Abstract: Polishing method comprising a step of receiving a surface to be polished, a configuration step during which the polishing machine is configured, and a polishing step during which the optical surface is polished, wherein the angle of inclination of the pin is between 2° and 20°, the inner cusp point is between ?10 mm and 10 mm, the outer cusp point is between R?15 mm and R?5 mm, the speed of advance is between 100 mm/min and 2000 mm/min; the speed of rotation is between 500 rpm and 3000 rpm; and the bearing force is between 50 N and 180 N.

Abstract: A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process.

Abstract: A pressing device (50) for pressing cutting means onto circumferential surfaces (12) of substantially cylindrical workpiece portions (13) during a finishing operation is provided for pressing the cutting means onto a circumferential surface with a pressing force over a contact angle. The pressing device is steplessly adaptable for the machining of workpiece portions of differing diameters that have a diameter difference of at least 0.1 mm.

Abstract: A finishing device for finish-machining of a workpiece includes a force-generating device for generating a driving force, a force-transmitting arm and a pressing device for applying a working force to a finishing tool, and further a measuring device for measuring a deformation of a segment of the force-transmitting arm arranged in the force flux between the driving force and working force and/or for measuring a deformation force applied in the segment.

Abstract: A method of machining a semiconductor substrate using a soft polishing pad and an apparatus for machining a semiconductor substrate which has a soft polishing pad. The method includes the steps of lapping a surface of the semiconductor substrate, and polishing the lapped surface of the semiconductor substrate. The step of polishing the lapped surface of the semiconductor substrate includes polishing the lapped surface of the semiconductor substrate using slurry containing an abrasive interposed between the semiconductor substrate and a polishing pad which has a shore D hardness of 65 or less.

Abstract: A glass polishing system includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit contacting with the glass and capable of being passively rotated due to the rotation of the glass, a moving unit for moving the upper unit in a horizontal or vertical direction, and a polishing slurry supply unit for supplying a polishing slurry to the glass through the upper unit.

Abstract: An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

Abstract: A glass polishing system includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit capable of contacting with the glass and being passively rotated due to the rotation of the glass, and a moving unit for moving the upper unit in a horizontal and/or vertical direction. The upper unit includes a platter installed to a spindle of the moving unit, a separative platter separatably installed to the platter and having a polishing pad contacting with the glass, and a vacuum chuck for fixing the separative platter with respect to the platter by means of vacuum.

Abstract: A glass polishing system includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit capable of contacting with the glass and being passively rotated due to the rotation of the glass, and a moving unit for moving the upper unit in a horizontal and/or vertical direction. The upper unit includes a platter installed to a spindle of the moving unit, a separative platter separatably installed to the platter and having a polishing pad contacting with the glass, and a vacuum chuck for fixing the separative platter with respect to the platter by means of vacuum.

Abstract: A glass polishing system includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit contacting with the glass and capable of being passively rotated due to the rotation of the glass, a moving unit for moving the upper unit in a horizontal or vertical direction, and a polishing slurry supply unit for supplying a polishing slurry to the glass through the upper unit.

Abstract: A system for polishing a glass includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit capable of contacting with the glass and being passively rotated due to the rotation of the glass, and a moving unit for moving the upper unit in a horizontal and/or vertical direction. The upper unit includes a fixed platter fixed to a spindle of the upper unit, a polishing platter installed movably with respect to the fixed platter, and a pressing member interposed between the fixed platter and the polishing platter so as to keep the uniformity of pressure applied from the polishing platter to the glass.

Abstract: A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.

Abstract: A fiber grinding process includes: contacting an end of the optical fiber with a grinding surface in such a manner that a central axis of the optical fiber at the end is inclined to the grinding surface; rotating the optical fiber about the central axis; and changing a contact pressure between the end of the optical fiber and the grinding surface by applying a variable torque while rotating the optical fiber. A substantially cone-shaped end face with a substantially elliptic cross-section may be produced. A fiber grinding apparatus is also disclosed.

Abstract: A polishing pad and a CMP apparatus are provided. The polishing pad includes a plurality of patterns formed of trenches having a predetermined size and may include a groove for slurry flow. The plurality of patterns can include herringbone shaped trenches in concentric rows, where the rows of herringbone shaped trenches alternate in direction.

