Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: The present invention relates to a slanting-bed feed processing machine tool of a large propeller. The machine tool comprises a slanting column feed bed, a machine tool spindle, a workpiece rotary worktable, a large propeller and a bed feed mechanism. The present invention coordinates the geometrical relationship between the machine tool and the large propeller to ensure that the slanting column feed bed moves between two blades, thereby reducing the overhang length of the spindle. Different forms of workpiece rotary worktables and bed feed mechanisms are selected according to different slanting column feed beds. Four types of slanting column feed beds are designed, which can be selected, optimized and applied for different processing objects. The present invention enhances the processing stiffness of the spindle and solves the problem of poor processing quality of the large propeller caused by machine tool vibration.

Abstract: A miter saw has a base assembly and a rotatable table disposed on the base assembly. The rotatable table is rotatable about a substantially vertical miter axis and has a substantially horizontal workpiece-supporting plane. A saw assembly is connected to the table and includes a blade. The blade is movable downwardly from a first position where the blade is above the workpiece-supporting plane to a second position where a portion of the blade is below the workpiece-supporting plane. The base assembly has a top surface and a first handle disposed on the top surface, with a first hole on the top surface extending through the base assembly, the first hole being configured to allow a user to extend the user's hand therethrough and grip the first handle.

Abstract: An apparatus for sharpening blades, such as those used for mowing. A rotary grinder is mounted within an extensible, retractable, and rotatable support assembly. Lockable, rotational adjustment of the position of the grinder about three axes, and translational movement along one axis is thereby provided. A spring attached to one end of the assembly counter-balances the weight of the grinder. An adjacent blade holding fixture maintains the workpiece at a predetermined angle for grinding. A toggle clamp, edge alignment keepers, and a registration pin secure the blade in place. An adapter fixture, including a toggle clamp and an alignment recess, attaches to one end of the blade holding fixture. The adapter fixture has an angled shelf to orient and secure smaller, contoured blades requiring a different edge grinding angle. Once the support assembly is adjustably secured, the grinder is moved along the cutting edge of the blade for sharpening.

Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pads positioned about the perimeter of the chuck, wherein each of the one or more polishing pads are movable in a sweep pattern adjacent the substrate receiving surface of the chuck and are limited in radial movement to about less than one-half of the radius of the chuck measured from the perimeter of the chuck.

Abstract: A polishing apparatus connected to a robot arm and used to polish a workpiece includes a bracket, a polishing assembly, and a positioning assembly. The polishing assembly is mounted on the bracket and includes a driver and a polishing plate connected to the driver. The driver is capable of driving the polishing plate to rotate, and defines an annular positioning groove around the spin axis. The positioning assembly includes a first positioning plate and a second positioning plate mounted on the bracket and opposite to the first positioning plate. The first positioning plate and the second positioning plate are clamped into two sides of the positioning groove, whereby the driver is clamped between the first positioning plate and the second positioning plate.

Abstract: A polishing apparatus used in chemical mechanical polishing device is provided. The polishing apparatus includes a polishing plate for holding a wafer to be polished; a polishing pad arm, one end of the polishing pad arm being fixed, another end of the polishing pad arm holding a polishing pad, and the polishing pad arm driving the polishing pad for moving relatively to the wafer; the polishing pad moving relatively to the wafer with drive from the polishing pad arm, and the polishing pad arm ensuring the polishing pad contacting the wafer during movement; and a slurry supply route for supplying polishing slurry between the polishing pad and the wafer during polishing. The present invention also provides a chemical mechanical polishing device. It makes for realizing miniaturization of a chemical mechanical polishing device, saving polishing slurry and improving utilization rate of the polishing pad in the chemical mechanical polishing device to apply the present invention.

Abstract: A disc sander includes a housing having an operation platform for holding a workpiece on a work surface at the operation platform for sanding, a sanding mechanism pivotally mounted on the housing and having a sanding surface for sanding the workpiece, and an angle adjustment unit set between the housing and the sanding mechanism and including two swing plates disposed at two opposite lateral sides relative to the housing and respectively connected to the sanding mechanism so that the sanding mechanism is biasable with the swing plates relative to the housing to change the angle between the work surface and the sanding surface.

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: The present disclosure relates to apparatus for grinding rotary blades, in particular scythe-like blades or circular blades, in particular for machines for slicing food products. The apparatus includes at least one mount for a rotary blade to which the rotary blade can be attached and at least one grinding tool. The grinding tool and the rotary blade attached in the mount are movable relative to one another such that a blade edge extending at the periphery of the rotary blade can be ground by the grinding tool. The apparatus includes a measuring device for determining the extent of the blade edge and a control which is designed to use the determined blade edge extent for controlling the relative movement between the grinding tool and the rotary blade.

Abstract: An apparatus for decoating a solar module includes a rotatable scraper, which is connected to a drive-shaft for driving in rotation and pressing with a pressure-force the scraper onto a surface of the solar module, wherein the rotatable scraper has prongs or teeth with side-faces and end-faces, and wherein the end-faces are embodied as polishing surfaces.

