Rotary Work Holder Patents (Class 451/398)
  • Patent number: 10702971
    Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: July 7, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
  • Patent number: 10532441
    Abstract: A flexible membrane for a carrier head of a chemical mechanical polisher includes a main portion, an annular outer portion, and three annular flaps. The main portion has a substrate mounting surface with a radius R. The annular outer portion extends upwardly from an outer edge of the main portion and has a lower edge connected to the main portion and an upper edge. The three annular flaps include a first annular flap joined to an inner surface of the main portion at a radial position between 75% and 95% of R, a second inwardly-extending annular flap joined to the annular outer portion at a position between the lower edge and the upper edge, and a third inwardly-extending annular flap joined to the upper edge of the annular outer portion.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: January 14, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Jamie Leighton
  • Patent number: 9922837
    Abstract: A method includes measuring a topography of a wafer, determining that a first portion of the wafer has a greater thickness than a specified thickness. The method further includes, after measuring the wafer, performing a Chemical Mechanical Polishing (CMP) process to a first side of the wafer, and during application of the CMP process, applying additional pressure to a region of the wafer, the region comprising an asymmetric part of the wafer, the region including at least a part of the first portion of the wafer.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: March 20, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Wen Liu, Che-Hao Tu, Po-Chin Nien, William Weilun Hong, Ying-Tsung Chen
  • Patent number: 9731399
    Abstract: A retaining ring for a polishing system is disclosed. The retaining ring has a process-resistant coating over a portion thereof. The process-resistant coating is a thin, smooth, conformal layer that is resistant to wear and chemical attack. The process-resistant coating is formed by a method that includes vapor deposition from a precursor gas mixture, which may deposit polyparaxyxylene from a gas mixture comprising paracyclophane. Adhesion of the process-resistant coating to the retaining ring may be enhanced by treating the surface of the ring prior to forming the coating. Resistance of the coating to the process may be further enhanced by treating the surface of the coating with an etching or deposition gas to impart texture.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: August 15, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Daniel L. Martin, Jeonghoon Oh, Simon Yavelberg
  • Patent number: 9694470
    Abstract: A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: July 4, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Shaun Van Der Veen, Steven M. Zuniga
  • Patent number: 9511474
    Abstract: A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table; a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes the retaining ring; a sensor for sensing the step height between the retaining ring and its membrane and a controller for adjusting the movement of the retaining ring based on the step height between the retaining ring and its membrane to ensure the step height remains at a fixed value as the retaining ring wears out.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: December 6, 2016
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Benfu Lin, Wei Lu, Alex See
  • Patent number: 9337075
    Abstract: A chemical mechanical polishing fixture having lateral perforation structures includes: a holder and a retaining ring. The holder includes: an annular substrate, a plurality of third holes and a plurality of lateral perforation structures. The annular substrate has a first joint surface, an outer periphery and an inner periphery. The third holes are annularly arranged on the first joint surface, and each third hole includes a first inner thread structure for individually providing a screw to be locked to a semiconductor machine. The lateral perforation structures penetrate from the outer periphery to the inner periphery of the annular substrate, where the lateral perforations are selected from: a converse U-shaped cube structure, an converse U-shaped cube structure, a cuboid structure, a cylinder structure, an elliptic cylinder structure, a flat cuboid structure or a hybrid structure of at least one cuboid structure and the above.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: May 10, 2016
    Assignee: KAI FUNG TECHNOLOGY CO., LTD.
    Inventor: Hui-Chen Yen
  • Patent number: 9242338
    Abstract: A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table, a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes a retaining ring, a sensor for sensing the depth of grooves on the retaining ring and a controller for determining an update pressure to apply to the retaining ring based on the depth of the grooves and applying the updated pressure to the retaining ring during processing.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: January 26, 2016
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Benfu Lin, Lei Wang, Xuesong Rao, Wei Lu, Alex See
  • Patent number: 9039488
    Abstract: Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a lug-pin device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: May 26, 2015
    Inventor: Wayne O. Duescher
  • Patent number: 9033768
    Abstract: The invention relates to a device (1) for machining a stepped shaft (2), having a workpiece rest (6); having a disk arrangement (3) which has a grinding disk (4) and a control disk (5); and having an axial stop arrangement (7), wherein the axial stop arrangement (7) has a contact adapter (8) which can be temporarily placed in contact with an end surface portion (9) of the shaft (2) and which has a punctiform contact surface (10) for contact against a stop part (11) of the stop arrangement (7).
