Abstract: A system for the profile machining of slabs (23) of marble, stone, glass and the like, using templates (31), comprises a plurality of mechanically adjustable pneumatically operating distance pieces or supporting blocks (1). Each distance piece or supporting block is adjustable for height by means of a screw (8) and nut (6) arrangement and is provided with suction seals (11) on its end surface to support the slab, (15, 16) on an annular step to fix the machining template, and (3) on its base to fix the assembly of slab and distance piece firmly to the workbench, as the slab is being machined. All the suction seals (3, 11, 15, 16) are connected to suction tubes (24) that terminate in a connecting nipple that is connected to a pneumatic vacuum source.

Abstract: The bench for machining elongate objects such as strips of marble and the like comprises a generally boxlike body having a surface over which a portable profiling machine can be moved and a side comprising means for holding elongate objects or strips or the like in position by means of a plurality of pneumatic suction inlets which, by the action of low pressure, hold the elongate object stably during its machining.

Abstract: A carrier head for a semiconductor wafer polishing apparatus includes a rigid plate which has a major surface with a plurality of open fluid channels. A flexible wafer carrier membrane has a perforated wafer contact section for contacting the semiconductor wafer, and a bellows extending around the wafer contact section. A retaining member is secured to the rigid plate with a flange on the bellows sandwiched between the plate's major surface and the retaining ring, thereby defining a cavity between the wafer carrier membrane and the rigid plate. A fluid conduit is coupled to the rigid plate allowing a source of vacuum and a source of pressurized fluid alternately to be connected to the cavity. An additional wafer carrier membrane is internally located with respect to the cavity formed by the wafer carrier membrane, and forms another cavity with respect to the rigid plate.

Abstract: A surface grinding method for a thin-plate workpiece is provided including the steps of (a) roughly surface grinding a first surface of a thin-plate workpiece using a thin-plate workpiece surface grinding device to create a reference plane having no sori or waviness; (b) inverting the thin-plate workpiece, the first surface of which has been roughly surface ground and, with a surface grinding device having a hard chucking plate, chucking the first surface to the hard chucking plate to roughly surface grind a second surface of the thin-plate workpiece; (c) chucking to the hard chucking plate the first surface of the thin-plate workpiece, the second surface of which has been roughly surface ground with the surface grinding device having the hard chucking plate to further finely surface grind the second surface of the thin-plate workpiece; and (d) inverting the thin-plate workpiece, the second surface of which has been finely surface ground and, with the surface grinding device having the hard chucking plate, ch

Abstract: A carrier head for a chemical mechanical polishing apparatus. A layer of conformable material is disposed in a recess of the carrier head to provide a mounting surface for a substrate. The conformable material may be elastic and undergo normal strain in response to an applied load. The carrier head may also include a support fixture detachably connected to a backing fixture, a retaining ring connected directly to the conformable material, and a shield ring which projects over a portion of the layer of conformable material.

Abstract: A CMP apparatus has an extended life and improved polishing accuracy and is capable of not only preventing a wafer 100 from dashing out of a carrier 1 and being damaged or wound, but also adjusting the elasticity of a pressure pad to a desired value in a fine manner. The CMP apparatus includes the carrier 1, a suction mechanism 4 having an air passage 40 disposed to open on a lower surface of the carrier 1 for drawing air, and a surface plate 300 having a hard polishing pad 220 and a soft pad 210 adhered thereto. The pressure pad in the form of a porous thin Teflon layer 7 having a thickness of 5 mm is adhered to a lower surface of the carrier 1 which holds the wafer 100. Thus, the rear surface of the wafer 100 is maintained in a horizontal state by the Teflon layer 7, and the warpage and/or irregularities in the thickness of the wafer 100, which appear on the front surface of the wafer 100, can be absorbed by the soft pad 210 and the hard polishing pad 220.

Abstract: A semiconductor wafer carrier for holding a wafer is provided, where the wafer has edge portions and central portions. The carrier has a fixed permanent magnet having portions defining a cavity and a first coil slidably disposed within the cavity of the fixed permanent magnet. Also provided is a speaker cone having a conical portion and a diaphragm portion. The conical portion has a first end of a first diameter and a second end of a second diameter larger than the first diameter. The first end is fixed to the first coil. The diaphragm covers the second end and has edge portions constrained from movement and central portions free to deflect. A backing film is sealingly affixed to the diaphragm for isolating the speaker from the outside environment. Lastly, a wafer retaining means is provided for retaining the wafer against the backing film along its edge portions.

