Abstract: The disclosure relates to layers comprising a body having a thickness, T, comprising a curable composition comprising a polymerizable epoxy-acrylate resin composition and abrasive particles at least partially embedded in the polymerizable epoxy-acrylate resin composition, wherein the body includes a plurality of void spaces free of the curable composition extending into the body from the first major surface and the depth of the plurality of void spaces is at least 10 percent of thickness T. The disclosure also relates to cured compositions formed from such curable compositions and, in turn, abrasive articles made from such cured compositions as well as methods for making abrasive articles.

Abstract: Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto a porous pad, contacting the substrate with the porous pad while moving the porous pad and substrate relative to one another such that higher portions of the substrate contact the porous pad and lower portions of the substrate do not contact the porous pad, and removing material from the higher portions of the substrate via contact with the porous pad to reduce a height of the higher portions of the substrate relative to the lower portions of the substrate.

Abstract: A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.

Abstract: A method for CMP is provided. The method includes the following operations. A semiconductor wafer is received. The semiconductor wafer is polished. In some embodiments, a residue is generated during polishing the semiconductor wafer and the residue attaches to a surface of a conditioning disk disposed on a dresser head. The dresser head and the conditioning disk are moved back and forth between a refuge position and a working region by the dresser arm during polishing the semiconductor wafer. The surface of the conditioning disk is scanned to remove the residue using a laser scanner when the dresser head and the conditioning disk are in refuge position.

Abstract: A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A nickel plating layer is provided over the metal wire. An adhesion layer is provided at an interface between the metal wire and the nickel plating layer. The adhesion layer contains nickel and tungsten. A plurality of abrasive particles are provided at a surface of the nickel plating layer.

Abstract: An abrasive sheet is described which is composed from a combination of an abrasive material and an abradable polymer composite wherein the abradable polymer composite comprises a layer of a first polymeric composition and conjoined thereto a layer of a second polymeric composition wherein the layer of said second polymeric composition is provided with a sensory cue.

Abstract: Presented herein are implantable digital communication techniques for use in implantable systems, such as implantable hearing systems. An implantable system in accordance with embodiments presented herein includes an implantable stimulator module and an implantable secondary module connected to the implantable stimulator module via a wire connection. The implantable secondary module is configured to generate and send a biphasic information signal to the implantable stimulator module via the wire connection. An error detector in the implantable stimulator module is configured to detect when the biphasic information signal includes an error.

Abstract: A method of fabricating a polishing pad includes determining a desired distribution of voids to be introduced within a polymer matrix of a polishing layer of the polishing pad. Electronic control signals configured to be read by a 3D printer are generated which specify the locations where a polymer matrix precursor is to be deposited, and specify the locations of the desired distribution of voids where no material is to be deposited. A plurality of layers of the polymer matrix corresponding to the plurality of the first locations is successfully deposited with the 3D printer. Each layer of the plurality of layers of polymer matrix is deposited by ejecting a polymer matrix precursor from a nozzle. The polymer matrix precursor is solidified to form a solidified polymer matrix having the desired distribution of voids.

Abstract: A polishing pad, having a polishing layer comprising a thermoset polyurethane foam, wherein the polishing layer has an in-plane variation of 12 or less in microrubber A hardness, the variation being obtained by measuring the polishing layer from a polishing surface side of the layer, the thermoset polyurethane foam contains, as raw material components, an isocyanate component and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise a trifunctional polyol having at least one terminated hydroxyl group that is a secondary hydroxyl group, and having a hydroxyl group value of 150 to 1,000 mg KOH/g in an amount of 10 to 50 parts by weight for 100 parts by weight of the active-hydrogen-containing compounds.

Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Abstract: Disclosed herein is sandpaper that includes a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper. The sandpaper includes a second plurality of particles having a second grain size that is smaller than the first grain size, the second plurality of particles having a second sanding surface covering a second area of the sandpaper. Further, the sandpaper includes a bonding layer having a back surface located opposite the first sanding surface and second sanding surface and a buffer positioned to raise the second plurality of particles such that the first sanding surface and the second sanding surface of the sandpaper are substantially planar.

Abstract: The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 shore D, and has a polishing surface for polishing a workpiece. Whereby, the polishing layer will not peel off from the cushion layer easily, so that the polishing quality is raised.

Abstract: A method for manufacturing a laminated polishing pad of the present invention, comprising the steps of: forming a polishing layer by providing a light transmitting region in an opening A of a polishing region; providing an adhesive member X on one side of the polishing layer, wherein the adhesive member X contains a hot-melt adhesive; providing a removable protective member on a part of the adhesive member X corresponding to the light transmitting region; bonding a support layer to the adhesive member X on which the removable protective member is provided; and removing a part of the support layer corresponding to the light transmitting region and also removing the removable protective member to form an opening B.