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: May 19, 2015
    Assignee: BorgWarner Inc.
    Inventors: Tom Cvjetkovic, Stefan Hambel, Erich Ostermeyer, Stefan Eisinger
  • Publication number: 20150133038
    Abstract: A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.
    Type: Application
    Filed: November 10, 2014
    Publication date: May 14, 2015
    Inventors: Satoru YAMAKI, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Makoto FUKUSHIMA, Shingo TOGASHI
  • Patent number: 9011207
    Abstract: Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating or rigid workpiece holder carrier that is supported by a pressurized-air flexible elastomer disk sealed air-chamber device and is rotationally driven by a flexible arm or a lug-pin device. The rotating wafer carrier rotor is horizontally restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. A wide range of abrading pressures are applied uniformly across the surface of the workpiece. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: April 21, 2015
    Inventor: Wayne O. Duescher
  • Patent number: 8998678
    Abstract: Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a circular flexible-arm device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial and lateral motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: April 7, 2015
    Inventor: Wayne O. Duescher
  • Patent number: 8998676
    Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: April 7, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
  • Patent number: 8986075
    Abstract: Disclosed is a blade grinder comprising a blade holder that is mounted so as to be rotatable about a horizontal shaft which is mounted so as to be rotatable about a vertical axis, thus allowing the blade to be optimally adjusted relative to a grinding disk. The grinding disk can preferably be vertically and horizontally moved using spindles. This creates a simple design allowing a lawnmower blade to be ground in a fully automatic manner.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: March 24, 2015
    Assignee: Johannes Franzen GmbH & Co. KG
    Inventor: Johannes Franzen
  • Patent number: 8986071
    Abstract: A parts carrier assembly for a grinding machine includes an annular parts carrier and a bearing insert. The annular parts carrier includes an upper surface, a lower surface, an inner edge, an outer edge, and a plurality of loading apertures. The inner edge is configured to engage a driving wheel of the grinding machine. The driving wheel rotates about a central axis resulting in rotation of the parts carrier about an offset axis, which is offset from the central axis. The loading apertures are configured to receive parts to be ground by the grinding machine. The bearing insert includes an inner bearing surface complementary in shape to the outer edge of the parts carrier. The outer surface the parts carrier bears against the inner bearing surface of the bearing insert as the parts carrier rotates about the offset axis.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: March 24, 2015
    Assignee: White Drive Products, Inc.
    Inventor: Hollis N. White, Jr.
  • Patent number: 8974267
    Abstract: An insert carrier is configured to receive at least one semiconductor wafer for double-side processing of the wafer between two working disks of a lapping, grinding or polishing process. The insert carrier includes a core of a first material that has a first surface and a second surface, and at least one opening configured to receive a semiconductor wafer. A coating at least partially covers the first and second surfaces of the core. The coating includes a surface remote from the core that includes a structuring including elevations and depressions. A correlation length of the elevations and depressions is in a range of 0.5 mm to 25 mm and an aspect ratio of the structuring is in a range of 0.0004 to 0.4.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: March 10, 2015
    Assignee: Siltronic AG
    Inventors: Georg Pietsch, Michael Kerstan
  • Publication number: 20150044947
    Abstract: Embodiments of the present invention provide a polishing ring assembly suitable for polishing an electrostatic chuck and method of using the same. In one embodiment, the polishing ring assembly has a retaining ring assembly and an electrostatic chuck fixture. The retaining ring assembly includes an inner diameter and a top surface, a plurality of outer drive rings wherein the plurality of outer drive rings are placed on the top surface of the ceramic retaining ring. The electrostatic chuck fixture includes an electrostatic chuck drive plate adjacent to the inner diameter of in the ceramic retaining ring. The electrostatic chuck drive plate has a lock to secure retaining ring assembly with the electrostatic chuck fixture without transferring the weight from one assembly over to the other through the locking mechanism.
