Abstract: A nozzle for spraying sublimable solid particles and preventing frost from forming at surfaces of the nozzle. The nozzle includes: a cleaning agent block for phase-changing a cleaning agent into a snow containing sublimable solid particles; a nozzle block for growing the cleaning agent snow through adiabatic expansion and spraying the grown cleaning agent snow onto a surface of an object; a carrier gas block for supplying a carrier gas to the nozzle block to mix with the cleaning agent snow; and a heater for heating at least a portion of the carrier gas supplied from the carrier gas supply source. Fine dry ice particles and liquid CO2, passing through a solenoid valve from a CO2 reservoir tank and a pressure drop of a flow rate regulation valve, are introduced into the spray nozzle and then mixed with the carrier gas, such as N2 or purified air, and discharged.

Abstract: A process is taught for producing a smooth, damage-free surface on a SiC wafer, suitable for subsequent epitaxial film growth or ion implantation and semiconductor device fabrication. The process uses certain oxygenated solutions in combination with a colloidal abrasive in order to remove material from the wafer surface in a controlled manner. Hydrogen peroxide with or without ozonated water, in combination with colloidal silica or alumina (or alternatively, in combination with HF to affect the oxide removal) is the preferred embodiment of the invention. The invention also provides a means to monitor the sub-surface damage depth and extent since it initially reveals this damage though the higher oxidation rate and the associated higher removal rate.

Abstract: An elongated work is attached to an elongated holding surface opposed to a flat abrasive surface in a grinding device. The holding member is supported on a spherical receiving body so that the holding member changes its attitude around the spherical receiving body. The change of the attitude of the holding member reliably enables the work to uniformly contact with the flat abrasive surface. When relative movement is induced between the work and the flat abrasive surface, a chamfer is formed on the work with a high accuracy. The work is prevented from suffering from generation of microcracks and chipping. In addition, if the work moves on the flat abrasive surface only in one direction, the probability of generation of microcracks and chipping is considerably reduced.

Abstract: The present invention relates to a cooling disc for cooling grinding tools, having at least one fastening opening, a side which can face a grinding tool, a side which can face away from a grinding tool, a first contact face which is configured in such a way that it can be brought into contact with a corresponding face of a holding element of a grinding tool, and a second contact face which is configured in such a way that it can be brought into contact with a corresponding face of a fixture for a grinding tool. Furthermore, the invention relates to a grinding system which comprises at least one grinding tool which is provided with a holding element, a fixture for a grinding tool, and at least one cooling disc.

Abstract: In a rough grinding step the large quantity of coolant supplied to cool the grinding point enables the flow to pass through a wheel-following air layer and reach the grinding point while the supply of an air jet is stopped during this step. At a fine grinding step, the grinding point can be cooled with a small quantity of coolant in so far it is reliably supplied to the grinding point. This is realized by supplying an air jet to intercept the wheel-following air layer which rotates to follow the grinding wheel, while supplying the coolant in small quantity. Consequently, the coolant is prevented from being scattered by the air jet and suspended in form of mist when supplied in large quantity at the rough grinding step, and the coolant quantity used can be reduced at fine grinding step and minute grinding step.

Abstract: A chemical mechanical polish system for polishing a wafer includes a polishing head; an inner tube connected to the polishing head, wherein the inner tube is filled with a heat media; a media heater connected to the inner tube; and a pressure controller connected to the inner tube.

Abstract: A method for the simultaneous double-side grinding of a plurality of semiconductor wafers, involves a process wherein each semiconductor wafer lies such that it is freely moveable in a cutout of one of a plurality of carriers caused to rotate by means of a rolling apparatus and is thereby moved on a cycloidal trajectory, wherein the semiconductor wafers are machined in material-removing fashion between two rotating working disks, wherein each working disk comprises a working layer containing bonded abrasive. The method according to the invention makes it possible, by means of specific kinematics, to produce extremely planar semiconductor wafers.