Abstract: The present invention provides a headstock of a polishing machine, having a simple structure and capable of tracing a pad surface. The headstock of the present invention is formed of a spindle, a holder plate, a spherical bearing, and a plate spring. The holder plate is connected to a lower end portion of the spindle via the spherical bearing and the plate spring. A workpiece is attached to the lower surface of the holder plate. The spherical bearing has a center of tilting movement on a rotation axis of the spindle. The holder plate has a balance plate. The center of gravity of the holder plate including the balance plate coincides with the center of tilting movement of the spherical bearing. The plate spring has an axisymmetric shape. More specifically, the plate spring has an opening portion at the center and a plurality of arm portions extending to the outer periphery in the diameter direction.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: A workpiece holding device enables stable polishing to be performed without sacrificing the structural strength of a top ring or the space necessary for machining a through hole or implanting engaging pins while allowing close contact to be made between a workpiece to a polishing cloth on a polishing tool. The top ring includes a top ring member having a holder plate for holding the workpiece on a front surface and a cover plate attached to a back surface of the holder plate by engaging a depression section formed on a back surface of the holder plate with a protrusion section formed on a front surface of the cover plate. A curved surface bearing unit provided between an end portion of a drive shaft and a back surface of the cover plate couples the drive shaft and the top ring member while permitting motion of the top ring member relative to the polishing tool. At least a portion of the curved surface bearing unit is positioned within the depression section.

Abstract: A cutting chuck for use with a cutting blade and for holding a semiconductor wafer in place during a dicing process and a die pick for picking the segmented semiconductor wafer from the chuck. The chuck includes a surface for supporting the wafer and several ports in the surface connected to a vacuum source. Preferably, the cutting chuck includes a housing having a base and a wall. A vacuum chamber is provided within the housing and on top of the base. A porous layer is located in housing and above the vacuum chamber. A surface layer is above the porous layer and contains ports connecting the surface supporting the wafer to the vacuum chamber via the porous layer. In a most preferred embodiment, the chuck is removeably attached to the vacuum source via a check valve. The cutting chuck may also include recesses in the surface to prevent impingement on the cutting chuck by a cutting blade during wafer dicing.

Abstract: A carrier head assembly including a drive shaft and a system flange connectable to the drive shaft where the system flange includes a number of magnetic plates. The carrier head assembly also includes a carrier head flange. The carrier head flange has more magnetic plates, these magnetic plates generally facing the previous plates. The magnetic plates magnetically engage to couple the carrier head flange to the system flange.

Abstract: An automatic polishing machine for polishing aircraft windows uses pressurized air to create a suction to hold the polishing unit on the aircraft, creates a suction to automatically pick up a polishing pad, which is impregnated with polishing compound, and, using a motor driving through a flexible drive joint, and using X and Y axis step motors, drives a polish head along the aircraft window, polishing the window.

Abstract: A method and apparatus for planarizing silicon wafers initially having wavy surfaces, such as might result from having been cut from a boule by means of a wire saw. A vacuum is applied to one side of a porous ceramic plate, and a perforated resilient pad is applied to the opposite side of the porous ceramic plate. The resilient pad is affixed to the ceramic plate by a peelable adhesive, and the vacuum extends through the perforations of the resilient pad to permit a wafer to be mounted on the exposed side of the resilient pad. The perforations in the resilient pad are distributed uniformally across the wafer, so that the atmospheric pressure pushing the wafer against the resilient pad is also uniform across the wafer. However, the wafer is not deformed while it is held in place for grinding. Because the wafer is not held in an elastically deformed condition while it is ground, the wafer has no tendency to spring back to its original wavy shape.

Abstract: A substrate holder assembly for retaining a substrate during chemical mechanical polishing is described. The substrate holder assembly includes: (i) a backing plate including a contact surface adapted for supporting components of the substrate holder assembly and the substrate; (ii) a shim positioned adjacent the contact surface of the backing plate for applying pressure on the substrate during chemical-mechanical polishing; and (iii) a carrier film disposed adjacent the shim such that at least a portion of the carrier film adjacent the shim protrudes outwardly.

