Abstract: A component manufacturing method includes causing a holding member to hold a workpiece such that a spherical center of a processed surface of the workpiece is located on a supporting member; rotating the workpiece by rotating the holding member; and polishing the workpiece by moving the supporting member to move the workpiece on a polishing tool, with the spherical center of the processed surface located at a spherical center of a processing surface of the polishing tool.

Abstract: A device for fine-machining a peripheral workpiece surface which is arranged eccentrically in relation to a workpiece axis of a workpiece, in particular of a pin bearing of a crankshaft, includes a rotary drive device for rotatably driving the workpiece about the workpiece axis, a pressing device for pressing a fine-machining tool against the peripheral workpiece surface, and a bearing device for supporting the pressing device on a frame. The device further includes a force application device which applies deceleration and/or acceleration forces on a bearing member of the bearing device, with the bearing member moving back and forth between two reversal positions when the workpiece rotates.

Abstract: A finishing device for finish-machining of a workpiece includes a force-generating device for generating a driving force, a force-transmitting arm and a pressing device for applying a working force to a finishing tool, and further a measuring device for measuring a deformation of a segment of the force-transmitting arm arranged in the force flux between the driving force and working force and/or for measuring a deformation force applied in the segment.

Abstract: The invention provides methods and apparatus for automated contamination removal in association with integrated circuit manufacturing and testing. Disclosed embodiments include methods for cleaning electrical contacts of integrated circuit packages with steps for transporting the package from a first position to a second position and, during the transit, bringing the electrical contacts into engagement with one or more cleaning station. Aspects of the disclosed apparatus include a package transit chute for moving packages from a first position to a second position and one or more cleaning stations between the first and second positions. The cleaning stations further include one or more cleaning mats positioned for cleaning electrical contacts of packages transported in the chute.

Abstract: The present invention provides a blade sharpening device designed for sharpening a blade for a uniform sharpening of the edge thereof. The blade sharpening device contains a base having a guide slidably movable relative to the base. The guide includes a material that receives an impression of a blade defining a blade contour. A blade holder is attached to the base for securing the blade while being sharpened. A carriage contains an elongated structure for interacting with the material of the guide which has received an impression of the blade defining a blade contour. The guide defines a sharpening path substantially aligning with the blade contour. The carriage also has an abrasive surface for sharpening the blade. In operation, the guide and carriage direct the movement of the abrasive surface along the contour of the blade for a uniform sharpening of the edge thereof.

Abstract: The invention relates to a pocket-sized knife sharpening device comprising two sharpening bars which are arranged in a housing and which are rotationally mounted. The sharpening bars are guided with the other ends thereof into arc-shaped recesses in the front wall and the rear wall of the housing. They are loaded onto each other by means of springs and cross each other in a knife opening which is formed by slits extending in a parallel manner in relation to each other in the front wall of the rear wall.

Abstract: An apparatus including a fixed abrasive article interposed between a substrate and a support assembly. The support assembly creates regions of high and low erosion force at the interface between the substrate and the fixed abrasive article. The high erosion force is sufficient to activate the fixed abrasive article.

Abstract: A cutting tool having a crystalline tip is pressed with a uniform pressure against the outboard surface of a vehicle wheel as the wheel is rotated. The smoothed wheel surface is then chrome plated to provide a cosmetic finish to the wheel face.

Abstract: An innovative cutter-grinder comprised of a base, a cutter holder, and a mobile base plate; the base plate being mounted with emery cloth before being placed on a deck of the frame to secure the emery cloth and allow easy replacement of the emery cloth; the cutter holder adapted with a roller at bottom retaining a blade for the user to hold the cutter holder to roll back and forth on the base plate to grind the cutter against the emery cloth; and an angle set plate being inserted onto slots respectively provided on both sides of the deck allowing the adjustment of the grinding angle.

Abstract: A non-serrated knife sharpening device providing a multitude of blade angle choices during the tapering and honing processes. The adjustable angle choices can be regulated fractionally, grossly, and anywhere in between. The knife is ground utilizing a novel concept whereby two aspects of the blade are held against two adjustably parallel surfaces simultaneously to maintain the grinding angle. Because the knife blade is unencumbered during the sharpening process, extremely acute angles can be incorporated into the clearance angle behind the edge. The device is free-standing, portable, sturdily built, accurate, and simple to use.

Abstract: The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.

Abstract: A cutting tool having a crystalline tip is pressed with a uniform pressure against the outboard surface of a vehicle wheel as the wheel is rotated. The smoothed wheel surface is then chrome plated to provide a cosmetic finish to the wheel face.