Abstract: A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: An apparatus for applying a lightly scratched surface to a metal sample comprises a motor, a disk, a frame, a motion guidance unit, and a plurality of springs. The motor may provide a rotational motion to the disk which includes abrasive elements configured to create a plurality of microscopic scratches on the surface of the metal sample. The frame may include a bottom wall with an opening in which the motor is positioned. The motion guidance unit may retain the frame and guide the motion of the motor across the surface of the metal sample. The plurality of springs may couple the motor to the bottom wall of the frame in order to suspend the motor within the opening of the bottom wall and to allow lateral motion of the motor and the disk while the motor is rotating.

Abstract: Provided are a substrate polishing apparatus and a method of polishing a substrate using the same. The substrate polishing apparatus includes a substrate supporting member, a polishing unit, and a control unit. The substrate is seated on the rotatable substrate supporting member. The polishing unit includes a rotatable and swingable polishing pad to polish a top surface of the substrate. The control unit controls the substrate supporting member and the polishing unit during a polishing process to adjust a value of a polishing variable adjusting a polishing amount of the substrate according to a horizontal position of the polishing pad with respect to the substrate. Therefore, the substrate polishing apparatus may locally adjust the polishing amount of the substrate to improve polishing uniformity and product yield.

Abstract: A robot positioned welding tip dresser assembly includes a pivot arm pivotally mountable on a welding gun apparatus. The pivot arm is pivotal about a pivot point. A welding tip dresser is mounted on a distal end of the pivot arm. A first retaining tab extends from the pivot arm. The first retaining tab includes an opening extending therethrough. At least one positioning mechanism is disposed relative to the pivot point and is cooperable with the first retaining tab to retain the pivot arm in one of a home position and a working position. The first retaining tab is engagable by end-of-arm tooling of a robot. The end-of-arm tooling is operable to release the positioning mechanism, and movement of the robot moves the pivot arm between the home and working positions.

Abstract: A jig is structured to guide a grinder along the inner surface of the base or cover of a combustion turbine. The jig includes a base having a bottom surface with a plurality of rollers arranged in substantially the same radius as the portion of the casing being repaired. Side rollers locate the base horizontally during movement. A top platform may restrain the base vertically by supporting a pivot block that bears against the rotor of the turbine. The grinder may be moved vertically or horizontally with respect to the base upon which it is secured.

Abstract: One or more high angle grinding units are supported by a carriage mountable on the underside of a rail grinding vehicle. Each grinding unit is attached to the carriage in a manner enabling controllable movement of the grinding units laterally, vertically, and angularly, with respect to the rails, so that a grinding stone rotated by the grinding unit can be operated to grind between a railhead and a closely adjacent rail structure to reform the gauge side of the railhead and the field side of the closely adjacent structure.

Abstract: A circular saw includes a worktable, a mounting seat extending upwardly from the worktable for mounting a motor thereon, a blade supporting unit pivotally mounted on the mounting seat at a pivot end so that an opposite free end is turnable to be close to and away from the worktable, and a saw blade shaft mounted rotatably on the blade supporting unit about a blade axis parallel to an output shaft axis of an output shaft of the motor and having a saw blade mounted thereon. The saw blade shaft is coupled to the output shaft by a drive transmitting unit which transmits driving force of the output shaft to the saw blade shaft so as to rotate the saw blade.

Abstract: A method and apparatus for the sharpening of blades, particularly the blades of a lawnmower are provided. In the present invention, a blade sharpening apparatus with a supporting base comprises a blade retention and positioning mechanism, a blade sharpening mechanism and a guide rod for directing the blade sharpening mechanism laterally across the width of the apparatus. In a preferred embodiment of the present invention, the blade retention and positioning mechanism includes a hand operated crank for rotating the blade support means. Rotation of the blade support means allows for the proper positioning of the blade with respect to the sharpening mechanism so as to generate the correct sharpening angle for the sharpening of the blade. In such embodiment, the sharpening mechanism may be a lightweight, portable grinder mounted onto a supporting plate for movement along and rotation about a guide rod mounted to said supporting base of the apparatus.

Abstract: An edge grinding unit for machines for working the edges of plates in general and of glass sheets in particular comprising at least at one rim of a plate being worked, a grinding wheel which is accommodated in a carousel element provided with a rotatable cage formed by a plurality of circumferentially distributed rollers. The edge grinding unit further comprising an arm for supporting the grinding wheel which provides, for the grinding wheel, a first oscillation axis and a second oscillation axis which are spaced one another and are substantially perpendicular to the advancement plane of the plate.

Abstract: A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers to polish a corresponding number of semiconductor wafers on a single polishing pad in parallel. In one embodiment, the wafer carriers are used to transfer semiconductor wafers between one or more wafer transfer stations and the polishing pad. In other embodiments, one or more wafer transfer arms are used to transfer the semiconductor wafers between the wafer transfer station(s) and the wafer carriers. The CMP apparatus is configured to sequentially process semiconductor wafers to increase the throughput of the apparatus. In addition, the components of the CMP apparatus are arranged such that the footprint of the apparatus is minimized.

