Discontinuous Or Differential Coating Impregnation Or Bond Patents (Class 451/534)
  • Patent number: 10046439
    Abstract: The invention relates to a vulcanized fiber grinding tool (1) comprising two vulcanized fiber grinding disks (2, 3) which are adhered to each other over the entire surface by means of an adhesive layer (4) arranged between the vulcanized fiber grinding disks (2, 3) such that the vulcanized fiber grinding disk (2, 3) outer faces provided with the grinding means point away from each other and the use of a support plate is not necessary.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: August 14, 2018
    Assignee: DIPL.-ING. GUENTER WENDT GMBH
    Inventor: Marion Wendt-Ginsberg
  • Patent number: 9168636
    Abstract: Provided are abrasive articles having a plurality of elongated channels extending across its working surface and intersecting with each other. These channels provide hinge points that enhance flexibility of the article along two or more directions. Optionally, the abrasive article includes a flexible attachment layer, along with apertures that penetrate through the attachment layer located at the intersection points of the channels. The enhanced flexibility allows the abrasive article to easily access recessed areas of the workpiece and facilitates applying even pressure across convex and concave surfaces. The channels assist in segregating dust particles from the abrading operation, and the optional apertures can be advantageously connected to a vacuum source for evacuation of the dust particles from the channels.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 27, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Charles R. Wald, Shigeaki Dohgoshi, Charles J. Studiner, IV, Jeffrey R. Janssen, Michael J. Annen, Paul D. Graham
  • Patent number: 9017150
    Abstract: A method of making a coated abrasive article includes the steps of: applying a make coat to a first major surface of a backing; applying shaped abrasive particles to the make coat to form a first abrasive layer consisting essentially of shaped abrasive particles; applying diluent particles to the make coat over the shaped abrasive particles to form a final abrasive layer; applying a size coat over the final abrasive layer; curing the make and size coats; and wherein the shaped abrasive particles comprise a vertex opposite a base and a width of the shaped abrasive particle tapers from the base to the vertex.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: April 28, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Steven J. Keipert, Ernest L. Thurber, Thomas J. Anderson
  • Patent number: 8961266
    Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 24, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
  • Patent number: 8647179
    Abstract: It is an object of the present invention to provide a polishing pad that is resistant to scratching and also has excellent flattening performance. One aspect of the present invention is a polishing pad, comprising a fiber-entangled body formed from fiber bundles made up of ultrafine fibers in which the average cross sectional area is between 0.01 and 30 ?m2, and a macromolecular elastomer, wherein part of the macromolecular elastomer is present inside the fiber bundles, whereby the ultrafine fibers are bundled, the number of fiber bundles per unit of surface area present in a cross section in the thickness direction is at least 600 bundles per square millimeter, and the volumetric ratio of a portion excluding voids is between 55 and 95%.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: February 11, 2014
    Assignee: Kuraray Co., Ltd.
    Inventors: Kimio Nakayama, Nobuo Takaoka, Mitsuru Kato, Hirofumi Kikuchi, Jiro Tanaka
  • Patent number: 8636563
    Abstract: In a rotating grinding- or cutting tool, in particular a grinding wheel or grinding roller, on one body, a coating of abrasive material, e.g. cubic boron nitride (CBN) or diamond is applied. The body (2, 12, 22, 32, 42) has two side walls (2a, 12a, 22a, 32a, 42a; 2a, 12a, 22a, 32a, 42a) which are connected to each other on their peripheral region, with the side walls being constructed with fiber-reinforced composite, in particular carbon fiber-, glass fiber- or synthetic fiber-reinforced composite.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: January 28, 2014
    Inventor: Norbert Asen
  • Patent number: 8602851
    Abstract: Provided is a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad. In one embodiment, the polishing pad comprises a polishing layer produced by applying to the subpad a hardenable fluid. In another embodiment, the subpad is coated with a barrier before coating with the hardenable fluid. In each embodiment, the depth of penetration of the polishing layer and/or barrier is substantially uniform. Also provided is a method of producing a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: December 10, 2013
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Brian Scott Lombardo, Joseph Cianciolo
  • Patent number: 8585470
    Abstract: A structure for a backing plate of an abrasive disk is disclosed. The structure includes layers of abrasive resin interspersed with layers of reinforcing fiberglass. The layers are generally disk shaped and cover certain radial intervals of the entire backing plate between the inner diameter and the outer diameter. For example, a radial stress profile plotting the stress along a radial line from inner to outer diameter can be determined. The amount and radial positioning of reinforcing layers (e.g., reinforcing fiberglass) may then be determined. An appropriate amount of reinforcing layers may then be placed within the radial intervals that experience the highest stress.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: November 19, 2013
    Assignee: Black & Decker Inc.
