Abstract: A carrier head for chemical mechanical polishing includes a base and a flexible membrane. A lower surface of the flexible membrane provides a substrate receiving surface of a substrate. The lower surface includes a first surface to apply a first pressure to a first portion of the substrate. A second surface surrounding the first surface applies a second pressure on a second portion of the substrate. An edge load ring surrounds the second surface. A lower surface of the edge load ring provides a third surface to apply a third pressure to a third portion of the substrate surrounding the second portion.

Abstract: Devices and methods for releasably attaching substrate assemblies to carrier heads of planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies. One aspect of the invention is directed toward a backing member for use in a carrier head to selectively couple a substrate assembly to the carrier head via a vacuum force before, during and after planarizing the substrate assembly. The backing member can include a body having a first section with a first surface configured to be received by the carrier head and a second section with a second surface configured to support a backside of the substrate assembly. The first and second sections of the body are preferably composed of flexible, incompressible materials. The backing member also includes a first vacuum passageway extending, through the body and a plurality of second vacuum passageways coupled to the first passageway.

Abstract: A non-contact pick-up device is disclosed. The non-contact pick-up device mainly includes a disk, and a plurality of air nozzles on the disk. Each nozzle has an air channel; and an upper end of the channel is tilt outwards. Therefore, as a disc-shaped article is placed on the disk; air jets out from the nozzles, due to Bernoulli principle, pressure difference is formed on the disc-shaped article. Thus, due to the action of atmosphere pressure, the disc-shaped article will be clamped. The pick-up device may be used in semiconductor manufacturing process for clamping a wafer.

Abstract: A workpiece such as a semiconductor wafer is held by a top ring, and a lower surface of the workpiece is polished to a flat mirror finish by being pressed against a polishing surface of the turntable while the top ring and the turntable are rotated. While the workpiece is being polished, at least one of the pressure and the flow rate of a fluid which is supplied to an upper surface of the workpiece is detected. When at least one of the detected pressure and the detected flow rate changes, the polishing of the workpiece is stopped.

Abstract: The invention relates, in one embodiment, to an arrangement configured to support a substrate during a dicing process. The substrate has thereon a first substrate side and a second substrate side. The first substrate side is smoother than the second substrate side. The arrangement includes a nest having a first nest side and a second nest side. The nest includes a grid which defines at least one nest opening. The nest opening has an opening area that is smaller than an area of a die diced from the substrate. The arrangement further includes a vacuum retainer plate having thereon at least one vacuum pedestal. The vacuum pedestal has an upper surface formed of a resilient material. The vacuum pedestal is configured to be disposed through the nest opening when the nest is mated with the vacuum retainer plate.

Abstract: The present invention provides a fixture for mounting a substrate to mounting tape on a film frame so as to retain the substrate to the film frame for dicing. A plurality of grooves for receiving a cutting saw extend longitudinally and transversely across the fixture to define die regions. The fixture also includes a plurality of apertures that align with the substrate and with dies to be cut from the substrate. The aligned apertures supply vacuum to the substrate to retain the substrate and cut dies in the fixture. When the dicing is completed, the vacuum is turned off and the individual dies can be readily removed from the fixture.

Abstract: A head support rest 29 is provided with machine bodies 21, 25 being movable and drivable in a horizontal direction, being free to go up and down. One or more absorption means aggregates 550 are provided with the head support rest 29, being free to move and position in a horizontal two-dimensional direction through a horizontal direction moving structure 33, 35, 36, 47, 49, 51 and 52. The absorption means aggregate 550 has a plurality of absorption means 55 provided such that absorption portions 57 are adjacent to one another. Absorption driving means 60, 62, 63, 65 are connected with each of absorption means 55. Then, a fine workpiece having complex shape can be also appropriately absorbed and carried.

