Abstract: A method of forming a shaped abrasive particle including extruding a mixture into a form, applying a dopant material to an exterior surface of the form, and forming a precursor shaped abrasive particle from the form.

Abstract: A surface machining method for a single crystal SiC substrate, including: a step of mounting a grinding plate which includes a soft pad and a hard pad sequentially attached onto a base metal having a flat surface, a step of generating an oxidation product by using the grinding plate, and a step of grinding the surface while removing the oxidation product, wherein abrasive grains made of at least one metallic oxide that is softer than single crystal SiC and has a bandgap are fixed to the surface of the hard pad.

Abstract: The invention relates to a vulcanized fiber grinding tool (1) comprising two vulcanized fiber grinding disks (2, 3) which are adhered to each other over the entire surface by means of an adhesive layer (4) arranged between the vulcanized fiber grinding disks (2, 3) such that the vulcanized fiber grinding disk (2, 3) outer faces provided with the grinding means point away from each other and the use of a support plate is not necessary.

Abstract: Provided are abrasive articles having a plurality of elongated channels extending across its working surface and intersecting with each other. These channels provide hinge points that enhance flexibility of the article along two or more directions. Optionally, the abrasive article includes a flexible attachment layer, along with apertures that penetrate through the attachment layer located at the intersection points of the channels. The enhanced flexibility allows the abrasive article to easily access recessed areas of the workpiece and facilitates applying even pressure across convex and concave surfaces. The channels assist in segregating dust particles from the abrading operation, and the optional apertures can be advantageously connected to a vacuum source for evacuation of the dust particles from the channels.

Abstract: A method of making a coated abrasive article includes the steps of: applying a make coat to a first major surface of a backing; applying shaped abrasive particles to the make coat to form a first abrasive layer consisting essentially of shaped abrasive particles; applying diluent particles to the make coat over the shaped abrasive particles to form a final abrasive layer; applying a size coat over the final abrasive layer; curing the make and size coats; and wherein the shaped abrasive particles comprise a vertex opposite a base and a width of the shaped abrasive particle tapers from the base to the vertex.

Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.

Abstract: It is an object of the present invention to provide a polishing pad that is resistant to scratching and also has excellent flattening performance. One aspect of the present invention is a polishing pad, comprising a fiber-entangled body formed from fiber bundles made up of ultrafine fibers in which the average cross sectional area is between 0.01 and 30 ?m2, and a macromolecular elastomer, wherein part of the macromolecular elastomer is present inside the fiber bundles, whereby the ultrafine fibers are bundled, the number of fiber bundles per unit of surface area present in a cross section in the thickness direction is at least 600 bundles per square millimeter, and the volumetric ratio of a portion excluding voids is between 55 and 95%.

Abstract: In a rotating grinding- or cutting tool, in particular a grinding wheel or grinding roller, on one body, a coating of abrasive material, e.g. cubic boron nitride (CBN) or diamond is applied. The body (2, 12, 22, 32, 42) has two side walls (2a, 12a, 22a, 32a, 42a; 2a, 12a, 22a, 32a, 42a) which are connected to each other on their peripheral region, with the side walls being constructed with fiber-reinforced composite, in particular carbon fiber-, glass fiber- or synthetic fiber-reinforced composite.

Abstract: Provided is a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad. In one embodiment, the polishing pad comprises a polishing layer produced by applying to the subpad a hardenable fluid. In another embodiment, the subpad is coated with a barrier before coating with the hardenable fluid. In each embodiment, the depth of penetration of the polishing layer and/or barrier is substantially uniform. Also provided is a method of producing a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad.

Abstract: A structure for a backing plate of an abrasive disk is disclosed. The structure includes layers of abrasive resin interspersed with layers of reinforcing fiberglass. The layers are generally disk shaped and cover certain radial intervals of the entire backing plate between the inner diameter and the outer diameter. For example, a radial stress profile plotting the stress along a radial line from inner to outer diameter can be determined. The amount and radial positioning of reinforcing layers (e.g., reinforcing fiberglass) may then be determined. An appropriate amount of reinforcing layers may then be placed within the radial intervals that experience the highest stress.

Abstract: A polishing pad has an opaque polishing layer with an aperture therethrough and a polishing surface, and a solid light-transmissive window in the aperture. The solid light-transmissive window includes an outer portion secured to the polishing layer and an inner portion secured to the outer portion. The outer portion has a upper surface recessed relative to the polishing surface, whereas the inner portion has an upper surface that is substantially co-planar with the polishing surface.