    Inventor: Donald W. Farber
  • Patent number: 8475228
    Abstract: A polishing pad has an opaque polishing layer with an aperture therethrough and a polishing surface, and a solid light-transmissive window in the aperture. The solid light-transmissive window includes an outer portion secured to the polishing layer and an inner portion secured to the outer portion. The outer portion has a upper surface recessed relative to the polishing surface, whereas the inner portion has an upper surface that is substantially co-planar with the polishing surface.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: July 2, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Boguslaw A. Swedek, Jimin Zhang
  • Patent number: 8444458
    Abstract: An abrasive article, such as a structured abrasive article, can be treated by subjecting it to plasma whereby the outer surface can be eroded exposing at least a portion of the abrasive particles dispersed within a cross-linked binder forming the abrasive composites. Depending on the process conditions for the plasma treatment, it is possible to erode only a small portion or substantially all of the cross-linked binder from the outer surface. Thus, the initial cut-rate of the abrasive article can be controlled since it is possible to precisely control the degree, height, or area of the exposed abrasive particles.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: May 21, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Scott R. Culler, Moses M. David, William C. Quade, Brian J. Brinkmeier
  • Publication number: 20130012107
    Abstract: An object of the invention is to provide a laminate polishing pad having a polishing layer and a cushion layer, which resist peeling. A laminate polishing pad including: a polishing layer with no region passing therethrough; an adhesive member; and a cushion layer placed on the polishing layer with the adhesive member interposed therebetween, wherein the back side of the polishing layer has at least one non-adhering region X continuously extending from a central region of the polishing layer to a peripheral end of the polishing layer, and/or the adhesive member has at least one non-adhering region Y continuously extending from a central region of the adhesive member to a peripheral end of the adhesive member.
    Type: Application
    Filed: March 11, 2011
    Publication date: January 10, 2013
    Applicant: TOYO TIRE & RUBBER CO., LTD.
    Inventor: Atsushi Kazuno
  • Patent number: 8337277
    Abstract: A polishing pad forms a planar surface on glass, semiconductors, dielectric material/metal composites and integrated circuits, as well as a polishing apparatus where it is difficult for the surface of the substrate to be scratched, the state of polishing can be accurately measured optically during polishing, and whether or not the entire surface of the workpiece is uniformly polished can be measured.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: December 25, 2012
    Assignee: Toray Industries, Inc.
    Inventors: Kuniyasu Shiro, Tomoyuki Honda, Miyuki Hanamoto
  • Publication number: 20120231711
    Abstract: A method of making a coated abrasive article includes the steps of: applying a make coat to a first major surface of a backing; applying shaped abrasive particles to the make coat to form a first abrasive layer consisting essentially of shaped abrasive particles; applying diluent particles to the make coat over the shaped abrasive particles to form a final abrasive layer; applying a size coat over the final abrasive layer; curing the make and size coats; and wherein the shaped abrasive particles comprise a vertex opposite a base and a width of the shaped abrasive particle tapers from the base to the vertex.
