Abstract: A method for breaking up Chemical Mechanical Polishing (CMP) slurry particles includes receiving a CMP slurry comprising particles suspended in a solution, placing the slurry into a first agitation tank, and agitating the slurry at a first frequency. The first frequency is selected to break up particles having a size within a specified range.

Abstract: An apparatus for reclaiming abrasive blasting material comprises a prime mover, a vacuum pump and a separator unit for separating the abrasive blasting material in the contaminated abrasive blasting material from contaminants. The vacuum pick-up draws the contaminated abrasive blasting material. The separator unit includes a screening device for separating and reclaiming the abrasive blasting material. The screening device comprises a support member having a longitudinal axis and a transverse axis, and an endless flexible screen belt mounted to the support member so as to be movable along an endless closed loop in the direction of the longitudinal axis. The screen belt has a plurality of openings being sized to allow particles of the abrasive blasting material of a desired size to fall therethrough by gravity and to prevent the contaminants larger than the abrasive blasting material from falling therethrough.

Abstract: Systems for recycling slurry materials during polishing processes are provided. One system includes a polisher having an inlet and drain outlet, and a slurry storage tank to supply a slurry including a preselected material to the polisher inlet, and a recycling assembly including a cross flow filter including an inlet to receive a waste slurry including the preselected material from the polisher drain outlet, where the cross flow filter is configured to concentrate the preselected material in an outlet slurry, a density meter configured to measure a concentration of the preselected material in the filter outlet slurry, a valve coupled to the filter outlet and configured to supply the slurry storage tank, and a controller coupled to the density meter and valve, where the controller is configured to open the valve when the concentration of the preselected material reaches a first concentration threshold.

Abstract: A method of recycling an abrasive slurry for recycling a slurry that: contains colloidal silica; and has been used in polishing semiconductor wafer(s) is provided. The method includes: adding a dispersant to the used slurry having been collected so as to prevent the used slurry from being gelled; irradiating ultrasound to the used slurry having been added with the dispersant so as to disperse a gelled portion and aggregated silica in the used slurry; and, by using a filter, removing a foreign substance contained in the used slurry having been irradiated with the ultrasound.

Abstract: The present invention provides a recovery device of a blasting medium for recovering a blasting medium after use, which has been injected to a work and has fallen therefrom, into a solid-gas separating tank by suctioning with a suction blower, wherein the solid-gas separating tank comprising: a sucking unit of the blasting medium; a vertically rising pipe provided in a vertical direction and adapted to connect the sucking unit and a tank body; a cushioning member disposed opposedly to an upper exit of the vertically rising pipe; a sieve into which the blasting medium that has collided against the cushioning member reducing its velocity falls, and which vibrates to classify a reusable blasting medium and a non-reusable blasting medium; an outlet portion for the reusable blasting medium classified by the sieve and an outlet portion for the non-reusable blasting medium; and an airflow path provided downstream of the sieve in an air current direction, and connected to the suction blower.

Abstract: The invention generally provides methods and compositions for planarizing a substrate surface having underlying dielectric materials. Aspects of the invention provide compositions and methods using a combination of low polishing pressures, polishing compositions, various polishing speeds, selective polishing pads, and selective polishing temperatures, for removing barrier materials by a chemical mechanical polishing technique with minimal residues and minimal seam damage. Aspects of the invention are achieved by employing a strategic multi-step process including sequential CMP at low polishing pressure to remove the deposited barrier materials.

Abstract: A granule dishwashing apparatus with at least one removable granule collector and method of use. The dishwashing apparatus may include a treatment chamber, a tank, one or more granule collectors and one or more pumping devices. Soiled articles are placed in the treatment chamber to be washed with a mixture of liquid and granules that is sprayed at the articles under high pressure. The mixture falls toward the tank after impacting the articles, passing through the granule collector(s). A liquid only portion is separated from the mixture using the granule collector(s) so that the articles can be rinsed. At any point following a cleaning cycle, the granule collector(s) can be removed to add more granules and to simplify the cleaning of the apparatus. The granule collectors may be connected to actuators so that they can be placed in a release mode or a collect mode depending on the function desired.