Abstract: A method for manufacturing an article having polymeric residue that is to be removed during the manufacture of the article is disclosed. The article is introduced into a controlled environment of a processing tool having one or more processing chambers. Free radicals are generated from one or more reactant gases and introduced into at least one of the one or more processing chambers where they react with the polymeric residue. A cryogenic cleaning medium is supplied into at least one of the one or more processing chambers where the cryogenic cleaning medium removes the polymeric residue present after the free radicals react with the polymeric residue. The reactant gases are selected to facilitate removal of the polymeric residue with the cryogenic cleaning medium. The cryogenic cleaning medium is supplied with a pulsating flow via a nozzle implement that sweeps across the article.

Abstract: Polishing uniformity in a CMP process may be improved due to an improvement in the temperature uniformity of a polishing surface, when a wafer is polished by a CMP apparatus including a polishing head for holding the wafer, a platen, a polishing pad at a top of the platen so as to polish the wafer, and a heat conduction medium on or in the polishing pad and configured to diffuse heat of the polishing pad such that the temperature distribution of the polishing pad may become substantially uniform.

Abstract: An apparatus for edge processing of a glass sheet, the apparatus including a shroud, a finishing member and a wiping device. The finishing member is substantially enclosed by the shroud. The apparatus uses pressurized air emitted by at least one slot in the wiping device to prevent contaminants resulting from the edge processing from settling on and/or adhering to surfaces of the glass sheet. The wiping device may include a jet of washing fluid directed at the glass sheet to further wash the surfaces and the processed edge of the glass sheet.

Abstract: A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head configured to polish a wafer may include a wafer carrier, a retainer ring, and a cooling element. A chemical mechanical polishing apparatus including a polishing pad formed on a platen and a polishing head including a retainer ring.

Abstract: Apparatus for and methods of chemical mechanical polishing (CMP) of semiconductor wafers are disclosed. A preferred embodiment comprises an apparatus for polishing a semiconductor workpiece that includes a polishing pad, a fluid dispenser adapted to dispense a fluid to the polishing pad, and a temperature measurement device adapted to measure the temperature of the fluid. The apparatus includes a heat exchanger adapted to increase or decrease the temperature of the fluid.

Abstract: The present invention relates generally to the field of chemical/mechanical polishing of substrates. In particular the invention relates to methods of producing improved membranes for use in chemical/mechanical polishing systems. The present invention provides a method of improving the properties of a flexible membrane for use in chemical/mechanical polishing, the method including subjecting the membrane to elevated temperatures.

Abstract: A coolant delivery apparatus for a machine tool wherein the position of the coolant delivery apparatus is controllable such that coolant may be delivered to the machining contact zone of a tool even though the location of the machining zone of the tool may change such as during machining of a workpiece, or from one workpiece to another.

Abstract: Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the contact surface of the processing pad and a plurality of microstructures on the conditioning surface. The microstructures can be arranged in a pattern corresponding to a desired pattern of microfeatures on the contact surface of the processing pad. In several embodiments, the microstructures are raised elements projecting from the conditioning surface and/or depressions in the conditioning surface. The condition surface can also be smooth. The conditioning device can also include a heater coupled to the end-effector for heating the processing pad.

Abstract: A substrate holding apparatus can accurately control temperature of a substrate in a direct manner with a relatively simple arrangement. The substrate holding apparatus has a top ring configured to hold a substrate to be polished and press the substrate against a polishing surface, and an air bag attached to the top ring so as to be brought into contact with a rear face of the substrate. The substrate holding apparatus also has a regulator operable to regulate a temperature control fluid to be supplied into the air bag, and a flow regulating valve operable to regulate a flow rate of the temperature control fluid discharged from the air bag.

Abstract: The carrier head has a base and a substrate backing structure for holding a substrate against a polishing surface during polishing. The substrate backing structure is connected to the base and includes an external surface that contacts a backside of the substrate during polishing. The substrate backing structure also includes a resistive heating system to distribute heat over an area of the external surface and at least one thermally conductive membrane. The external surface is a first surface of the at least one thermally conductive membrane, and the resistive heating system is integrated within one of the at least one thermally conductive membrane.

Abstract: A method of polishing a remote grip optical connector comprises providing an optical fiber having a stripped terminal end. The fiber is inserted through a connector body and ferrule, where the connector body has a gripping region. The optical fiber is secured in the gripping region of the connector body. The connector is heated to heat the optical fiber and the ferrule to an elevated temperature and the heated terminal end of the optical fiber is polished flush with the heated end face of the ferrule.

