Abstract: Disclosed is a method for generating settings for machining an optical lens, including: a) acquiring a file characterizing the shape to which the optical lens must be machined in order to allow it to be mounted in a spectacle frame; b) decomposing the shape into a plurality of distinct objects, including an exterior envelope inside of which all the other objects are located; c) determining a machining order of the other objects; and d) generating the machining settings depending on the machining order.

Abstract: A substrate cleaning apparatus includes a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces, a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces, and a rotation driving part to rotate the porous suction part.

Abstract: Disclosed herein is a tarp motor assembly for a truck bed that utilizes both a worm drive, comprising a worm gear and a worm screw which is arranged directly on a motor-driven armature shaft of an electric motor, and a spur gear transmission, which is driven by the worm drive and connected to an output shaft, to control spooling of a tarp over the truck bed.

Abstract: A device for producing a reproducible identification pattern of a polished gemstone includes light directing means for directing a focused beam of light onto a gemstone orientated in a particular known manner to produce an output of the internal refraction and reflection characteristics of the gemstone including reflected light beams having particular locations, sizes and intensities. The device also includes automated means for changing a position of the gemstone relative to the focused beam of light; and also a means for recording the output in a manner to record the relative size and location of the reflected light beams.

Abstract: A smoking accessory kit system facilitates the process of hand-rolling cigarettes, cigars or the like. The system includes a primary tray having a bottom wall and a perimeter wall coupled to and extending upwardly from the bottom wall. A top edge of the perimeter wall defines an access opening into an interior of the primary tray. A plurality of magnets is attached to the primary tray. A plurality of attachments is magnetically attachable to the primary tray.

Abstract: A lapping tool for lapping a wafer section in a well controlled manner, has a head with an actuator for bending the row tool, and a force multiplier coupled between the actuator and row tool to multiply the force generated by the actuator for application of greater bending force to the row tool than can be generated by the actuator. Furthermore, at least two actuators, which are controlled together, simultaneously apply force to one force multiplier, so as to further increase bending force. The increase in available force permits the use of a row tool of a ceramic or other material that is substantially stiffer than stainless steel, such as a row tool having a coefficient of thermal expansion that is substantially similar to that of the rowbar itself. The tool further includes structures for tilting or otherwise orienting the wafer section relative to the lapping plate.

Abstract: A tip of a capillary used for microinjection is polished on a plurality of sides by using a polishing plate having a surface roughened by dry etching. A first side of the tip is placed on the polishing plate at a predetermined angle and with a predetermined amount of pressing. The polishing plate is repeatedly moved at a predetermined speed by a predetermined distance such that the first side is polished. The capillary is then rotated around an axis thereof to obtain a second side of the tip, and the process of polishing is repeated for the second side.

Abstract: A bed-type circular saw blade grinder includes: a bed section; a support section fixedly connected with the bed section, a circular saw blade being rotatably connected with the support section; a rotary seat pivotally disposed on the bed section via a pivot shaft and reciprocally rotatable about the pivot shaft between a first position and a second position, the rotary seat having a first connection section and a second connection section positioned on two sides of the pivot shaft; a circular saw blade restriction section disposed at the first connection section for driving the circular saw blade to intermittently rotate; and a grinding unit disposed at the second connection section for grinding saw teeth. When the rotary seat is pivotally rotated between the first and second positions, the rotary seat drives the circular saw blade restriction section and the grinding unit to move with the rotary seat.

Abstract: A lapping tool for lapping a wafer section in a well controlled manner, has a head with an actuator for bending the row tool, and a force multiplier coupled between the actuator and row tool to multiply the force generated by the actuator for application of greater bending force to the row tool than can be generated by the actuator. Furthermore, at least two actuators, which are controlled together, simultaneously apply force to one force multiplier, so as to further increase bending force. The increase in available force permits the use of a row tool of a ceramic or other material that is substantially stiffer than stainless steel, such as a row tool having a coefficient of thermal expansion that is substantially similar to that of the rowbar itself. The tool further includes structures for tilting or otherwise orienting the wafer section relative to the lapping plate.

