Laminate Patents (Class 451/533)
  • Patent number: 9018273
    Abstract: A polishing pad, having a polishing layer comprising a thermoset polyurethane foam, wherein the polishing layer has an in-plane variation of 12 or less in microrubber A hardness, the variation being obtained by measuring the polishing layer from a polishing surface side of the layer, the thermoset polyurethane foam contains, as raw material components, an isocyanate component and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise a trifunctional polyol having at least one terminated hydroxyl group that is a secondary hydroxyl group, and having a hydroxyl group value of 150 to 1,000 mg KOH/g in an amount of 10 to 50 parts by weight for 100 parts by weight of the active-hydrogen-containing compounds.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: April 28, 2015
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Aya Ito, Masato Doura
  • Patent number: 9011212
    Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: April 21, 2015
    Assignee: Fujibo Holdings, Inc.
    Inventors: Kouki Itoyama, Fumio Miyazawa
  • Patent number: 9011211
    Abstract: Disclosed herein is sandpaper that includes a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper. The sandpaper includes a second plurality of particles having a second grain size that is smaller than the first grain size, the second plurality of particles having a second sanding surface covering a second area of the sandpaper. Further, the sandpaper includes a bonding layer having a back surface located opposite the first sanding surface and second sanding surface and a buffer positioned to raise the second plurality of particles such that the first sanding surface and the second sanding surface of the sandpaper are substantially planar.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: April 21, 2015
    Inventor: Christian T. Zyniecki
  • Publication number: 20150093979
    Abstract: The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 shore D, and has a polishing surface for polishing a workpiece. Whereby, the polishing layer will not peel off from the cushion layer easily, so that the polishing quality is raised.
    Type: Application
    Filed: September 29, 2014
    Publication date: April 2, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, WEN-CHIEH WU, YUNG-CHANG HUNG
  • Publication number: 20150079879
    Abstract: A method for manufacturing a laminated polishing pad of the present invention, comprising the steps of: forming a polishing layer by providing a light transmitting region in an opening A of a polishing region; providing an adhesive member X on one side of the polishing layer, wherein the adhesive member X contains a hot-melt adhesive; providing a removable protective member on a part of the adhesive member X corresponding to the light transmitting region; bonding a support layer to the adhesive member X on which the removable protective member is provided; and removing a part of the support layer corresponding to the light transmitting region and also removing the removable protective member to form an opening B.
    Type: Application
    Filed: February 28, 2013
    Publication date: March 19, 2015
    Inventor: Kenji Nakamura
  • Patent number: 8979611
    Abstract: A polishing pad having a polishing layer comprising a thermoset polyurethane foam, wherein about the thermoset polyurethane foam, the Asker C hardness value thereof is 82 or less as a 60-second value, the hardness value being a value after the foam is immersed in water for 24 hours, and further the value of the tensile storage modulus E? (30° C.) thereof at a frequency of 1.6 Hz satisfies the following expression (1): Y<5X?150??(1) wherein Y represents the tensile storage modulus E? (MPa), and X represents the Asker C hardness value (60-second value) after the foam is immersed in water for 24 hours.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: March 17, 2015
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Akinori Sato, Nobuyoshi Ishizaka
  • Publication number: 20150065013
    Abstract: A chemical mechanical polishing pad is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a specific gravity of greater than 0.6; a Shore D hardness of 60 to 90; an elongation to break of 100 to 300%; and, a unique combination of an initial hydrolytic stability and a sustained hydrolytic instability.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 5, 2015
    Inventors: Michelle Jensen, Bainian Qian, Fengji Yeh, Marty W. DeGroot, Mohammad T. Islam, Matthew Richard Van Hanehem, Darrell String, James Murnane, Jeffrey James Hendron, John G. Nowland
  • Publication number: 20150056892
    Abstract: Disclosed is a polishing pad for chemical-mechanical polishing. The polishing pad has a porous interface and a substantially non-porous bulk core. Also disclosed are related apparatus and methods for using and preparing the polishing pad.