Abstract: Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the contact surface of the processing pad and a plurality of microstructures on the conditioning surface. The microstructures can be arranged in a pattern corresponding to a desired pattern of microfeatures on the contact surface of the processing pad. In several embodiments, the microstructures are raised elements projecting from the conditioning surface and/or depressions in the conditioning surface. The condition surface can also be smooth. The conditioning device can also include a heater coupled to the end-effector for heating the processing pad.

Abstract: The heaters in the respective thin-film magnetic head in the bar are electrically connected to its neighbors, and a variable resistor is connected to each of the heaters in parallel. The resistance of each of the variable resistors is varied depending on the amount that the medium-opposing surface (ABS) of the thin-film magnetic head is to project. Also, the medium-opposing surface of the thin-film magnetic head in the magnetic head bar is polished while energizing all the heaters by the same power supply.

Abstract: A nozzle assembly and method is configured to apply coherent jets of coolant in a tangential direction to the grinding wheel in a grinding process, at a desired temperature, pressure and flowrate, to minimize thermal damage in the part being ground. Embodiments of the present invention may be useful when grinding thermally sensitive materials such as gas turbine creep resistant alloys and hardened steels. Flowrate and pressure guidelines are provided to facilitate optimization of the embodiments.

Abstract: A method for manufacturing an article having polymeric residue that is to be removed during the manufacture of the article is disclosed. The article is introduced into a controlled environment of a processing tool having one or more processing chambers. Free radicals are generated from one or more reactant gases and introduced into at least one of the one or more processing chambers where they react with the polymeric residue. A cryogenic cleaning medium is supplied into at least one of the one or more processing chambers where it removes the polymeric residue present after the free radicals react with the polymeric residue. The reactant gases are selected to facilitate removal of the polymeric residue with the cryogenic cleaning medium. The cryogenic cleaning medium is supplied via a nozzle implement that sweeps across the article. A slide mechanism and drive motor may be supplied internal or external to the controlled environment.

Abstract: In a grinding machine grinding a workpiece W by a grinding wheel G to supply coolant to one of a grinding point P or the workpiece W by way of a relative movement between the grinding wheel W rotatably supported on a wheel slide 11 and the workpiece W supported by a work support device 17, air layer 36 flowing on a circumferential surface Gc of said grinding wheel G by blowing hydraulic jet 35 transversally from one side to the other side of the grinding wheel G along the circumferential surface Gc at an upper stream position of a rotational direction of the grinding wheel G from the grinding point P. Mist of coolant blown by the hydraulic jet 35 through a recovering port 37, 43, 53 mounted on a wheel guard 20 covering a part of the grinding wheel G.

Abstract: An ice blasting apparatus comprises: an ice making device operating a cutting blade to shave off ice freezing on an inner wall of the freezing casing and continuously discharges the shaved ice as flake-shaped ice pellets; an ice mixing tank mixing the ice pellets and water and maintaining the resulting ice slurry at a predetermined concentration with a concentration sensor; and a blast gun blasting the ice slurry. A trimming method is performed on a film insert molding with a film material adhering to a face of a resin molding and extending beyond a periphery edge of the resin molding. A blast gun facing the face with the film adhering to it blasts ice slurry of a required concentration toward the vicinity of the periphery edge of the resin molding to remove the unnecessary portion of the film material extending beyond the periphery edge of the resin molding.

Abstract: A plasma assisted cryogenic cleaner for and a method of performing cleaning of a surface that must be substantially free of contaminants has a resiliently mounted nozzle for spraying a cryogenic cleaning medium on the surface. The cleaning is conducted by applying to the substrate surface a mixture of gases selected from the group consisting of oxygen, nitrogen, hydrogen, fluorine, hydrofluorocarbon or a mixture of such gases to both remove the photoresist layer and alter the composition of the residues such that the residues are soluble in water and/or have a weakened bonds that they can be removed with a stream of cryogenic medium. The cryogenic and plasma processes can be performed sequentially or simultaneously.

Abstract: The invention is an apparatus used for cleaning equipment including extremely high voltage energized electrical equipment using a dry ice blasting stream as the cleaning agent. The apparatus comprises a cleaning wand and a heating mechanism for impeding the formation of condensation and/or frost on the outer surface of the wand, thereby enabling the wand to operate for prolonged periods of time.

