Abstract: A high density manufacturing cell or carousel for optimizing floor space usage to reduce equipment footprint and material travel path is disclosed. The carousel allows processing and transferring of products to be concurrently performed, minimising non-productive time. The manufacturing cell or carousel comprises: (a) a plurality of rotary platforms, (b) a plurality of vertical moving platforms, (c) a vertical walking beam, and (d) a load gripper and a unload gripper mounted to independent robots.

Abstract: A method of polishing an outer surface of a ceramic coated gas turbine engine component includes applying a rotating diamond brush to the outer surface. The brush is configured to achieve a uniform finish of 150 microinches Ra or less over the surface. The brush contains diamond impregnated bristles, and is affixed to a rotary head of a robotic arm. A force sensing controller limits brush forces against the component. The component disclosed is a hot section turbine vane designed for directional control of high temperature, high-pressure combustion gases, but the method may be applied to other components contained within such aerospace applications. The polished coating provides an improved thermal barrier for maintaining structural integrity of the component in environments having temperatures ranging up to 2,000 degrees Celsius. The method limits abrasive removal of ceramic material to only 0.0005 to 0.00075 inch, and saves time and expense over past practices.

Abstract: A deburring machine for removing burrs from workpieces includes a framework, a deburring mechanism and a transport mechanism. The deburring mechanism mounted on the framework, includes deburring units positioned on the framework. The transport mechanism is positioned on the framework adjacent to the deburring units. The transport mechanism includes a base, multi-station rotating plate and a first driver. The base is positioned on the framework. The multi-station rotating plate is rotatably positioned on the base. The first driver is positioned on the framework and connects with the base. The first driver is capable of driving the multi-station rotating plate to transport the workpieces to the plurality of deburring units, the plurality of deburring units are capable of removing the burrs of the workpieces.

Abstract: A workpiece holder for a surface grinding machine is provided. The workpiece holder includes a central workpiece holder shaft around which the workpiece holder can be driven in rotation, at least one workpiece fixture to hold at least one workpiece, and at least two holder parts movable relative to one another that jointly define the at least one workpiece fixture and that can be fixed relative to one another by means of a joining device.

Abstract: A superfinishing system and method, wherein an abrasive is employed to process a workpiece, and wherein the system simultaneously mounts a plurality of workpieces in a diagonal turret, or mounts a plurality of different types of workpieces in a plurality of chucks for different operations thereon, or performs a plurality of different operations on the same workpiece without remounting. The system improves throughput by allowing flexibility in the operation and multitasking.

Abstract: The present invention provides a multiple station tooling machine for the production of spirally grooved products and includes a base plate, a plurality of work stations distributed around the base plate and operable to effect selected tooling operations on work pieces, a support stand coupled to the base plate and supporting a support plate, and a turntable disposed above the support plate, the turntable being iteratively angularly movable. The multiple station tooling machine also includes a plurality of workpiece retaining elements and an actuating assembly including drive motors mounted on the support plate for moving the workpiece retaining elements to and between selected orientations. A plurality of generally vertical shafts each has a respective workpiece retaining element secured to one end thereof.

Abstract: A chemical mechanical polishing apparatus is provided. The apparatus includes a single polishing pad and a leaf structure having a pair of fingers. Each finger holds a carrier device designed to hold a wafer to be polished. The leaf structure is configured to apply each of the wafers onto the single polishing pad.

Abstract: An method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof. Each cavity has notches cut in the walls thereof and a pattern etched in the base thereof. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. A moistening liquid is dispensed and diffuses into the cavities via the notches cut in the walls and collects in the pattern etched on the base of the cavity thereby increasing the suctional force used to secure the holding disk. When the template is releasably secured within a cavity, rotatably connected to a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head.

Abstract: A method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof and a backing plate positioned on a side of the main disk opposite the first side. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. When the template is releasably secured to and rotatable with a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head. A plurality of shims are selectively received within respective cavities between a base of the cavity and the holding disk for adjusting a depth of the cavity thereby adjusting an amount of a wafer to be lapped and polished. The shims have varying thickness' and are color coated, each color being representative of a predetermined thickness for the shim.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate. A central portion of the flexible membrane is formed of a first material with a different rigidity than a second material that forms the annular portion of the flexible membrane.

Abstract: A parallel alignment device for chemical mechanical polishing using a plurality of carrier devices (123) rotatably coupled to a turret means. The apparatus (100) includes a turret and plurality of rotatable polishing surfaces (111) positioned around the turret. The apparatus also includes a plurality of carrier devices (123) rotatably coupled to the turret, where the carrier devices (123) are each adapted to hold a workpiece to be polished on at least one of the rotatable polishing surfaces. Each of the carrier devices is operably independently to each other during a process for chemical mechanical polishing.

Abstract: A chemical mechanical polishing apparatus includes a rotatable carousel and multiple carrier head assemblies coupled to the carousel. Each carrier head assembly includes multiple carrier heads each of which can hold a single substrate. The apparatus includes multiple substrate processing stations separated from one another in substantially equal angular intervals. The carrier head assemblies can be positioned in angular alignment with the stations and can be rotated from one station to another station. At least one polishing station includes a fixed abrasive sheet and a fluid bearing surface that provides an upward pressure against the lower surface of the polishing sheet. The carrier head assembly is positioned so that the substrates are in angular alignment with the fluid bearing disposed below the polishing sheet, and the substrates are brought into contact with the polishing sheet.