Abstract: An apparatus and method recycles the abrasive fluid or slurry effluent used in the polishing step in the manufacture of semiconductors. Agglomerations of abrasive grains built up in the slurry effluent are crushed using a mill, ultrasonic oscillation, or pressurized circulation. The slurry effluent is then regenerated and reused.

Abstract: A process for machining a wafer-like workpiece between two plates, in which material is abraded from the workpiece under the influence of an auxiliary substance supplied and of a pressure acting on the workpiece. In this process, the pressure on the workpiece is significantly reduced and then increased again at least once during the machining of the workpiece, and the supply of the auxiliary substance is reduced as the pressure is increased.

Abstract: An improved method for lapping the opposed major surfaces of a wafer is provided. In this regard, a multi-step lapping process is provided in which lapping continues while transitioning from a first slurry having larger abrasive particles to a second slurry having smaller abrasive particles so as to reduce the overall length of the lapping process. In addition, the multi-step lapping process is optimized so as to remove no more than about 90 microns in total thickness from the opposed major surfaces of the wafer. By completing the lapping with slurry having smaller abrasive particles, subsequent etching of the wafers produces shallower surface pitting. As such, the wafers generally require less polishing than required by conventional processes.

Abstract: An apparatus and a process for recovering an abrasive from a waste fluid of a chemical mechanical polishing (CMP) process. The apparatus comprises a pre-filter into which a waste fluid of a CMP process is introduced, a membrane separation apparatus into which filtered waste fluid obtained from the pre-filter is introduced, a washing unit wherein a concentrated slurry obtained from the membrane separation apparatus is washed with water and a post-filter wherein the concentrated slurry obtained from the washing unit is filtered. Particles of the abrasive are thereby efficiently recovered from a waste fluid discharged from a CMP process in semiconductor manufacturing factories and are reused.

Abstract: An method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof. Each cavity has notches cut in the walls thereof and a pattern etched in the base thereof. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. A moistening liquid is dispensed and diffuses into the cavities via the notches cut in the walls and collects in the pattern etched on the base of the cavity thereby increasing the suctional force used to secure the holding disk. When the template is releasably secured within a cavity, rotatably connected to a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head.

Abstract: A method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof and a backing plate positioned on a side of the main disk opposite the first side. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. When the template is releasably secured to and rotatable with a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head. A plurality of shims are selectively received within respective cavities between a base of the cavity and the holding disk for adjusting a depth of the cavity thereby adjusting an amount of a wafer to be lapped and polished. The shims have varying thickness' and are color coated, each color being representative of a predetermined thickness for the shim.

Abstract: A granule dishwashing apparatus with easily removable granule collectors and method of use. The dishwashing apparatus consists primarily of a treatment chamber, a tank, one or more granule collectors and one or more pumping devices. Soiled articles are placed in the treatment chamber to be washed with a mixture consisting of liquid and granules that is sprayed at the articles under high pressure. The mixture falls toward the tank after impacting the articles, passing through the granule collector(s). A liquid only portion is separated from the mixture at some point using the granule collector(s) so that the articles can be rinsed. At any point following a cleaning cycle, the granule collector(s) can be removed to add more granules and to simplify the cleaning of the apparatus. In a multiple collector system, the granule collectors are connected to actuators so that the collectors can be placed in a release mode or a collect mode depending on the function desired.

Abstract: A slurry dispensing unit for a chemical mechanical polishing apparatus equipped with multiple slurry dispensing nozzles is disclosed. The slurry dispensing unit is constructed by a dispenser body that has a delivery conduit, a return conduit and a U-shape conduit connected in fluid communication therein between for flowing continuously a slurry solution therethrough and a plurality of nozzles integrally connected to and in fluid communication with a fluid passageway in the delivery conduit for dispensing a slurry solution. The multiple slurry dispensing nozzles may either have a fixed opening or adjustable openings by utilizing a flow control valve at each nozzle opening.