Abstract: Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for transferring energy relative to the wafer. A thermal energy detector oriented adjacent to the wafer mounting surface detects the temperature of the wafer. A controller is responsive to the detector for controlling the supply of thermal energy relative to the thermal energy transfer unit. Embodiments include defining separate areas of the wafer, providing separate sections of the thermal energy transfer unit for each separate area, and separately detecting the temperature of each separate area to separately control the supply of thermal energy relative to the thermal energy transfer unit associated with the separate area.

Abstract: Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the contact surface of the processing pad and a plurality of microstructures on the conditioning surface. The microstructures can be arranged in a pattern corresponding to a desired pattern of microfeatures on the contact surface of the processing pad. In several embodiments, the microstructures are raised elements projecting from the conditioning surface and/or depressions in the conditioning surface. The condition surface can also be smooth. The conditioning device can also include a heater coupled to the end-effector for heating the processing pad.

Abstract: A metal machining apparatus for removal of metal from a workpiece, that employs a laser-targeted coolant nozzle to apply coolant fluid to a machining tool, such as a grinding wheel, to remove metal from a workpiece. The laser-targeted coolant nozzle has a coolant nozzle body having a flow passage for the coolant fluid, and a laser bore through which a visible laser can be inserted. The visible laser cooperates with a positioning feature on the nozzle body for visually positioning the coolant nozzle relative to the grinding wheel. When the laser is removed and replaced with a seal plug, the stream of cooling fluid passing through the flow passage can be directed accurately at the grinding wheel for improved workpiece grinding.

Abstract: A substrate processing apparatus polishes a to-be-polished portion of a semiconductor substrate with a polishing tape. Part of the polishing tape is heated in advance. Part of the polishing tape is deformed conforming to a shape of the to-be-polished portion. Part of the deformed polishing tape is brought into contact with the to-be-polished portion of the substrate. The substrate and polishing tape are moved relative to each other.

Abstract: It is one object of a grinding machine and a grinding fluid supply-nozzle therefor according to the present invention to supply grinding fluid to a moving grinding point reliably, even if the surfaces of a grinding wheel is abraded up. A wheel head 5 advances/retracts to a workpiece. A grinding wheel G is carried rotatably by the wheel head 5 and grinds an eccentric portion W of the workpiece. A grinding fluid supply-nozzle 50 supplies grinding fluid to a moving grinding point K where the grinding wheel G contacts the eccentric portion W of the workpiece. The grinding fluid supply-nozzle 50 is made from a curve portion 53, an opening 51 and a straight portion 52 between the curve portion 53 and the opening 51. The grinding fluid supply-nozzle 50 spouts the grinding fluid to a grinding fluid supply point Pc upstream the grinding points K and Ks, even in the case that the grinding wheel G has been abraded up.

Abstract: Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the contact surface of the processing pad and a plurality of microstructures on the conditioning surface. The microstructures can be arranged in a pattern corresponding to a desired pattern of microfeatures on the contact surface of the processing pad. In several embodiments, the microstructures are raised elements projecting from the conditioning surface and/or depressions in the conditioning surface. The condition surface can also be smooth. The conditioning device can also include a heater coupled to the end-effector for heating the processing pad.

Abstract: A method of preparing a sanding block to repair a damaged surface profile. A first step involves finding an undamaged surface profile that matches the damaged surface profile. A second step involves providing a moulding block having a body with a flat surface surrounded by an upstanding flexible peripheral seal to form an enclosure. A third step involves filling the enclosure of the moulding block with hot melt adhesive and, with the hot melt adhesive still mouldable, pressing the moulding block against the undamaged surface profile until the hot melt adhesive solidifies to form a negative image of the undamaged surface profile. A fourth step involves removing the negative image formed of solidified hot melt adhesive from the undamaged surface profile for use as a sanding block.

Abstract: A coolant nozzle is used on a machine tool having a rotating bit of convoluted longitudinal profile for cutting a number of slots in a disk. The nozzle includes at least one coolant inlet and at least one coolant outlet. The coolant outlet has a convoluted section and is positioned to direct a coolant stream tangentially at the bit in a direction of rotation of the bit. Internal surface portions of the nozzle define one or more passageways between the inlet and the outlet(s).

