Abstract: A sander apparatus for use with a drill press having a chuck defining a drill chuck axis. The sander apparatus includes a base assembly and a sander assembly supported by the base assembly, the base assembly locating the sander assembly in a predetermined location relative to the drill press chuck, in which a central pin axis of the sander assembly is aligned with the drill chuck axis. When a portion of an upper shaft of the sander assembly is secured in the chuck, rotation of the chuck about the drill chuck axis causes corresponding rotation of a body element of the sander assembly about the central pin axis. The base assembly supports the sander assembly in the predetermined location thereof as a workpiece is engaged with one or more abrasive elements on the body element while the body element rotates about the central pin axis.

Abstract: A control method of a grinding water flow rate during a double side grinding process. A double side grinder used includes a grinding wheel, a feed unit and a water supply device, wherein a water inlet is disposed on the feed unit. The control method includes: prepare for grinding and complete the installation of a workpiece according to an operation procedure of the double side grinder; during a process of double side grinding, the flow rate of the water inlet is set to decrease with the shortening of the teeth length of the grinding wheel, with the flow rate of the water inlet being set to have a linear relationship with the teeth length of the grinding wheel.

Abstract: A method and apparatus for insitu adjustment of wafer slip detection during work piece polishing are disclosure. In one aspect, a chemical mechanical planarization (CMP) system, includes: a carrier configured to retain a substrate, a platen supporting a polishing pad, and a slip sensor configured to generate a signal indicative of a characteristic of a surface of the polishing pad. The system further includes a processor configured to: receive the signal from the slip sensor, calibrate a steady-state value of the signal when the CMP system is in a steady-state condition, compare the signal received from the slip sensor to the calibrated steady-state value during CMP polishing, and detect wafer slip in response to the signal received from the slip sensor during the CMP polishing differing from the calibrated steady-state value by more than a threshold value.

Abstract: A cement surface grinding device includes a central disk which is extended upwards with a central shaft; the central disk being rotary with respect to the central shaft; at least one outer rotary disk arranged around the central disk; a bottom of the outer rotary disk being installed with a grinding sheet; and a rotary frame arranged above the central disk and the at least one outer rotary disk; the rotary frame including a connecting frame and a plurality of connecting rods; an upper side of the central shaft being connected to a central hole of a seat and the seat being connected to a lower side of the connecting frame; each outer rotary disk being formed with an outer belt wheel and the central disk being formed with a connecting element; and a belt winding around the connecting element and the outer belt wheel.

Abstract: A hand-held machine tool having a, in particular rod-shaped, handle element for an operator to grasp and having a machining head, which is movably mounted on the handle element by means of a joint assembly and which has an electric drive motor for driving a tool holder for holding a machining tool, wherein a bottom side of the handle element and a machining side of the machining head face a workpiece in a base position of the machining head, wherein the joint assembly is connected to the machining head in an articulated-connection region of the machining head, wherein a flexible suction hose for conducting a suction flow from the machining head to the handle element extends between the handle element and the machining head, which suction hose is fastened to an end region of the handle element by means of a first hose end and to a suction connection of the machining head by means of a second hose end.

Abstract: A cleansing device is proposed. The cleansing device may include an inner cleansing part coming into close contact with a cleansing target; an outer cleansing part provided outside the inner cleansing part; and a rotating part configured to rotate the inner cleansing part and the outer cleansing part relative to each other. The inner cleansing part and the outer cleansing part have at least one contact point.

Abstract: A grinding machine for grinding a surface of an object is described which has a plurality of grinding brushes which are rotatably mounted about a brush axis of rotation, at least one brush carrier on which at least one of the grinding brushes is mounted and which is rotatably mounted about a carrier axis of rotation, and a conveying device for conveying the object at a feed speed through the grinding machine. The grinding machine has an input device and an output device. A brush rotational speed about the brush axis of rotation and/or a carrier rotational speed about the carrier axis of rotation and/or the feed speed is/are adjustable by the input device, and an expected grinding result can be output by the output device.