Abstract: A pivoting arm cut-off saw is provided having a base, a cutting arm assembly and a lock bar. Cutting arm assembly is pivotally attached to the base and shiftable between a raised and lowered position. A lock bar interposed between the base and the cutting arm is slidably moveable between an unlock position where cutting arm assembly is free to pivot and a locked position in which a locking portion of a lock bar is interposed between a fixed stop on the base and a rotating stop on the cutting arm. The lock bar is provided with a grip portion to be grasped by the user enabling the lock bar to be moved between a pair of limit stops.

Abstract: A pivoting arm cut-off saw is provided having a base, a cutting arm assembly and a lock bar. Cutting arm assembly is pivotally attached to the base and shiftable between a raised and lowered position. A lock bar interposed between the base and the cutting arm is slidably moveable between an unlock position where cutting arm assembly is free to pivot and a locked position in which a locking portion of a lock bar is interposed between a fixed stop on the base and a rotating stop on the cutting arm. The lock bar is provided with a grip portion to be grasped by the user enabling the lock bar to be moved between a pair of limit stops.

Abstract: An end face polishing apparatus is provided in which polishing accuracy is improved, regardless of the length of the ferrule when polishing the end face of the ferrule. The end face polishing apparatus in which a rod-shaped member mounted on a jig plate by a polishing member mounted on the polishing plate which is rotatably and swingably supported to the apparatus body is pressed to be polished; in which the jig plate is provided on either the jig plate or the polishing plate, and the other is slidably contacted by a slidable contact member, and is supported in a state where rotation is regulated on the polishing plate.

Abstract: The sharpening device for dental instruments comprises a chuck head holder having an arcuate member to one end of which the chuck head with the chuck is radially attached while the arcuate member is guided in a base of the device. The grinding head with the grinding wheel comprises a grinding head bearing which is rotatable around the mid-perpendicular of the base and includes a pivot which extends in parallel to the surface of the base and on which the grinding head turns, the latter being under the action of a tension spring in such a manner that the grinding wheel surface, which is disposed at an angle with respect to the mid-perpendicular, is pressed against the surface to be treated of the instrument. Moreover, the chucking assembly allows an essentially improved chucking of the instrument due to a thrust bolt which is actuated by an eccentric member and presses the shank of the instrument against the chuck opening. The head of the thrust bolt may be movable in order to adapt to the shape of the shank.

Abstract: There is described an apparatus for finishing a steel edge (14) of a ski (15) by means of a pot-shaped grinding wheel (1) driven by a motor (2) with an axis of rotation extending transverse to the feed direction (8). To create advantageous constructional conditions it is proposed that the grinding wheel (1) with the motor (2) should be mounted in a frame (7) of a setting means so as to be freely rotatable about a swing axis (a) limited by a stop, which swing axis extends transverse to the feed direction (8) and vertical to the axis of rotation of the grinding wheel (1), and that for setting the grinding wheel (1) against the steel edge (14) the setting means can be swivelled in the direction of the axis of rotation of the grinding wheel (1) about a swivel axis (b) parallel to the feed direction (8) between two working positions on the one hand for the machining surface of the steel edge (14) on the side of the running surface and on the other hand for the outer machining surface of the steel edge (14).

Abstract: A fixture for controllably holding a blade and particularly a scissor or scissor element for precise sharpening and shaping including hollow grind and clamshell (convex) sharpening. The fixture comprises an articulable holding arm with at least two movable joints and an extension portion swivelly attached to one of the joints. The extension portion terminates in a holding member for the scissor or scissor element which holding member is freely concentrically rotatable relative to the longitudinal extension axis of the extension portion. The holding member comprises a clamping element for holding the scissor element parallel to the longitudinal extension axis. The extension portion further comprises a position adjustable stop to limit rotation of the holding member to provide a precise angular holding of the scissor element relative to an adjacent sharpening element.

Abstract: In a stand (1), a work-piece spindle (2) is mounted for rotation around a vertical axis (C). On the stand (1), a slide (3) can be shifted horizontally and on the slide, a work-piece carrier (5) can be swivelled around a vertical axis (C1). On the carrier (5), a slide (6) can be shifted vertically. The slide (6) bears a linear guide element (7) able to be swivelled around a horizontal axis (A) and on which a second slide (8) can be shifted. The slide (8) bears the grinding spindle (axis B) with mounted grinding worm (9). A dressing device (12) is arranged, relative to the axis (C1), opposite the work-piece spindle (2). The machine makes easy operation possible, because all parts to be operated are quite accessible.

Abstract: A method of working a workpiece with an apparatus comprising the steps of holding the workpiece by a holding means, rotating the held workpiece by a rotational means in a direction of a tool to match a rotational axis line of the workpiece with a rotation axis line of the tool, matching a vertical axis of the holding means holding the workpiece with an intersection of a swingable rotation axis line of a means for swingably rotating the tool and the tool rotation axis line, and holding the workpiece above the tool and the working the workpiece by exerting work pressure on the workpiece.

Abstract: This invention relates to an apparatus and method to modify molding machines for producing colored plastic parts using coloring liquid. The apparatus is inserted into and moved longitudinally along an injection molding machine barrel for forming a groove of varying shape and depth in the lower portion of the barrel.