Abstract: An abrasive tape is supplied to a tape head by a tape supply unit and taken up from the tape head by a tape take-up unit. The tape head presses the abrasive tape against a surface of an object under polish, which is rotated by a rotating unit. A tape head pressuring unit utilizes a voice coil motor, for example. Since the tape head pressuring unit generates a pressuring force for pressuring the tape head using the electromagnetic force, it is able to set a minute pressuring force by controlling a drive signal, and to obtain the fine adjustment of the pressuring force easily by controlling the electric signal. Therefore, it becomes possible to press the abrasive tape against the surface of the object under polish with a desired low pressure.

Abstract: An apparatus for reducing non-uniform stretch of a belt used in the CMP system is disclosed. The belt that may be used with the apparatus extends between a first roller and a second roller to define a belt loop with an inner surface and an outer surface to be used for CMP. The apparatus includes a compensating roller that has a first end and a second end where the first end and second end extends a width of the belt. The first end and the second end have a first diameter. The center of the roller has a second diameter that is less than the first diameter. The compensating roller has a symmetrically tapered shape that extends between each of the first end and second end to the center. The compensating roller is positioned inside of the belt loop, and is applied to the inner surface of the belt loop to reduce non-uniform stretch of the belt.

Abstract: A single-sided finishing apparatus is provided having a plurality of finishing stations with rotating transfer stations positioned therebetween. A hold down system presents the edge of the workpiece to the finishing head. The rotating transfer station includes a clamp for grasping a leading corner of a workpiece while rollers continue to drive the workpiece forward, thereby rotating the workpiece 90°.

Abstract: A shaping pulley assembly (6) for a belt notching machine, including on a frame (1) a pair of driving and shaping pulleys (3, 4) for a grinding belt (5), includes a shaping pulley holder element (9) like a fork supported by the frame (1), having a C-shaped body with end brackets (90, 91), a stationary center and a removable counter-center, both being live centers which are housed in respective housings of the end brackets (90, 91), a shaping pulley (4) in the form of a cylindrical roller provided with center holes (42, 43) opposite to each other for fixed center and removable counter-center, respectively on the bases (40, 41) of the shaping pulley.

Abstract: A tubular workpiece notching machine usable for general grinding operations has a worktable (1) whose base plate (10) is pivotally mounted to the frame (6) of the notching machine around a pivotal orthogonal axis (Y—Y) in such a manner that the worktable (1) is movable from a first working position in which the machine vice (2) co-operates with the shaping pulley (3) in recessing ends of tubular workpiece by grinding, to a second working position in which the shaping pulley (3) is used for generally grinding a workpiece. Connecting elements are provided for removably anchoring the base plate (10) of the worktable (1) to the frame (6) in the first working position.

Abstract: A linear chemical mechanical polishing apparatus that is equipped with a programmable pneumatic support platen and a method for controlling the polishing profile on a wafer surface during a linear CMP process are disclosed. The programmable pneumatic support platen is positioned juxtaposed to a bottom surface of a continuous belt for the linear CMP apparatus and positioned corresponding to a position of the wafer carrier so as to force the polishing pad against the wafer surface to be polished. The support platen has a predetermined thickness, a plurality of apertures through the thickness and a plurality of openings in a top surface in fluid communication with a gas source through the plurality of apertures.

Abstract: An invention is provided for removal rate profile manipulation during a CMP process. An apparatus of the embodiments of the present invention includes an actuator capable of vertical movement perpendicular to a polishing surface of a polishing pad. The actuator is further capable of flexing the polishing pad independently of a pad support device. Also included in the apparatus is an actuator control mechanism that is in communication with the actuator. The actuator control mechanism is capable of controlling an amount of vertical movement of the actuator, allowing the actuator to provide local flexing of the polishing pad to achieve a particular removal rate profile. The actuator can also be capable of horizontal movement parallel to the polishing surface of the polishing pad.