Abstract: An apparatus 40 for sharpening a router or shaper bit 12 of the type having a flat cutting face 18. The apparatus 40 includes a chuck 64 holding the cutting bit 12. A grinding wheel 108 has a flat grinding face 110 and a grinding wheel shaft 116 on which the grinding wheel 108 rotates. A chuck support supports the chuck 64 and positions it so that the bit cutting face 18 is in a plane parallel to and in front of the flat face 110 of the grinding wheel 108. A side adjustment plate 46 has an index dial by which the side adjustment plate 46 is moved incrementally, in small amounts, to move the cutting face 18 of bit 12 into and against the grinding wheel face 110 during the grinding process. A carriage plate 44 permits moving the bit 12 back and forth in a plane perpendicular to the grinding wheel shaft. A laser 314 directs a beam onto a mirror 318 affixed to the bit cutting face 28.

Abstract: The emery wheel grinding machine with adjustable drill bit chuck disclosed herein has an adjustable chuck in which is provided with a T-bushing having an outer flange formed at one end thereof. The outer flange is provided with several pairs of stop traps along its circumference, whereas the number of stop traps are determined according to the number of cutter blades to be shaved. Several stop pins are formed on the surface of the outer flange to control the turning angle of the drill bit or the cutter. The T-bushing further has a taper hole in it. When the chuck head which holds the drill bit or the cutter is inserted into the taper hole, the cutter blade can be in contact with the emery wheel with a certain tilted angle thereby allowing the cutter blades of various length and number to be effectively shaved, ground and finished.

Abstract: A dual position sharpening device can be set up so that the abrasive wheel is either vertical or horizontal. A guard retains cooling water in either position.

Abstract: A rotary blade sharpener is comprised of a motorized platen positioned in a housing with a surrounding wall and an open top. An abrasive sheet with an adhesive bottom surface is adhered to a disc, which is tightened to the platen by a knob. The disc is color coded to indicate the grit of the abrasive sheet. An adjustable support rack is hinged to the housing above the platen. A jig is positioned on the rack and arranged to slide side to side thereon. The jig is arranged to receive and securely hold a blade and position it against the abrasive sheet. The rack is adjustable to position a beveled front end of the blade flat on the abrasive sheet. A lubricant container with a drip tube is attached to the housing. A cutout in the surrounding wall is arranged to enable grinding a flat side of the blade.

Abstract: A polishing machine for polishing a periphery of a sheet of the present invention comprises a grinding shaft tilting mechanism (1) capable of changing a tilting angle of a rotary shaft of a grinding stone (3) with respect to a rotary shaft of the sheet (2) and also capable of changing its tilting direction. Accordingly, in a recess portion or a protrusion portion in the periphery, when the tilting direction is changed while the tilting angle is being maintained, chamfering (polishing) can be executed with high accuracy in the same manner as that of the outer circumferential portion of the sheet.

Abstract: To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining work of the object to be machined, specifically a correcting mechanism for deforming the object to be machined together with a jig holding the object to be machined is provided in a machining apparatus. The correcting mechanism includes a base, a plurality of levers provided at first ends with pins, a shaft fixed to the base for rotatably supporting the levers, and a plurality of correcting drive means coupled to second ends of said levers for pivoting the levers to the shaft to thereby pivoting the pins.

Abstract: A powered sharpening system utilizing a turntable to rotate reversible, interchangeable platters carrying different grades of abrasive for grinding, polishing and lapping woodworking and other edge tools to be sharpened that are secured in a tool holder that contacts a reference surface on a tool rest to facilitate formation of bevels and micro-bevels at desired angles. Use of a platter of a first thickness followed by a thinner platter enables automatic formation of a micro-bevel without any adjustment in the tool holder, tool rest or sharpening technique. The turntable is rotated by an electric motor that also rotates a conventional abrasive wheel or a conventional narrow abrasive belt. The motor is mounted in a base within which a duct is located for coupling to a vacuum system for removing, through ports in the duct, abrasive and metal particles produced in grinding and sharpening. Blades on the underside of the turntable induce airflow through the base to cool the motor and other components.

Abstract: When electric elements are formed on a ceramic bar or the like, the positional displacement of the respective elements occurs due to a division exposing process or the like. An object of the present invention is to provide a device and a method which unify the non-polished portion of the respective elements by conducting polishing while a complicated deformation or the like is given to the ceramic bar. To achieve this object, the ceramic bar or like is held by using a jig, and a plurality of loads are applied to portions of the jig where the ceramic bar or the like is held, to thereby deform the ceramic bar or the like and polish the element in that state. In this situation the load applied points are disposed so as to avoid the boundaries of the division exposure.

