Abstract: A method of applying an air barrier to an inner surface of a tire includes placing the tire in a tire trimming machine, rotating the tire in the tire trimming machine as a part of a tire trimming operation, and while performing the tire trimming operation spraying the air barrier material onto the inner surface of the tire.

Abstract: A method includes forming a first cavity having a first width and a second cavity having a second width greater than the first width in a dielectric material, forming a first conformal layer in the first and second cavities, forming spacers in the first and second cavities, the spacers covering a first portion of the first conformal layer positioned on sidewalls of the first and second cavities and exposing a second portion of the first conformal layer positioned on the sidewalls of the first and second cavities, forming a material layer in the first and second cavities to cover bottom portions of the first conformal layer, performing a first etch process to remove the second portion of the first conformal layer positioned on the sidewalls of the first and second cavities, removing the spacers and the material layer, and forming a fill material in the first and second cavities.

Abstract: According to an exemplary embodiment of the present invention, a trocar is provided. The trocar includes: a sharp end; at least three concave cutting edges extended from the sharp end; and at least three concave cutting surfaces forming the sharp end and the at least three cutting edges.

Abstract: A locator pin according to one disclosed non-limiting embodiment of the present disclosure includes an elongated body that extends from a base along an axis, the elongated body deflectable off the axis relative to the base.

Abstract: Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a lug-pin device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.

Abstract: Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating or rigid workpiece holder carrier that is supported by a pressurized-air flexible elastomer disk sealed air-chamber device and is rotationally driven by a flexible arm or a lug-pin device. The rotating wafer carrier rotor is horizontally restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. A wide range of abrading pressures are applied uniformly across the surface of the workpiece. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.

Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.

Abstract: Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a circular flexible-arm device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial and lateral motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.

Abstract: Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The carrier rotor is also restrained by a rigid rotating housing to allow a limited lateral motion and also a limited angular motion. Air pressure within a sealed bellows chamber provides controlled abrading pressure for wafers or other workpieces. Vacuum can also be applied to the bellows chamber to quickly move the wafer away from the abrading surface. Wafers can be quickly attached to the workpiece carrier with vacuum.

Abstract: The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

Abstract: Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The wafer carrier rotor is contained by a set of idlers that are attached to a stationary rotor housing to provide support against abrading forces that are imposed on the wafer by the moving abrasive coating on a rotary platen. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The system is also well suited for lapping optical devices and rotary seals and for chemical mechanical planarization (CMP) polishing of wafers using resilient pads. Pressurized air is injected into the bellows device to provide uniform abrading pressure across the full surface of the wafer. Wafers can be attached to the workpiece carrier with vacuum.

Abstract: Provided is a lapping carrier including a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece. The aperture extends from the first major surface through the base carrier to the second major surface. The base carrier includes a first metal or a polymer. At least a portion of the first major surface or at least a portion of each of the first and the second major surfaces includes a polymeric region. In at least a portion of the polymeric region, at least one adhesion promoting layer is interposed between the polymeric region and the base carrier. The adhesion promoting layer includes an inorganic coating.

Abstract: A wafer carrier adapted to further reduce the edge effect and allow a wafer to be uniformly polished across its entire surface, with a retaining ring made from very hard materials such as PEEK, PET or polycarbonate with a hardness in the range of 80 to 85 Shore D, while the inner surface or insert is made of polyurethane or other material with a hardness in the range of 85 to 95 Shore A.

Abstract: An arrow preparation system preferably includes a lengthwise base, at least two arrow supports and a grinding member. The lengthwise base preferably includes a pair opposing rails for slidably retaining the at least two arrow supports and the grinding member. Each arrow support preferably includes a support slidable base, a pair of roller bearings, an anchor pin and a knurled nut. The knurled nut is secured to anchor pin and threadably retained in the support slidable base. The pair of roller bearings are rotatably retained on a top of the support slidable base to support an arrow shaft. The grinding member preferably includes a slidable grinding base, the anchor pin and the knurled nut. The slidable grinding base includes a vertical grinding face. A piece of self-sticking sandpaper is applied to the vertical grinding face. The knurled nut and anchor pin and threadably retained in the slidable grinding base.