Abstract: A sand-belt finishing machine having a sand-belt replacement mechanism includes a support rack, a first roller, a second roller, an upright rod, an elastic member, a sand belt, and a pull lever. When the upright rod is moved by the pull lever to compress the elastic member, the distance between the first roller and the second roller is shortened. When the upright rod is released by the pull lever, the upright rod is returned to its original position by the elastic member, so that the distance between the first roller and the second roller is increased. Thus, the sand belt can be mounted on and detached from the first roller and the second roller rapidly, easily and conveniently, thereby facilitating the user replacing the sand belt.

Abstract: An adjusting device for the sanding drum of a double-drum sander is installed between the opposite ends of the rear grinding drum and the machine frame of a sander for adjusting a rear sanding drum to a most suitable height to match with the size number of the emery of the front sanding drum of the sander so as to carry out abrading with excellent effect.

Abstract: An apparatus for reducing non-uniform stretch of a belt used in the CMP system is disclosed. The belt that may be used with the apparatus extends between a first roller and a second roller to define a belt loop with an inner surface and an outer surface to be used for CMP. The apparatus includes a compensating roller that has a first end and a second end where the first end and second end extends a width of the belt. The first end and the second end have a first diameter. The center of the roller has a second diameter that is less than the first diameter. The compensating roller has a symmetrically tapered shape that extends between each of the first end and second end to the center. The compensating roller is positioned inside of the belt loop, and is applied to the inner surface of the belt loop to reduce non-uniform stretch of the belt.

Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract: An emery polishing machine is provided with plural adjusting devices positioned between the opposite shaft ends of two emery polishing wheels and machine box. The adjusting devices enable the two emery-polishing wheels to be micro-adjusted to move upward and downward independently. Emery paper tapes of different-sized sands can be fitted on the two emery-polishing wheels to carry out rough and fine polishing at the same time. Two dust-collecting pipes are provided at one side of the dust-preventing cover of the machine box, and plural rollers are provided on the dust-preventing cover. Thus, after a wooden board has one side polished, it can be turned over and directly placed on the rollers on the dust-preventing cover to be moved in a feeding opening to have the other side polished. Thus a wooden board is quickly moved with less force and less space.

Abstract: A shaping pulley assembly (6) for a belt notching machine, including on a frame (1) a pair of driving and shaping pulleys (3, 4) for a grinding belt (5), comprises a shaping pulley holder element (9) like a fork supported by the frame (1), having a C-shaped body with end brackets (90, 91), a stationary centre and a removable counter-centre, both being live centres which are housed in respective said housings of the end brackets (90, 91), a shaping pulley (4) in the form of a cylindrical roller provided with centre holes (42, 43) opposite to each other for fixed centre and removable counter-centre, respectively on the bases (40, 41) of the shaping pulley.

Abstract: A polishing head for polishing the end surface of a semiconductor wafer has a driver roller, a driving motor for rotating it, a pair of upper and lower follower rollers one above the other parallel to and horizontally separated from the driver roller and an endless polishing belt around these rollers. As the driving motor causes the polishing belt to run around the rollers, the semiconductor wafer is pushed against the polishing belt between the upper and lower follower rollers. A pair of upper and lower tension-controlling rollers are provided for controlling the tension in the polishing belt between the two follower rollers. At least one of these tension-controlling rollers is movable vertically. A polisher is formed with such a polishing head, a holder for holding and rotating the wafer and an attaching device for attaching the polishing head to the polisher.

Abstract: The invention relates to a circularly-symmetrical metal part (1) having an outer surface (3) which, in axial section, has a general profile made up of a uniform succession of flattened convex arches (4). The invention also relates to a polishing method in which the polishing means move in a tracking motion so as to track the outer surface of the part to be polished, and to apparatus for implementing the polishing method.

Abstract: A grinding machine includes a work table disposed on top of a base, a housing rotatably secured to the base with a shaft and having a roller disposed on one end, a casing has one end secured to the housing and has another roller, a sander belt is engaged over the rollers. The sander belt is adjustable relative to the base and the work table when the housing is rotated and adjusted relative to the base about the shaft. A plate is secured to the base and has a curved slot, the casing has a fastener adjustably engaged in the curved slot of the plate.