    Type: Application
    Filed: July 25, 2014
    Publication date: February 12, 2015
    Inventors: William Ming-Ye LU, Wendell Glen BOYD, JR., Stacy MEYER
  • Patent number: 8939817
    Abstract: Provided is a membrane assembly of a carrier head in a chemical-mechanical polishing apparatus. The membrane assembly includes a main membrane and a circular ring. The main membrane has a wafer contacting surface in contact with a wafer while a chemical-mechanical polishing process is being performed. The circular ring is disposed at an edge portion of the main membrane and receives an air pressure to downwardly apply the air pressure to the main membrane at the edge portion.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: January 27, 2015
    Assignee: K.C. Tech Co., Ltd.
    Inventor: Jun Ho Son
  • Patent number: 8939815
    Abstract: A system includes a chuck with a retaining ring on a first surface thereof. The first surface and the retaining ring are both circular, the retaining ring having a first inner circumference. The system also includes a platen with a second surface, and the second surface faces the first surface and is operable to move with the first surface. The system further includes an air zone circumscribed by the first inner circumference that provides an effective inner circumference different from the first inner circumference.
    Type: Grant
    Filed: February 21, 2011
    Date of Patent: January 27, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hui-Ting Tsai, Feng-Inn Wu
  • Patent number: 8932106
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: January 13, 2015
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Katsuhide Watanabe, Hozumi Yasuda, Satoru Yamaki
  • Publication number: 20140357161
    Abstract: A polishing head assembly for single side polishing of silicon wafers includes a polishing head and a cap. The polishing head includes a top surface and a bottom surface and defines a longitudinal axis extending therethrough. The cap is positioned coaxially with the polishing head and includes an upper surface and a lower surface. The upper surface is spaced from the bottom surface of the polishing head to form a chamber that allows the cap to deflect toward the polishing head.
    Type: Application
    Filed: May 31, 2014
    Publication date: December 4, 2014
    Inventors: Sumeet Bhagavat, Peter Albrecht, Alex Chu, Ichiro Yoshimura, Yunbiao Xin, Roland Vandamme
  • Patent number: 8888562
    Abstract: In the double-side polishing apparatus, one end part of a slurry supply hole has a female-tapered face whose inner diameter is gradually increased toward a polishing face of a polishing plate. A pad hole, which corresponds to the slurry supply hole, is formed in a polishing pad covering the slurry supply hole. An edge of the pad hole is located in the slurry supply hole. A fixation pipe, in which a flange section facing the female-tapered face is formed at one end part, is fixed in the slurry supply hole. The edge of the pad hole is sandwiched and held between the female-tapered face of the slurry supply hole and the flange section of the fixation pipe.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: November 18, 2014
    Assignee: Fujikoshi Machinery Corp.