Abstract: A grinding machine for operative cylinders, of the type comprising a piece-holder head and a tailstock center between which an operative cylinder is positioned for being ground, includes a moving system associated with both the piece-holder head and the tailstock center to allow them to be moved along a common movement direction. A further object of the present invention relates to a grinding method.

Abstract: In some aspects, a chemical mechanical polishing (CMP) apparatus is provided that includes a polishing head having (a) a rotatable spindle; (b) a membrane coupled to the rotatable spindle and adapted to press a substrate against a polishing pad during polishing of the substrate; and (c) a retaining ring rotatable coupled to the spindle and adapted to surround a substrate being pressed against a polishing pad during polishing and to limit lateral movement of the substrate relative to the polishing head. The CMP apparatus also includes a drive mechanism coupled to the retaining ring and adapted to drive the retaining ring at a different rate of rotation than the spindle during polishing. Numerous other aspects are provided.

Abstract: A double-disc grinding apparatus having at least: a rotatable ring-shaped holder for supporting a sheet-like wafer having a notch for indicating a crystal orientation from an outer circumference side along a radial direction, the holder having a protruding portion to be engaged with the crystal-orientation-indicating notch; and a pair of grindstones for simultaneously grinding both surfaces of the wafer supported by the holder, in which the holder is provided with at least one protruding portion separately from the protruding portion to be engaged with the crystal-orientation-indicating notch, and the both surfaces of the wafer are simultaneously ground by the pair of the grindstones while the wafer is supported and rotated with the at least one protruding portion being engaged with a wafer-supporting notch formed on the wafer.

Abstract: A ring fixture system for rotating a ring to perform engraving work. The system comprises a vise-securable fixture base with opposing mandrels connected through spaced arms of the fixture base at a ring-engraving location between the arms to form a mandrel assembly. The mandrels are provided with sets of detents with different degrees of rotational spacing, and the detents on one mandrel of the mandrel assembly can be engaged independently of the other set of detents on the other mandrel. The fixture base further includes a tool-supporting bridge connected between the fixture arms above the ring-engraving location to hold an engraving tool orthogonally to the ring axis, and may further include a sliding tool support on the bridge. Also, a method is disclosed for engraving a ring using the ring fixture system with the detents and tool-supporting bridge.

Abstract: A robotic manipulator for clamping a workpiece includes a power source, a first rotary member, and a clamping mechanism. The first rotary member is connected to and rotated by the power source. The clamping mechanism is non-rotatably connected to the first rotary member and includes a first clamping member and a second clamping member capable of coupling to and decoupling from the first clamping member. The first clamping member and the second clamping member are coupled to each other. A receptacle is defined between the first clamping member and the second clamping member to receive the workpiece. The receptacle has a shape and size substantially the same as the workpiece.

Abstract: A polishing method and a polishing system are provided. By means of adjusting a rotational center of a polishing article corresponding to positions of a polishing pad or polishing pads, a polishing rate of the polishing article surface has a better uniformity, resulted from compensation of polishing rates at the rotational center of the polishing article.

Abstract: An apparatus has a motor, a shaft attached to the motor arranged to be turned by the motor when the motor operates, an attachment at an end of the shaft opposite the motor arranged to allow mounting of components to be ground, a loading block arranged under the end of the shaft having the attachment to support the components to be ground, and an interface to a grinding tool arranged adjacent to the loading block. An apparatus has a motor mounted on a slide, a shaft attached to the motor arranged to spin when the motor operates, an attachment on the end of the shaft to allow attachment of a component, a loading block at least partially supporting the shaft, an interface to a manufacturing tool, the motor and shaft arranged to insert the shaft into the interface when moved along the slide to an engaged position.