    Type: Application
    Filed: November 23, 2010
    Publication date: September 13, 2012
    Inventors: Steven J. Keipert, Ernest L. Thuber, Thomas J. Anderson
  • Patent number: 8257152
    Abstract: The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 ?m; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 ?m.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: September 4, 2012
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Andrew R. Wank, Donna M. Alden, Joseph K. So, Robert Gargione, Mark E. Gazze, David Drop, Colin F. Cameron, Jr., Mai Tieu Banh, Shawn Riley
  • Patent number: 8251777
    Abstract: The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and a liquid carrier to polish the surface of the object. The polishing composition includes the abrasive particles suspended in the liquid carrier, and is applied at a pH above about 7.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: August 28, 2012
    Assignee: Cabot Microelectronics Corporation
    Inventors: Kevin Moeggenborg, John Clark, Jeffrey Gilliland, Stanley Lesiak, Susan Wilson, Vlasta Brusic
  • Patent number: 8096859
    Abstract: A honing tool for honing holes in workpieces, having an abrasive portion including a first abrasive layer therearound of abrasive particles of a first size, including a region having a second abrasive layer of abrasive layers of a second size sufficiently smaller than the first size, so as to be disposed in interstices between abrasive particles of the first abrasive layer without altering the diametrical size of the first layer, and so as to provide enhanced wear resistance.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: January 17, 2012
    Assignee: Sunnen Products Company
    Inventor: John J. Schimweg
  • Patent number: 8062096
    Abstract: The invention is directed to a method of polishing a surface of a substrate comprising aluminum, comprising contacting a surface of the substrate with a polishing pad and a polishing composition comprising an abrasive, an agent that oxidizes aluminum, and a liquid carrier, and abrading at least a portion of the surface to remove at least some aluminum from the substrate and to polish the surface of the substrate, wherein the abrasive is in particulate form and is suspended in the liquid carrier.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: November 22, 2011
    Assignee: Cabot Microelectronics Corporation
    Inventors: Vlasta Brusic, Richard Jon Jenkins, Christopher C. Thompson
  • Patent number: 7981173
    Abstract: A process of making a laminate and laminate formed thereby and a process of making an abrasive laminate and laminate formed thereby include providing a first moving sheet having a first side and a second side, applying active foaming material in a pre-mixed form to the first side, providing a second moving sheet having a first side and second side, the second sheet provided in a manner such that the first side of the second sheet contacts the foaming material to form an uncured laminate and maintaining the first sheet and the second sheet at a predetermined distance relative to one another during a curing period of the foaming material such that the foaming material bonds to the first sheet and the second sheet and upon curing forms a laminate.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: July 19, 2011
    Assignee: Ali Industries, Inc.
    Inventors: Terry Ali, Christopher Ali, Frank F. Ali
  • Publication number: 20110104999
    Abstract: Disclosed is an exemplary abrasive pad having a plurality of first elongated members and a plurality of second elongated members arranged crosswise relative to the first elongated members to form a mat having a first side and an opposite second side. The second elongated members alternately pass over and under the first members in a serpentine manner, and include a longitudinal concave region and a longitudinal convex region. The abrasive pad includes an abrasive material affixed to the convex region of at least one of the plurality of second elongated members, wherein the concave region of the second elongated members are devoid of abrasive material.
    Type: Application
    Filed: November 2, 2010
    Publication date: May 5, 2011
    Inventors: Simon Palushaj, Jerry Duda
  • Patent number: 7922783
    Abstract: There are provided a polishing pad which exhibits excellent polishing stability and excellent slurry retainability during polishing and even after dressing, can prevent a reduction in polishing rate effectively and is also excellent in an ability to flatten an substrate to be polished, and a method for producing the polishing pad. The method comprises dispersing water-soluble particles such as ?-cyclodextrin into a crosslinking agent such as a polypropylene glycol so as to obtain a dispersion, mixing the dispersion with a polyisocyanate such as 4,4?-diphenylmethane diisocyanate and/or an isocyanate terminated urethane prepolymer, and reacting the mixed solution so as to obtain a polishing pad having the water-soluble particles dispersed in the matrix.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: April 12, 2011
    Assignee: JSR Corporation
    Inventors: Fujio Sakurai, Iwao Mihara, Yoshinori Igarashi, Kou Hasegawa
  • Patent number: 7815496
    Abstract: The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the second portion of the polishing surface is located in a second region of the polishing pad juxtaposed with the first region in the radial direction of the pad. The hydrophilic material may be a polymer resin that contains hydrophilic functional groups having OH and/or ?O at bonding sites of the polymer. The hydrophobic material may be a polymer resin that contains hydrophobic functional groups having H and/or F at bonding sites of the polymer. The polishing pad is manufactured by extruding respective lines of the hydrophilic and hydrophobic materials. The extruders and a backing are moved relative to each other such that the lines form concentric rings of the hydrophilic and hydrophobic materials.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: October 19, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Sam Lim, Young-Nam Kim, Gi-Jung Kim
  • Patent number: 7695347
    Abstract: A method for polishing a wafer effectively preventing a sag in an outer peripheral portion of a wafer and a polishing pad for polishing a wafer preferably used in the method for polishing a wafer are provided. The method for polishing a wafer comprises the step of: mirror-polishing a wafer with a main surface of the wafer being in contact with a polishing pad of non-woven fabric impregnated with resin, wherein a ratio of surface roughness of the polishing pad to compressibility thereof {surface roughness Ra (?m)/compressibility (%)} is 3.8 or more.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: April 13, 2010
    Assignees: Shin-Etsu Handotai Co., Ltd., Rodel Nitta Company
    Inventors: Hisashi Masumura, Kazuya Tomii, Shigenao Ito, Kenichi Anzai, Kenichi Inoue
  • Patent number: 7645186
    Abstract: A chemical mechanical polishing pad manufacturing assembly is provided having a subpad layer having a top surface and a bottom surface; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of a subpad layer to the backing plate; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate. Also provide is a method of manufacturing a chemical mechanical polishing pad using the chemical mechanical polishing pad manufacturing assembly.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: January 12, 2010
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Michelle Jensen, John Gifford Nowland, Brenda Harding, Carol Corder
  • Patent number: 7544114
    Abstract: Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade, but are characterized by excellent mechanical strength and grinding performance. Methods for making the abrasive tools utilizing agglomerated abrasive grain are described.