Abstract: An abrasive article, such as a structured abrasive article, can be treated by subjecting it to plasma whereby the outer surface can be eroded exposing at least a portion of the abrasive particles dispersed within a cross-linked binder forming the abrasive composites. Depending on the process conditions for the plasma treatment, it is possible to erode only a small portion or substantially all of the cross-linked binder from the outer surface. Thus, the initial cut-rate of the abrasive article can be controlled since it is possible to precisely control the degree, height, or area of the exposed abrasive particles.

Abstract: An object of the invention is to provide a laminate polishing pad having a polishing layer and a cushion layer, which resist peeling. A laminate polishing pad including: a polishing layer with no region passing therethrough; an adhesive member; and a cushion layer placed on the polishing layer with the adhesive member interposed therebetween, wherein the back side of the polishing layer has at least one non-adhering region X continuously extending from a central region of the polishing layer to a peripheral end of the polishing layer, and/or the adhesive member has at least one non-adhering region Y continuously extending from a central region of the adhesive member to a peripheral end of the adhesive member.

Abstract: A polishing pad forms a planar surface on glass, semiconductors, dielectric material/metal composites and integrated circuits, as well as a polishing apparatus where it is difficult for the surface of the substrate to be scratched, the state of polishing can be accurately measured optically during polishing, and whether or not the entire surface of the workpiece is uniformly polished can be measured.

Abstract: A method of making a coated abrasive article includes the steps of: applying a make coat to a first major surface of a backing; applying shaped abrasive particles to the make coat to form a first abrasive layer consisting essentially of shaped abrasive particles; applying diluent particles to the make coat over the shaped abrasive particles to form a final abrasive layer; applying a size coat over the final abrasive layer; curing the make and size coats; and wherein the shaped abrasive particles comprise a vertex opposite a base and a width of the shaped abrasive particle tapers from the base to the vertex.

Abstract: The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 ?m; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 ?m.

Abstract: The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and a liquid carrier to polish the surface of the object. The polishing composition includes the abrasive particles suspended in the liquid carrier, and is applied at a pH above about 7.

Abstract: A honing tool for honing holes in workpieces, having an abrasive portion including a first abrasive layer therearound of abrasive particles of a first size, including a region having a second abrasive layer of abrasive layers of a second size sufficiently smaller than the first size, so as to be disposed in interstices between abrasive particles of the first abrasive layer without altering the diametrical size of the first layer, and so as to provide enhanced wear resistance.

Abstract: The invention is directed to a method of polishing a surface of a substrate comprising aluminum, comprising contacting a surface of the substrate with a polishing pad and a polishing composition comprising an abrasive, an agent that oxidizes aluminum, and a liquid carrier, and abrading at least a portion of the surface to remove at least some aluminum from the substrate and to polish the surface of the substrate, wherein the abrasive is in particulate form and is suspended in the liquid carrier.

Abstract: A process of making a laminate and laminate formed thereby and a process of making an abrasive laminate and laminate formed thereby include providing a first moving sheet having a first side and a second side, applying active foaming material in a pre-mixed form to the first side, providing a second moving sheet having a first side and second side, the second sheet provided in a manner such that the first side of the second sheet contacts the foaming material to form an uncured laminate and maintaining the first sheet and the second sheet at a predetermined distance relative to one another during a curing period of the foaming material such that the foaming material bonds to the first sheet and the second sheet and upon curing forms a laminate.

Abstract: Disclosed is an exemplary abrasive pad having a plurality of first elongated members and a plurality of second elongated members arranged crosswise relative to the first elongated members to form a mat having a first side and an opposite second side. The second elongated members alternately pass over and under the first members in a serpentine manner, and include a longitudinal concave region and a longitudinal convex region. The abrasive pad includes an abrasive material affixed to the convex region of at least one of the plurality of second elongated members, wherein the concave region of the second elongated members are devoid of abrasive material.

Abstract: There are provided a polishing pad which exhibits excellent polishing stability and excellent slurry retainability during polishing and even after dressing, can prevent a reduction in polishing rate effectively and is also excellent in an ability to flatten an substrate to be polished, and a method for producing the polishing pad. The method comprises dispersing water-soluble particles such as ?-cyclodextrin into a crosslinking agent such as a polypropylene glycol so as to obtain a dispersion, mixing the dispersion with a polyisocyanate such as 4,4?-diphenylmethane diisocyanate and/or an isocyanate terminated urethane prepolymer, and reacting the mixed solution so as to obtain a polishing pad having the water-soluble particles dispersed in the matrix.