Abstract: In a method and apparatus for multiple-bearing grinding of workpieces, such as crankshafts, wherein a support element seat occurs at a bearing point at the same time as the grinding of the main bearing a grinding-supporting unit is used that contains a grinding spindle head having at least one grinding disk and support elements in the form of support jaws or support bodies that can be swiveled in. After the support point seat is ground, the support elements are brought into contact therewith and support the workpiece during the further machining. The simultaneous grinding of the support point seat and several bearing points results in a reduction in the machining time in the grinding of the workpiece compared to the prior art.

Abstract: Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or unclamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions. In a closed position, a constraining member aligns the wafer after wafer handoff and/or clamps the wafer during rotation to prevent it from flying off the chuck. In an open position, the constraining member moves away from the wafer to allow liquid etchant to flow from the wafer edge without obstruction. The constraining members may be, for example, cams, attached to arms or links of the chuck. The cams or other constraining members move between open and closed positions by self-balancing forces including a first force, such as a spring force, that acts to move a cam in a first direction, and a non-contact actuate-able force, such as a magnetic force, that acts to move the cam in the opposite direction.

Abstract: A grinding machine for grinding work pieces between centers, as well as for centerless grinding, features a drive for a grinding wheel and a drive for a regulating wheel. The work piece can be supported between the grinding wheel and the regulating wheel either between centers on a work piece axis or on a rest for centerless grinding. The driving axis of the regulating wheel and the work piece axis are parallel, and the wheels can be adjusted relative to the work piece independently of one another. The drive of the regulating wheel serves for driving the work piece while grinding between centers or for driving the work piece during centerless grinding. In addition, a means for measuring the contact pressure of the regulating wheel on the work piece is provided for grinding between centers. This means may consist, for example, of a pressure sensor.

Abstract: The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.

Abstract: A centering device (13) is arranged to surround a loading table (11) on which a lens blank (1) is to be set, to set the geometric center of the lens blank (1) to coincide with the center of the loading table (11). The centering device (13) includes three clamp pins (31) which press the peripheral surface of the lens blank (1). When centering is ended, the loading table (11) on which the lens blank (1) is set is pushed up by a moving device (12) from a centering position (H1) to a block position (H2), and a peripheral portion of the lens blank (1) on a concave surface side is urged against the lower surfaces of locking portions (31A) of clamp pins (31). After a predetermined amount of wax (4) is dripped onto the lens blank (1), a lens holding unit (2) is moved downward by a predetermined amount and urged against the wax on the lens blank (1) to spread the wax thin and let the wax to solidify. Thus, the lens blank (1) and lens holding unit (2) are bonded to each other.

Abstract: A polishing holder for a workpiece end surface comprises a main body and a framework, in which the main body is coupled to a plurality of fixtures used for coupling to polished-to-be workpieces, a periphery of the main body is provided with a ring first supporting portion; a framework, provided with a second supporting portion surrounding an outside of the first supporting portion. Whereby, the second supporting portion limits a deviation region of the first supporting portion to enable the main body to be kept parallel to a polishing surface during a polished end surface of the workpiece is brought into contact with the polishing surface and polished thereby so that the production time and cost of the first supporting portion can be reduced broadly.

Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.

Abstract: A CMP head includes a membrane support and a membrane. The membrane support is disk-shaped, having an origin and a radius R. The membrane support has at least a ventilator disposed in a central region within the range between origin and (?) R, and at least a diversion opening disposed in a peripheral region within the range between (?) R and R. The membrane includes a disk-shaped part disposed on the first surface of the membrane support, and an annular part surrounding the annular sidewall of the membrane support.

Abstract: The present invention is directed to a wafer holder and a related wafer conveyor system. The wafer holder holds a wafer and moves horizontally within a chamber. A contact area between the wafer and the wafer holder is reduced, and potential contaminants generated by ear between components of the wafer holder are trapped by an airtight cover. Since the wafer holder moves horizontally while being fixed to a guide rail, the wafer conveyor system reduces friction between the guide rail and the wafer holder.