    Type: Grant
    Filed: October 1, 2007
    Date of Patent: June 9, 2009
    Assignee: Saint-Gobain Technology Company
    Inventor: Xavier Orlhac
  • Patent number: 7520968
    Abstract: An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: April 21, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Rashid A. Mavliev, Lakshmanan Karuppiah
  • Publication number: 20090068938
    Abstract: A grinding lamella (1) for being arranged on a rotatingly drivable grinding wheel (8), has at least two annular portions (4, 5, 6, 7, 24, 25, 26, 27, 34, 35, 36, 37, 44, 45, 46, 47) arranged at an angle (?) relative to one another. At least partially, the grinding lamellae (1) have a shape that deviates from the shape of a circular wheel with a central aperture. The grinding wheel (8) containing the grinding lamellae has at least one carrier element (2) and a least two such grinding lamellae (1) that partially overlap and, together, form an annular shape. If use is made of a pattern (14, 32) for a piece of material or a strip of material for producing the grinding lamellae (1), the grinding lamellae (1) are arranged side by side in the same direction so as to adjoin one another and offset relative to one another by 180°.
    Type: Application
    Filed: February 28, 2007
    Publication date: March 12, 2009
    Applicant: LUKAS-ERZETT VEREINIGTE SCHLEIF-UND FRASWERKZEUGFABRIKEN GmbH & CO. KG
    Inventor: Georg Klug
  • Publication number: 20080318505
    Abstract: A web-style polishing pad includes a guide layer through which individual polishing elements protrude on one side and a flexible under-layer attached to the other side. The polishing elements may be affixed at their base to the compressible under-layer and pass through corresponding holes in the guide layer so as to be maintained and translatable in a substantially orthogonal orientation with respect to a plane defined by the guide layer.
    Type: Application
    Filed: January 2, 2008
    Publication date: December 25, 2008
    Inventor: Rajeev Bajaj
  • Publication number: 20080299879
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
    Type: Application
    Filed: May 29, 2007
    Publication date: December 4, 2008
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Kun-Cheng Sung
  • Publication number: 20080292869
    Abstract: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. Such a method may include securing the plurality of superabrasive particles in the solidified organic material layer such that the organic material layer wicks up the protruding portions of the superabrasive particles. In addition to the wicking of the organic material layer around the superabrasive particles, various additional parameters may be utilized to improve retention. For example, in another aspect the plurality of superabrasive particles may be secured in an arrangement that minimizes mechanical stress impinging on protruding portions of any individual superabrasive particle when used to abrade a work piece.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 27, 2008
    Inventor: Chien-Min Sung
  • Patent number: 7427340
    Abstract: A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised features are adapted to polish the feature surface of a substrate and define channels therebetween. The conductive processing pad may have lower features made of a conductive composite that extend into the sub-pad from the conductive carrier. The conductive processing pad is adhered to a sub-pad bound to an opposing conductive layer and the opposing conductive layer bound to a platen assembly.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: September 23, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Rashid A. Mavliev, Ralph M. Wadensweiler
  • Publication number: 20080146131
    Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
    Type: Application
    Filed: February 28, 2008
    Publication date: June 19, 2008
    Inventors: Jean Vangsness, Oscar Kai Chi Hsu, Alaka Potnis
  • Patent number: 7374476
    Abstract: A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas to form a plurality of discrete elements that are distributed on a film support material. The film support material is supported by a liquid and is drawn from the liquid with a backing layer. At least a portion of the discrete elements are spaced apart from each other on the film support material to form a textured surface for engaging a microelectronic substrate and removing material from the microelectronic substrate. The discrete elements can be uniformly or randomly distributed on the film support material.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: May 20, 2008
    Assignee: Micron Technology, Inc.