Abstract: A polishing pad having a polishing layer comprising a thermoset polyurethane foam, wherein about the thermoset polyurethane foam, the Asker C hardness value thereof is 82 or less as a 60-second value, the hardness value being a value after the foam is immersed in water for 24 hours, and further the value of the tensile storage modulus E? (30° C.) thereof at a frequency of 1.6 Hz satisfies the following expression (1): Y<5X?150??(1) wherein Y represents the tensile storage modulus E? (MPa), and X represents the Asker C hardness value (60-second value) after the foam is immersed in water for 24 hours.

Abstract: A chemical mechanical polishing pad is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a specific gravity of greater than 0.6; a Shore D hardness of 60 to 90; an elongation to break of 100 to 300%; and, a unique combination of an initial hydrolytic stability and a sustained hydrolytic instability.

Abstract: Disclosed is a polishing pad for chemical-mechanical polishing. The polishing pad has a porous interface and a substantially non-porous bulk core. Also disclosed are related apparatus and methods for using and preparing the polishing pad.

Abstract: Bonded abrasive articles and in particular organic bonded depressed center wheels with one or more reinforcements have reduced stiffness in comparison to conventional counterparts. Techniques for producing and using such wheels are described. In one example, a method for reducing the stiffness of an organically bonded abrasive wheel includes applying to a raised hub region of a reinforced depressed center wheel a force effective to irreversibly decrease the stiffness of said wheel.

Abstract: An object of the invention is to provide a polishing pad which has a polishing layer with a phase-separated structure and can provide high polishing rate and high planarization property and with which scratching can be suppressed. The polishing pad comprises the polishing layer. The polishing layer comprises a product of curing reaction of a polyurethane-forming raw material composition containing: (A) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (a) containing an isocyanate component and a polyester-based polyol; (B) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (b) containing an isocyanate component and a polyether-based polyol; and a chain extender, wherein the product of curing reaction has a phase-separated structure.

Abstract: A method of evenly coating small abrasive particles, specifically a method of coating diamond particles?10 ?m with nickel, and an abrasive article containing the coated abrasive particles, for example, a fixed diamond wire. The method includes applying ultrasonic energy to the plating bath and adjusting the power of the ultrasonic energy that a non-agglomeration factor (NAF) of the batch of abrasive particle is at least about 0.9, the non-agglomeration factor defined as a ratio (D50sa/D50b), wherein D50b represents the median particle size of the coated abrasive particles and D50sa represents the median particle size of the abrasive particles prior to coating.

Abstract: A method for producing a laminated polishing pad, which is free from warpage and does not cause peeling between a polishing layer and a cushion layer during polishing, includes the steps of: laminating a hot-melt adhesive sheet to a surface of a cushion layer with a base material in which a thermoplastic resin base material is provided peelably on one surface of the cushion layer, on which the thermoplastic resin base material is not provided; heating the laminated hot-melt adhesive sheet to be melted or softened; laminating a polishing layer on the melted or softened hot-melt adhesive to prepare a laminate; cutting the laminate to the size of the polishing layer to prepare a laminated polishing sheet; and peeling the thermoplastic resin base material from the laminated polishing sheet.

Abstract: Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.

Abstract: A foot exfoliation device including a base tray having non-slip surface member disposed on a bottom side thereof; a continuous wall disposed on the base tray top side proximal the periphery thereof; and a trough continuously disposed on the top side inside the wall. Stacked sand paper sheets are disposed within the trough. A removable snap-on cover is disposed atop the base tray. A sand paper post member, which is centrally disposed within the trough proximal to a base tray front end, permits exfoliation between toes. An aperture, centrally disposed proximal to a forward end of each of the sand paper sheets, slidingly receives the post member therethrough. A mirror is disposed on an underside of the cover to permit inspection of the user's feet.

Abstract: An abrasive article may include an abrasive body having a grinding layer, where the grinding layer may include a bond and abrasive particles contained within the bond. The abrasive body also may include a volumetric ratio GLVb/GLVap of at least about 0.4, where GLVb is a volume percent of bond for a total volume of the grinding layer and GLVap is a volume percent of abrasive particles for a total volume of the grinding layer. The abrasive particles may include seeded sol-gel ceramic and may have an average particle size of at least about 600 microns. In addition, the abrasive particles may include a coupling agent that may include an organic material with a silane functional group. Prior to formation of the abrasive article, the abrasive particles may be coated by the coupling agent at a ratio ACOA/AAB of at least about 0.1, where CCOA is the amount of coupling agent in grams in a pre-formation mixture and AAB is the amount of abrasive particles in pounds (lbs) in the pre-formation mixture.