Abstract: A tensioning assembly for a polishing belt on a linear chemical mechanical polishing apparatus. The tensioning assembly comprises first and second rollers which are operably engaged by respective air cylinders and exert a selected degree of downward tension on the lower run of the horizontal polishing belt. A third roller biased typically by a spring pushes upwardly on the lower run of the belt between the first and second rollers. Accordingly, the first and second rollers, in conjunction with the third roller, tension the belt on the apparatus to maintain optimum material removal rates and uniformity. The degree of tension exerted on the belt can be varied according to stretching of the belt resulting from prolonged use.

Abstract: A tensioning assembly for a polishing belt on a linear chemical mechanical polishing apparatus. The tensioning assembly comprises first and second rollers which are operably engaged by respective air cylinders and exert a selected degree of downward tension on the lower run of the horizontal polishing belt. A third roller biased typically by a spring pushes upwardly on the lower run of the belt between the first and second rollers. Accordingly, the first and second rollers, in conjunction with the third roller, tension the belt on the apparatus to maintain optimum material removal rates and uniformity. The degree of tension exerted on the belt can be varied according to stretching of the belt resulting from prolonged use.

Abstract: A polishing bar is provided with a plurality of backings that are carried via blocks of impact absorbent material on a bar of greater stiffness. Each backing is shaped with two surfaces at an angle to each other. A polishing tape is disposed over the angled surfaces of each backing. The portion of the polishing tape over the forward surface of the backing is employed to polish the angled edge of the top wafer of a rotating bonded wafer pair.

Abstract: A polishing head for polishing the end surface of a semiconductor wafer has a driver roller, a driving motor for rotating it, a pair of upper and lower follower rollers one above the other parallel to and horizontally separated from the driver roller and an endless polishing belt around these rollers. As the driving motor causes the polishing belt to run around the rollers, the semiconductor wafer is pushed against the polishing belt between the upper and lower follower rollers. A pair of upper and lower tension-controlling rollers are provided for controlling the tension in the polishing belt between the two follower rollers. At least one of these tension-controlling rollers is movable vertically. A polisher is formed with such a polishing head, a holder for holding and rotating the wafer and an attaching device for attaching the polishing head to the polisher.

Abstract: Generally, a method and system for lifting a web of polishing material is provided. In one embodiment, the system includes a platen that has a first lift member disposed adjacent to a first side and a second lift member disposed adjacent to a second side. The platen is adapted to support the web of polishing media that is disposed between the first and the second lift members. A method includes supporting a web of polishing media on a platen between a first lift member and a second lift member and moving at least the first lift member or the second lift member to an extended position relative the platen that places the web in a spaced-apart relation with the platen.

Abstract: A belt tracking mechanism for a belt using machine having a frame, a drive pulley, an idler pulley and a belt trained over the pulleys includes a support member for supporting the idler pulley for rotation about an axis fixed relative to the support member. A mounting stud attached to the support member parallel to the idler pulley axis and threadably engaged with an adjustment knob connects the support member to the frame, the stud being loosely received in an opening in the frame and the knob loosely engaging the frame around the opening on a side of the frame facing away from the support member. A spring biases the support member in a belt tightening direction about the axis of the mounting stud, and the forces imposed on the support member by the belt and spring and mounting stud hold a bend line of the support member, which extends transversly of the support member against the frame.

Abstract: A belt adjusting device of the belt sander comprises a seat on which a driving roller and a driven roller are pivotally mounted. A reduction gear set is mounted on the seat and is driven by a motor. The gear set is provided with a shaft rod capable of turning in the direction perpendicular to the motor spindle and having one end which is disposed in a long slot of a swiveling member. When the shaft rod slides in the long slot, the push portion of other end of the swiveling member is caused to swivel a predetermined angle, so as to push an action rod in constant contact with the swiveling member to act. The action rod is pivoted with the driven roller. When the action rod is pushed, the free end of the driven roller is caused to engage in an up-and-down displacement perpendicular to the motor spindle. The sanding belt can be thus displaced horizontally on the two rollers to adjust automatically the contact position between the sanding belt and a workpiece.