Abstract: A holder for precision working of optical lenses comprises a cylindrical base (4) designed as a dressing tool, a diaphragm holder (5) fastened thereto, an elastic diaphragm (6) attached air-tight thereto as well as a centric duct (22, 23) crossing the base (4) and the diaphragm holder (5) axially. The dressing tool (4) is preferably a cup-shaped tool to which a lens holder formed as a ring element (15) can be fastened in a capping manner. The lens holder (15) is provided with banking and/or supporting surfaces (21) as well as engaging elements (17) for holding a lens (19) to be worked; moreover, it may be provided with additional dressing elements (18). The dressing tool (4) and the lens holder (15) are combined to a combined tool K which can be fastened to a common rotating machine spindle (1).

Abstract: There is disclosed a wafer holding jig having a porous holding surface for vacuum-holding a semiconductor wafer while the wafer is ground or polished. The porosity of a center region of the holding surface is made larger than that of an outside region formed to surround the center region. The outer diameter of the center region is made less than that of the wafer, while the outer diameter of the outside region is made greater than that of the wafer. It is possible to prevent deterioration in machining accuracy, which deterioration would otherwise occur due to deformation of a wafer stemming from catch of dust or the like, or application of machining pressure to the wafer.

Abstract: A squeegee unit is driven to rotate about a rotation axis perpendicular to a glass substrate surface with a motor while a plurality of blades of the squeegee unit contact on the substrate surface. The rotating squeegee unit is moved in a predetermined path on the substrate surface by relatively moving an X-Y stage so that its blades remove foreign materials adhered to the glass substrate surface.

Abstract: A rotational support assembly for holding and rotating an article. The assembly includes a support member for holding the article and a drive mechanism for rotating the support member. A drive shaft couples the drive mechanism directly to the support member. The assembly also includes a vacuum system including at least one passageway formed in the support member and the drive shaft. The passageway extends between an inlet in the shaft for coupling the passageway to a vacuum source and an outlet opening connected to the surface of the support member for holding the article against the support member by a vacuum.

Abstract: A carrier assembly for use in the processing of semiconductor wafers which avoids the use of a gimbal mechanism. The wafer carrier assembly comprises a backing pad for the wafer, with the wafer and backing pad secured within a retaining ring, such that the retaining ring, wafer, and backing pad move as single, integral assembly. A resiliently flexible outer housing terminates in a pad load ring transmits the rotation of the drive shaft to the load plate while allowing limited axial movement between the outer ring and inner ring assembly. The wafer/load plate assembly is permitted to float within the outer ring while the outer ring locally depresses the polishing pad near the wafer periphery, to mitigate edge exclusion.

Abstract: Disclosed is a chemical mechanical polishing system. The system includes a mechanical arm and a carrier body that is configured to be coupled to the mechanical arm. The carrier body has a recessed portion for retaining a semiconductor wafer. The recessed portion has a carrier film that is in direct contact with a back side of the semiconductor wafer. The system further includes a plurality of pressure rings that are defined in the carrier body, such that the plurality of pressure rings are in direct contact with the carrier film. Each of the plurality of pressure rings are used to apply a selected pressure to the carrier film, such that the carrier film produces a back pressure against the back side of the semiconductor wafer. The back pressure is configured to be consistent with the selected pressure that is applied to each of the plurality of pressure rings.

Abstract: The method for polishing a semiconductor substrate includes the steps of (a) forming a flowing liquid layer between a semiconductor substrate and a substrate holder to thereby support the semiconductor substrate therebetween by surface tension of the flowing liquid layer, and (b) compressing the semiconductor substrate onto a polishing cloth including process liquid therein. The method ensures that a semiconductor substrate is not damaged at a reverse surface thereof and also that a semiconductor substrate is not contaminated by particles contained in process liquid, because the flowing liquid layer prevents particles of process liquid from entering between the semiconductor substrate and the substrate holder.

Abstract: The present invention is a planarizing machine for use in chemical-mechanical planarization of semiconductor wafers that has a moveable platen, a polishing pad, a wafer carrier, and a wafer separator. The polishing pad is positioned on the platen, and it has a planarizing surface with an operational zone upon which the wafer may be planarized. The wafer carrier holds a wafer and is positionable opposite the polishing pad to engage the wafer with the operational zone of the polishing pad. The wafer separator engages either the polishing pad, the wafer, or the wafer carrier to urge a portion of the wafer away from the pad.