    Type: Application
    Filed: August 14, 2014
    Publication date: February 26, 2015
    Inventors: Robert VACASSY, George FOTOU
  • Patent number: 8961269
    Abstract: Bonded abrasive articles and in particular organic bonded depressed center wheels with one or more reinforcements have reduced stiffness in comparison to conventional counterparts. Techniques for producing and using such wheels are described. In one example, a method for reducing the stiffness of an organically bonded abrasive wheel includes applying to a raised hub region of a reinforced depressed center wheel a force effective to irreversibly decrease the stiffness of said wheel.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: February 24, 2015
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Han Zhang, Johannes Hermanus Kuit, Robert Jitze Wilting
  • Patent number: 8939818
    Abstract: An object of the invention is to provide a polishing pad which has a polishing layer with a phase-separated structure and can provide high polishing rate and high planarization property and with which scratching can be suppressed. The polishing pad comprises the polishing layer. The polishing layer comprises a product of curing reaction of a polyurethane-forming raw material composition containing: (A) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (a) containing an isocyanate component and a polyester-based polyol; (B) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (b) containing an isocyanate component and a polyether-based polyol; and a chain extender, wherein the product of curing reaction has a phase-separated structure.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: January 27, 2015
    Assignee: Toyo Tire & Rubber Co. Ltd.
    Inventors: Shinji Shimizu, Atsushi Kazuno
  • Publication number: 20150004890
    Abstract: A method of evenly coating small abrasive particles, specifically a method of coating diamond particles?10 ?m with nickel, and an abrasive article containing the coated abrasive particles, for example, a fixed diamond wire. The method includes applying ultrasonic energy to the plating bath and adjusting the power of the ultrasonic energy that a non-agglomeration factor (NAF) of the batch of abrasive particle is at least about 0.9, the non-agglomeration factor defined as a ratio (D50sa/D50b), wherein D50b represents the median particle size of the coated abrasive particles and D50sa represents the median particle size of the abrasive particles prior to coating.
    Type: Application
    Filed: June 26, 2014
    Publication date: January 1, 2015
    Inventors: Zoran KRSTIC, William MECCA, Andrew G. HAERLE, Nicholas J. TUMAVITCH, Brian C. SHAFFER
  • Publication number: 20150004879
    Abstract: A method for producing a laminated polishing pad, which is free from warpage and does not cause peeling between a polishing layer and a cushion layer during polishing, includes the steps of: laminating a hot-melt adhesive sheet to a surface of a cushion layer with a base material in which a thermoplastic resin base material is provided peelably on one surface of the cushion layer, on which the thermoplastic resin base material is not provided; heating the laminated hot-melt adhesive sheet to be melted or softened; laminating a polishing layer on the melted or softened hot-melt adhesive to prepare a laminate; cutting the laminate to the size of the polishing layer to prepare a laminated polishing sheet; and peeling the thermoplastic resin base material from the laminated polishing sheet.
    Type: Application
    Filed: January 9, 2013
    Publication date: January 1, 2015
    Inventor: Yoshiyuki Nakai
  • Patent number: 8920219
    Abstract: Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: December 30, 2014
    Assignee: NexPlanar Corporation
    Inventors: William C. Allison, Diane Scott, Rajeev Bajaj
  • Patent number: 8919349
    Abstract: A foot exfoliation device including a base tray having non-slip surface member disposed on a bottom side thereof; a continuous wall disposed on the base tray top side proximal the periphery thereof; and a trough continuously disposed on the top side inside the wall. Stacked sand paper sheets are disposed within the trough. A removable snap-on cover is disposed atop the base tray. A sand paper post member, which is centrally disposed within the trough proximal to a base tray front end, permits exfoliation between toes. An aperture, centrally disposed proximal to a forward end of each of the sand paper sheets, slidingly receives the post member therethrough. A mirror is disposed on an underside of the cover to permit inspection of the user's feet.
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: December 30, 2014
    Inventors: Gary L. Wallace, Cathy Wallace
  • Publication number: 20140378036
    Abstract: An abrasive article may include an abrasive body having a grinding layer, where the grinding layer may include a bond and abrasive particles contained within the bond. The abrasive body also may include a volumetric ratio GLVb/GLVap of at least about 0.4, where GLVb is a volume percent of bond for a total volume of the grinding layer and GLVap is a volume percent of abrasive particles for a total volume of the grinding layer. The abrasive particles may include seeded sol-gel ceramic and may have an average particle size of at least about 600 microns. In addition, the abrasive particles may include a coupling agent that may include an organic material with a silane functional group. Prior to formation of the abrasive article, the abrasive particles may be coated by the coupling agent at a ratio ACOA/AAB of at least about 0.1, where CCOA is the amount of coupling agent in grams in a pre-formation mixture and AAB is the amount of abrasive particles in pounds (lbs) in the pre-formation mixture.