Abstract: The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the second portion of the polishing surface is located in a second region of the polishing pad juxtaposed with the first region in the radial direction of the pad. The hydrophilic material may be a polymer resin that contains hydrophilic functional groups having OH and/or ?O at bonding sites of the polymer. The hydrophobic material may be a polymer resin that contains hydrophobic functional groups having H and/or F at bonding sites of the polymer. The polishing pad is manufactured by extruding respective lines of the hydrophilic and hydrophobic materials. The extruders and a backing are moved relative to each other such that the lines form concentric rings of the hydrophilic and hydrophobic materials.

Abstract: A method for polishing a wafer effectively preventing a sag in an outer peripheral portion of a wafer and a polishing pad for polishing a wafer preferably used in the method for polishing a wafer are provided. The method for polishing a wafer comprises the step of: mirror-polishing a wafer with a main surface of the wafer being in contact with a polishing pad of non-woven fabric impregnated with resin, wherein a ratio of surface roughness of the polishing pad to compressibility thereof {surface roughness Ra (?m)/compressibility (%)} is 3.8 or more.

Abstract: A chemical mechanical polishing pad manufacturing assembly is provided having a subpad layer having a top surface and a bottom surface; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of a subpad layer to the backing plate; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate. Also provide is a method of manufacturing a chemical mechanical polishing pad using the chemical mechanical polishing pad manufacturing assembly.

Abstract: Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade, but are characterized by excellent mechanical strength and grinding performance. Methods for making the abrasive tools utilizing agglomerated abrasive grain are described.

Abstract: An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.

Abstract: A grinding lamella (1) for being arranged on a rotatingly drivable grinding wheel (8), has at least two annular portions (4, 5, 6, 7, 24, 25, 26, 27, 34, 35, 36, 37, 44, 45, 46, 47) arranged at an angle (?) relative to one another. At least partially, the grinding lamellae (1) have a shape that deviates from the shape of a circular wheel with a central aperture. The grinding wheel (8) containing the grinding lamellae has at least one carrier element (2) and a least two such grinding lamellae (1) that partially overlap and, together, form an annular shape. If use is made of a pattern (14, 32) for a piece of material or a strip of material for producing the grinding lamellae (1), the grinding lamellae (1) are arranged side by side in the same direction so as to adjoin one another and offset relative to one another by 180°.

Abstract: A web-style polishing pad includes a guide layer through which individual polishing elements protrude on one side and a flexible under-layer attached to the other side. The polishing elements may be affixed at their base to the compressible under-layer and pass through corresponding holes in the guide layer so as to be maintained and translatable in a substantially orthogonal orientation with respect to a plane defined by the guide layer.

Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.

Abstract: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. Such a method may include securing the plurality of superabrasive particles in the solidified organic material layer such that the organic material layer wicks up the protruding portions of the superabrasive particles. In addition to the wicking of the organic material layer around the superabrasive particles, various additional parameters may be utilized to improve retention. For example, in another aspect the plurality of superabrasive particles may be secured in an arrangement that minimizes mechanical stress impinging on protruding portions of any individual superabrasive particle when used to abrade a work piece.

Abstract: A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised features are adapted to polish the feature surface of a substrate and define channels therebetween. The conductive processing pad may have lower features made of a conductive composite that extend into the sub-pad from the conductive carrier. The conductive processing pad is adhered to a sub-pad bound to an opposing conductive layer and the opposing conductive layer bound to a platen assembly.

Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.

Abstract: A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas to form a plurality of discrete elements that are distributed on a film support material. The film support material is supported by a liquid and is drawn from the liquid with a backing layer. At least a portion of the discrete elements are spaced apart from each other on the film support material to form a textured surface for engaging a microelectronic substrate and removing material from the microelectronic substrate. The discrete elements can be uniformly or randomly distributed on the film support material.

Abstract: A sanding block includes a compressible core having at least one pair of sides characterized such that an abrasive material is adhered to said sides substantially along the surface thereof and having a juncture area defined between said two sides which does not have said abrasive material adhered thereto such that the abrasive material does not run continuously about the sides of the core thereby providing the two sides to be readily compressed toward one another. A method of forming the same is also provided.

Abstract: An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element.

Abstract: Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade, but are characterized by excellent mechanical strength and grinding performance. Methods for making the abrasive tools utilizing agglomerated abrasive grain are described.