Abstract: An interfaced carrier assembly including an interface circuit having printed contacts to provide electrical interface or feedback control for lapping operations. The printed contacts are formed on a base material on the interface circuit and interface with terminal pads on a slider bar supported by a carrier plate for lapping feedback control. The interface circuit is assembled with the carrier plate with contacts on the interface circuit aligned with terminal pads on the slider bar supported by the carrier plate. Alignment of the terminal pads on the slider bar and contacts on the interface circuit are measured by digital cameras for assembly of the interfaced carrier assembly.

Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.

Abstract: The frame of a polishing machine has a disc-shaped polishing table mounted thereon for rotation coaxially about a vertical axis, the table having thereon an upper, generally planar polishing surface for removably supporting thereon a plurality of annular workpiece carriers for rotation therewith and for rotation about their repsective axes relative to the table. The outer peripheral surface of each carrier is disposed to be engaged at angularly spaced points thereabout by a pair of rollers mounted on the frame for rotation about spaced, vertical axes. The output of a single AC electric motor is connected to the table to effect rotation thereof about its vertical axis, and to one roller of each pair thereof to drive the one roller about its axis. The one roller of each such pair thereof is in driving, rolling engagement with the carrier engaged thereby, while the other roller of such pair is rotated by the engaged carrier.

Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage. A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.

Abstract: An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surface of the carrier adapted to support a bar for lapping. The actuator adapted to actuate the carrier at the spaced actuation points and including a plurality of actuation members movably actuated via pressure supplied to the actuation members. The actuation members are supported in spaced staggered relation in chambers in a manifold for bidirectional actuation. The actuation members are spaced relative to the spaced actuation points and are supported relative to the manifold to provide precision actuation for incrementally adjusting the profile of the carrier.

Abstract: A lapping machine for lapping a row bar includes a lap plate for providing a lapping surface, a row tool having a plurality of bend cells formed by defining a plurality of slits, a pressure mechanism for pressing the row tool toward the lapping surface of the lap plate, and a bend mechanism for bending the bend cells of the row tool toward the lapping surface of the lap plate. The bend mechanism includes an air cylinder unit having a plurality of double-acting air cylinders, a plurality of racks operatively connected to the double-acting air cylinders, respectively, a plurality of drive pinions arranged coaxially and meshing with the racks, respectively, each drive pinion having a lever for driving the corresponding bend cell, a plurality of support pinions arranged coaxially and meshing with the racks, respectively, and a guide mechanism for guiding each rack, the respective drive pinion, and the respective support pinion in substantially the same plane.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top ring and having a plurality of stages positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces. The polishing apparatus further includes a plurality of support tables removably held by the respective stages of the rotary transporter for supporting the workpieces, and a pusher for transferring the workpiece between the support table and the top ring.

Abstract: An abrasive machine includes a rotatably driven tool, chucking equipment for holding the work pieces and a feeding device for effecting relative displacement between the work piece and the rotatably driven tool. The machine further includes a tubular cylindrical housing, a shaft provided with a recess, a rotatable outer casing peripherally enclosing the housing, and a lid member connected to the casing and extending radially over a first end of the tubular cylindrical housing such that an inner surface of the lid members faces the first end of the housing. The rotatably driven tool includes abrasive material carried on the inner surface of the lid member. The shaft is arranged such that when the shaft executes an angular displacement, the work piece held by the chucking equipment is caused to approach and contact the abrasive material.

Abstract: Disclosed herein is a lapping machine for lapping a row bar having a plurality of head sliders. The lapping machine includes a lap plate for providing a lapping surface, a row tool having a work surface for pressing the row bar against the lapping surface, and a mechanism for operating the row tool so that a given pressure distribution is produced between the row bar and the lapping surface. The row tool has a plurality of holes arranged along the work surface. The mechanism includes a plurality of pivoted links each having a load point where a force having a direction perpendicular to the work surface is applied to the row tool in each of the holes. Each of the pivoted links further has a support point as the fulcrum and an effort point where a force having a direction substantially parallel to the work surface is received. The ratio of a distance between the load point and the support point to a distance between the effort point and the support point is substantially constant.