    Type: Application
    Filed: June 25, 2014
    Publication date: December 25, 2014
    Inventors: Tyler B. Cichowlas, Michael W. Klett
  • Patent number: 8883288
    Abstract: An abrasive article includes a backing having a major surface, an adhesion promoting layer overlying the major surface of the backing, and a make layer directly contacting the adhesion promoting layer. The adhesion promoting layer has a thickness of at least about 10 microns and is formed of a polar thermoplastic material, a cross-linkable polymer, or blends thereof.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: November 11, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Anthony C. Gaeta, Paul S. Goldsmith, Kamran Khatami, Pranjal Shah
  • Publication number: 20140295741
    Abstract: Herein are disclosed an apparatus and method for reaction injection molding of polyurethane foam. In the method, a recirculation loop containing polyols along with an effective amount of water, and a recirculation loop containing isocyanates, are each partially evacuated.
    Type: Application
    Filed: June 12, 2014
    Publication date: October 2, 2014
    Inventors: Elizabeth A. Sargent, David R. Dow, Grady A. Dunham, Douglas E. Earl, Jeffrey P. Lenzendorf
  • Patent number: 8795029
    Abstract: An endpoint detection method includes processing an outer surface of a substrate, directing an incident light beam through a window in an opaque metal body onto the surface being processed, receiving at a detector a reflected light beam from the substrate and generating a signal from the detector, and generating a signal based on the reflected light beam received at the detector, and detecting a processing endpoint. The signal is a time-varying cyclic signal that varies as the thickness of the layer varies over time, and detecting the processing endpoint includes detecting that a portion of a cycle of the cyclic signal has passed, the portion being less than a full cycle of the cyclic signal.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: August 5, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Patent number: 8790165
    Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: July 29, 2014
    Assignee: FNS Tech Co., Ltd.
    Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Xuechan Zhao
  • Patent number: 8771042
    Abstract: A polishing apparatus is provided for polishing an optical fiber connector. The optical fiber connector includes a connector housing and a ferrule. The polishing apparatus includes a mount to receive and hold the optical connector and a polisher housing supported by a base. The polisher housing houses a polisher that comprises a platen that supports a polishing media, the platen being coupled to a planetary gear system. The mount is disposed on a cover that encloses the polisher housing when the cover is placed in a closed position. A rotatable knob is exposed at an opening of the base, the rotatable knob being engaged with the planetary gear system to move the planetary gear system. The polishing media is disposed proximate to a fiber tip extending from an end face of the ferrule of the optical connector disposed in the mount when the cover is placed in the closed position.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: July 8, 2014
    Assignee: 3M Innovative Properties Company
    Inventors: Ronald P. Pepin, Richard L. Simmons
  • Patent number: 8771389
    Abstract: A method of forming one or more TSP compacts is provided. The method includes placing one or more TSP material layers in an enclosure and surrounding each TSP material layer with at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates. The method also includes exposing the enclosure to a high temperature high pressure process wherein the at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates bond to the TSP material layers forming a stack of TSP material layers including the TSP material layers one over the other with tungsten carbide bonded to each of the TSP material layers and encapsulating each of the TSP material layers.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: July 8, 2014
    Assignee: Smith International, Inc.
    Inventors: Madapusi K. Keshavan, Monte Russell
  • Patent number: 8734205
    Abstract: A macro-porous abrasive article includes a spun lace substrate having a macro-porous structure and a coating. The coating is made of a resin binder and abrasive aggregates. The abrasive aggregates are formed from a composition of abrasive grit particles and a nanoparticle binder. The coating is at least partially embedded in the substrate. A method for making the macro-porous abrasive article includes combining abrasive aggregates of abrasive grit particles and a nanoparticle binder with a resin binder to form a slurry. The slurry is applied to a macro-porous support structure so that the slurry at least partially penetrates the substrate. The resin is then cured to bond the aggregate grains to the substrate.
    Type: Grant
    Filed: December 14, 2009
    Date of Patent: May 27, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Paul S. Goldsmith, Anthony C. Gaeta, James J. Manning, Kamran Khatami
  • Patent number: 8715035
    Abstract: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads.
