Abstract: A high speed polishing device useful for polishing a large number of miniature components, such as multi-layer electronic components, is disclosed. In various embodiments of the present invention, a vertical planetary ball mill or other barrel polishing device is modified to rotate polishing containers having a modified interior cavity structure. This interior cavity provides a smooth, gradually curved interior sidewall that improves circulation within the container during high-speed vertical polishing rotation. The improved circulation results in polishing for a larger number of components placed within the container and in less time than existing polishing container structures. In further embodiments, the containers are rotated around a generally tilted axis positioned at an angle between entirely vertical and horizontal positions. Rotation about a tilted axis further reduces collisions and increases relative polishing movement within the container.

Abstract: A parts carrier assembly for a grinding machine includes an annular parts carrier and a bearing insert. The annular parts carrier includes an upper surface, a lower surface, an inner edge, an outer edge, and a plurality of loading apertures. The inner edge is configured to engage a driving wheel of the grinding machine. The driving wheel rotates about a central axis resulting in rotation of the parts carrier about an offset axis, which is offset from the central axis. The loading apertures are configured to receive parts to be ground by the grinding machine. The bearing insert includes an inner bearing surface complementary in shape to the outer edge of the parts carrier. The outer surface the parts carrier bears against the inner bearing surface of the bearing insert as the parts carrier rotates about the offset axis.

Abstract: A polishing apparatus used in chemical mechanical polishing device is provided. The polishing apparatus includes a polishing plate for holding a wafer to be polished; a polishing pad arm, one end of the polishing pad arm being fixed, another end of the polishing pad arm holding a polishing pad, and the polishing pad arm driving the polishing pad for moving relatively to the wafer; the polishing pad moving relatively to the wafer with drive from the polishing pad arm, and the polishing pad arm ensuring the polishing pad contacting the wafer during movement; and a slurry supply route for supplying polishing slurry between the polishing pad and the wafer during polishing. The present invention also provides a chemical mechanical polishing device. It makes for realizing miniaturization of a chemical mechanical polishing device, saving polishing slurry and improving utilization rate of the polishing pad in the chemical mechanical polishing device to apply the present invention.

Abstract: A carrier assembly includes carrier protrusions extending outward from a base plate front face, one protrusion for each wafer to be polished. Each carrier protrusion has a front face separated from the base plate front face. An optional detachable ring may surround each protrusion front face to form a cavity for holding a wafer. In some examples of a carrier assembly, a frame having a separate aperture for each carrier protrusion holds all the detachable rings against the base plate front face. In other examples of a carrier assembly, the detachable rings are omitted, or a separate retaining ring for each carrier protrusion replaces the frame. A carrier protrusion may optionally be formed with edge relief to allow part of the wafer to deflect away from a polishing pad during polishing. A compressible elastic material may optionally be placed between a wafer and a carrier protrusion.

Abstract: A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers.

Abstract: A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions.

Abstract: A centering device (13) is arranged to surround a loading table (11) on which a lens blank (1) is to be set, to set the geometric center of the lens blank (1) to coincide with the center of the loading table (11). The centering device (13) includes three clamp pins (31) which press the peripheral surface of the lens blank (1). When centering is ended, the loading table (11) on which the lens blank (1) is set is pushed up by a moving device (12) from a centering position (H1) to a block position (H2), and a peripheral portion of the lens blank (1) on a concave surface side is urged against the lower surfaces of locking portions (31A) of clamp pins (31). After a predetermined amount of wax (4) is dripped onto the lens blank (1), a lens holding unit (2) is moved downward by a predetermined amount and urged against the wax on the lens blank (1) to spread the wax thin and let the wax to solidify. Thus, the lens blank (1) and lens holding unit (2) are bonded to each other.

Abstract: To provide a centerless grinding method which facilitates a tooling change and enables automation. A blade 11 is disposed slidable along a first straight line 101, i.e., Y axis, a grinding wheel 7 is disposed slidable along a second straight line 102, i.e., X axis, and a regulating wheel 9 is disposed slidable along a third straight line 103 intersecting with the second straight line at an angle ?2. At a tooling change, then, the blade is moved in a negative direction of the Y axis with an increase in diameter of a workpiece, the grinding wheel is moved in a negative direction of the X axis with an increase in diameter of the workpiece, and the regulating wheel is moved in a positive direction of the Y axis and also in a positive direction of the X axis with an increase in diameter of the workpiece. With this, angles ? and ?, which a contact angular position reference line S makes with line segments OB and OR, are made always constant.

Abstract: Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.

Abstract: A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions.