Abstract: A materials handling apparatus and method utilizing flotation pads to inject a thin fluid film to produce a near frictionless surface for easily positioning and finishing foundry castings. The present invention further relates to a material handling apparatus and method utilizing a vacuum lock to serve as a vice for securing foundry castings or other work pieces during finishing stages. The invention further incorporates an apparatus and method for protecting the vacuum lock components from damage or interference with material movement during positioning.

Abstract: The invention relates to an apparatus for lifting a substrate from a surface of a chuck subsequent to a processing step. The apparatus includes a perimeter pin for lifting the substrate from the surface of the chuck to a first position wherein the substrate is disposed on the perimeter pin during lifting. The perimeter pin is configured to overcome a holding force at an interface of the substrate and the surface. Generally, the holding force is generated between the substrate and the surface during the processing step. The apparatus further includes a center pin for moving the substrate from the first position to a second position wherein the substrate is disposed on the center pin during moving. The second position is further away from the surface of the chuck than the first position.

Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: A vacuum-hydrostatic shoe especially suited for supporting a workpiece in metalworking operations is disclosed. The vacuum-hydrostatic shoe is comprised of a body with a support surface confronting the workpiece. Preferably the support surface is shaped to substantially conform to the workpiece shape. The shoe body comprises hydrostatic pockets. Each hydrostatic pocket has a first pressure opening defined in the support surface and a second pressure opening fluidly connected to a respective first pressure opening. The second pressure openings are also fluidly connected to a supply of pressurized fluid so that a flow of pressurized fluid can be created between the shoe body and the workpiece. The shoe body further comprises a vacuum pocket. The vacuum pocket has a first vacuum opening defined in the support surface and a fluidly connected second vacuum opening. The second vacuum opening is also fluidly connected to a source of vacuum to create a vacuum pressure between the shoe body and workpiece.

Abstract: Devices and methods for releasably attaching substrate assemblies to carrier heads of planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies. One aspect of the invention is directed toward a backing member for use in a carrier head to selectively couple a substrate assembly to the carrier head via a vacuum force before, during and after planarizing the substrate assembly. The backing member can include a body having a first section with a first surface configured to be received by the carrier head and a second section with a second surface configured to support a backside of the substrate assembly. The first and second sections of the body are preferably composed of flexible, incompressible materials. The backing member also includes a first vacuum passageway extending through the body and a plurality of second vacuum passageways coupled to the first passageway.

Abstract: A round groove is formed at the center of a wafer sucking face of a wafer suction pad. A plurality of annular grooves are formed on the wafer sucking face concentrically with the round groove. Each of the grooves is connected with an air intake line. Each of the air intake lines is connected with an air sucking device via a valve. Intake of the air is controlled by opening and closing of each of the valves. When holding the wafer by suction, the air is sucked only from the groove or grooves located inside the outer diameter of the held wafer. Therefore, the entire face of each of wafers of various sizes can be appropriately held by one wafer suction pad.

Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head includes a compliant backing member with a plurality of cells which contact an upper surface of the flexible membrane to improve vacuum-chucking of the substrate.

Abstract: Apparatus and method of polishing substrates using a carrier that does not contact the backside of the substrate during polishing. The apparatus preferably forms an air bearing between the substrate and the carrier plate during polishing. Alternatively, liquids, or combinations of liquids and gases may be used to form the bearing layer. When a water layer is formed, at least a portion of the carrier plate is formed as a microporous force applicator. The apparatuses are also capable of adjusting the force profile that is applied to the substrate so as to differentially polish different areas of the substrate. A containment ring is provided for horizontal containment of the substrate during polishing and to define an area within which the substrate precesses during polishing. A containment ring or barrier is also provided for precessing with a substrate during polishing.