    Type: Grant
    Filed: February 21, 2006
    Date of Patent: May 6, 2014
    Assignee: NexPlanar Corporation
    Inventors: Pradip K. Roy, Manish Deopura, Sudhanshu Misra
  • Publication number: 20140120809
    Abstract: A chemical mechanical polishing pad for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate is provided containing a polishing layer, wherein the polishing layer comprises the reaction product of raw material ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate. Also provide are methods of making and using the chemical mechanical polishing pad.
    Type: Application
    Filed: November 1, 2012
    Publication date: May 1, 2014
    Inventors: Bainian Qian, David B. James, James Murnane, Fengji Yeh, Marty W. DeGroot
  • Publication number: 20140106652
    Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.
    Type: Application
    Filed: April 16, 2012
    Publication date: April 17, 2014
    Applicant: FUJIBO HOLDINGS INC.
    Inventors: Kouki Itoyama, Fumio Miyazawa
  • Patent number: 8662962
    Abstract: A sheet of sandpaper includes a backing layer having opposed first and second major surfaces, an adhesive make coat on the first major surface, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and a non-slip coating layer on the second major surface. Methods of making and using such sandpaper are also provided.
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: March 4, 2014
    Assignee: 3M Innovative Properties Company
    Inventor: John G. Petersen
  • Patent number: 8663349
    Abstract: Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating polycrystalline diamond tables and PDCs in a manner that facilitates removal of metal-solvent catalyst used in the manufacture of polycrystalline diamond tables of such PDCs.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: March 4, 2014
    Assignee: US Synthetic Corporation
    Inventors: Mohammad N. Sani, Jair J. Gonzalez, Andrew E. Dadson, Debkumar Mukhopadhyay
  • Publication number: 20140038503
    Abstract: A polishing pad for polishing a semiconductor device and manufacturing method therefor, the polishing pad comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein an M-component of the polyurethane-polyurea resin foam has a spin-spin relaxation time T2 of 160 to 260 ?s, the polyurethane-polyurea resin foam has a storage elastic modulus E? of 1 to 30 MPa, the storage elastic modulus E? being measured at 40° C. with an initial load of 10 g, a strain range of 0.01 to 4%, and a measuring frequency of 0.2 Hz in a tensile mode, and the polyurethane-polyurea resin foam has a density D in a range from 0.30 to 0.60 g/cm3. The polishing pad remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and can be used for primary polishing or finish polishing.
    Type: Application
    Filed: April 16, 2012
    Publication date: February 6, 2014
    Applicant: FUJIBO HOLDINGS, INC.
    Inventors: Kouki Itoyama, Fumio Miyazawa
  • Publication number: 20140037936
    Abstract: There is provided a preparation method for a porous pressure sensitive adhesive article, a porous pressure sensitive adhesive article, and an abrasive pad. According to an example of the present application, as a porous pressure sensitive adhesive article including a pressure sensitive adhesive layer formed on a porous article, an article having excellent resistance to an external shear strength and to peeling can be provided. Further, according to the above method, the porous article can be attached firmly to a large-area adherent. In an example, the porous article may be an abrasive pad.
    Type: Application
    Filed: August 16, 2013
    Publication date: February 6, 2014
    Applicant: LG CHEM, LTD.
    Inventors: Jong Rok JEON, Se Woo Yang, Suk Ky Chang
  • Publication number: 20140017985
    Abstract: An abrasive article includes a substrate, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, at least about 5% and not greater than about 99% of a total amount of the first type of abrasive particle has an exposed surface, and a bonding layer overlying at least a portion of the abrasive particles and the tacking layer.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 16, 2014
    Inventors: Yinggang Tian, Mary J. Puzemis, Paul W. Rehrig, John Pearlman, Arup K. Khaund, Wei Che
  • Publication number: 20140017984
    Abstract: An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, a second type of abrasive particle different than the first type of abrasive particles overlying the tacking layer, and a bonding layer overlying at least a portion of one of the first type of abrasive particle and the second type of abrasive particle and the tacking layer.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 16, 2014
    Inventors: Paul W. Rehrig, Yinggang Tian, Wei Che, Arup K. Khaund, Thomas Puthanangady, Christopher Arcona, Srinivasan Ramanath
  • Patent number: 8628383
    Abstract: A coated abrasive product includes a particulate material containing green, unfired abrasive aggregates having a generally spheroidal or toroidal shape, the aggregates formed from a composition comprising abrasive grit particles and a nanoparticle binder. Free abrasive products, bonded abrasive products, and the particulate material also contain aggregates.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: January 14, 2014
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Shelly C. Starling, James Manning, Colleen Rafferty, Mark Sternberg, Anthony Gaeta
  • Publication number: 20140011434
    Abstract: An abrasive article includes a substrate comprising an elongated body, a first type of abrasive particle overlying the substrate, a bonding layer overlying the first type of abrasive particle, and a lubricious material overlying or integrated within the bonding layer.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 9, 2014
    Inventors: Mary J. PUZEMIS, Yinggang TIAN, Paul W. REHRIG, Arup K. KHAUND, John PEARLMAN
  • Patent number: 8602851
    Abstract: Provided is a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad. In one embodiment, the polishing pad comprises a polishing layer produced by applying to the subpad a hardenable fluid. In another embodiment, the subpad is coated with a barrier before coating with the hardenable fluid. In each embodiment, the depth of penetration of the polishing layer and/or barrier is substantially uniform. Also provided is a method of producing a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: December 10, 2013
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Brian Scott Lombardo, Joseph Cianciolo
  • Patent number: 8597087
    Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: December 3, 2013
    Assignee: Black & Decker Inc.