Abstract: An abrasive article includes a backing having a major surface, an adhesion promoting layer overlying the major surface of the backing, and a make layer directly contacting the adhesion promoting layer. The adhesion promoting layer has a thickness of at least about 10 microns and is formed of a polar thermoplastic material, a cross-linkable polymer, or blends thereof.

Abstract: Herein are disclosed an apparatus and method for reaction injection molding of polyurethane foam. In the method, a recirculation loop containing polyols along with an effective amount of water, and a recirculation loop containing isocyanates, are each partially evacuated.

Abstract: An endpoint detection method includes processing an outer surface of a substrate, directing an incident light beam through a window in an opaque metal body onto the surface being processed, receiving at a detector a reflected light beam from the substrate and generating a signal from the detector, and generating a signal based on the reflected light beam received at the detector, and detecting a processing endpoint. The signal is a time-varying cyclic signal that varies as the thickness of the layer varies over time, and detecting the processing endpoint includes detecting that a portion of a cycle of the cyclic signal has passed, the portion being less than a full cycle of the cyclic signal.

Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.

Abstract: A polishing apparatus is provided for polishing an optical fiber connector. The optical fiber connector includes a connector housing and a ferrule. The polishing apparatus includes a mount to receive and hold the optical connector and a polisher housing supported by a base. The polisher housing houses a polisher that comprises a platen that supports a polishing media, the platen being coupled to a planetary gear system. The mount is disposed on a cover that encloses the polisher housing when the cover is placed in a closed position. A rotatable knob is exposed at an opening of the base, the rotatable knob being engaged with the planetary gear system to move the planetary gear system. The polishing media is disposed proximate to a fiber tip extending from an end face of the ferrule of the optical connector disposed in the mount when the cover is placed in the closed position.

Abstract: A method of forming one or more TSP compacts is provided. The method includes placing one or more TSP material layers in an enclosure and surrounding each TSP material layer with at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates. The method also includes exposing the enclosure to a high temperature high pressure process wherein the at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates bond to the TSP material layers forming a stack of TSP material layers including the TSP material layers one over the other with tungsten carbide bonded to each of the TSP material layers and encapsulating each of the TSP material layers.

Abstract: A macro-porous abrasive article includes a spun lace substrate having a macro-porous structure and a coating. The coating is made of a resin binder and abrasive aggregates. The abrasive aggregates are formed from a composition of abrasive grit particles and a nanoparticle binder. The coating is at least partially embedded in the substrate. A method for making the macro-porous abrasive article includes combining abrasive aggregates of abrasive grit particles and a nanoparticle binder with a resin binder to form a slurry. The slurry is applied to a macro-porous support structure so that the slurry at least partially penetrates the substrate. The resin is then cured to bond the aggregate grains to the substrate.

Abstract: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads.

Abstract: A chemical mechanical polishing pad for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate is provided containing a polishing layer, wherein the polishing layer comprises the reaction product of raw material ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate. Also provide are methods of making and using the chemical mechanical polishing pad.

Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Abstract: A sheet of sandpaper includes a backing layer having opposed first and second major surfaces, an adhesive make coat on the first major surface, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and a non-slip coating layer on the second major surface. Methods of making and using such sandpaper are also provided.

Abstract: Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating polycrystalline diamond tables and PDCs in a manner that facilitates removal of metal-solvent catalyst used in the manufacture of polycrystalline diamond tables of such PDCs.

Abstract: A polishing pad for polishing a semiconductor device and manufacturing method therefor, the polishing pad comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein an M-component of the polyurethane-polyurea resin foam has a spin-spin relaxation time T2 of 160 to 260 ?s, the polyurethane-polyurea resin foam has a storage elastic modulus E? of 1 to 30 MPa, the storage elastic modulus E? being measured at 40° C. with an initial load of 10 g, a strain range of 0.01 to 4%, and a measuring frequency of 0.2 Hz in a tensile mode, and the polyurethane-polyurea resin foam has a density D in a range from 0.30 to 0.60 g/cm3. The polishing pad remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and can be used for primary polishing or finish polishing.

Abstract: There is provided a preparation method for a porous pressure sensitive adhesive article, a porous pressure sensitive adhesive article, and an abrasive pad. According to an example of the present application, as a porous pressure sensitive adhesive article including a pressure sensitive adhesive layer formed on a porous article, an article having excellent resistance to an external shear strength and to peeling can be provided. Further, according to the above method, the porous article can be attached firmly to a large-area adherent. In an example, the porous article may be an abrasive pad.