Abstract: The invention relates to a machine tool for machining workpieces, comprising a workpiece holder. Said workpiece holder comprises a support, a workpiece spindle head mounted on a first side of the support, and a tailstock. Said tailstock is mounted on a second side of the support which is different from the first side in a manner so as to be displaceable.

Abstract: A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.

Abstract: An extremely precise computer controlled grinding machine having the capability to write its own computer programs for controlling the grinding machine to perform individual tasks, including both grinding and dressing to several millionths of an inch. A new device for dressing is included which is directly on the machine, alleviating the need for a separate dressing machine. The Windows-based computer program is easy to use, and includes numerous features for self-maintenance and reproducibility.

Abstract: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring.

Abstract: Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece during mechanical or chemical-mechanical polishing. In this embodiment, the carrier head can include a retaining ring carried by a workpiece holder. The retaining ring can include an inner surface, an outer surface, and a base surface extending at least partially between the inner and outer surfaces. The retaining ring can further include at least one annular groove and a plurality of transverse grooves. The annular groove can be positioned adjacent to the base surface between the inner and outer surfaces. The plurality of transverse grooves can extend from the inner surface of the retaining ring to the annular groove in the base surface.

Abstract: A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; and at least one annular barrier of elastic material extending from the bottom surface of the support. Each barrier has an annular partition portion that extends through the pressure chamber and divides the pressure chamber into respective pressure zones on opposite sides thereof, and an annular contact portion that abuts the membrane such that the barrier contacts the membrane but is not fixedly attached thereto. The contact portion includes a pair of annular flanges extending laterally in opposite directions at the lower end of the partition portion.

Abstract: During centerless cylindrical grinding, attention must be paid to the fact that the workpiece (3) is placed in a very specific position between the grinding wheel (1), the regulating wheel (2) and the support guide (4). The optimal position of the workpiece (3) initially set cannot be maintained as a result of the progression of the grinding process and the changes caused by said process in the diameter and contour of the workpiece (3). The invention provides a solution to said problem, whereby height adjustment and/or the oblique position of the support guide (4) are automatically modified in accordance with the progression of the grinding process and during said grinding process with the purpose of achieving operationally optimal readjustment. The progression of the grinding process can be detected using measuring techniques, e.g. by measuring the diameter of the workpiece (3) or its deviation from roundness and using said measurement as output variable for adjusting the support guide (4).

Abstract: The present invention is directed to a wafer holder and a related wafer conveyor system. The wafer holder holds a wafer and moves horizontally within a chamber. A contact area between the wafer and the wafer holder is reduced, and potential contaminants generated by ear between components of the wafer holder are trapped by an airtight cover. Since the wafer holder moves horizontally while being fixed to a guide rail, the wafer conveyor system reduces friction between the guide rail and the wafer holder.

Abstract: Retaining rings, planarizing apparatuses including retaining rings, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a carrier head for retaining a micro-device workpiece during mechanical or chemical-mechanical polishing includes a workpiece holder configured to receive the workpiece and a retaining ring carried by the workpiece holder. The retaining ring includes an inner surface, an outer surface, a first surface between the inner surface and the outer surface, and a plurality of grooves in the first surface extending from the inner surface to the outer surface. The grooves include at least a first groove and a second groove positioned adjacent and at least substantially transverse to the first groove.

Abstract: An apparatus that mass polishes a variety of fiber optic cable connectors simultaneously. The apparatus includes a plurality of polishing plates, each capable of holding its own polishing film and pad, and having a varying height. The apparatus further includes a plurality of connector fixtures that may receive a variety of connectors at varying angles. Each connector fixture communicates with a corresponding polishing pad. Thus, fiber optic cable connectors having a variety of polished end faces may be provided with the apparatus. The apparatus also eliminates the potential for contamination among polishing films, reduces polishing steps, and saves labor and maintenance costs.