Abstract: A method and apparatus are disclosed wherein, while holding an optical fiber 1 by an optical fiber holder section 4 so as to serve a distal end 1a of the optical fiber 1 as a free end and holding the distal end 1a of the optical fiber 1 in contact with a grinding flat portion 5b to cause the distal end 1a of the optical fiber 1 to be flexed on the grinding flat portion 5b, reciprocating movement for causing the distal end 1a of the optical fiber 1 to slide on the grinding flat portion 5b in a first sliding direction and an oppositely orientated second sliding direction is relatively implemented a plural number of times between the grinding flat portion 5b and the distal end 1a of the optical fiber 1.

Abstract: A retractable knife sharpener having an ergonomically shaped handle with an internal hollowed portion and an opening at one end thereof in communication with the hollowed portion and a sled slideably received within the hollowed portion and having an outer end with a knife sharpening structure and an inner end and selectively positionable, relative to the handle, between a retracted position and an extended position that exposes the knife sharpening structure.

Abstract: A process is described for the chemical mechanical machining of semiconductor wafers. A plurality of surfaces are successively subjected to a polishing step, in which they are brought into contact with a polishing device. The polishing device contains a polishing-grain carrier with polishing grains, and the surfaces are moved relative to the polishing device. Material is removed from the surface by the polishing grains, which are fixed in the polishing-grain carrier and may become partially detached from the carrier material during the polishing operation. In each case one or more polishing steps is preceded by a conditioning step for regeneration of the polishing device. The polishing device and a conditioning surface of strong structure are brought into contact with one another and moved relative to one another, with the result that starting states of the polishing-device surface at a beginning of the individual polishing steps are comparable with one another.

Abstract: An electrical lapping guide is disclosed which is suitable for use with a single slider having a magnetic recording head. The electrical lapping guide provides for monitoring the progression of lapping; does not require additional electrical connection pads; and, is removable after completion of lapping.

Abstract: A glide/burnish suspension assembly processes magnetic memory storage disks by “flying” a glide/burnish slider across the surface of a rotating disk. A glide/burnish suspension assembly as described herein includes mounting holes and a tooling hole that are compatible with existing Type-2/Type-4 glide/burnish testing fixtures. The glide/burnish suspension assembly includes a stainless steel loadbeam that is compatible with Type-8/Type-20 designs, i.e., the loadbeam is configured to provide the structural support and rigidity required for use with smaller glide/burnish sliders. In this respect, the loadbeam can accommodate 70%, 50%, 30%, and possibly smaller glide/burnish sliders. The glide/burnish suspension assembly facilitates the continued use of “older” Type-2/Type-4 fixtures to perform gliding and/or burnishing of disks using the “newer” Type-8/Type-20 loadbeams designed to support 30% sliders.

Abstract: A superfinishing method of a tapered roller bearing, including the steps of: rotating an outer ring of the tapered roller bearing about a center axis thereof; inserting a straight-shaped superfinishing stone from a front face of outer ring; and slidingly contacting a leading end face of the superfinishing stone with a taper-shaped raceway surface formed in an inner peripheral surface of the outer ring to thereby superfinish the raceway surface. The superfinishing stone is inclined outwardly of the front face of outer ring with respect to a vertical line of the raceway surface.

Abstract: Described is a method and apparatus for producing bi-directional linear polishing that uses a flexible pad. In one aspect, a horizontal drive assembly moves a horizontal slide member that is horizontally moveable over rails attached to a single casting. Openings within the casting exist for the inclusion of the supply spool, the receive spool and the pad path rollers. A drive assembly translates the rotational movement of a motor into the horizontal bi-directional linear movement of the horizontal slide member. With the polishing pad properly locked in position, preferably being attached between a supply spool and the receive spool, horizontal bi-directional linear movement of the horizontal slide member creates a corresponding horizontal bi-directional linear movement of a portion of the polishing pad.

Abstract: The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.

Abstract: A disc burnishing system configured to contact and level irregularities located on a surface of a disc is provided. The system includes a motor to rotate the disc and an armature. A slider is carried on the armature over the surface of the disc. The slider includes at least one raised air bearing rail disposed on and extending from a bottom surface that faces the disc. At least one burnish pad is disposed on the bottom surface and extends towards the disc. Each burnish pad is spaced apart from each raised air bearing rail. In accordance with one embodiment of the system, a defect detection apparatus is operably disposed relative the slider and is utilized to first detect an irregularity before it is burnished.