Abstract: Various embodiments of the present invention pertain to enabling location specific burnishing of a disk. According to one embodiment, the smoothness of a disk is evaluated by gliding over a disk to determine if there is an asperity on the disk. If there is an asperity on the disk, a location of the asperity is stored to enable location specific burnishing of the disk.

Abstract: The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or holding the workpiece surface and a workpiece-surface-influencing-device (WSID). The WSID is used to uniformly distribute the applied force to the workpiece surface and includes various layers that are used to process and apply a uniform and global force to the workpiece surface.

Abstract: A system for selectively sensing and removing asperities from hard disk drive disk is disclosed. The system includes a test stand supporting the disk, the test stand having at least one suspension for flying over a surface of the disk. The system also includes a glide pad coupled to the at least one suspension for flying over the surface and locating asperities. A PZT sensor is coupled to the glide pad for sensing and mapping asperities on the surface of the disk. A burnish pad is coupled to the at least one suspension for wearing-away sensed and mapped asperities on the surface of the disk and a thermal fly height controller is coupled to the burnish pad for protruding the burnish pad when it is proximate to one of the mapped asperities for facilitating the wearing-away of the mapped asperity.

Abstract: A method for selectively sensing and removing asperities from the surface of hard disk drive media is disclosed. A thermally controlled flying height burnish slider is flown on a test stand with its thermal flying height control deactivated. The burnish slider flies at a nominal flying height over the surface of the media to remove any existing loose particles from the surface. A glide slider coupled to a PZT sensor is then flown over the surface of the media, the PZT sensor head mapping locations of any asperities on the surface of the media. The thermal flying height controlled burnish slider is next flown over the surface of the media with the thermal flying height control activated. The thermal flying height control is actuated when a mapped location of an asperity on the surface is proximate to the burnish slider, causing the burnish slider to protrude, wearing off the asperity.

Abstract: A system and method for treating (e.g. polishing to remove defects) the surface of a media, such as a magnetic hard disk, while in operation, such as during dynamic electrical testing is disclosed. Further, a method for manufacturing a head for treating the surface of a media is disclosed.

Abstract: A glide/burnish suspension assembly processes magnetic memory storage disks by “flying” a glide/burnish slider across the surface of a rotating disk. A glide/burnish suspension assembly as described herein includes mounting holes and a tooling hole that are compatible with existing Type-2/Type-4 glide/burnish testing fixtures. The glide/burnish suspension assembly includes a stainless steel loadbeam that is compatible with Type-8/Type-20 designs, i.e., the loadbeam is configured to provide the structural support and rigidity required for use with smaller glide/burnish sliders. In this respect, the loadbeam can accommodate 70%, 50%, 30%, and possibly smaller glide/burnish sliders. The glide/burnish suspension assembly facilitates the continued use of “older” Type-2/Type-4 fixtures to perform gliding and/or burnishing of disks using the “newer” Type-8/Type-20 loadbeams designed to support 30% sliders.

Abstract: A thrustwall surface polishing tool for use with a power means for rotating a workpiece about an axis for treating a workpiece thrustwall surface.

Abstract: A method and apparatus for thermally attaching web-based polishing pads in a chemical-mechanical planarization (CMP) system. Specifically, one end of a first web-based polishing pad and an end of a second web-based polishing pad are inserted in a thermal sealing unit. The ends of the polishing pads are brought into contact with each other and secured in place within the thermal sealing unit. A heating element within thermal sealing unit is activated, thereby fusing the polishing pads.

Abstract: A disc burnishing system configured to contact and level irregularities located on a surface of a disc is provided. The system includes a motor to rotate the disc and an armature. A slider is carried on the armature over the surface of the disc. The slider includes at least one raised air bearing rail disposed on and extending from a bottom surface that faces the disc. At least one burnish pad is disposed on the bottom surface and extends towards the disc. Each burnish pad is spaced apart from each raised air bearing rail. In accordance with one embodiment of the system, a defect detection apparatus is operably disposed relative the slider and is utilized to first detect an irregularity before it is burnished.

Abstract: A method and apparatus for providing a low cost contact burnish slider is disclosed that can remain in contact or at the initial low flying heights even as the pad surfaces and leading edges wear. The burnish slider includes a body having a leading edge and a trailing edge and an air bearing surface being configured at the leading edge of the body to cut disk asperities as the slider flies and configured away from the leading edge to maintain a flying attitude wherein the leading edge is near the data recording surface and to provide restoring forces to maintain the flying attitude. The air bearing surface may include a front pad proximal to the leading edge and a rear pad distal to the leading edge. Alternatively, the air bearing surface may include two front pads proximal to the leading edge on opposite sides of the body and two rear pads distal to the leading edge and disposed on opposite sides of the body. The front and rear pad(s) extends substantially across the body of the slider.