    Inventors: Tadakazu Miyashita, Shogo Koyama
  • Patent number: 8870626
    Abstract: A polishing pad used in conjunction with a carrier ring to polish a substrate and has a motion direction when polishing is provided. The carrier ring has at least one carrier groove, and the substrate has a substrate radius. The polishing pad has a polishing layer and a surface pattern. The surface pattern has traversing grooves, and an angle between the tangent line of each traversing groove and the tangent line of the motion direction is not equal to 0 degree. Each traversing groove respectively has a traversing groove trajectory corresponding to the motion direction, and the traversing groove trajectory of the traversing groove has a trajectory width smaller than the substrate radius. At leading region of the carrier ring corresponding to the motion direction, the traversing grooves have at least one carrier compatible groove which aligns with the at least one carrier groove of the carrier ring.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: October 28, 2014
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu-Piao Wang
  • Patent number: 8858302
    Abstract: A retainer ring of a chemical mechanical polishing apparatus includes a base portion having a ring shape, the base portion including a pressurizing surface and a combining surface opposite the pressurizing surface, slurry inflowing portions on the pressurizing surface of the base portion, the slurry inflowing portions having groove shapes, and minute grooves at least on a surface portion of the slurry inflowing portions.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: October 14, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Choon-Goang Kim
  • Patent number: 8845394
    Abstract: Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The wafer carrier rotor is contained by a set of idlers that are attached to a stationary rotor housing to provide support against abrading forces that are imposed on the wafer by the moving abrasive coating on a rotary platen. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The system is also well suited for lapping optical devices and rotary seals and for chemical mechanical planarization (CMP) polishing of wafers using resilient pads. Pressurized air is injected into the bellows device to provide uniform abrading pressure across the full surface of the wafer. Wafers can be attached to the workpiece carrier with vacuum.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: September 30, 2014
    Inventor: Wayne O. Duescher
  • Patent number: 8845396
    Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: September 30, 2014
    Assignee: Ebara Corporation
    Inventors: Osamu Nabeya, Tetsuji Togawa, Makoto Fukushima, Hozumi Yasuda
  • Publication number: 20140287662
    Abstract: A retaining ring includes a generally annular upper portion having a top surface configured to be connected to a base of a carrier head and a lower surface, and a plurality of substantially identical arcuate segments detachably secured to the upper portion to form an annular lower portion. Each of the arcuate segments has an upper surface that abuts the lower surface of the upper portion and a bottom surface for contacting a polishing pad during polishing.
    Type: Application
    Filed: March 19, 2014
    Publication date: September 25, 2014
    Inventors: Irfanulla Khuddus Rahmathullah, Bopanna Ichettira Vansantha, Padma Gopalakrishnan, Abraham Palaty, Aswathnarayanaiah Ravi, Ashish Bhatnagar, Young J. Paik, Stacy Meyer, Daniel Martin
  • Patent number: 8840446
    Abstract: An inner ring for a carrier head has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. An outer ring for a carrier head has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: September 23, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Yin Yuan, Huanbo Zhang, Gautam Shashank Dandavate
  • Publication number: 20140273756
    Abstract: A substrate precession apparatus for a carrier head is provided. The apparatus enables substrate precession, which is the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and a retaining ring assembly may be de-coupled and move independently of one another to promote substrate precession during a CMP process.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Chih Hung CHEN, Gautam Shashank DANDAVATE, Jayakumar GURUSAMY, Samuel Chu-Chiang HSU
  • Patent number: 8834661
    Abstract: Row bars are attached to a lapping ring by a first single-sided adhesive film that adheres to the row bars and are secured to a first lapping ring by a vacuum. After backside lapping is performed on the row bars, the row bars are transferred to a second lapping ring with second single-sided adhesive film by compressing the row bars between the adhesive films and deactivating the vacuum, thereby releasing the row bars from the first lapping ring and providing ring-to-ring transfer without peeling the row bars off the first single-sided adhesive film. Lapping rings used for this process include vacuum channels and slots for holding the row bars so that the top surfaces of the row bars and lapping ring are substantially flat. Ring-to-ring transfer tools are used to transfer row bars between the backside lapping ring and the frontside lapping ring with minimal handling of the row bars.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: September 16, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: Ziggi, Michael Chia Loke Lim
  • Publication number: 20140242886
    Abstract: A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including a pressing portion to adsorb and press a substrate, a first partition on the pressing portion and extending from an edge of the pressing portion along a height direction, a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, and a second horizontal extending portion from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion expanding by pneumatic pressure.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 28, 2014
    Applicant: SAMSUNG ELECTRONICS., LTD.