Abstract: A polishing apparatus includes a polishing unit having a spindle having an axial bore defined therein, a housing by which the spindle is rotatably supported, a polishing pad mounted on an end of the spindle and having an opening defined therein that is held in fluid communication with the axial bore, a slurry supply pipe inserted in the axial bore in the spindle and having a supply port supplying a slurry to the workpiece held on the chuck table and an inlet port remote from the supply port, introducing the slurry into the slurry supply pipe, a slurry introducing unit connected to the inlet port of the slurry supply pipe, introducing the slurry into the inlet port, and a cleaning water introducing unit connected to the inlet port of the slurry supply pipe, introducing cleaning water into the inlet port.

Abstract: The present invention provides a wafer polishing apparatus, including: a surface plate having a polishing pad attached on an upper surface thereof; a slurry injection nozzle configured to inject slurry toward the polishing pad; at least one polishing head configured to accommodate a wafer and rotate at an upper portion of the surface plate; an index configured to support so as to connect the at least one polishing head at an upper portion thereof; and a particle suction part coupled to the index and configured to suck particles generated during polishing of the wafer.

Abstract: The present disclosure includes charging members for charging abrasive particles into the surface of a lapping plate. The charging members include one or more channels to permit abrasive slurry to flow through when the charging member is in contact with the lapping plate.

Abstract: There is furnished a working tool comprising a rotating shaft (6), a polishing plate (3) mounted on the shaft, an expandable elastomer sheet (4) attached to the polishing plate (3), an abrasive cloth (5) attached to the elastomer sheet (4), and means for pressing the elastomer sheet (4) at a plurality of positions under respective predetermined different pressures such that a lower surface of the abrasive cloth (5) is deformed to the desired inverted convex shape in accordance with differences of pressing force applied to the elastomer sheet (4) at the plurality of positions. A substrate is produced by bringing the inverted convexly deformed surface of the abrasive cloth (5) in contact with a substrate stock, and rotating and moving the working tool for polishing the substrate over a selected area.

Abstract: A method includes polishing a wafer on a polishing pad, performing conditioning on the polishing pad using a disk of a pad conditioner, and conducting a heat-exchange media into the disk. The heat-exchange media conducted into the disk has a temperature different from a temperature of the polishing pad.

Abstract: The present invention provides an apparatus and method for processing a component surface by abrading the component surface using an abrasive surface. The apparatus comprises an abrasive surface which is rotatable about an axis extending parallel to said component surface. A support is provided for moving the abrasive surface or the component surface along a computer-generated toolpath and for applying a force between the abrasive surface and the component surface. The support increases the force between the abrasive surface and the component surface from a minimum force to a maximum force as the distance along the toolpath increases to maintain constant material removal from the component surface.

Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.

Abstract: A method for cleaning a skid of a surface roughness tester including the skid provided with a skid aperture in a vertical direction, and a stylus disposed in the skid aperture of the skid and capable of moving in the vertical direction, wherein the surface roughness tester measures surface roughness of an object by moving the skid along a surface of the object. The method includes removing a foreign substance existing in a gap between the skid aperture and the stylus after measuring the surface roughness of the object.

Abstract: A chemical mechanical polishing system is provided. The chemical mechanical polishing system includes a platen, a load cup, a hub, a first polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup, and a second polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup the second arm rotatable independently from the hub.

Abstract: A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

Abstract: Disclosed is a polishing pad for chemical-mechanical polishing. The polishing pad has a porous interface and a substantially non-porous bulk core. Also disclosed are related apparatus and methods for using and preparing the polishing pad.

Abstract: A planarization device includes a planarization pad and a pad conditioner over the planarization pad. The pad conditioner includes a rotatable plate having a lower surface separated from an upper surface of the planarization pad by a predetermined distance and at least one nozzle opening on the lower surface of the rotatable plate.

Abstract: A pressure module and two polishing fixture modules are herein disclosed for fiber optic polisher, or polishing machine. Said pressure module further includes an adjustable spring between a top turntable and a bottom turntable, which are kinematically connected and driven by at least three pair of drive-pins and drive-bushes. Said pressure module is able to apply an adjustable pressure from bottom of the polishing fixture module. So the Fixture Module could not be floating in the pressure direction and maintain stationary when polishing machine is working. Two different quick-release mechanisms for a flexure polishing fixture module were invented for holding and releasing fiber ferrules or connectors during the polishing process controlled by sets of magnets. It's easy to work, and to protect the fixture flexure from the un-proper torque applied by different operators. The current invention is an improvement over our previous invention.