Abstract: A quick change insert system for a microfinishing machine comprising an insert body having a connection side and a finishing side, the connection side including a keyway defined by a central wall and a pair of oppositely disposed sidewalls, the finishing side including at least one finishing support surface; and a finishing arm having an extending key including a central shoulder and a pair of oppositely disposed side walls wherein the insert body keyway and finishing key are correspondingly matingly shaped in a press fit relationship whereby the insert body is retained on the finishing arm during finishing.

Abstract: A method of burnishing an asperity on a magnetic surface of an operational disk drive. The disk drive includes a slider maintaining an MR element. Rotation of the disk relative to the slider forms an air bearing between the slider and the disk surface, generating a fly height of the slider relative to the disk surface. With this in mind, the method includes identifying the presence of the asperity. The disk speed is increased from a normal operational rate to a first burnishing rate. Further, an internal pressure of the disk drive is reduced from a normal operational pressure to a first burnishing pressure. A first burnishing fly height is thusly established at the first burnishing rate and the first burnishing pressure. In this regard, the first burnishing fly height is less than a fly height otherwise found with the disk drive operating at the first burnishing rate and the normal operational pressure. The slider is then positioned over the asperity.

Abstract: A honing head for microburnishing surface of a recording/reproducing disc to a smoothness at which asperities are limited to submicron heights including a hardened contact bearing surface having an array of depressions with abrupt trailing edges interconnected by recessed channels leading outwardly from the honing head. The array of channels span a band in which an asperity may be present, and the sharp edges shear off the asperities within the band which extend above the chosen submicroinch height, with the separated particulates being passed through the recesses and channel system to the outer edge of the honing head. The trailing edges act to shear off the unwanted heights of the asperities, while the recesses enable pressure differentials and air flows to direct the separated particulates outwardly relative to the disc, centripetal forces of rotation bearing the particulates from the disc.

Abstract: The burnishing head for hard disk processing includes a solid body having generally rectangular surfaces, including an upper surface, a burnishing pad surface, a front surface, a rear surface and two side surfaces. A plurality of burnishing pads are disposed upon the burnishing pad surface. The pads are shaped such that each pad has a burnishing edge that is generally parallel to said front surface and therefore orthogonal to the direction of media travel. The burnishing pads are preferably configured such that one frontward leading pad is centrally disposed proximate the front surface of the head, followed by two middle pads that are disposed in a spaced apart relationship. A single centrally disposed rear middle pad is formed behind the two middle pads, and two rear pads are disposed in a spaced apart relationship at the rear surface of the head. In the preferred embodiment the pads are generally triangular in shape and the outer surface of the leading and rearward pads is tapered.

Abstract: A burnishing head configured to provide extremely close control of the burnishing height, to aerodynamically eject particles generated by the burnishing process from beneath the burnishing head onto the disc surface, whence they can be swept from the disc by centripetal force, and to optimize the tribological relationship between the burnishing head and a disc being burnished. The burnishing head includes a plurality of burnishing pads arranged in an elliptical pattern, with the actual burnishing surface of the burnishing pads being either ion milled to provide a closely controlled surface texture, or lapped to a extremely smooth surface. The shape of the individual burnishing pads is also formed by the process of ion milling, and is either elliptical, or, preferably, an aerodynamic teardrop shape, which acts to aerodynamically displace generated particles from beneath the burnishing head.

Abstract: A shoe assembly for a micro-finishing machine for finishing a workpiece includes a C-frame structure adapted for nonrotatable mounting to the micro-finishing machine. The C-frame assembly includes a pair of slats and a replaceable insert secured nonrotatably to the C-frame assembly.

Abstract: A burnishing head configured to provide extremely close control of the burnishing height, to minimize stiction between the burnishing head and a disc being burnished, and to optimize the tribological relationship between the burnishing head and a disc being burnished. The burnishing head includes one or more spacer pads, associated with selected ones of the burnishing pads on the burnishing head, which remain in contact with the surface of a disc being burnished. The height from the contact surface of the spacer pad to the contact surface of the burnishing pad determines the effective burnishing height. The burnishing head also includes moats, or recessed areas, surrounding the burnishing pads to minimize the stiction caused by generation of a liquid meniscus between the disc and contacting elements of the burnishing head, and which act as collection points for particulates generated by the burnishing process.