    Inventors: Chang Gyu WOO, Sung Ho SHIN, Joo Yeop NAM, Ki Hong CHO
  • Patent number: 8808062
    Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: August 19, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
  • Patent number: 8765259
    Abstract: The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate consists of first elastomer, the first elastomer comprising a plurality of first holes; wherein the first holes have a drop shape, and each of the first holes has an opening. The buffer substrate consists of second elastomer, the second elastomer comprising a plurality of second holes. The surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: July 1, 2014
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Patent number: 8753176
    Abstract: A device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the front side of the wafer and the assembly carrier by freezing of the film.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: June 17, 2014
    Assignee: Infineon Technologies AG
    Inventors: Werner Kroeninger, Manfred Schneegans
  • Patent number: 8740673
    Abstract: A wafer carrier adapted to further reduce the edge effect and allow a wafer to be uniformly polished across its entire surface, with a retaining ring made from very hard materials such as PEEK, PET or polycarbonate with a hardness in the range of 80 to 85 Shore D, while the inner surface or insert is made of polyurethane or other material with a hardness in the range of 85 to 95 Shore A.
    Type: Grant
    Filed: October 4, 2011
    Date of Patent: June 3, 2014
    Assignee: Strasbaugh
    Inventors: William J. Kalenian, Larry Spiegel
  • Patent number: 8734202
    Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: May 27, 2014
    Assignee: Applied Materials, Inc.
    Inventors: David James Lischka, Thomas Lawrence Terry
  • Patent number: 8721393
    Abstract: Apparatus, systems and methods related to sharpening blades for rotary cutters. In one illustrative embodiment, a power sharpener system secures a rotary cutting blade between upper and lower columns that form a rotating axle in contact with upper and lower sharpening stones, each positioned at an appropriate angle to contact a cutting edges of the rotary blade for sharpening. The upper column may be rotatably attached to an upper cover or lid and the lower column rotatably disposed in a base. After the rotary blade is secured, an electric motor is used to rotate the column, contacting the edges of the blade against the stones to simultaneously sharpen both edges of the blade. In some embodiments, a retractable plate may be disposed around the lower column for placement of the rotary blade thereon and a lifting lever may be used to facilitate blade removal.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: May 13, 2014
    Inventor: Jim Bagley
  • Patent number: 8721391
    Abstract: A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: May 13, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Yin Yuan, Huanbo Zhang, Gautam Shashank Dandavate
  • Patent number: 8694150
    Abstract: A machining installation for workpieces comprises a workpiece positioning device comprising a workpiece holder pivot unit as well as a tool positioning device comprising a tool holder pivot unit. The workpiece holder pivot unit is designed such that a workpiece holder is pivotable about at least three and no more than four workpiece holder pivot axes. Moreover, the tool holder pivot unit is designed such that a tool holder is pivotable about no more than two tool holder pivot axes. The machining installation has a simple design and ensures flexible and accurate machining of workpieces.
    Type: Grant
    Filed: July 1, 2009
    Date of Patent: April 8, 2014
    Assignee: MAG IAS GmbH
    Inventors: Moshe Israel Meidar, Wolfgang Horn, Siegfried Schmalzried, Waldemar Haus
  • Publication number: 20140030967
    Abstract: An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen.
    Type: Application
    Filed: September 30, 2013
    Publication date: January 30, 2014
    Inventor: Michael F. Hart
  • Publication number: 20140017981
    Abstract: Among other things, one or more techniques and/or systems are provided for driving a body of a polishing head using an alignment gear. That is, an alignment gear, coupled to a housing of the polishing head, can transfer rotational force from the housing to the body responsive to the alignment gear being mated with a channel associated with the body. For example, the housing can supply pressure to the body, resulting in the body and the housing moving towards one another into a mated state. When the body and the housing are in the mated state, the alignment gear can mate with the channel (e.g., the alignment gear can fit within the channel). In this way, the alignment gear can drive the body by transferring rotational force to the body, resulting in the body rotating a semiconductor wafer against a polishing pad to polish the semiconductor wafer, for example.