Abstract: A method for preparing a glass substrate for use in making a magnetic recording medium is herein disclosed and the method is characterized in that an abrasive liquid containing a CeO2-base abrasive having an average particle size, D50, of not more than 0.5 &mgr;m in an amount of not more than 1% by mass and an abrasive cloth are used in a step for final polishing the glass substrate for magnetic recording media. The method permits easy preparation of a glass substrate for use in making a magnetic recording medium, which has a uniform surface, is substantially free of any surface defect and has a smooth surface having an extremely low surface roughness.

Abstract: A granule dishwashing apparatus with easily removable granule collectors and method of use. The dishwashing apparatus consists primarily of a treatment chamber, a tank, one or more granule collectors and one or more pumping devices. Soiled articles are placed in the treatment chamber to be washed with a mixture consisting of liquid and granules that is sprayed at the articles under high pressure. The mixture falls toward the tank after impacting the articles, passing through the granule collector(s). A liquid only portion is separated from the mixture at some point using the granule collector(s) so that the articles can be rinsed. At any point following a cleaning cycle, the granule collector(s) can be removed to add more granules and to simplify the cleaning of the apparatus. In a multiple collector system, the granule collectors are connected to actuators so that the collectors can be placed in a release mode or a collect mode depending on the function desired.

Abstract: A preferred embodiment of a workpiece finishing system impinges a grit and fluid slurry onto a workpiece and then recycles the slurry for subsequent reuse. In another aspect of the present invention, a recovery tank is used for generally settling and concentrating the grit in the slurry, and for separating out a portion of the fluid from the grit. A further aspect of the present invention provides a venturi-type nozzle for expelling the grit and fluid onto a workpiece, wherein the nozzle has a selectively movable inlet thereby varying the slurry concentration properties of the nozzle.

Abstract: A first pump collects used slurry which is employed for a CMP technique. A new slurry supply device supplies new slurry having a concentration higher than a concentration of the used slurry, to the used slurry. A sensor measures a concentration of recycled slurry produced by mixing the used slurry with the new slurry. The new slurry supply device stops supplying the new slurry, in a case where the concentration which the sensor measures is equal to or above a predetermined value. A second pump supplies recycled slurry onto a polishing stage, after the used slurry is completely recycled.

Abstract: A fluid collection apparatus having an accumulator for contacting a polishing surface of a polishing pad and collecting fluid from the polishing pad, a reservoir for receiving fluid from the accumulator, and a volume maintainer for maintaining a set volume of fluid in the reservoir.

Abstract: A slurry recycling system of a CMP apparatus, and a method of the same, which restores the state of agglomeration of the abrasive grains to the initial state to enable reuse of the slurry and thereby reduces the cost of the polishing work and improves the operating rate of the CMP apparatus. Slurry S used in the CMP apparatus 1 is sent to a dispersion chamber 31. A vibration element 40 of an ultrasonic dispersion apparatus 4 mounted in the dispersion chamber 31 is made to vibrate by a vibrator 41 to generate ultrasonic vibration energy, whereby the agglomerated particles in the slurry S are made to disperse. Suitably thereafter, the slurry S is returned to the slurry feed apparatus 300 to enable reuse of the slurry S.

Abstract: Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and thinly across the polishing pad. A control system coordinates the distribution of slurry to the polishing pad with the motion of the carrier head.

Abstract: The method and apparatus of removing metallic particles of magnetic material from coolant fluid used in a machining operation includes placing an assembly including elongated magnets (A) in elongated covers (B) constructed of a non-magnetic plastic with sealing and reinforcing members preventing direct attachment of metallic particles to the magnet facilitating removal of the particles when the assembly is removed from the coolant fluid.