Abstract: A honing head for microburnishing surface of a recording/reproducing disc to a smoothness at which asperities are limited to submicron heights including a hardened contact bearing surface having an array of depressions with abrupt trailing edges interconnected by recessed channels leading outwardly from the honing head. The array of channels span a band in which an asperity may be present, and the sharp edges shear off the asperities within the band which extend above the chosen submicroinch height, with the separated particulates being passed through the recesses and channel system to the outer edge of the honing head. The trailing edges act to shear off the unwanted heights of the asperities, while the recesses enable pressure differentials and air flows to direct the separated particulates outwardly relative to the disc, centripetal forces of rotation bearing the particulates from the disc.

Abstract: The burnishing head for hard disk processing includes a solid body having generally rectangular surfaces, including an upper surface, a burnishing pad surface, a front surface, a rear surface and two side surfaces. A plurality of burnishing pads are disposed upon the burnishing pad surface. The pads are shaped such that each pad has a burnishing edge that is generally parallel to said front surface and therefore orthogonal to the direction of media travel. The burnishing pads are preferably configured such that two frontward leading pads are disposed proximate the front surface in a spaced apart relationship and one leading middle pad is disposed rearwardly of the two frontward leading pads and generally between the two frontward leading pads. Two rear pads are disposed generally rearwardly of the leading middle pad in a spaced apart relationship, and one rearward pad is disposed rearwardly of the two rear pads and generally between the two rear pads.

Abstract: A shoe assembly for a micro-finishing machine for finishing a workpiece includes a C-frame structure adapted for nonrotatable mounting to the micro-finishing machine. The C-frame assembly includes a pair of slats and a replaceable insert secured nonrotatably to the C-frame assembly.

Abstract: A system for burnishing a disc includes a slider having burnish pads. The burnish pads are disposed on air bearing surface of the slider and extends therefrom. The burnish pad includes a burnish face which configured to burnish a surface of the disc and blow away burnished asperities.

Abstract: A burnishing head for burnishing the surface of magnetic or magneto-optical memory disks is described. The burnishing head comprises a plurality of curved burnishing pads symmetrically arranged on the bottom surface of the head. In one embodiment, there are thirteen circular burnishing pads symmetrically arranged on the bottom surface of a square burnishing pad in such a way that there is no dedicated leading edge of the burnishing head. The area between the curved burnishing pads is wide enough to allow the free flow of air to help the escape of debris created during burnishing. The burnishing head has no tapered leading edge. The burnishing pad flies parallel to the surface of the disk in a level manner, such that all burnishing pads are simultaneously used.

Abstract: Apparatus and method for polishing one or both sides of a semiconductor wafer that has a central opening are provided. In one aspect, the apparatus includes a mandrel for holding the wafer and a motor coupled to the mandrel that is operable to rotate the mandrel. A first polisher assembly is provide that has a first polish pad for polishing the first side of the wafer and a second polish pad for polishing the second side of the wafer, and first means for moving the first and second polish pads into and out of engagement with the first and second sides of the wafer. According to the method, a semiconductor wafer is coupled to a rotatable mandrel and a polishing mixture is dispensed on one or both of the sides of the semiconductor wafer. A first polish pad is brought into contact with the first side of the semiconductor wafer and a second polish pad is brought into contact with the second side of the semiconductor wafer such that the first and second polish pads are positioned in opposition.

Abstract: A burnishing head for burnishing the surface of magnetic or magneto-optical memory disks is described. The burnishing head comprises a plurality of curved burnishing pads symmetrically arranged on the bottom surface of the head. In one embodiment, there are thirteen circular burnishing pads symmetrically arranged on the bottom surface of a square burnishing pad in such a way that there is no dedicated leading edge of the burnishing head. The area between the curved burnishing pads is wide enough to allow the free flow of air to help the escape of debris created during burnishing. The burnishing head has no tapered leading edge. The burnishing pad flies parallel to the surface of the disk in a level manner, such that all burnishing pads are simultaneously used.