    Inventor: Scott G. Meikle
  • Patent number: 7364501
    Abstract: A sanding block includes a compressible core having at least one pair of sides characterized such that an abrasive material is adhered to said sides substantially along the surface thereof and having a juncture area defined between said two sides which does not have said abrasive material adhered thereto such that the abrasive material does not run continuously about the sides of the core thereby providing the two sides to be readily compressed toward one another. A method of forming the same is also provided.
    Type: Grant
    Filed: June 26, 2006
    Date of Patent: April 29, 2008
    Inventors: Terry Ali, Christopher Ali
  • Patent number: 7329171
    Abstract: An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: February 12, 2008
    Assignee: 3M Innovative Properties Company
    Inventor: Douglas P. Goetz
  • Patent number: 7275980
    Abstract: Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade, but are characterized by excellent mechanical strength and grinding performance. Methods for making the abrasive tools utilizing agglomerated abrasive grain are described.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: October 2, 2007
    Assignee: Saint-Gobain Abrasives Technology Company
    Inventors: Anne M. Bonner, Eric Bright, Edward L. Lambert, Dean S. Matsumoto, Xavier Orlhac, David A. Sheldon
  • Patent number: 7163450
    Abstract: The present invention provides an abrasive pad for abrading a surface to be abraded in the presence of an abrasive solution, which includes a hydrophobic polymer as a base material, and in which a graft-polymer chain having a hydrophilic group is introduced into the surface of the hydrophobic polymer. The hydrophilic group possessed by the graft-polymer chain is preferably a nonionic hydrophilic group selected from the group consisting of hydrophilic groups having an N-monoalkyl substituted structure and hydrophilic groups having an N-dialkyl substituted amide group. An amount of the hydrophilic graft-polymer to be introduced into the base material is preferably 10.0% to 150.0% in terms of graft ratio.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: January 16, 2007
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Koichi Kawamura, Morio Yagihara
  • Patent number: 7137872
    Abstract: A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a central passage to an outer edge. A reduced profile for the main radial flutes is provided adjacent to the outer edge. A plurality of secondary radial flutes is provided extending from the outer edge, but not in communication with either the central passage or the main radial flutes.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: November 21, 2006
    Assignee: TCG International Inc.
    Inventors: Jonathan P. Thomas, Keith A. Beveridge, Chad James Olson, David Osland
  • Patent number: 7077737
    Abstract: A flexible file system for providing abrasive files that can be used for wood or metal working that can be supplied in different sizes, stiffness and with different types of abrasive surfaces in different cross-sections. These flexible files can be attached to form a web that can be loaded into a dispenser either on a spindle or folded for easy dispensing of files as they are needed. The dispenser can have optional blades for separating the files as they are dispensed. Various methods can be used to attach the files into a web for easy dispensing and later separation including attach strips with cut or break points.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: July 18, 2006
    Inventor: Guenter Manigel
  • Patent number: 6986705
    Abstract: An article or polishing pad for altering a surface of a work piece includes a polymer matrix created by reaction injection molding of size controlled gas bubbles within a polyurethane matrix. The proposed liquid urethane precursor is first injected into an actuated mold and cured. The molded product is then removed from the mold and double side faced or ground to form a single thin polishing pad comprising a single layer of homogeneous material.
    Type: Grant
    Filed: April 5, 2004
    Date of Patent: January 17, 2006
    Assignee: RimPad Tech Ltd.
    Inventors: Spencer Preston, Doug Hutchins, Steve Hymes
  • Patent number: 6935931
    Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 ?m or less, wherein about 75% or more of the pores have a pore size within about 20 ?m or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 ?m or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: August 30, 2005
    Assignee: Cabot Microelectronics Corporation
    Inventor: Abaneshwar Prasad
  • Patent number: 6929539
    Abstract: The present invention provides a flexible abrasive product comprised of an open cell foam backing, a foraminous barrier coating and a shaped foraminous abrasive coating.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: August 16, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: James W. Schutz, Stacee L. Royce, Michael J. Annen, Jon R. Pieper, Jeffrey D. Sheely
  • Patent number: 6921566
    Abstract: A multi-layer flexible non-skid cushioning tape having a top layer of plastic material having a frictional surface thereon, an elastomeric cushioning layer comprising a neoprene/EPDM/SBR blend, and an adhesion layer of a plastic sheet with a pressure sensitive adhesive thereon. The layers are laminated together for application to a platform. The cushioning tape provides a vibration-absorbing, non-skid surface with an improved coefficient of friction-resisting slippage.