Abstract: A semiconductor wafer fabrication apparatus includes a carrier head for holding a wafer and distributing a downward pressure across a back surface of the wafer. The apparatus also includes a wafer processing station disposed near the carrier head. The station includes a grinding wheel and a flat fluid bearing. The fluid bearing provides an upward pressure against a front surface of the wafer to substantially flatten the front surface of the wafer and conform it to the flatness of the bearing surface. The face of the wafer can move with very little friction across the bearing surface. The grinding wheel can be raised into contact with the front surface of the wafer and rotated to grind the front surface while the fluid bearing provides the upward pressure and the carrier head distributes the downward pressure. The technique can be used to planarize a wafer having one or more previously-formed layers despite variations in thickness of the wafer or warpage of the wafer.

Abstract: An apparatus for polishing wafers wherein a retainer ring 40 is held by a carrier 32 of a wafer-holding head 20 by using an O-ring 31. Further, a protection sheet 80 for a wafer 2 is held by the retainer ring so as to cover the surface of an air-blow member 34 of the carrier. While the wafer is being held and polished, therefore, the back surface of the wafer does not come into direct contact with the carrier, and the protection sheet is interposed between the back surface of the wafer and the carrier.

Abstract: A method for off-line testing a polishing head used in a CMP polishing apparatus is disclosed. The method utilizes at least two sets of pressurizing/vacuuming/venting devices for the independent testing of at least two fluid chambers which may include a membrane chamber, a retaining ring chamber and an innertube chamber normally found in a CMP polishing head. The present invention further discloses an off-line testing apparatus for a chemical mechanical polishing head which includes at least two independent sets of pressurizing/vacuuming/venting devices for testing a CMP head that is equipped with at least two fluid chambers such as a membrane chamber, a retaining ring chamber and an innertube chamber. The method and apparatus can be used advantageously for testing a variety of defects in a CMP polishing head prior to the installation of the head into a CMP apparatus. The defects include leakage between the fluid chambers, loss of vacuum seal in the fluid chambers, and binding between the fluid chambers.

Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.

Abstract: A vacuum chuck is disclosed which has nipples as support structure and for vacuum delivery. In the preferred embodiment, two types of nipples are used: “plain” nipples which provide only support and vacuum nipples which provide support and deliver vacuum to retain the wafer on the chuck. The contact surface of the plain nipples is made smaller than that of the vacuum nipples. The chuck is secured to a stage using special supports which have limited flexibility in two axis with respect to the chuck, so as to prevent warping the chuck. Special vacuum nipples are disclosed which do not deliver vacuum unless the wafer exerts sufficient predetermined pressure on the nipple. The chuck is designed to hold both 200 mm and 300 mm wafers.

Abstract: A valve lapping tool is comprised of a molded plastic and wood particulate composite having knurl pattern on the outside surface of the handle of the tool. Rubber suction cups are attached to the opposite ends of the tool for gripping and rotating a valve on a valve seat of an engine block.

Abstract: A polishing head for performing chemical-mechanical polishing on a linear polisher has a dual stage wafer carrier assembly that incorporates a removable subcarrier. When in use, a main pressure chamber exerts a downforce on the subcarrier housing, while a separate secondary pressure chamber residing between the subcarrier housing and the subcarrier exerts a slightly different downforce on the subcarrier. Since the second pressure chamber exerts the downforce pressure directly on the subcarrier, the direct pressure application, as well as a more uniform distribution of pressure ensures for an improvement to the uniformity of pressure distribution. Additionally, the easily removal subcarrier allows for faster and easier removal of the subcarrier for cleaning and maintenance, as well as for changing inserts and improving process repeatability.

Abstract: A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

Abstract: The present invention relates to a vacuum system for reliably holding wafers exposed to effluents in a wafer chuck. A vacuum pump generates a vacuum communicated to a wafer chuck through a tank. The tank has a baffle for converting vapor effluent to liquid effluent from the air sucked into the vacuum system. The tank stores the liquid effluent to prevent the effluent from fouling the vacuum pump and other components. A pressure transducer is connected to the tank to detect a loss in vacuum that may indicate a lost wafer condition. A trap is placed between the tank and the vacuum pump to detect if excessive effluents have escaped from the tank and to signal that corrective action may need to be taken.