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract: An apparatus and method for removing a portion of material from the surface of a ceramic include a table with a rotatable wheel thereon. A pad is disposed on the rotatable wheel such that the pad can remain on the rotatable wheel as the wheel is rotated but is removable from the wheel when not in use. A recrystallized silicon carbide disk is disposed on the pad having sufficient friction to remain on the pad as the wheel and pad are rotated but is removable from the rotatable wheel and pad when not in use.

Abstract: A grout removal tool includes a cover shaped to define a substantially enclosed interior cavity and a grinding assembly designed to simultaneously abrade grout from multiple, non-linear tile joints. The grinding assembly includes a motor-driven shaft that is rotatably coupled to the cover by a pair of ball bearings. The grinding assembly additionally includes two or more grinding elements that are axially mounted on the shaft in a spaced apart relationship, each grinding element including at least one disc-shaped grinding wheel. A vacuum attachment is externally mounted on the cover and is in communication with the interior cavity through a plurality of circular openings formed in the cover in direct alignment with the grinding elements. One end of the vacuum attachment is preferably connected to a vacuum device that forcibly withdraws and contains debris created during the grout grinding process.

Abstract: A robotic surface treatment device includes at least two wheels, at least two electric motors, wherein one electric motor is connected to one corresponding wheel via a motor shaft, at least two treatment pads, wherein at least one treatment pad is attached to a bottom surface of a corresponding wheel, a main controller positioned on top of and in connection with drive controllers positioned on top of each electric motor, a plurality of sensors integrated in the main controller, and a rechargeable battery connected to the main controller. At least one treatment fluid tank may be positioned on the robotic surface treatment device, and at least one treatment fluid tube may extend from a bottom surface of the treatment fluid tank to a bottom surface of the robotic surface treatment device. The sensors may be laser or acoustic sensors configured to create a boundary line for a treatment area.

Abstract: A construction of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered.

Abstract: A grinding apparatus includes a table, a grinding disk assembled on the table, three support plates for supporting workpieces, three weights, and a mechanism to suspend and lower any of the weights over the grinding disk. The three support plates are assembled on the table and located upon the grinding disk. The lifting mechanism includes a drive cylinder, a board member, a connecting member connecting the drive cylinder and the board member, and three fastening members rotatably attached to the board member, for hooking the weight blocks. The drive cylinder drives the board member bringing with the weight blocks to move towards the support plates until the weight blocks loaded on the support plates, to increase a grinding force.

Abstract: An automated filler production method includes obtaining gap measurement data by measuring a gap between component parts of a structure, delivering the gap measurement data to a data collector function, monitoring incoming filler requirements, updating solid model definitions of the filler, creating portable Machine Control Data (MCD) using the gap measurement data in the form of the updated solid model, delivering the MCD to a filler machining center and machining a filler from a filler substrate using the MCD, while providing status updates as the data progresses through the filler machining process.

Abstract: A method and system for resurfacing one or more lacrosse balls is provided. The system includes a container, a rotatable member, and a motor. The container is configured to hold the one or more lacrosse balls. The rotatable member includes an abrasive surface configured to scuff the lacrosse balls while in the container, The motor includes a drive shaft coupled to the rotatable member and configured to facilitate rotation of the rotatable member. With this arrangement, the lacrosse balls are positioned over the abrasive surface such that, upon rotation of the rotatable member the abrasive surface scuffs the lacrosse balls to, thereby, resurface the balls.

Abstract: A tool holder (10) for a tool which can rotate about an axis of rotation (D) comprises a clamping shank (18) which, in an end shank region, has a clamping formation (14) with an accommodating opening (16) which is central in relation to the axis of rotation (D) and is intended for accommodating a retaining shank of the tool, there being provided, on the lateral circumference of the accommodating opening (16), at least one clamping surface for securing the retaining shank of the tool with press-fit action. According to the invention, on an axial section which forms an axial bracing section (VA), the tool holder (10) has a bracing arrangement (20) which, at least during operation of the tool holder (10), subjects the tool holder (10) to a bracing force (Vk) with a bracing force component (Vk) acting in the axial direction.