Abstract: A polishing system for polishing a wafer or the like, comprises: a vacuum system comprising a vacuum pump and a vacuum passage connected thereto; a fluid supply system comprising a fluid source and a fluid passage connected thereto; a polishing head comprising a holding member for holding the wafer or the like on the lower surface thereof which has at least one through hole in communication with the vacuum passage and the fluid passage; and a polishing member. Polishing of the wafer or the like is performed by pressing the wafer or the like held on the lower surface of the holding member, against the polishing member while providing relative motion between the holding member and the polishing member and supplying an abrasive slurry to the polishing member. Separation of the wafer or the like from the polishing head is performed by injecting a fluid from the fluid supply system to the object through the through hole of the holding member.

Abstract: A method of automatically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The polishing tape passes arcuately around a roller and passes between the roller and the surface film and contacts the surface film in a line running across the width of the tape. The system determines the thickness of the wafer surface film during the polishing process with a real time measurement device such as an effipsometer, or by determining a work-performed factor and calculating an estimated film thickness from the work-performed factor.

Abstract: An apparatus for engaging a workpiece against a polishing surface in a first embodiment includes a lower plate member, the lower plate member includes a hub on a top surface. An upper plate member includes a seat disposed on a bottom surface. The hub fits within the seat to form an air bearing between the lower and upper plate members. A structure supplies air to the air bearing and a flexure spring is disposed between the upper and lower plate members. The lower plate member includes vacuum holes in its bottom surface which are connected to a vacuum source which creates a vacuum pressure for holding the workpiece against the lower plate. A retainer ring including a flange is positioned about the outer edge surface of the lower plate member for holding the workpiece in place on the bottom surface of the lower plate member.

Abstract: A substrate holder assembly for immobilizing an integrated circuit (IC) wafer during polishing is described. The substrate holder includes a base plate sized to support the integrated circuit (IC) wafer, a circumferential restraint member arranged with respect to the base plate to engage the IC wafer's edges and a carrier assembly disposed above the base plate and below the IC wafer. The carrier assembly includes a film having a surface that is characterized by a substantially oblate spheroid or hyperboloid surface of rotation, wherein the surface of the film is capable of supporting the IC wafer in a manner causing the IC wafer to bow according to the surface of rotation.

Abstract: Uniform planarization of a patterned semiconductor wafer is effected with a chemical-mechanical polishing apparatus containing a base plate comprising a convex surface portion.

Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.

Abstract: A grazing incidence optic is fabricated by grinding, polishing, or both, using a tapered, barrel-shaped tool. The optic surface to be ground or polished is placed in contact with a selected portion of the grinding or polishing surface of the tool, and the tool is rotated about its longitudinal axis. The optic is subjected to a reciprocating grinding movement along the length of the barrel tool. A helical groove in the tool allows slurry to pass between the optic surface being worked and the tool surface. Air is forced between the optic surface and the tool surface to release the optic from the tool.

Abstract: An improved chemical mechanical polishing (CMP) device for chemically and mechanically planarizing the surface of a semiconductor wafer includes a flat wafer stage for loading and affixation of the semiconductor wafer so that the surface of a material to be polished, i.e. the surface of the wafer, faces up, and a cylindrical polishing pad formed above the exposed surface of the wafer to be polished which is rotatable at high speed so that the contact point of the wafer and the pad moves linearly. The stage is constructed to support a wafer by a vacuum suction through vacuum holes. The cylindrical polishing pad has a rotating axis for transmitting rotation at the center, thereof, and a double layer polishing pad having different hardness on a peripheral surface of the rotating axis.

Abstract: A polishing apparatus comprises a pressure container having a first opening at its bottom and being rotatable about an axis perpendicular to a plane of the first opening; a wafer support coupled elastically to the first opening, sealing the first opening hermetically and having a wafer supporting surface; and a lower surface plate disposed underneath the wafer supporting surface and having a polishing surface approximately parallel to the wafer supporting surface. The wafer support may be provided with flatness adjusting means for selectively applying a larger pressure on a region of the wafer held on the wafer supporting surface than a pressure on other region. The flatness adjusting means may comprise a plurality of pressing pins, or may comprise a hollow within the wafer support, a surface plate having elasticity and sealing the hollow, and means for applying pressure to the hollow. Wafer can be polished under uniform pressure applied on the back surface. Flatness of the wafer can be improved.

Abstract: A carrier uses multiple bellows to form two pressure chambers between the housing and carrier base and retaining ring assembly. By pressurizing the first chamber, an even load can be applied across the substrate. By pressurizing the second chamber, the retaining ring can pressed against the polishing pad. The bellows allow the carrier base to pivot with respect to the housing, but the downward force is evenly applied to the substrate through the first pressure chamber. Torque is transferred from the carrier housing to the carrier base through the bellows.