Abstract: A method and apparatus for creating a groove in the surface of a collector ring for use in an electrical device. The method and apparatus can be used to create a new groove in the surface of a collector ring having none, or can be used to enhance or re-form an existing groove in the surface of a collector ring. In some embodiments, the groove in the surface of the collector ring is created using a cutting tool that has a cutting action that functions independently from the motion of the collector ring. In other embodiments, a masking material is positioned over a portion of the surface of the collector ring to create a masked portion and an exposed portion of the surface of the collector ring. A groove is then created in the exposed portion of the surface of the collector ring. The masking material is then removed from the surface of the collector ring.

Abstract: Detecting the deviation of the grinding wheel position from the amount of work deformation after grinding, and correctly adjusting the grinding wheel position, it provides both-side grinding techniques for making the work excellent in flatness and parallelism. When the feeding operation of grinding wheels (1,2) is completed, the distances from hydrostatic pads (20, 21) to the surface and back of work (W) are measured at three points, and the deformation amount of work (W) is detected from the results of measurement at the three points by using air gauge sensors (Sa, Sb, Sc), and in case the calculated amount of deformation exceeds the specified value, the moving adjustment of grinding wheels (1, 2) is performed in accordance with the amount of deformation so that work (W) is flat without deformation when the feeding operation of grinding wheels (1, 2) is completed.

Abstract: Apparatus for chemical mechanical polishing are disclosed. A disclosed apparatus includes a polishing station having a polishing pad, a gas supplier to generate pressurized gas to press a wafer toward the polishing pad, and a polishing head assembly including a planar member having a plurality of fine holes in communication with the gas supplier and a membrane to press the wafer toward the polishing pad due to the pressurized gas received through the plurality of fine holes, wherein the plurality of fine holes are arranged to rotate at different radii of rotation when the planar member rotates.

Abstract: A cutting tool having a crystalline tip is pressed with a uniform pressure against the outboard surface of a vehicle wheel as the wheel is rotated. The smoothed wheel surface is then chrome plated to provide a cosmetic finish to the wheel face.

Abstract: An improved design for a retaining ring for a chemical mechanical poling machine is described which provides superior flexibility and instantaneous in-situ control of the polishing rate in the edge region of a wafer. The design has a plurality of straight slurry delivery groves, angled in the direction of rotation of said ring wherein each alternate channel is recessed away from the inner circumference of the bottom, pad contacting, surface, of said retaining ring by a recess which extends upward from the bottom surface only sufficiently to prevent contact of the retaining ring with the polishing pad in the area of the recess. Each recess curves outwardly towards the inner circumference of the retaining ring in a manner to form a symmetrical segmented tab with a rounded edge, tangent to the inner circumference of the retaining ring, and meeting the inner circumference at the exit end of an adjacent non-recessed slurry channel. For a 200 mm.

Abstract: A semiconductor substrate support is provided. The semiconductor substrate support includes a chuck configured to change between a compliant state and a rigid state. An electromagnetic field source configured to apply an electromagnetic field to the chuck is included. The electromagnetic field causes the chuck to change from the compliant state to the rigid state. A method for supporting a semiconductor substrate and a system for cleaning a substrate and an apparatus are also provided.

Abstract: A tool assembly which is adapted to perform a cutting operation and also a beveling operation on a pipe. There is a rotary power saw which has rotary drive member to which a saw blade can be mounted. There is a bevel section having a mounting member that connects to the rotary drive member, and a bevel member. There is a locating surface portion around the axis of rotation of the bevel member, and an end lateral locating section and an apex end of the bevel member. The bevel section can be removably connected to the drive member of the power saw.

Abstract: An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regions. The partition portion of the membrane is fixed to a slider that can move up and down in a guide groove formed in the membrane supporter.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: A wafer polisher, wherein a retainer ring (28) is installed in a wafer holding head (14), a protective sheet material (52) is disposed inside the retainer ring (28), and a wafer (W) is pressed against a polishing pad (20) through the protective sheet material (52) for polishing, whereby the protective sheet material (52) can be disposed without causing wrinkles on the inner peripheral part of the retainer ring (28).