Abstract: A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.

Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes a polishing surfaces, such as pads mounted on respective platens, located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, for example oscillate radially within the rotatable support. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing.

Abstract: A new machine for and method of manufacturing fluted pin fasteners and the pins produces thereby are disclosed which utilize a circular grinding arrangement of a plurality of grinders which grind flutes into a threaded pin. An internally threaded collar threads onto the pin. When the collar engages a surface of a work piece, resistance to further threading increases. When sufficient resistance to threading occurs, the driver deforms the lobes of the collar radially inward toward the axis of the collar. Material of the collar positioned internally from the lobes responds to deformation of the lobes and flows radially inward into the flutes of the pin to lock the collar, pin, and work piece together. The driver then rotates freely, and a joint has been made with a predetermined axial load thereby locking the component parts together.

Abstract: The invention concerns a device for sharpening of knives, which are mounted in the knife ring of a chip cutter and whose cutting edges run essentially parallel to the knife ring axis. Several grinding tools can be run intermittently and simultaneously in the direction of the knife ring axis in order to sharpen individual knives The knife ring stands still during the sharpening and is rotated around its own axis during the pauses between sharpening corresponding to the distribution of the knives over the periphery of the knife ring. Any grinding tool sharpens any knife in such a way that the desired total (amount of) removed grinding material is achieved with the last grinding tool in the peripheral direction of the knife ring.

Abstract: Machine comprising a main frame (1), machine bed (2), headstock (3) and tailstock (4) with means (17, 18) for mounting of the work for rotation about a work axis (C2), the means being disposed on the machine bed, with the headstock being movable in a direction (Z-axis) parallel to the work axis (C2). The machine also includes a slide system supported by the main frame (1) comprising two controlled-drive slides (7, 10), of which one (10) is displaceable in a direction (Y-axis) perpendicular to the work axis (C2), and the other (7) in a direction (X-axis) perpendicular to the Y and Z axes. Further included is a cradle (12) supported by the slide system (7, 10) and holding a tool head (13) for angular setting about an axis (A) perpendicular to the work axis (C2), the tool head being disposed between the headstock and tailstock.

Abstract: An apparatus for polishing semiconductor wafers and other workpieces that includes polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a carousel, which provides circumferential positioning of the heads relative to the polishing pads, and the wafer heads oscillate radially as supported by the carousel to sweep linearly across the respective pads in radial directions with respect to the rotatable carousel. Each polishing station includes a pad conditioner to recondition the polishing pad so that it retains a high polishing rate. Washing stations may be disposed between polishing stations and between the polishing stations and a transfer and washing station to wash the wafer as the carousel moves. A transfer and washing station is disposed similarly to the polishing pads.

Abstract: A method of resharpening the knives in a chipping machine while they are installed in the knives' rotor is disclosed. For this purpose all knives are moved forward one after another to their functional position by an amount that corresponds to the wear of the edges. As part of this, the radial grinding feed which is required in order to achieve the desired protrusion of the edges above the relevant area of the knives' rotor is pre-programmed based on the detected state of wear. A device to implement this method is also disclosed. The device comprises a rotational disk for the knife rotor placed on top of a machine frame and where an equipment table is provided that supports a cross-wise translatory moveable grinding unit, as well as a radially moveable adjustment device which has a sensor to determine the state of wear of the relevant area of the knife rotor 8 and a stop face to limit the knife feed.

Abstract: An apparatus for grinding spherical surfaces of workpieces includes a grinding section having a grindstone rotating mechanism for rotating around an axis of a shaft thereof with a grindstone held at an end of the shaft, a feeding mechanism for feeding the grindstone rotating mechanism toward the workpiece in a direction along the shaft, and a fixing mechanism for holding the grindstone rotating mechanism and the feeding mechanism and determining an angle 1 inclination of the short of the grindstone rotating mechanism with respect to the workpiece. A plurality of workpiece holding mechanisms are provided for holding the workpieces at ends of shafts thereof, the workpiece held by at least one of the workpiece holding mechanisms being opposed to the grindstone. A workpiece rotating mechanism is provided for rotating the workpiece holding mechanism which holds the workpiece opposed to the grindstone.

Abstract: A first end surface of a coiled compression spring at its relaxed length is machined to a plane transverse to the spring axis. The spring is then placed in a press structure having first and second opposed planar support surfaces, with the machined spring end surface bearing against the first support surface, the unmachined spring end surface bearing against a planar first surface of a lateral force compensation member, and an opposite, generally spherically curved surface of the compensation member bearing against the second press structure support surface. The spring is then compressed generally to its loaded length, and a circumferentially spaced series of marks, lying in a plane parallel to the second press structure support surface, are formed on the spring coil on which the second spring end surface lies. The spring is then removed from the press structure, and the second spring end surface is machined to the mark plane.

Abstract: A wafer chamfer polishing apparatus with a rotary circular dividing table, wherein the vacuum pump for pneumatically activating the wafer suction cups is mounted on an integral part of the rotary circular dividing table and the drive motors for dynamically activating the wafer suction cups are installed on an independent stationary body.