Abstract: The present invention provides a dual purpose workpiece handoff station for intermediately staging a semiconductor wafer, or other workpiece, being transferred between processing stations in, for example, a Chemical-Mechanical Planarization (CMP) machine. The handoff station includes a workpiece processing surface; such as a polishing pad or buffing pad, defining a plurality of apertures for applying fluids, including water, chemicals, slurry, or vacuum, to the surface of a workpiece. In operation, a workpiece carrier moves a polished wafer from a primary polishing surface to the handoff station, and polishes, buffs, or cleans the wafer in the handoff station by rotating the wafer and oscillating the wafer across the handoff station polishing surface while pressing the wafer thereon.

Abstract: A method of producing an ocular lens, comprising the steps of: (a) preparing a lens blank which gives an ocular lens, the lens blank having a concave back surface and a convex front surface, at least a portion of the front surface being tapered to give a tapered surface; (b) forming a back curved surface of the ocular lens by effecting a cutting operation on the concave back surface of the lens blank, while the lens blank is supported on a spindle of a back surface cutting device such that the tapered surface of the lens blank is drawn onto a tapered holding surface of the spindle under a negative pressure applied to the lens blank, the tapered holding surface following a profile of the tapered surface of the lens blank; and (c) forming a front curved surface of the ocular lens by effecting a cutting operation on the front surface of the lens blank whose back surface has been cut to form the back curved surface, while the lens blank is supported on a spindle of a front surface cutting device such that the bac

Abstract: A method and apparatus for grinding wafers without using an ultraviolet tape attached to the front face of the wafer reduces manufacturing costs, simplifies the grinding process and protects the semiconductor chips formed on the front face of the wafer from being damaged by static electricity. The grinding apparatus uses a grind chuck formed of a soft material having a high elastic modulus and a rising groove formed in the grind chuck. Deionized water is supplied onto the wafer from a first direction. Simultaneously, deionized water or air is supplied into the rising groove of the grind chuck from a second direction opposite to the first direction. The circumferential edge of the wafer overlaps the rising groove, such that the simultaneous supply of deionized water and/or air from the two directions protects the front surface of the wafer from being contaminated by silicon dust.

Abstract: A grindstone having a vacuum system is applied to a pin chuck stepper. The vacuum system has a vacuum tube attached on the edge of the grindstone. When the grindstone moves on a pin chuck stage on the pin chuck stepper, the vacuum tube vacuums the pin chuck stage to free particles on the pin chuck stage.

Abstract: The present invention provides a grinding apparatus for semiconductor wafers for preventing the silicon powder generated from the wafer grinding process and mixed with cooling water from contaminating height gauges of the grinding apparatus because the silicon powder is scattered toward them, and for preventing wear-down of the contact heads of the height gauges due to the abrasion with a wafer to be fixed on a spin-chuck and the spin-chuck.

Abstract: A nest mechanism which is arranged to support a substrate during a dicing process, and methods for using such a nest mechanism, are disclosed. According to one aspect of the present invention, a nest apparatus supports a substrate, which includes a chip, a first side, and a second side, during a dicing process, includes an alignment mechanism that positions the substrate with respect to the nest apparatus. The nest apparatus also includes a grid arrangement that defines an opening which receives a contact which is included on the second side of the substrate. In one embodiment, the alignment mechanism is an alignment pin that engages the substrate, as for example through an opening in the substrate, to hold the substrate.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.

Abstract: A polishing apparatus comprises holding means for holding an object with the surface to be polished being exposed, first driving means for pressing the holding means against the polishing cloth with variable pressing force and rotating the holding means. It also comprises a guide ring body, provided around the holding means and independent of rotation of the holding means, a lower end of the guide ring body being brought into contact with the polishing cloth. It further comprises second driving means for pressing the guide ring body against the polishing cloth with variable pressing force and rotating the guide ring body independent of rotation of the holding means.