Abstract: The present invention provides an abrasive pad for abrading a surface to be abraded in the presence of an abrasive solution, which includes a hydrophobic polymer as a base material, and in which a graft-polymer chain having a hydrophilic group is introduced into the surface of the hydrophobic polymer. The hydrophilic group possessed by the graft-polymer chain is preferably a nonionic hydrophilic group selected from the group consisting of hydrophilic groups having an N-monoalkyl substituted structure and hydrophilic groups having an N-dialkyl substituted amide group. An amount of the hydrophilic graft-polymer to be introduced into the base material is preferably 10.0% to 150.0% in terms of graft ratio.

Abstract: A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a central passage to an outer edge. A reduced profile for the main radial flutes is provided adjacent to the outer edge. A plurality of secondary radial flutes is provided extending from the outer edge, but not in communication with either the central passage or the main radial flutes.

Abstract: A flexible file system for providing abrasive files that can be used for wood or metal working that can be supplied in different sizes, stiffness and with different types of abrasive surfaces in different cross-sections. These flexible files can be attached to form a web that can be loaded into a dispenser either on a spindle or folded for easy dispensing of files as they are needed. The dispenser can have optional blades for separating the files as they are dispensed. Various methods can be used to attach the files into a web for easy dispensing and later separation including attach strips with cut or break points.

Abstract: An article or polishing pad for altering a surface of a work piece includes a polymer matrix created by reaction injection molding of size controlled gas bubbles within a polyurethane matrix. The proposed liquid urethane precursor is first injected into an actuated mold and cured. The molded product is then removed from the mold and double side faced or ground to form a single thin polishing pad comprising a single layer of homogeneous material.

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 ?m or less, wherein about 75% or more of the pores have a pore size within about 20 ?m or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 ?m or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

Abstract: The present invention provides a flexible abrasive product comprised of an open cell foam backing, a foraminous barrier coating and a shaped foraminous abrasive coating.

Abstract: A multi-layer flexible non-skid cushioning tape having a top layer of plastic material having a frictional surface thereon, an elastomeric cushioning layer comprising a neoprene/EPDM/SBR blend, and an adhesion layer of a plastic sheet with a pressure sensitive adhesive thereon. The layers are laminated together for application to a platform. The cushioning tape provides a vibration-absorbing, non-skid surface with an improved coefficient of friction-resisting slippage.

Abstract: A superabrasive wire saw having a plurality of individual coated superabrasive particles attached to a wire with an organic binder is disclosed and described. The superabrasive particle can be coated with a solidified coating of a molten braze alloy that is chemically bonded to the superabrasive particle. The organic binder can optionally contain filler materials and/or an organometallic coupling agent to improve the retention of coated superabrasive particles. The resulting superabrasive wire saws can be produced having diameters of less than 0.5 mm which significantly reduce kerf loss. Various methods for making and using such a superabrasive wire saw are additionally disclosed and described.

Abstract: Embodiments of the invention include an ion exchange polish pad for polishing a semiconductor substrate, on which various conductive, semiconductive, and/or insulative layers are formed, for example a conductive copper layer. Embodiments also include the method for the manufacture of an ion exchange polish pad. In certain embodiments an ion exchange polish pad includes a base material and a ion exchange layer including, which further includes an ion exchange material. Cations in the ion exchange material may be exchanged with other cations, such as copper, under the proper process conditions for the planarization of a processed semiconductor substrate.

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 ?m or less, wherein about 75% or more of the pores have a pore size within about 20 ?m or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 ?m or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 ?m or less, wherein about 75% or more of the pores have a pore size within about 20 ?m of less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 ?m or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

Abstract: Ceramic aggregate particles comprising a plurality of solid particulates bonded together by ceramic binding material and methods of providing a plurality of such particles having substantially uniform cross-sectional shape are provided. The ceramic aggregate particles may incorporate a high percentage of solid particulates. The ceramic binding material may closely conform to the outermost surfaces of the solid particulates contained within the ceramic aggregate particle. When abrasive particulates are employed as the solid particulates, abrasive articles can be made which provide consistent high cut rates and consistent surface finish over relatively long periods of time.

Abstract: This invention discloses fixed abrasive chemical mechanical polishing pads, wherein the pad itself comprises at least one material selected from the group consisting of oxidants, wetting agents and other additives normally delivered via a polishing slurry, which assist in the polishing effectiveness of the pad. The improved polishing pad provides both the benefit of a fixed abrasive and the benefits of slurry based polishing systems.