Abstract: The apparatus is to be reduced in size and consumption of utility items is to be decreased, while the connection is to be facilitated by the in-line transporting system. The grinding apparatus includes a turntable 21 for securing a glass master disc 30 for rotating the glass master disc 30, a polishing pad 11 caused to bear against the grinding surface of the glass master disc 30 secured to the turntable 21 with a pre-set pressure and a slurry nozzle 14 for supplying the grinding liquid to the grinding surface of the glass master disc 30. The polishing pad 11 is thrust against the glass master disc 30 rotated by rotation of the turntable 21. The glass master disc 30 has its grinding surface ground as the grinding liquid is supplied to the grinding surface.

Abstract: The present invention is a planarizing machine for use in chemical-mechanical planarization of semiconductor wafers that has a moveable platen, a polishing pad, a wafer carrier, and a wafer separator. The polishing pad is positioned on the platen, and it has a planarizing surface with an operational zone upon which the wafer may be planarized. The wafer carrier holds a wafer and is positionable opposite the polishing pad to engage the wafer with the operational zone of the polishing pad. The wafer separator engages either the polishing pad, the wafer, or the wafer carrier to urge a portion of the wafer away from the pad.

Abstract: The invention relates to an apparatus and process for machining a rotating workpiece by means of rotary ultrasonic grinding. The apparatus performs rotary ultrasonic grinding by rotating and vibrating a surface finishing tool in contact with a rotating workpiece. The rotary ultrasonic grinding process is a hybridized method which comprises a combination of conventional ultrasonic machining and diamond grinding. Important parameters in one embodiment of the process include ultrasonic vibration amplitude and frequency, static pressure or force, tool rotation speed, workpiece rotation speed, grit size, grit concentration, abrasive type, and bond type.

Abstract: A device for processing ophthalmic lenses, which has at least one processing station for processing an edge and/or a surface of the ophthalmic lens and a multiaxial positioning unit, which has a gripping unit, which grips the ophthalmic lens and inserts it into a respective processing station and removes it therefrom. The gripping unit is provided with a plurality of vacuum grippers which are controlled by a control unit for applying a vacuum.

Abstract: The invention relates to a device to machine workpiece edges with variable dimensions using a device for clamping the workpieces and a machining unit, whereby the device according to the invention is characterized by a first clamping bed with a clamping plate for clamping the workpiece surfaces, a second clamping bed with a clamping plate for clamping the workpiece edges hanging over the first clamping bed and means to change the position and the orientation of the first clamping bed relative to the second clamping bed.

Abstract: A retaining device retains a workpiece to allow the workpiece to slide against a polishing pad located on a polishing board opposed to the retaining device. The retaining device includes a plate including a permeable portion and a seal portion having a lower permeability and provided around an outer periphery of the permeable portion. By absorbing air toward a first surface of the permeable portion, the workpiece is attached and attracted to a second surface of the permeable portion opposite to the first surface. The retaining device further includes a retainer ring provided on an outer peripheral portion of the plate for preventing an outer edge of the workpiece from being overhung by polishing; and a backup ring located between the plate and the retainer ring for putting the retainer ring into pressure contact with the polishing pad. Since the workpiece can be attached and attracted to or released from the plate by a simple operation, the time required for retaining the plate is shortened.

Abstract: A chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom. The apparatus includes a carrier, which positions the substrate against the rotating polishing pad. The carrier includes an integral loading member therein, which controls the load force of the substrate against the polishing pad. Multiple substrates may be simultaneously polished on a single rotating polishing pad, and the polishing pad may be rotationally oscillated to reduce the likelihood that any contaminants are transferred from one substrate to another along the polishing pad. A multi-lobed groove in the polishing pad may be used, in conjunction with a moving substrate, to polish the surface of the substrate.

Abstract: A system and method for chemically and mechanically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The system determines the thickness of the wafer surface film during the polishing process with a real time measurement device such as an ellipsometer, or by determining a work-performed factor and calculating an estimated film thickness from the work-performed factor. Finally, the system automatically controls the polishing process to stop polishing the semiconductor wafer when the wafer surface film achieves a predefined planarization.