Abstract: An abrasive article includes a substrate, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, at least about 5% and not greater than about 99% of a total amount of the first type of abrasive particle has an exposed surface, and a bonding layer overlying at least a portion of the abrasive particles and the tacking layer.

Abstract: An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, a second type of abrasive particle different than the first type of abrasive particles overlying the tacking layer, and a bonding layer overlying at least a portion of one of the first type of abrasive particle and the second type of abrasive particle and the tacking layer.

Abstract: A coated abrasive product includes a particulate material containing green, unfired abrasive aggregates having a generally spheroidal or toroidal shape, the aggregates formed from a composition comprising abrasive grit particles and a nanoparticle binder. Free abrasive products, bonded abrasive products, and the particulate material also contain aggregates.

Abstract: An abrasive article includes a substrate comprising an elongated body, a first type of abrasive particle overlying the substrate, a bonding layer overlying the first type of abrasive particle, and a lubricious material overlying or integrated within the bonding layer.

Abstract: Provided is a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad. In one embodiment, the polishing pad comprises a polishing layer produced by applying to the subpad a hardenable fluid. In another embodiment, the subpad is coated with a barrier before coating with the hardenable fluid. In each embodiment, the depth of penetration of the polishing layer and/or barrier is substantially uniform. Also provided is a method of producing a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad.

Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.

Abstract: An abrasive disc includes a backing layer on a first major surface, a water-impermeable abrasive layer on a second major surface, and a water-absorbable, compressible, resilient, porous foam layer sandwiched in between the backing layer and the abrasive layer. The disc further includes a plurality of perforations. The disc is used to abrade a surface. Fluid is absorbed into the abrasive disc. The fluid is then released to the surface by compressing the abrasive disc against the surface in an abrading motion. The fluid is allowed to mix with and absorb surface swarf; and compression on the abrasive disc is released, reabsorbing the fluid and trapping swarf inside the disc.

Abstract: Composition, apparatus, and methods of composition and apparatus manufacture, for sharpening a paper shredder blade. Composition includes grinding powder, thickening agent, and additive. The thickening agent may be a white oil, an animal oil, a vegetable oil, or a stearine wax. The additive may be an antirust powder, an antiwear powder, an antistatic powder, or an antioxidation powder. The grinding composition is dispensed into a polyethylene film, and sealed to form the grinding apparatus, as a grinding sheet or a grinding packet. A method for forming a grinding sheet includes selecting the constituent materials for a grinding composition; stirring the constituent grinding composition materials; heating the constituent materials to melting; mixing the constituent materials, while melting and intermixing; cooling and packaging the grinding composition to form a grinding sheet or packet.

Abstract: A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.

Abstract: A polishing pad which suppresses occurrence of a scratch or a roll-off on an object to be polished so that flatness is improved is provided. A polishing pad 1 is comprised a polyurethane sheet 2 having a polishing surface P for performing polishing processing to an object to be polished and an elastic sheet 3 having elasticity joined on a surface of the polyurethane sheet 2 on the opposite side to the polishing surface P. The polyurethane sheet 2 is set higher in compressibility than the elastic sheet 3, and is set lower in A hardness than the elastic sheet 3. The elastic sheet 3 is set at 1% or more in compressibility, and is set at 90 degrees or less in A hardness. Further, both of the polyurethane sheet 2 and the elastic sheet 3 are formed to have a thickness of 0.2 mm or more. The flexibility of the polyurethane sheet 2 is exerted during polishing processing so that the polyurethane sheet 2 deforms to press the polishing surface P approximately evenly on the object to be polished.

Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.

Abstract: Flexible abrasive sheet articles having precision thickness flat-topped raised island structures that are coated with a monolayer of equal sized abrasive agglomerate are described. Methods of producing high quality equal-sized spherical shaped composite abrasive agglomerate beads containing small diamond abrasive particles are described. Beads are produced by level-filling fine mesh screens or perforated sheets with a water based metal oxide slurry containing abrasive particles and then using a fluid jet to eject the abrasive slurry lumps from the individual screen cells into a dehydrating environment. Surface tension forces form the ejected liquid lumps into spheres that are solidified and then heated in a furnace to form ceramic beads. These porous ceramic abrasive beads can be bonded directly onto the flat planar surface of a flexible backing material or they can be bonded onto raised island surfaces to form rectangular or disk abrasive sheet articles.

Abstract: A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G?, of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 ?m/min.