    Type: Application
    Filed: July 12, 2012
    Publication date: January 16, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Pei Tang, Kun-Tai Wu
  • Patent number: 8628382
    Abstract: A workpiece holder for a surface grinding machine is provided. The workpiece holder includes a central workpiece holder shaft around which the workpiece holder can be driven in rotation, at least one workpiece fixture to hold at least one workpiece, and at least two holder parts movable relative to one another that jointly define the at least one workpiece fixture and that can be fixed relative to one another by means of a joining device.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: January 14, 2014
    Assignee: Supfina Grieshaber GmbH & Co. KG
    Inventor: Torsten Bergmann
  • Publication number: 20140011431
    Abstract: A method for positioning operative cylinders, for example of rolling-mills or paper-mills on a grinding machine, includes at least the following steps: A—positioning the transversal, longitudinal center-line plane of the cylinder in correspondence with a reference point situated between a movable piece-holder head and tailstock center of the machine; B—moving the piece-holder head and the tailstock center in the direction of the cylinder until there is a reciprocal coupling. The present invention relates also to a machine for implementing the above method.
    Type: Application
    Filed: December 7, 2011
    Publication date: January 9, 2014
    Applicant: TENOVA S.p.A.
    Inventors: Claudio Trevisan, Erasmo Trenti, Thomas Andersson, Matteo Anzini
  • Publication number: 20130324017
    Abstract: A retaining ring includes an annular lower portion and an annular upper portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, an inner rim projecting upward from the main body, an outer rim projecting upward from the main body and separated from the inner rim by a gap, and a plurality of azimuthally separated interlock features positioned between the inner rim and the outer rim, each interlock feature projecting upwardly from the main body. The annular upper portion has a top surface and a bottom surface and a plurality of azimuthally separated recesses in the bottom surface, the recesses defining thin portions of the upper portion, the plurality of interlock features fitting into the plurality of recesses. The lower portion is a plastic and the upper portion is a material that is more rigid than the plastic.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 5, 2013
    Inventors: Irfanulla Khuddus Rahmathullah, Bopanna Ichettira Vansantha, Padma Gopalakrishnan, Ravi Aswathnarayanaiah, Abraham Palaty, Young J. Paik, Stacy Meyer, James Klingler, Ashish Bhatnagar
  • Publication number: 20130316628
    Abstract: A flexible membrane for a polishing head includes a main part having a first surface configured to make contact with a surface of a substrate and a second surface opposite to the first surface, a plurality of extensions extending substantially perpendicularly from the second surface of the main part so as to define a plurality of independent spaces, respectively, and an inner ring coupled with an inner side of an outermost extension of the extensions to support an edge portion of the main part. A bottom surface of the inner ring is substantially flat.
    Type: Application
    Filed: March 6, 2013
    Publication date: November 28, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Seok JANG, Young-Ho KOH, Jae-Sun KIM, Kuen-Byul KIM, Jae-Chang LEE, Min-Sung HEO, Jin-Suk HONG, Jae-Dong LEE
  • Publication number: 20130316620
    Abstract: A retainer ring is provided for use in conjunction with Chemical Mechanical Polishing apparatus which polishing is used to polish a substrate. Particularly, the retainer ring includes an inner surface defining a retainer area, an outer surface, a front surface extending between the inner and outer surface, the front surface being in contact with the polishing pad during polishing and a transition region between the outer surface and the front surface. A CMP apparatus which includes at least a ring having the above features is also provided for.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 28, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: André Loebmann, Norman Nagel
  • Patent number: 8585468
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: November 19, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Patent number: 8574033
    Abstract: Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: November 5, 2013
    Assignee: LG Siltron Inc.
    Inventor: Jae Chel Sung
  • Publication number: 20130260654
    Abstract: Disclosed herein is a carrier head for a chemical mechanical polishing system. The carrier head for a chemical mechanical polishing system includes a base. A substrate receiving member having an outer surface against which a substrate can be mounted is connected to a lower part of the base. Inside of the substrate receiving member, at least two bladders are connected to the lower part of the base. The at least two bladders can apply pressure independently to predetermined areas of an inner surface of the substrate receiving member by expanding and contacting the inner surface. At least one wall structure is connected to the lower part of the base, wherein the at least one wall structure can limit lateral expansions of the at least two bladders.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 3, 2013
    Inventor: Joon Mo KANG