Abstract: A polishing device for polishing optical lenses having a tiltable base part for directly or indirectly receiving a polishing plate, which base part is connected to a polishing spindle having an axis of rotation D in order to be rotationally driven, wherein a rotary joint for supplying a polishing agent is provided, which rotary joint is at least partly arranged opposite said polishing spindle, relative to the base part, and a coupling element is provided by means of which the rotary joint can be detachably push-fitted or clipped onto a polishing spindle. A method for polishing selected zones of aspherical lenses which are not rotationally symmetric using a polishing plate which is guided by a polishing spindle so as to be tiltable, wherein during polishing, a polishing agent is introduced between said polishing plate and the lens via a rotary joint arranged between said polishing spindle and said polishing plate.

Abstract: The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput.

Abstract: A grinder equipped with a curved motion mechanism to process a working piece to form a double-envelope structure includes a grinding wheel, a driving shaft, a track bracket and a holder. The grinding wheel includes a grinding edge which has a grinding zone in contact with the working piece. The driving shaft drives the grinding wheel spinning. The track bracket holds the driving shaft and is movable in a curved motion against the holder. The driving shaft is coupled with the track bracket via a middle section and driven by the curved motion to tilt against the holder and oscillate about the grinding zone of the grinding wheel as an oscillation center. Thus the invention can process the working piece at varying angles to form a worm with the double-envelope structure and improve process precision.

Abstract: A wafer processing equipment, for use in operations of cutting and grinding wafers, comprises a driving device and at least one processing wheel. The driving device has a spindle extending therefrom, which can be fitted with a locking member. The processing wheel is coupled to the spindle of the driving device. The processing wheel defines a through hole at a center thereof, whereby the spindle of the driving device can be inserted through the through hole of the processing wheel to be fitted with the locking member, so that the processing wheel can be securely coupled to the spindle. The processing wheel can be selected to be a cutting wheel or a grinding wheel. As such, only one set of wafer processing equipment is adequate in performing both of cutting and grinding operations, thereby reducing the working space required for processing wafers and lowering the manufacturing cost.

Abstract: An edger machine for treating a floor and other surfaces has a housing with a motor and a deck. The motor has a drive shaft extending into an upper deck section of the deck. A pulley is positioned forward of the drive shaft, and a drive belt connects the drive shaft to the pulley. The pulley is constructed to mount a resurfacing disc in a lower deck section of the deck. A pair of guide wheels is mounted on an upper surface of the lower deck section adjacent the upper deck section. The guide wheels are rotatable about a vertical axis and positioned such that the wheels can roll against a vertical surface.

Abstract: A processing apparatus including a holding unit having a holding surface for holding a platelike workpiece and a processing unit for processing the workpiece held by the holding unit. The processing unit includes a processing wheel opposed to the holding surface of the holding unit, a wheel mount having a supporting surface for detachably supporting the processing wheel, a rotating shaft connected to another surface of the wheel mount opposite to the supporting surface, a housing for rotatably supporting the rotating shaft, a mount cover provided on the housing so as to cover the wheel mount with a predetermined gap defined between the mount cover and the wheel mount, the mount cover having a cleaning water inlet communicating with the predetermined gap, and a cleaning water source connected to the cleaning water inlet.

Abstract: With a method for the production of a precise prefabricated concrete part, especially in the form of a sleeper or a plate for a fixed track for rail-guided vehicles, the prefabricated concrete part is ground at the functionally relevant points to the predetermined size by means of a grooved roller. The device for this is a grinding machine with a grooved roller to grind the prefabricated concrete part at functionally relevant points to a predetermined size. The grooved roller is made of a wear resistant material, especially silicon carbide.

Abstract: The rotary platens used here for high speed lapping are light in weight and low in mass inertia to allow fast acceleration and deceleration of the platens. The use of cast aluminum materials that are adhesively bonded together provides very rigid platens that have precision-flat surfaces that are dimensionally stable over long periods of time. Use of hardened spherical bead coatings on the surfaces of the platens provides wear-resistant coatings that are easy to apply and to maintain. The platens are constructed using ribs that provide very substantial stiffness and yet are light in weight which allows relatively small motors to be used to drive the platens. Platens are also constructed where the platen mass center is offset a very small distance from the center of rotation of the spherical-action bearings that support the platens to prevent dynamic distortion of the platen abrasive surface due to platen out-of-balance forces.