    Type: Grant
    Filed: May 6, 2004
    Date of Patent: July 26, 2005
    Inventor: Evan Lipstein
  • Patent number: 6915796
    Abstract: A superabrasive wire saw having a plurality of individual coated superabrasive particles attached to a wire with an organic binder is disclosed and described. The superabrasive particle can be coated with a solidified coating of a molten braze alloy that is chemically bonded to the superabrasive particle. The organic binder can optionally contain filler materials and/or an organometallic coupling agent to improve the retention of coated superabrasive particles. The resulting superabrasive wire saws can be produced having diameters of less than 0.5 mm which significantly reduce kerf loss. Various methods for making and using such a superabrasive wire saw are additionally disclosed and described.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: July 12, 2005
    Inventor: Chien-Min Sung
  • Patent number: 6905526
    Abstract: Embodiments of the invention include an ion exchange polish pad for polishing a semiconductor substrate, on which various conductive, semiconductive, and/or insulative layers are formed, for example a conductive copper layer. Embodiments also include the method for the manufacture of an ion exchange polish pad. In certain embodiments an ion exchange polish pad includes a base material and a ion exchange layer including, which further includes an ion exchange material. Cations in the ion exchange material may be exchanged with other cations, such as copper, under the proper process conditions for the planarization of a processed semiconductor substrate.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: June 14, 2005
    Assignee: Planar Labs Corporation
    Inventors: Sanjay Dabral, Anil K. Pant
  • Patent number: 6899598
    Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 ?m or less, wherein about 75% or more of the pores have a pore size within about 20 ?m or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 ?m or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: May 31, 2005
    Assignee: Cabot Microelectronics Corporation
    Inventor: Abaneshwar Prasad
  • Patent number: 6896593
    Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 ?m or less, wherein about 75% or more of the pores have a pore size within about 20 ?m of less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 ?m or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: May 24, 2005
    Assignee: Cabot Microelectronic Corporation
    Inventor: Abaneshwar Prasad
  • Patent number: 6881483
    Abstract: Ceramic aggregate particles comprising a plurality of solid particulates bonded together by ceramic binding material and methods of providing a plurality of such particles having substantially uniform cross-sectional shape are provided. The ceramic aggregate particles may incorporate a high percentage of solid particulates. The ceramic binding material may closely conform to the outermost surfaces of the solid particulates contained within the ceramic aggregate particle. When abrasive particulates are employed as the solid particulates, abrasive articles can be made which provide consistent high cut rates and consistent surface finish over relatively long periods of time.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: April 19, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: James L. McArdle, Scott R. Culler, William P. Wood
  • Patent number: 6875097
    Abstract: This invention discloses fixed abrasive chemical mechanical polishing pads, wherein the pad itself comprises at least one material selected from the group consisting of oxidants, wetting agents and other additives normally delivered via a polishing slurry, which assist in the polishing effectiveness of the pad. The improved polishing pad provides both the benefit of a fixed abrasive and the benefits of slurry based polishing systems.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: April 5, 2005
    Assignee: J. G. Systems, Inc.
    Inventor: John Grunwald
  • Patent number: 6846232
    Abstract: The invention provides a backing for an abrasive article comprising a sheet-like polymeric substrate having a first major surface including a pattern of non-abrasive raised areas and depressed areas and an opposite second major surface including a plurality of shaped engaging elements that are one part of a two-part mechanical engagement system. An abrasive product is provided by coating at least the raised areas of the backing with an abrasive coating.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: January 25, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: Ehrich J. Braunschweig, Daidre L. Syverson, Edward J. Woo, Michael J. Annen
  • Patent number: 6840843
    Abstract: A method for producing a polishing pad comprising (a) providing a porous polymer structure, (b) compressing at least a region of the porous polymer structure to provide a translucent region, and (c) forming a polishing pad comprising the porous polymer structure, whereby a polishing pad is produced comprising the translucent region. Also provided is a polishing pad produced according to this method, and a polishing pad comprising a region that is at least translucent, wherein the translucent region is porous, as well as a method of polishing a substrate using a pad of the invention.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: January 11, 2005
    Assignee: Cabot Microelectronics Corporation
    Inventors: Jeremy Jones, Roland K. Sevilla