    Inventors: Jason C. Shermer, Matthew J. Holland
  • Patent number: 8574040
    Abstract: An abrasive disc includes a backing layer on a first major surface, a water-impermeable abrasive layer on a second major surface, and a water-absorbable, compressible, resilient, porous foam layer sandwiched in between the backing layer and the abrasive layer. The disc further includes a plurality of perforations. The disc is used to abrade a surface. Fluid is absorbed into the abrasive disc. The fluid is then released to the surface by compressing the abrasive disc against the surface in an abrading motion. The fluid is allowed to mix with and absorb surface swarf; and compression on the abrasive disc is released, reabsorbing the fluid and trapping swarf inside the disc.
    Type: Grant
    Filed: December 14, 2009
    Date of Patent: November 5, 2013
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Mervyn Chung-Fat, Biagio P. Pellegrino, Vivien Luttenschlager
  • Patent number: 8568498
    Abstract: Composition, apparatus, and methods of composition and apparatus manufacture, for sharpening a paper shredder blade. Composition includes grinding powder, thickening agent, and additive. The thickening agent may be a white oil, an animal oil, a vegetable oil, or a stearine wax. The additive may be an antirust powder, an antiwear powder, an antistatic powder, or an antioxidation powder. The grinding composition is dispensed into a polyethylene film, and sealed to form the grinding apparatus, as a grinding sheet or a grinding packet. A method for forming a grinding sheet includes selecting the constituent materials for a grinding composition; stirring the constituent grinding composition materials; heating the constituent materials to melting; mixing the constituent materials, while melting and intermixing; cooling and packaging the grinding composition to form a grinding sheet or packet.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: October 29, 2013
    Assignee: Aurora Office Equipment Co., Ltd Shanghai
    Inventor: Hsin-Hsiung Chen
  • Patent number: 8562389
    Abstract: A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: October 22, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Jimin Zhang, Thomas H. Osterheld, Boguslaw A. Swedek
  • Patent number: 8557376
    Abstract: A polishing pad which suppresses occurrence of a scratch or a roll-off on an object to be polished so that flatness is improved is provided. A polishing pad 1 is comprised a polyurethane sheet 2 having a polishing surface P for performing polishing processing to an object to be polished and an elastic sheet 3 having elasticity joined on a surface of the polyurethane sheet 2 on the opposite side to the polishing surface P. The polyurethane sheet 2 is set higher in compressibility than the elastic sheet 3, and is set lower in A hardness than the elastic sheet 3. The elastic sheet 3 is set at 1% or more in compressibility, and is set at 90 degrees or less in A hardness. Further, both of the polyurethane sheet 2 and the elastic sheet 3 are formed to have a thickness of 0.2 mm or more. The flexibility of the polyurethane sheet 2 is exerted during polishing processing so that the polyurethane sheet 2 deforms to press the polishing surface P approximately evenly on the object to be polished.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: October 15, 2013
    Assignee: Fujibo Holdings Inc.