Abstract: An end face polishing apparatus is provided in which polishing accuracy is improved, regardless of the length of the ferrule when polishing the end face of the ferrule. The end face polishing apparatus in which a rod-shaped member mounted on a jig plate by a polishing member mounted on the polishing plate which is rotatably and swingably supported to the apparatus body is pressed to be polished; in which the jig plate is provided on either the jig plate or the polishing plate, and the other is slidably contacted by a slidable contact member, and is supported in a state where rotation is regulated on the polishing plate.

Abstract: An abrasive machine includes a rotatably driven tool, chucking equipment for holding the work pieces and a feeding device for effecting relative displacement between the work piece and the rotatably driven tool. The machine further includes a tubular cylindrical housing, a shaft provided with a recess, a rotatable outer casing peripherally enclosing the housing, and a lid member connected to the casing and extending radially over a first end of the tubular cylindrical housing such that an inner surface of the lid members faces the first end of the housing. The rotatably driven tool includes abrasive material carried on the inner surface of the lid member. The shaft is arranged such that when the shaft executes an angular displacement, the work piece held by the chucking equipment is caused to approach and contact the abrasive material.

Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage. A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.

Abstract: A ferrule holder for holding a ferrule in a grinding apparatus, wherein said holder is e.g., substantially spherical in shape or provided with a cardanic mounting device. The ferrule holder has a cut face, a holder recess in the cut face adapted to accept the ferrule, and an attachment mechanism for attaching the ferrule within the holder recess. Moreover, a ferrule grinding apparatus is disclosed with at least one grinding plate for grinding the surface of a ferrule, at least one ferrule holder adapted to hold the ferrule and at least one ferrule positioning mechanism, wherein the ferrule holder and the said ferrule positioning mechanism cooperate together to position dynamically the ferrule such that the face of the ferrule is parallel to the surface of the grinding plate.

Abstract: A polishing holder arm includes a polishing holder mounting/dismounting device having a base section supported by a base plate through a horizontally rotational shaft to permit the device to rotate and move upward from an approximately horizontal position and the other end section engaged with the polishing holder H. The holder H includes a coupling section whose rotation is restricted by the polishing holder arm and which is detachably coupled with the polishing holder mounting/dismounting device at a center. A polishing force applying device A moves between a position where it applies a downward spring urging force to the polishing holder arm and a position where it permits the polishing holder arm to rotate and move upward. With this arrangement, the optical fiber end surface polishing device causes the polishing holder H to be easily mounded and dismounted on and from the polishing holder arm; can adjust a polishing force double and permits the polishing holder arm to jump upward and rotate at least 90.

Abstract: The sharpening device for dental instruments comprises a chuck head holder having an arcuate member to one end of which the chuck head with the chuck is radially attached while the arcuate member is guided in a base of the device. The grinding head with the grinding wheel comprises a grinding head bearing which is rotatable around the mid-perpendicular of the base and includes a pivot which extends in parallel to the surface of the base and on which the grinding head turns, the latter being under the action of a tension spring in such a manner that the grinding wheel surface, which is disposed at an angle with respect to the mid-perpendicular, is pressed against the surface to be treated of the instrument. Moreover, the chucking assembly allows an essentially improved chucking of the instrument due to a thrust bolt which is actuated by an eccentric member and presses the shank of the instrument against the chuck opening. The head of the thrust bolt may be movable in order to adapt to the shape of the shank.

Abstract: A plurality of centering parts 13 corresponding to drill diameters are disposed in a drill centering tool 3 and the drill centering tool 3 is supported at the side of a drill polishing machine 1. A drill 2 to be polished can be easily and accurately centered in the centering part 13 of the drill centering tool 3. In particular, the drill 2 is centered by fitting the front end portion of the spiral drill groove 14 of the drill 2 to a centering pawl 15 of the drill centering tool 3, chucking the centered drill 2 in a drill chuck 4 of the drill polishing machine 1, and polishing by fitting the cutting edge 5 to be polished at the front end of the drill 2 to the polishing surface of a grinder. Even if the drill diameters are different, drills to be polished can be easily centered and polished.