Abstract: A tire resurfacing device for raising a rear wheel of a motorcycle off of the ground and rounding the surface thereof. The tire resurfacing device includes a base portion. The base portion has a first and second portion integrally coupled together. The first portion lies in a plane generally perpendicular to a plane of the second portion. The second portion has a free end having a platform thereon. A grinding assembly includes a rod. The rod is elongate and has a first and second end. The first end is hingedly coupled to a free end of the first portion. A bracket member has a concave inner surface. The bracket has an exterior surface. The second end of the rod is fixedly coupled to the exterior surface of the bracket member. The bracket member has a plurality of apertures therein. An abrasive pad is removably coupled to the inner surface of the bracket. The abrasive pad has a plurality of openings therein. A plurality of fastening means fastens the abrasive pad to the bracket.

Abstract: The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.

Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

Abstract: A tire resurfacing device for raising a rear wheel of a motorcycle off of the ground and rounding the surface thereof. The tire resurfacing device includes a base portion. The base portion has a first and second portion integrally coupled together. The first portion lies in a plane generally perpendicular to a plane of the second portion. The second portion has a free end having a platform thereon. A grinding assembly includes a rod. The rod is elongate and has a first and second end. The first end is hingedly coupled to a free end of the first portion. A bracket member has a concave inner surface. The bracket has an exterior surface. The second end of the rod is fixedly coupled to the exterior surface of the bracket member. The bracket member has a plurality of apertures therein. An abrasive pad is removably coupled to the inner surface of the bracket. The abrasive pad has a plurality of openings therein. A plurality of fastening means fastens the abrasive pad to the bracket.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: A wire cleaning system includes a pair of blocks that are generally elongated and have an internal chamber. A conduit extends from the chamber to a port disposed at the side of the block. The port is connected to an air supply. A groove is made on one side of the block. The groove generally conforms to the wire diameter or shape. Holes are made from the bottom of the groove to the chamber. An abrasive media may be placed over the holes in the groove in the blocks. A pair of the above-described blocks with media disposed in the grooves are placed on opposite sides of the wire and squeezed together by clamps, holding the media against the wire. The face on the leading side of the block is placed against a stop to prevent it from moving as the wire is pulled. Additional pairs of blocks are added as required in a radial direction to cover the entire circumference of the wire. As the wire is pulled, air is injected into the ports in the blocks. The air exits from the holes and blows off the debris from the media.

Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.

Abstract: A cutlery device is provided having a blade with a sharpened edge and an opposite, unsharpened back. The cutlery device also includes a tang extending from the blade which is at least partially enclosed in a handle. The tang has a tapered thickness to produce a cutlery device that is balanced when grasped with some fingers on the handle and some fingers on the blade. The back of the blade is curved so that a finger may be comfortably pressed against the back. The handle is curved for comfort and pieces of the handle are secured on the tang with rivets of varying length to accommodate the shape of the handle. A sharpening aid is also provided for the cutlery device which has at least one angled wall for positioning a sharpening surface at a sharpening angle, permitting the cutlery device to be held with the blade positioned vertically during a sharpening operation.

Abstract: When electric elements are formed on a ceramic bar or the like, the positional displacement of the respective elements occurs due to a division exposing process or the like. An object of the present invention is to provide a device and a method which unify the non-polished portion of the respective elements by conducting polishing while a complicated deformation or the like is given to the ceramic bar. To achieve this object, the ceramic bar or like is held by using a jig, and a plurality of loads are applied to portions of the jig where the ceramic bar or the like is held, to thereby deform the ceramic bar or the like and polish the element in that state. In this situation the load applied points are disposed so as to avoid the boundaries of the division exposure.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: A system for burnishing a disc includes a slider having burnish pads. The burnish pads are disposed on air bearing surface of the slider and extends therefrom. The burnish pad includes a burnish face which configured to burnish a surface of the disc and blow away burnished asperities.

Abstract: For conveying in single file and in a lying position substantially cylindrical objects such as nuclear fuel pellets (P) in a substantially horizontal, non-linear path, a conveying system (20) is proposed, which comprises an endless belt (26) running over pulleys having substantially vertical axes. Regulatable guides (44) maintain the objects laterally on the upper edge (30) of the endless belt (26).