Abstract: A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material from a front side and a back side of each wafer simultaneously. The carrier includes a plate including wafer contaminating material and having an opening and a thickness. An insert has a thickness and is disposed in the opening for receiving at least one wafer and engaging a peripheral edge of the wafer to hold the wafer as the carrier rotates. The thickness of the insert is significantly greater than the thickness of the plate to inhibit removal of material from the plate and thereby inhibit bulk metal contamination of the wafer.

Abstract: A machining apparatus for machining a workpiece by rotating and revolving either the workpiece or a tool 1 to contact with each other. The machining apparatus comprises rotation/revolution ratio setting motors M1 and M3 for setting a ratio of a number of rotations to a number of revolutions of the workpiece or the tool 1, to a numerical value having a fraction below a decimal point, by changing the number of revolutions. The workpiece is machined by setting the number of revolutions and the number of rotations at the ratio.

Abstract: Thin, planar substrates are carried on a substrate carrier (20) through a polishing operation. The substrate carrier (20) is injection molded or modified-injection molded from a plastic material, and includes one or more receptacles for receiving the substrates to be carried through the polishing process. A drive force transmission arrangement is also included in the substrate carrier (20) through which the carrier may be driven in the polishing process. The substrate carrier (20) is relatively non-abrasive and composed of melt processable engineering polymers or blends. Non-abrasive fillers or reinforcing material may also be included in the plastic.

Abstract: An abrasive machine includes a rotatably driven tool, chucking equipment for holding the work pieces and a feeding device for effecting relative displacement between the work piece and the rotatably driven tool. The machine further includes a tubular cylindrical housing, a shaft provided with a recess, a rotatable outer casing peripherally enclosing the housing, and a lid member connected to the casing and extending radially over a first end of the tubular cylindrical housing such that an inner surface of the lid members faces the first end of the housing. The rotatably driven tool includes abrasive material carried on the inner surface of the lid member. The shaft is arranged such that when the shaft executes an angular displacement, the work piece held by the chucking equipment is caused to approach and contact the abrasive material.

Abstract: A non-circular workpiece carrier, which includes a wheel-like carrier body, and at least one carriage, wherein the wheel-like carrier body has a transmission unit disposed around the periphery thereof, which receives a transmission power for causing the wheel-like carrier body to turn round, and at least one carrier unit; the at least one carriage is respectively disposed in the at least one carrier unit to hold non-circular workpiece, and forced to gyrate in the at least one carrier unit relative to the wheel-like carrier body, enabling loaded non-circular workpiece to be surface-processed (ground, polished, etc.) more evenly. Different carriages are alternatively used with the carrier body subject to the shapes of workpiece to be processed.

Abstract: A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.

Abstract: A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted against the surface of the wafer. Thus, all abrasive grains on the grinding wheel can act on the whole surface of the wafer.

Abstract: The present invention relates generally to a device used to process workpieces. In particular, the invention relates to a carrier that is used to support a workpiece during workpiece honing, grinding, or polishing. The carrier includes a rigid core coated with a fiber-free, scratch-resistant material to prevent scratching of workpieces disposed in the carrier. An adhesive layer is typically used to attach the scratch-resistant layer to the rigid core. The adhesive film and the scratch-resistant films may be attached to the rigid core by hot pressing.

Abstract: A hand grinder, comprising a housing, a motor arranged in the housing, a tool holder with a grinding tool received in the tool holder, a work shaft driven by the motor, two rotary bearings which support the work shaft, a compensating unit arranged on the work shaft for joint rotation therewith between the rotary bearings and provided for compensation of an imbalance produced by the tool holder with the grinding tool during rotation of the work shaft, the compensating unit including different imbalance masses which are offset from one another in an axial direction of the work shaft and are arranged on the work shaft diametrically opposite to one another.

Abstract: In a two-axis turning machine, the cutting tool unit machines a first diameter of a workpiece portion of barstock extending from a main spindle chuck. A special subspindle chuck rotating in the same direction advances axially, grasps the workpiece as it is cut off from the barstock, and retracts. The barstock is fed through the first chuck for subsequent first operation machining and located against a stop which is independent of the tool slides. The subspindle chuck rotation is reversed, displacing the first-generated workpiece axis from the subspindle axis, and a second diameter, eccentric to the first diameter, is formed by the cutting tool unit in a second operation.

Abstract: Methods and device for manufacturing a plate with a plane main surface or with parallel main surfaces, whereby material is taken off from the edges of the plate and from the central portion of the plate alternately by means of polishing in order to obtain main surfaces having a convex, plane, or concave shape. Polishing is stopped after at least one transition from convex to concave or vice versa at the moment at which the main surface has a substantially plane shape or has substantially parallel main surfaces.