arranged at a polishing spindle and having a transport element intended to be held at a tool change arm, the transport element being positionable against a holding element of the tool change arm in order to perform a tool change, wherein at least one locking element is provided which can be positioned against the tool change arm such that a positive and/or non-positive joint results.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: September 18, 2012
    Assignee: Schneider GmbH & Co. KG
    Inventors: Gunter Schneider, Helwig Buchenauer, Stephan Huttenhuis, Ulf Börner
  • Publication number: 20120227765
    Abstract: A system and method for high efficiency floor treating is provided. Embodiments of the floor treating system include a floor treating device with a power source having a rotatable drive shaft with an axis of rotation, a flywheel with an aperture for receiving the drive shaft, a counterbalance connected to the flywheel, and a floor treating attachment located at a distance of at least 0.400 inch from the axis of rotation of the drive shaft. Embodiments of the floor treating method include agitating a cleaning substance using the floor treating device with the floor treating attachment positioned at least 0.400 inch from the axis of rotation of the drive shaft.
    Type: Application
    Filed: May 22, 2012
    Publication date: September 13, 2012
    Inventor: John Franklin Geurkink
  • Publication number: 20120231706
    Abstract: This machine includes a base frame (17) and a lens support (19) mounted on the frame (17) with the lens support (19) having elements (29A, 29B) for driving a lens (15) into rotation around a first axis. It includes a tool holder set (21) including a rotary shaft (39) around a second axis (C-C?) and elements (43) for inclining the first axis (A-A?) with respect to the second axis (C-C?). The rotary shaft (39) bears at least two tools (49, 51) for machining the lens, spaced out along the second axis (C-C?), and a spacer (50) positioned in an intermediate area (55) located between both machining tools (49, 51). The spacer (50) defines an outer surface (57) for machining the lens.
    Type: Application
    Filed: March 8, 2012
    Publication date: September 13, 2012
    Applicant: LUNEAU TECHNOLOGY OPERATIONS
    Inventor: Jean-Jacques VIDECOQ
  • Publication number: 20120171933
    Abstract: A method and apparatus for controlling pressure or forces applied to a substrate in a polishing process is described. In one embodiment, a polishing system is described. The system includes a platen rotatably disposed on a base, the platen having a sidewall and a polishing pad disposed thereon forming an interior volume, and a pad pressure applicator disposed in the interior volume of the platen adjacent the underside of the polishing pad.
    Type: Application
    Filed: December 13, 2011
    Publication date: July 5, 2012
    Applicant: APPLIED MATERIALS, INC.
    Inventor: Hung Chih Chen
  • Publication number: 20120156964
    Abstract: An automated knife sharpening and cleaning system is provided. The system comprises a container body that is configured to hold a utensil holder that is configured to releasably couple to the container body, the utensil holder configured to hold a utensil. The system further includes a drive assembly and a gripper assembly, the gripper assembly being coupled to the drive assembly and the drive assembly being configured to move the gripper assembly within the three-dimensional coordinate space of the container body. The system further includes a grinding assembly that is configured to sharpen the utensil. During operation of the system, the gripper assembly is configured to grip the utensil and remove the utensil from the utensil holder, hold the utensil within the grinding assembly during sharpening, and replace and release the utensil in the utensil holder once the sharpening is complete. Moreover, the system may clean and sanitize the utensil.
    Type: Application
    Filed: December 15, 2011
    Publication date: June 21, 2012
    Inventor: Charles R. Anderson
  • Publication number: 20120142259
    Abstract: A system for grinding surgical needles made of refractory metal alloys such as tungsten-rhenium alloys includes a rotatable grinding wheel having a grinding surface, a layer of a binding material, such as a nickel binding material layer, overlying the grinding surface, and a plurality of abrasive particles, such as ABN600 abrasive particles, embedded within the binding material layer. The abrasive particles are similarly sized and the binding material layer has a thickness that is about 65% of the size of the similarly sized abrasive particles. The system includes a lubricating device adapted to apply a lubricant to an interface between the grinding surface and distal ends of needle blanks and a rotating element coupled with the rotatable wheel for rotating the grinding surface at about 10,000 surface feet per minute.
    Type: Application
    Filed: December 5, 2010
    Publication date: June 7, 2012
    Applicant: Ethicon, Inc.
    Inventor: Michael L. Hamilton
  • Publication number: 20120108146
    Abstract: A rough grinding process grinds the workpiece W supported by the supporting device by the rough grinding wheel until remaining a removed amount for finish grinding being preset, and then finish grinds the removed amount while the workpiece W is continuously supported by the supporting device. The removed amount for finish grinding is set based on at least one of thermal displacement of the multifunction grinding machine and changing amount of grinding force based on the rough grinding wheel. A profile remaining the removed amount for finish grinding is a profile not depending on a profile of the rough grinding wheel.
    Type: Application
    Filed: October 14, 2011
    Publication date: May 3, 2012
    Applicant: JTEKT CORPORATION
    Inventors: Satoshi YAMAGUCHI, Yoshihiro Mizutani
  • Publication number: 20120100780
    Abstract: An abrasive saw having an associated cutting wheel is used for cutting objects. The saw includes a base, a cutting assembly operably mounted to the base and a controller. The cutting assembly includes a pivot shaft, a drive shaft operably mounted to the pivot shaft, a drive, and a drive wheel. A flexible drive element operably connects the drive shaft and a drive wheel. The distance between the drive wheel axis of rotation and the drive shaft axis of rotation is variable to increase or decrease a tension in the flexible drive element. A feed table is operably mounted to the base and is movable forward and rearward in a direction of rotation of the associated cutting wheel. The cutting wheel is lockable in the cutting position and the feed table, with the object secured thereto, is moved, by the controller toward the associated cutting wheel to cut the object.
    Type: Application
    Filed: April 1, 2010
    Publication date: April 26, 2012
    Applicant: ILLINOIS TOOL WORKS INC.
    Inventors: John L. Weingart, Lawrence L. Freson, Michael F. Hart, Arnold Buchanan
  • Publication number: 20120083190
    Abstract: An ultra-low temperature magnetic polishing machine includes a housing defining therein a grinding chamber, a door hinged to the housing and controllable to open/close the grinding chamber, a motor mounted inside the housing below the grinding chamber, a magnetic disc set in between the grinding chamber and the motor and rotatable by the motor to cause an alternative magnetic field in the grinding chamber, a freezer having an output pipeline inserted into the grinding chamber and freezing medium deliverable through the output pipeline into the grinding chamber, a container set in the grinding chamber, and magnetically conductive grinding media put in the container.
    Type: Application
    Filed: January 4, 2011
    Publication date: April 5, 2012
    Applicant: HOLDING ELECTRIC CO., LTD.
    Inventor: Lu-Jung LIAO
  • Patent number: 8133093
    Abstract: A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: March 13, 2012
    Assignee: Strasbaugh, Inc.
    Inventors: Michael Vogtmann, Thomas A. Walsh
  • Publication number: 20120028546
    Abstract: A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpiece includes providing the grinding apparatus including the upper and lower working disks and providing at least one carrier including an outer toothing. The upper and lower working disks are rotated. The carrier is moved between the rotating working disks using a rolling apparatus and the outer toothing on cycloidal paths relative to working layers of the working disks. Loose abrasives are added to a working gap formed between the working layers. A carrier, without workpieces inserted therein, is moved in the working gap so as to effect material removal from the working layers.
    Type: Application
    Filed: July 13, 2011
    Publication date: February 2, 2012
    Applicant: Siltronic AG
    Inventors: Georg Pietsch, Michael Kerstan