Abstract: A disk texturing apparatus for texturing surfaces of a magnetic disk or the like with cross-pattern grooves. The texturing apparatus is basically constituted by a rotational drive having a spindle for supporting and rotating a disk, and a tape transport mechanism for moving a texturing tape across and in pressed with a texturing surface of said disk. The spindle of the rotational drive mechanism is arranged to hold a disk in an eccentrically deviated position off the rotational axis of the rotational drive. As a result, the disk is revolved along an eccentrically deflecting orbit around the rotational axis of said rotational drive while being rotated with the spindle, moving in and out in radial directions in a degree commensurate with the amount of deviation from said rotational axis to form cross-pattern grooves on the disk surface.

Abstract: A surface polishing machine for polishing a workpiece, the machine including a body member adapted to be positioned adjacent the workpiece and having first and second pivot means spaced apart from each other, a pair of polishing arms, each pivotable on a pivot means, each arm having a first end adapted to receive a surface grinding means for finishing the workpiece and a second end, an actuating means connected to the respective second ends of the first and second polishing arms for moving the arms about the first and second pivot means from respective treatment enabling positions adjacently spaced from the workpiece to respective treatment positions wherein the surface grinding means engages the workpiece, whereby the actuating means forces the respective second ends of the first and second polishing arms away from each other thereby producing a grinding pressure at the surface grinding means of each respective first and second polishing arms, a rolling support member for pivotably supporting and horizontall

Abstract: A burnishing head, which is used to polish the surface of carriers that hold magnetic media (e.g., disks for computer hard drives), includes a slider that is mounted on a suspension. The slider includes at least four protrusions that protrude toward the surface to be polished. The protrusions are arranged symmetrically relative to the center of the slider. The sum of the surface areas of the protrusions is no more than approximately 20% of the total surface area of the slider that faces the surface to be polished. Preferably the sum of the surface areas of the protrusions is no more than 10%, even more preferably, no more than 7%, of the total surface area of the slider that faces the surface to be polished.

Abstract: A device and process for the surface machining of workpieces with convex surfaces, the device including an abrasive belt, abrasive belt clamping devices, an abrasive belt tensioning device, and clamping tongs device with two clamping arms, one of which is rotatable relative to the other. A section of unused abrasive belt is drawn from a supply roll for the abrasive belt and a corresponding section of used abrasive belt is wound onto a wind-up roll for the abrasive belt so that machining proceeds with a new section of abrasive belt.

Abstract: An improved mechanism for applying a controlled load to a specimen being polishing in an automatic polishing machine including a tension spring for exerting a downward load which is transmitted to the specimen to press the same against an abrasive polishing member, and a stepper motor connected by a plurality of mechanical elements to one end of the tension spring whereby through use of a microprocessor the stepper motor may be operated to control the load applied to the specimen.

Abstract: Tooling for applying an abrasive belt on a machine for abrasive belt machining of cylindrical bearing surfaces comprises, for each bearing surface to be machined, an arm and three abrasive belt application shoes a first of which is mounted in a top median position on the arm and the other two of which are mounted in a bottom lateral position on two jaws articulated to the arm and coupled together in such manner that they can be clamped together. The arm carries a first shoe having a concave abrasive belt application surface subtending an angle greater than 90.degree. and less than 180.degree. and a gauge with two opposed and horizontally aligned sensors and each jaw carries a second shoe having a concave abrasive belt application surface subtending an angle slightly less than 90.degree. whereby when clamped around the bearing surface to be machined the three shoes together envelope the bearing surface to be machined over an angle of at least 270.degree.

Abstract: The present invention relates to an apparatus for polishing semiconductor wafers and, in particular, one in which the polishing pads are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross-section along this linear dimension. In addition, the wafer holder travels in a straight line parallel to the long linear dimension of the polishing pads.

Abstract: A universal surface polishing assembly movable along the longitudinal axis of a workpiece including a pair of polishing arms with a surface grinding material affixed to each end of the polishing arms respectively, a regulated cylinder for actuating the polishing arms onto the machine component bearing surface, and a pair of stabilizing plates located directly adjacent the polishing arms for stabilizing the polishing arms during the microfinishing operation. The surface polishing assembly is designed to be adapted to various machines having means for workpiece rotation such as grinders, lathes, mills etc. Many different machine components that require microfinishing of various bearing surfaces can be finished in the present invention due to the manual indexing ability inherent in the slidable polishing assembly.