Abstract: A lawn mower blade sharpening apparatus has a standard bench grinder having a grinding wheel thereon attached to a workbench. A lawn mower blade support frame is attached to the workbench adjacent the bench grinder and has a blade support surface hinged to the frame and a cutout area therein having the bench grinder grinding wheel extending through the cutout so that the blade support surface can be rotated on the hinge adjacent the grinding wheel to vary the angle of the blade support surface to the grinding wheel. A threaded adjustment bolt is threaded through the frame and abuts the blade support surface and has a gripping handle on one end thereof and an abutment cap on the other end thereof. Threading the threaded adjustment bolt in and out adjusts the angle of the hinge blade support surface to change the angle of the support relative to the grinding wheel for sharpening blades at different angles on the grinding wheel while supported on the blade support surface.

Abstract: A sharpening apparatus for sharpening blades of tools and other implements such as spatulas and grill scrapers. The sharpening apparatus includes a base member on which a sharpening stone is positioned. A slidable blade guide member is slidably connected to the base member. The slidable blade guide member includes a guide surface that is disposed at an angle relative to the upper surface of the sharpening stone, and a mounting mechanism for removably mounting a spatula against the guide surface such that the scraping edge of the spatula is in engagement with the sharpening stone. The slidable blade guide member is manually slidable back and forth to sharpen the scraping edge of the spatula. A fixed blade guide member is also attached to the base member.

Abstract: Midspan access to selected optical fibers which are encapsulated in an optical ribbon or tube is achieved by placing the desired span of the encapsulated fibers to be accessed between opposing abrasive layers and controllably urging at least one of the abrasive layers in the direction of the opposing abrasive layer to cause both abrasive layers to contact the encapsulant which covers the fibers. The amount of force applied to the at least one abrasive layer is limited by the structure of a resilient element which is coupled to the abrasive surface. Stress concentrators are created in the encapsulant and the encapsulant is removed from the span portion by relative movement of the encapsulated fibers and the abrasive layers. A minimum separation distance between the opposing abrasive layers can be defined, according to the thickness of the specific encapsulated fiber medium undergoing fiber separation, to avoid contact between the abrasive surfaces and the fibers within the medium.

Abstract: An apparatus to clean gold plated contact surfaces on printed circuit boards uses a printed circuit board guide and cleaning units in contact with the printed circuit board guide. A guide rail on the printed circuit board guide is adapted to guide the printed circuit board having contaminated gold plated contact surfaces. The cleaning units include grindstones to abrade the gold plated contact surfaces and rub off the contaminants. Embodiments are capable of achieving cleaning uniformity, reducing failure rate, and enhancing the quality of the products. The effectiveness of the invention permits operators to carry out other operations during the cleaning process. Practice of the present invention also provides improved operating conditions without problems such as those due to the presence of waste eraser particles.

Abstract: A method of and apparatus for burnishing a surface of a magnetic disc of a disc drive are disclosed. The disc drive has a data head and an actuator supporting the head as the head flies above the surface of the disc. A controller causes the disc to be rotated at rates of rotation which will result in burnishing head fly heights which are less than a normal operational fly height of the head. An actuator controller controls the actuator to repeatedly move the head across a region of the disc during a burnishing time period. The head flies above the surface of the disc at the burnishing fly heights during the burnishing time period to thereby reduce asperities on the disc.

Abstract: A burnish head comprising a slider body having a single crystal diamond attached to a rear portion flies above the disk surface at a relatively low flying height when the disk is rotated at a high angular velocity. The diamond produces acoustic waves that cut or crack disk asperities, resulting in a highly-smooth disk surface suitable for near-contact or in-contact magnetic recording.

Abstract: A polishing method and apparatus for a silicon substrate or the like, the method including disposing a polishing cloth in contact with a surface of a work to be polished, pressing the polishing cloth using pressing rods against the surface of the work to be polished in a region with a smaller area than the area of the surface of the work to be polished while adjusting the pressure of contact, and polishing the entire surface to be polished while moving the work relative to the polishing cloth and putting it under circulating movement with a radius smaller than a diametrical length of the region along the surface to be polished without autorotation.

Abstract: A portable manual sharpener for cutting tools such as knives, scissors and the like includes a base having a first stage sharpening station which includes a stationary non-rotatable support member with an abrasive coated planar surface on opposite sides of the support member. A pair of symmetrical slots are disposed adjacent to the planar faces with a guide surface located in each slot at a predetermined angle to the planar surface. A hold down device maintains the cutting blade in contact with the guide surface as the blade is moved through the sharpening station with the cutting edge facet of the blade in sliding contact with the abrasive particles on the planar face. The base includes an area which can be conveniently hand held.