Abstract: The present disclosure relates to an internal gear grinding machine having a grinding arm at which a grinding spindle is arranged and having a measuring head, wherein the measuring head advantageously includes a measuring sensor. Furthermore, in accordance with the present disclosure, the measuring head is movable from a grinding position into a measuring position via a linear guide.

Abstract: The present disclosure relates to an internal gear grinding machine with a grinding arm, on which a grinding spindle is arranged, and with an adjustable coolant nozzle, wherein the coolant nozzle is adjustable via a drive.

Abstract: A method of monitoring a thickness of a conductive film on a substrate during polishing of the substrate with use of an eddy current sensor is provided. This method includes: polishing the conductive film by pressing the substrate against a polishing surface on the rotating polishing table; obtaining output signal of the eddy current sensor during polishing; calculating an amount of output adjustment of the eddy current sensor using the output signal obtained when the substrate is not present above the eddy current sensor; with use of the amount of output adjustment, correcting the output signal obtained when the substrate is present above the eddy current sensor; and monitoring the thickness of the conductive film based on the corrected output signal.

Abstract: Edges of panels, such as glass panels, are ground and polished using grinder wheels that are cooled and lubricated with a coolant. A coolant deflector is utilized to help prevent coolant, which may contain panel particles or abrasives, from entering between the panel and a conveying mechanism that transports the panel.

Abstract: An apparatus for machining an elongated workpiece with a tool a support column having a generally planar and vertical front wall and a pair of generally planar, parallel, and vertical side walls projecting rearward from respective outer edges of the front wall. A workpiece holder on the front wall can hold the workpiece forward of the front wall in a vertical orientation. A vertical guide secured to one of the side walls carries a vertical slide shiftable along the vertical guide. A front horizontal guide on the vertical slide forward of the front wall from the guide carries tool holder shiftable in the front horizontal guide on the vertical slide forward of the front wall and is adapted to hold the tool.

Abstract: A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.

Abstract: A floor care machine is provided that includes a replaceable floor care element that is quickly and easily attached and detached. To attach the floor care element, an operator positions the floor care element under a motor and lifts the element up to a motor interface. The motor interface aligns with a complementary interface of the floor care element.

Abstract: The present disclosure discloses a device for measuring physical parameters of a slurry used in a chemical mechanical polishing apparatus and measuring method using the same. The chemical mechanical polishing apparatus comprises a polishing head, a rotary table, a polishing platen and a polishing pad having a through-hole. The device for measuring physical parameters of slurry comprises: a sensor disposed in the polishing platen and adapted to contacted the slurry via the through-hole of the polishing pad for measuring the physical parameters of the slurry; a converter disposed in the rotary table and coupled to the sensor for converting a measuring signal of the sensor into a standard electrical signal; and a processing unit coupled to the converter for acquiring the standard electrical signal to calculate physical parameters of the slurry.

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: A polishing head for use in a polishing machine for optical surfaces, having an axis of rotation and a base body having a holding structure intended to be arranged at a polishing spindle and having a transport element intended to be held at a tool change arm, the transport element being positionable against a holding element of the tool change arm in order to perform a tool change, wherein at least one locking element is provided which can be positioned against the tool change arm such that a positive and/or non-positive joint results.

Abstract: This machine includes a base frame (17) and a lens support (19) mounted on the frame (17) with the lens support (19) having elements (29A, 29B) for driving a lens (15) into rotation around a first axis. It includes a tool holder set (21) including a rotary shaft (39) around a second axis (C-C?) and elements (43) for inclining the first axis (A-A?) with respect to the second axis (C-C?). The rotary shaft (39) bears at least two tools (49, 51) for machining the lens, spaced out along the second axis (C-C?), and a spacer (50) positioned in an intermediate area (55) located between both machining tools (49, 51). The spacer (50) defines an outer surface (57) for machining the lens.