Abstract: An apparatus for exposing a substrate chucked on a substrate holder includes a substrate stocking device for stocking a plurality of substrates, a substrate conveying system for picking up the substrate from the substrate stocking device and conveying the substrate to the substrate, holder while chucking a portion of a rear surface of the substrate and a cleaning system for cleaning the rear surface of the substrate.

Abstract: A silicon wafer grinding apparatus for grinding a backside surface of a semiconductor wafer that includes integrated circuit chips patterned on a frontside surface of the wafer. The apparatus includes a plurality of chuck tables that secure a plurality of wafers to be ground. Each chuck table includes a cushioned rubber pad secured to the table and an interface with the frontside surface of the wafer. An organic acid cooling fluid is utilized during the grinding procedure to prevent silicon particles and residue from being adhered to the metal bond pads of the integrated circuit chips.

Abstract: A carrier apparatus for positioning and biasing a substrate against a polishing pad. The carrier apparatus includes a resilient membrane which loads the substrate against the pad. The membrane is configured to create one or more vacuum regions which chuck the substrate to the membrane so that the carrier may move the substrate on and off the polishing pad. In addition, the membrane may be pressurized to dechuck the substrate and allow the substrate to be front loaded or to float on the polishing pad. A retaining ring is directly adhered to the membrane to define a substrate receiving portion of the membrane. The retaining ring limits twisting of the membrane with respect to the substrate. In addition, the membrane is protected from the polishing pad by a right angled and annular shield. The membrane has a circumferential dimple expansion member prevent the center of the membrane from doming during the polishing process.

Abstract: An apparatus and method for cleaning and reconditioning a wafer carrier backing film. The apparatus comprises a flat perforated surface plate with a perforated film or perforated embossed glass plate on its surface; a backing plate connected to the surface plate which is fitted for connection to a cleaning solution supply and a vacuum source; and a contacting mechanism for extension/retraction of the surface plate until it contacts the carrier backing film. Following a wafer unload cycle, the carrier backing film is reconditioned by spraying a cleaning solution at the carrier backing film so as to rinse slurry deposits from the film material; extending the surface plate to make sealed contact with the wafer carrier; initiating a vacuum condition to press the carrier backing film and draw out slurry residuals and excessive water content from within the film; and retracting the surface plate to reconstitute the film as the material draws in surrounding air to break the vacuum condition.

Abstract: A method and apparatus for dicing a semiconductor wafer in which the wafer is bowed or bent by forcing it into contact with a spherical surface having parallel grooves therein and in which an array of parallel wire saws that are in registration with the grooves is forced against the wafer for sawing parallel channels therethrough. A second array of parallel wire saws that are orthogonal to the wires of the first array is provided spaced therefrom for sawing parallel channels through the wafer that are orthogonal to the channels produced by the first array of parallel wire saws.

Abstract: A plurality of cells are provided in a concave portion of a top plate. A cloth to which water is penetrated is provided in a back face of each cell, and a wafer is attracted by the cloth. First and second pipes are connected to each cell. The first pipe introduces liquid to the cell, and the second pipe discharges liquid from the cell, and guides liquid to the first pipe. A constant-temperature device is provided to each first pipe, and a temperature of liquid of each cell is adjusted by the constant-temperature device in accordance with a temperature distribution of the wafer. Whereby, a polishing rate of each part of the wafer can be equalized.

Abstract: A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.

Abstract: A method of polishing semiconductor wafers and apparatus therefore are described. According to the present invention, a semiconductor wafer mounted on the lower side of a wafer mounting plate may be polished on a polishing pad by the front referenced polishing technique due to a flexibility of the wafer mounting plate to make the same to conform in detail with the backside contour of the wafer under polishing pressure and a selected flexibility differential between a wafer holding region and the outer moving region of the wafer mounting plate.

Abstract: A polishing apparatus, for polishing/cleaning a target object surface by using a polishing tape, has a spindle rotatably placed inside an opening formed in a base plate, a motor for rotating the spindle, a compression roller rotatably supported between a pair of side walls attached to the spindle, supply and take-up rollers supported rotatably by the side walls for advancing the polishing tape, and a motor for the take-up roller. The polishing tape is supplied from the supply roller and taken up by the take-up roller through the compression roller, while rotating around with the spindle. The compression roller has a smaller diameter at its center part than at its end parts for preventing the polishing tape from becoming twisted or wrinkled when the compression roller is rotated by the motion of the spindle while being pressed against a target object and being advanced from the supply roller to the take-up roller.