Abstract: A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion.

Abstract: A swing grinding fixture and process for using the same is disclosed that enables a conventional surface grinder to remanufacture a machine tool cutting insert by grinding a predetermined shape into the insert. A quick clamping insert holder coupled to a slide secures the tool insert in the fixture. A precision spindle cartridge is mounted in a rigid fixture body and coupled to the slide to provide the swing motion required to generate the radius to be ground. The rigid fixture body includes a pair of micrometer adjustable stops which limit the arc through which the slide may be swung and control the flank shape ground into the insert. In an alternative embodiment, a sine plate is attached to the fixture body and is used to incline the fixture to a predetermined insert rake angle. In operation, the grinding fixture is securely mounted to the table of a surface grinder and a cutting tool insert is secured in the insert holder.

Abstract: A lapping apparatus for uniformly laps work pieces. The lapping apparatus includes a rotary lapping plate, a lapping base including a plurality of pads contacting the lapping plate, an adapter including first and second surfaces for supporting the mounting base contacting the lapping plate, and a supporting mechanism provided on the lapping base for supporting the second surface of the adapter by a supporting point. As the adapter supporting the work piece is supported on two points on the work piece and one supporting point of the lapping plate, the lapping surface of the work piece may follow as the lapping plate. Accordingly, it becomes possible to uniformly lap the work piece regardless of accuracy of the lapping base.

Abstract: Apparatus and method for grinding semiconductor chips and other specimens prior to microscopic examination thereof by supporting a specimen on a specimen mount, fixing the specimen mount to a lower end of a lower arm, connecting an upper end of the lower arm to a swingable arm by a horizontal pivot which permits the lower arm and specimen mount to move upwardly and downwardly relative to the swingable arm, providing a stop to limit downward movement of the specimen mount relative to the swingable arm when the lower arm reaches a zero position, moving the swingable arm downwardly to lower the specimen to engage an underlying rotatable grinding platen to define a zero position, and continuing to move the swingable arm downwardly beyond the zero position by an amount corresponding to the amount of material to be removed from a lower portion of the specimen so that the stop will prevent removal of additional material.

Abstract: An apparatus for grinding a blade used in, for example, a glass or hedge trimmer including grinder support and a blade mount provided close to each other. The grinder support holds a grinder, which has a round grindstone, in such a manner that the grinding surface of the grindstone can be oriented not only horizontally and vertically but also in an inclined direction so as to meet the action angle of the tooth of the blade; and the blade mount includes a horizontal surface section and a sloped surface section so that the trimmer blade is place thereon when ground by the grindstone held on the grinder support.

Abstract: A device for producing inclines and/or grooves on friction pads, such as brake pads for motor vehicles comprises a table with a mount for the brake pads. The table is linearly moved on a carriage below flat, truncated-conical grind disks which are disposed in pairs and oriented mutually mirror-symmetrical. The table is swivellable about an axis oriented tranversely to the travel direction. The swivel movement is effected by at least one pneumatic cylinder. Control valves or control switches run onto cam ramps on cam bars when the table is driven forward and they initiate the swivel operation of the table. The friction pad is operated on when the table is in the downwardly or upwardly pivoted position, whereby the table is preferably locked in its position during the various grinding operations.

Abstract: A machine is disclosed for forming facets on the surfaces of a plurality of workpieces. The machine is characterized by the presence of a plurality of pin members for holding the workpieces to be faceted against an abrading surface of a lap or an abrading wheel. The pin members are positioned and held together in a contiguous relationship. The machine also includes a mechanism for setting the angular relationship of the pin members relative to the lap or abrading wheel and for causing movement of the pin members away from the lap. An automated lap cooling, moisturizing and working compound supply system is also provided in another embodiment of this invention, for allowing continuous operation of the machine.

Abstract: To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining work of the object to be machined, specifically a correcting mechanism for deforming the object to be machined together with a jig holding the object to be machined is provided in a machining apparatus. The correcting mechanism includes a base, a plurality of levers provided at first ends with pins, a shaft fixed to the base for rotatably supporting the levers, and a plurality of correcting drive means coupled to second ends of said levers for pivoting the levers to the shaft to thereby pivoting the pins.