Abstract: A grinding attachment for use in conjunction with hand-held grinding or drilling power tools such as are commonly found around the house, and method for using this attachment. The purpose of the invention is to allow the homeowner and the like to have greater facility in performing surface sanding, grinding, or finish work on pieces of wood and the like. In particular, the goal is to provide proficiency in working with surfaces that are not planar or otherwise simple. By providing an appropriate compound support against which an abrasive belt or the like is to run as it works the surface, it is possible to have a variety of backing shapes ranging from a strictly planar backing to one that allows the abrasive material to take the shape of whatever piece is being pressed against it. The invention derives its motive power from a coupling to a power tool, typically by the insertion of a drive axle of the attachment into the chuck of a hand drill.

Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.

Abstract: A belt adjusting device of the belt sander comprises a seat on which a driving roller and a driven roller are pivotally mounted. A deceleration gear set is mounted on the seat and is driven by a motor. The gear set is provided with a shaft rod capable of turning in the direction perpendicular to the motor spindle and having one end which is disposed in a long slot of a swiveling member. When the shaft rod slides in the long slot, the push portion of other end of the swiveling member is caused to swivel a predetermined angle, so as to push an action rod in constant contact with the swiveling member to act. The action rod is pivoted with the driven roller. When the action rod is pushed, the free end of the driven roller is caused to engage in an up-and-down displacement perpendicular to the motor spindle. The sanding belt can be thus displaced horizontally on the two rollers to adjust automatically the contact position between the sanding belt and a workpiece.

Abstract: A polishing apparatus includes a lapping tape for polishing a surface of a magnetic disc, a tape supply unit for supplying the lapping tape, a varnisher roller for pressing the lapping tape onto the surface of the magnetic disc, and a pressing unit for pressing the lapping tape to the surface of the magnetic disc by way of the varnisher roller. The pressing unit is constituted by a swing lever having the varnisher roller at one end portion, and a balance adjusting unit. The balance adjusting unit sets the pressing force to zero by establishing the balance of the swing lever, and then breaks the balance so as to press the lapping tape to the surface of the magnetic disc by way of the varnisher roller with a desired pressing force.

Abstract: Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped.

Abstract: Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped.

Abstract: A system and method for planarizing a plurality of semiconductor wafers is provided. The method includes the steps of processing each wafer along the same process path using at least two polishing stations to each partially planarize the wafers. The system includes an improved process path exchanging a detachable wafer carrying head with spindles at each processing point and conveying the detached wafer carrying heads in a rotary index table between processing points. The system also provides for improved polishing accuracy using linear polishers having pneumatically adjustable belt tensioning and aligning capabilities.

Abstract: Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped.

Abstract: Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped.

Abstract: Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped.

Abstract: Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped.

Abstract: A belt polishing machine has a moving endless abrasive coated polishing belt that wraps around and travels over a substantial portion of a circumferential surface of a rotatable workpiece for finishing the surface. A drive pulley drives the polishing belt in a continuous path at a desired surface speed over the circumferential surface of the workpiece while the workpiece is being rotated at a desired rotational speed. Guide pulleys direct the polishing belt around and into engagement with a substantial portion of the circumferential surface and may supply tension to the polishing belt during finishing operations. Separate tensioning pulleys may be provided. A coolant feed applies coolant against the polishing belt for separating and carrying away removed material from the belt and cleaning the abrasive for a subsequent pass. A backup shoe may be provided to selectively apply additional pressure through the belt upon portions of the polished surfaces to improve cylindricity.

Abstract: A grinding device includes a grinding member disposed on a base, and a board rotatably supported in the base at a shaft. An axle is rotatably secured in the board for supporting the tools. A spring is coupled between the base and the board for moving the axle and thus the tools toward the grinding member and for allowing the tools to be ground by the grinding member. The grinding member is rotated to grind the tools. A rack is coupled to the axle to rotate the tools for allowing the peripheral portion of the tools to be ground by the grinding member.