Abstract: A semiconductor wafer fabrication apparatus includes a carrier head for holding a wafer and distributing a downward pressure across a back surface of the wafer. The apparatus also includes a wafer processing station disposed near the carrier head. The station includes a grinding wheel and a flat fluid bearing. The fluid bearing provides an upward pressure against a front surface of the wafer to substantially flatten the front surface of the wafer and conform it to the flatness of the bearing surface. The face of the wafer can move with very little friction across the bearing surface. The grinding wheel can be raised into contact with the front surface of the wafer and rotated to grind the front surface while the fluid bearing provides the upward pressure and the carrier head distributes the downward pressure. The technique can be used to planarize a wafer having one or more previously-formed layers despite variations in thickness of the wafer or warpage of the wafer.

Abstract: The present invention provides a fixture (10) for coupling an optical component (12) to a machining apparatus through the use of a vacuum. The fixture includes a base (34) having means for coupling the fixture (10) to a machine and defining an aperture (50) communicable with a vacuum source, a fixture (60) sealably coupled to the base (34), and a pad (92) disposed on the fixture (60). The fixture (60) further includes an inner surface (64), an outer surface (66), and a passage (68) extending therebetween. The fixture is coupled to the base such that the inner surface (64) of the fixture (60) cooperates with the base (34) to define a cavity (62). The pad (92) is disposed on the fixture (60) to surround the passage (68) communicating with the cavity (62) and to securely and sealingly connect an optical component (12) to the fixture (60) when the cavity (62) is subjected to a negative pressure.

Abstract: A method and apparatus are provided for handling planar structures, such as semiconductor wafers, with reduced breakage and cracking. The method includes the step of segmenting a wafer prior to grinding. The apparatus includes a segmented vacuum table for supporting wafer portions in position to be ground to a desired thickness. In another aspect of the invention, adhesive material is employed to individually secure wafer portions in position during the grinding process.

Abstract: The present invention provides a work unloading means capable of unloading polished works safely and promptly from a processing section. This means uses an upper and a lower surface plates 5 and 6 to polish works 4 held by a plurality of carriers 3 that engage a sun gear 1 and an internal gear 2, allows the works 4 to be sucked by the bottom surface of the upper surface plate 5 to lift them together with the plate 5, and then intermittently rotates the lifted upper surface plate 5 by a specified angle increment to transfer the works 4 to an unloading position A, where the works are released from the upper surface plate 5 for unloading.

Abstract: A semi-conductor wafer polishing head includes three air lines for controlling three respective head functions, and an air control system providing precise head control and functional checking of each head sub-system, including air line pressure checking and chamber leak rate testing. The control system includes electrically operated valves for selectively coupling air chambers in the head with either a source of pressurized air, a source of negative air pressure, or a vent to atmosphere. A pair of air gauges are employed to check chamber leak rate respectively during positive and negative air pressure tests.

Abstract: A method of dicing a semiconductor wafer having a bottom side and a circuit side along a plurality of street indices. The method includes applying an adhesive to the bottom side of the wafer, placing the bottom side of the wafer on a chuck or a spacer having a plurality of recesses therein, aligning the street indices on the wafer with recesses in the chuck or spacer, and dicing the wafer along the street indices.

Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer includes a polishing section for polishing a surface of the workpiece held by the top ring, and a cleaning section for cleaning the workpiece which has been polished in the polishing section. The polishing apparatus further includes a workpiece transfer robot for transferring the workpiece to be polished to the polishing section or the workpiece which has been polished in the cleaning section. The workpiece transfer robot has a robot body, at least one arm operatively coupled to the robot body by at least one joint, a holder mechanism mounted on the: arm for holding a workpiece, and a sealing mechanism provided at the joint for preventing liquid from entering an interior of the joint.