    Inventors: Yasushi Matsumura, Masataka Takagi
  • Patent number: 8550878
    Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: October 8, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Naga Chandrasekaran, Arun Vishwanathan
  • Patent number: 8545583
    Abstract: Flexible abrasive sheet articles having precision thickness flat-topped raised island structures that are coated with a monolayer of equal sized abrasive agglomerate are described. Methods of producing high quality equal-sized spherical shaped composite abrasive agglomerate beads containing small diamond abrasive particles are described. Beads are produced by level-filling fine mesh screens or perforated sheets with a water based metal oxide slurry containing abrasive particles and then using a fluid jet to eject the abrasive slurry lumps from the individual screen cells into a dehydrating environment. Surface tension forces form the ejected liquid lumps into spheres that are solidified and then heated in a furnace to form ceramic beads. These porous ceramic abrasive beads can be bonded directly onto the flat planar surface of a flexible backing material or they can be bonded onto raised island surfaces to form rectangular or disk abrasive sheet articles.
    Type: Grant
    Filed: January 5, 2005
    Date of Patent: October 1, 2013
    Inventor: Wayne O. Duescher
  • Patent number: 8512100
    Abstract: There are provided an abrasive tape capable of suppressing contamination of a magnetic disk due to shattered abrasive particles and smoothing the surface of the magnetic disk; a method for producing an abrasive tape; and a varnishing process. An abrasive tape 1 produced according to the method for producing an abrasive tape of the invention is used in a process for varnishing a magnetic disk and produced according to a process for preparing a slurry by kneading and dispersing abrasive particles 5 and a binding agent 6; a process for forming a coating film by applying the slurry on a support 2; a process for forming an abrasive particle layer 3 by hardening the coating film; and a process for forming a coating layer 4 on the surface of the abrasive particle layer 3.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: August 20, 2013
    Assignee: Showa Denko K.K.
    Inventors: Ryuji Sakaguchi, Kazuya Niwa
  • Patent number: 8512427
    Abstract: A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G?, of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 ?m/min.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: August 20, 2013
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Jia Xie, David B. James, Chau H. Duong
  • Patent number: 8506356
    Abstract: An apparatus for chemical mechanical polishing (CMP) of a wafer has a rotatable platen to hold a polishing pad, a polishing head for holding the wafer against the polishing pad, an optical monitoring system and a position sensor. The platen has a hole therein, the optical monitoring system includes a light source to direct a light beam through the aperture toward the wafer from a side of the wafer contacting the polishing pad and a detector to receive reflections of the light beam from the wafer, and the position sensor senses when the hole is adjacent the wafer such that the light beam generated by the light source can pass through the hole and impinge on the wafer.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: August 13, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Patent number: 8496512
    Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: July 30, 2013
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu-Piao Wang
  • Patent number: 8491359
    Abstract: The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: July 23, 2013
    Assignee: Bestac Advanced Material Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang, Wen-Chieh Wu
  • Patent number: 8476328
    Abstract: A method for manufacturing a polishing pad that has high level of optical detection accuracy and is prevented from causing slurry leak from between the polishing region and the light-transmitting region includes preparing a cell-dispersed urethane composition by a mechanical foaming method; placing a light-transmitting region at a predetermined position on a face material or a belt conveyor, continuously discharging the cell-dispersed urethane composition onto part of the face material or the belt conveyor where the light-transmitting region is not placed; placing another face material or belt conveyor on the discharged cell-dispersed urethane composition; curing the cell-dispersed urethane composition to form a polishing region including a polyurethane foam, so that a polishing sheet is prepared; applying a coating composition containing an aliphatic and/or alicyclic polyisocyanate to one side of the polishing sheet and curing the coating composition to form water-impermeable film; and cutting the polishing
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: July 2, 2013
    Assignee: Toyo Tire & Rubber Co., Ltd
    Inventors: Junji Hirose, Takeshi Fukuda
  • Patent number: 8444457
    Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: May 21, 2013
    Assignee: Black & Decker Inc.
    Inventors: Jason C Shermer, Matthew J Holland
  • Patent number: 8431489
    Abstract: A chemical mechanical polishing pad having a polishing layer with an integral window and a polishing surface adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate, wherein the formulation of the integral window provides improved defectivity performance during polishing. Also provided is a method of polishing a substrate using the chemical mechanical polishing pad.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: April 30, 2013
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Mary Jo Kulp, Shannon H Williams
  • Patent number: 8430721
    Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: April 30, 2013
    Assignee: Innopad, Inc.
    Inventors: Oscar K. Hsu, Paul Lefevre, Marc C. Jin, John Erik Aldeborgh, David Adam Wells