Abstract: There is provided a tension adjusting mechanism which can prevent a dancer arm from being widely rotated and a peripheral roller such as a guide roller from early abrading even in the case a wire is tensioned or loosened in accordance with a speed increase or decrease of the wire. A plurality of dancer rollers are rotatably supported to a front end of a rotatable dancer arm. A plurality of guide rollers are disposed in such a manner as to oppose to the dancer rollers, thereby successively guiding one wire on the dancer roller through the guide rollers. A predetermined tension is applied to the wire by rotating and urging the dancer arm to one direction by an urging member.

Abstract: A sizing and finishing machine includes a mechanism for rotating an associated workpiece and a first microfinishing belt for selectively contacting the associated workpiece. The belt has a maximum grit size of 60 microns. A structure is provided for rotatably holding the first microfinishing belt and a housing is provided on which the structure is mounted. A mechanism moves the first housing and hence the first microfinishing belt toward and away from the associated workpiece. The mechanism is timed to the rotation of the associated workpiece to maintain a substantially constant pressure of the first microfinishing belt on the associated workpiece. If desired, a second microfinishing belt mounted separately on a second housing can be provided with the two housings and their respective belts being separately controlled. The force exerted by the microfinishing belt on the associated workpiece is limited to a pressure of less than approximately 25 psi.

Abstract: A polishing apparatus has a spindle disposed rotatably through an opening of a base plate, a pair of side walls attached to the spindle, a compression roller attached rotatably to an end part of and between the side walls for compressing a polishing tape onto a target object, a tape-supplying roller and a take-up roller which are both attached rotatably between and to the side walls between the spindle and the compression roller, and a tape-running roller attached rotatably between and to the side walls for causing the polishing tape to travel. The axis of rotation of the compression roller intersects that of the spindle perpendicularly and both the tape-supplying and take-up rollers are parallel to the compression roller and their axes of rotation intersect that of the spindle such that the center of gravity of the apparatus is always on the axis of rotation of the spindle.

Abstract: The present invention describes an apparatus and method for aligning a pad/belt on a roller for use in chemical mechanical polishing using linear planarization. The present invention comprises an alignment sensor that senses the alignment of the pad/belt. The present invention additionally comprises a tensioner that tensions the pad/belt on the roller. And, a controller that controls the alignment of the pad/belt on the roller by controlling the tensioner.

Abstract: The surface of a fingernail is efficiently and uniformly ground by a grinder having an endless grinding belt that is adjustably supported between a rotating wheel mounted on a follower axle and a connecting portion of a driving axle carried by a connecting seat. The driving axle is rotated by a round axle disposed within a hollow pipe and rotated by a driving unit.

Abstract: An apparatus for continually shifting an endless abrasive belt trained between a drive pulley and an idler wheel. The belt is trained around an idler wheel which is supported by an arm above a continually pivoting platform transverse to the travel direction of travel of the endless belt. The platform is pivotally supported by a fulcrum mechanism at a pivot axis bisecting the platform, and a resilient member urges one side of the platform down while an inflatable and deflatable bladder continually urges the other side of the platform up and down. A tensioning means biases the arm supporting the idler wheel away from the drive pulley to maintain tension on the endless belt between the idler wheel and the drive wheel while the idler wheel is reciprocating. The bladder is continually inflated and deflated per a preselected time period to selectively vary the shifting cycle.

Abstract: In order to develop further a portable motor or engine-driven cutting-off machine with a housing (100) and an arm (12) connected thereto, on which a parting-off tool (22) is detachably secured, which can be driven with the aid of a traction means gearing (13, 14, 28) with a power transmission shaft (14) disposed on the arm (12) in such a way that, by means of simple constructional modifications, the rigidity between housing and arm is enhanced and their disadvantageous vibration behavior during cutting operations is improved, it is proposed that the arm (12) and the housing (100) or a housing half (11) be fabricated in a one-piece construction.