Abstract: A carrier assembly includes an internal pressurized fluid circuit applying positioning forces to a ring extension. Also included is an internal diaphragm having a flexible portion providing gimbal action for the carrier assembly. The pressure between the diaphragm and a pressure plate changes the surface curvature of the pressure plate in a controlled manner. An automatic ring extension is also provided.

Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also includea flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.

Abstract: A stage is provided with pressing holes arranged circumferentially and suctioning holes arranged circumferentially to be close to the outer peripheral edge side compared to the pressing holes. A cavity connected to these pressing holes and suctioning holes is provided within a wafer holder. In addition, first filters, which allow a gas to flow from the cavity side to the wafer holding surface side, are arranged between the pressing holes and the cavity. Second filters, which allow a gas to flow only from the wafer holding surface side to the cavity side, are arranged between the suctioning holes and the cavity.

Abstract: A holder for flat subjects, in particular semiconductor wafers, in particular in a device for the chemical-mechanical polishing of semiconductor wafers, with a plate-like head which can be connected on the upper side to a height adjustable spindle and at the lower side comprises a holding plate which is coupled to a carrier section arranged above the holding plate via a universal joint and which comprises a number of vertical bores which extend to the lower side of the plate and can be connected to a vacuum and/or a fluid source, wherein the holding plate is height adjustably guided in the carrier section, between the carrier section and the holding plate there is arranged an annular closed membrane within which there is formed an essentially air-tightly closed inner space which can be selectively connected to atmosphere or vacuum or to a pressure source.

Abstract: A separation type grinding or polishing (hereinafter "grinding") surface plate (11) comprises a surface plate body (12) connected to a drive of a grinding apparatus directly or through a water cooled jacket or the like, and a disk (13) for grinding which is adapted to rotate together with the surface plate body (12) and contact an article being ground directly or through an abrasive cloth (14). The disk (13) for grinding is detachably held on the surface plate body (12) by vacuum suction or magnetic forces. Accordingly, it is possible to ensure an accuracy in a cleaning operation of a surface plate, a replacing operation of an abrasive cloth or the like as well as labor saving and to prevent lowering of a grinding accuracy due to thermal deformation.

Abstract: A polishing apparatus for uniformly polishing the whole of a target surface of a semiconductor wafer includes a wafer holder for holding a wafer by adsorption and a pad to which the wafer holder is compressed while rotating. Between a rotary shaft for the apparatus and the wafer holder is a mechanism for allowing the orientation of the wafer holder to change with an increased degree of freedom. This mechanism is formed with a container filled with a liquid and attached to the lower end of the rotary shaft and an elastic member which seals the liquid in the container.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head includes a compliant backing member with a plurality of cells which contact an upper surface of the flexible membrane to improve vacuum-chucking of the substrate.

Abstract: An apparatus for holding a substrate to be polished comprises: a rotating rotary shaft; a substrate holding head in the form of a disc; a sealing member provided to the back face of the substrate holding head; a guiding member which is provided to the back face of the substrate holding head to be located outside the sealing member; and a fluid flow path which vertically penetrates the inside of the substrate holding head. The fluid flow path allows an air under pressure introduced from the upper end side thereof to flow out through the opening at the lower end thereof to a space. The sealing member is formed with a ventilation body having a large number of successive vent openings in the inside such as nonwoven fabric.

Abstract: A wafer cutting chuck for reducing wear and damage to a cutting blade. The chuck has a surface for supporting a wafer. The chuck also has a plurality of recesses in its surface to accommodate a cutting blade of a wafer spindle and blade assembly. The recesses are at least as wide as the cutting blade and they correspond to street indices on the wafer. Preferably, the chuck is constructed of a metal, a ceramic, or silicon. In a most preferred embodiment of the present invention, the recesses include ports which are connected to a vacuum pump. The ports allow a vacuum, created by the vacuum pump, to pull an adhesive tape from the wafer, so that the cutting blade of the wafer spindle and blade assembly does not contact the adhesive tape.