Abstract: A manicure device which is well suited for filing or buffing the convex top surfaces and the outer convex edges of fingernails and toenails includes a flexible, textured belt disposed in a cartridge which is detachably secured to a housing containing a high speed electric motor. The casing includes bearings over which the belt passes when the device is being used, and a belt opening which exposes a portion of the textured surface of the belt so that a fingernail can be pressed thereto. The machine allows the belt to be pressed against a convex surface or edge of a fingernail or toenail, so that the belt will conform to the convex shape thereof and provide uniformly smooth filing or buffing. The cartridges are relatively inexpensive and easily replaced, which facilitates and promotes replacement of the cartridge whenever the machine is being used to file or buff the fingernails or toenails of a different person, whereby better hygiene is achieved.

Abstract: A shaft sanding device including a main housing. A motor is secured within the main housing. The motor is coupled with a power source. A drive roller is secured within the main housing. The drive roller has a drive arm extending outwardly therefrom to couple with the motor. A first idle roller is secured within the main housing opposed from the drive roller. In association with the first idle roller is a second idle roller having a resilient arm rotatably coupled therewith. The resilient arm is pivotally coupled to the main housing adjacent to the motor secured therein. The resilient arm biases the second idle roller away from the main housing. A sand paper belt is disposed around the drive roller, the first idle roller, and the second idle roller.

Abstract: The present invention is a high speed grinding system for cutting various aggregate and non-aggregate, natural stone and composite building materials with steel or non-steel reinforced materials. The cutting system comprises a hydraulically driven power head, a guide bar having two water reservoirs and water outlets and a 90.degree. "V" shaped groove on the upper and lower edges and a bar nose shaped to fit on the front edge of the guide bar and a cutting belt mounted on the guide bar, bar nose and a drive sheave of the power head. The cutting belt comprises a continuous tensile member with equally spaced matrix cutting segments affixed thereto and embedded in molded plastic. The cutting belt is hydroplaned on a sheet of water in the 90.degree. "V" grooves. In addition, utilizing the hydraulic principle to "lift" the belt off the bar nose, eliminates the need for a rotating bar nose wheel.

Abstract: A conversion grinding wheel frame for an abrasive-belt to secure thereto for replacing a conventional stone grinding wheel used on a cylindrical roll grinding machine. The abrasive-belt conversion wheel is secured to a spindle of the grinding machine by a wheel clamping assembly. The abrasive-belt conversion wheel frame having an engagement working surface and a mounting surface with both surfaces having apertures therethrough traversing from a chamber within the abrasive-belt conversion grinding wheel frame. Fluid under pressure in the chamber escapes through the apertures to the working surface and mounting surface. The pressure of the gas expands the abrasive-belt while being mounted onto the abrasive-belt conversion grinding wheel frame. The mounting surface is diametrically tapered in relation to the working surface to afford initial engagement of the abrasive-belt which further assists mounting the abrasive-belt onto the working surface.

Abstract: A band sander has a motor housing (2) and a band running case (17) located below the latter, the abrasive band revolving therein. The abrasive band is driven via a belt (17) and belt wheels (14, 16). Because of manufacturing tolerances, it is necessary to be able to adjust the belt tension in a simple manner after the device has already been assembled. This is effected by an insert plate (19) which is inserted into a slot (18) between the motor housing (2) and band running case (7) so as to be displaceable. The insert plate (19) has steps (31 to 33) of varying height which determine the distance between the motor housing (2) and band running case (7) and accordingly determine the belt tension.

Abstract: A tapered bearing for the drive drum assembly of a belt grinding machine that employs multiple, parallel, abrasive grinding belts, and back-up shoes for pressing the belts against the surfaces on a workpiece to be ground. The drive drum assembly, in cooperation with small pulleys operatively associated with the contouring head, keeps the abrasive belts properly trained. The central shaft of the drive drum assembly, which has a plurality of large pulleys and spacers positioned therealong, is secured between a fixed bearing support and a laterally movable support bracket. A tapered bearing is fastened to one end of the central shaft, and a complementary shaped aperture is defined in a spindle retained in the movable support bracket. When the movable support bracket is shifted inwardly, by the hydraulic circuitry of the grinding machine, the tapered bearing fits snugly into the aperture so that the drive drum assembly is supported in a rigid, sag-free manner.