Abstract: Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for transferring energy relative to the wafer. A thermal energy detector oriented adjacent to the wafer mounting surface detects the temperature of the wafer. A controller is responsive to the detector for controlling the supply of thermal energy relative to the thermal energy transfer unit. Embodiments include defining separate areas of the wafer, providing separate sections of the thermal energy transfer unit for each separate area, and separately detecting the temperature of each separate area to separately control the supply of thermal energy relative to the thermal energy transfer unit associated with the separate area.

Abstract: There is provided a chemical mechanical polishing apparatus, which may include a polishing table rotated by a polishing table motor and having a pad thereon, a carrier head located above the polishing table to be rotatable by the driving of a carrier head motor and having a wafer located under the bottom thereof, a slurry supplier for supplying a slurry to the upper portion of the polishing table, a first polishing end point detector for detecting a polishing end point through the temperature change of the temperature sensor, at least one temperature sensor for detecting the temperature of a polishing region (the wafer, the pad, and the slurry), and a second polishing end point detector for detecting a polishing end point from the changes of load current, voltage, and resistance of the carrier head motor.

Abstract: Apparatus and method to inject an air stream with dry ice or other sublimable particles to be blasted against a surface to be cleaned. An air lock assembly (20) with an air stream passage (21) and an intersecting conveyor passage (13) that has an endless cable conveyor assembly (38) passing through it. The conveyor (38) passes through a hopper (30) of dry ice particles before entering the air lock (20) and injecting the air stream with dry ice particles. V-seals packings (18) are provided as a means of limiting air form escaping from the points where the conveyor (38) enters and exits the air lock assembly (20). An adjustable speed motor (10) drives the conveyor (38) thereby giving an adjustable control of the ratio of dry ice to air.

Abstract: A method of precisely controlling the amount of flatness or curvature in a lapping plate is disclosed. The lapping plate is formed from two layers of metal alloys, such as tin-antimony and steel. A bimetallic effect is exploited to induce a linear expansion in the plate so that the flatness or curvature of the plate is manipulated with thermal cycling. The plate is machined and charged under very specific and tightly controlled temperatures to produce a very robust, flat plate charge. As temperature cycling induces a linear expansion along a single plane across the plate, the resultant flatness change is scalar with temperature, and can be repeated and controlled. When the plate laps magnetic sliders, the plate can be thermally cycled to produce a conical surface and a high crown-to-camber ratio can be achieved.

Abstract: The present invention supplies coolant to a grinding wheel surface and reliably guides the coolant to a grinding point on the grinding wheel surface, thereby significantly reducing the amount of coolant to be used. In a grinding method and device for supplying coolant while grinding a workpiece W with a rotating grinding wheel 1, a fluid nozzle 2 is disposed upstream from a grinding point 11 on the circumferential surface 10 of the grinding wheel 1. The fluid nozzle 2 blows a jet of fluid across an air layer 12, which is a layer of flowing air dragged along the circumferential surface 10 of the grinding wheel 1, from one lateral side of the air layer 12 to the other lateral side thereof. A grinding fluid nozzle 3 supplies coolant to a region between the grinding point 11 and a cutoff position 13 at which the fluid jet from the fluid nozzle 2 has deflected the air flow from the air layer 12. The coolant supplied from the grinding fluid nozzle 3 contacts the grinding point 11 on the grinding surface 10.

Abstract: A method of treating the surface of mechanically abraded glass includes a first step of providing a glass substrate having opposing first and second surfaces. The glass substrate having a recess in the first surface formed by abrasion, such as sand blasting. The glass substrate can also include a via therethrough, formed by said abrasion technique. A next step includes heating the glass substrate to its softening point. A next step includes holding the glass substrate at its softening point for a predetermined period of time to polish the recess and vias. This polishing returns transparency to the glass and reduces the possibility of crack propagation by reducing stress points and microcracks.

Abstract: A system and apparatus precisely controls the amount of flatness or curvature in a lapping plate. The lapping plate is formed from two layers of metal alloys, such as tin-antimony and steel. A bimetallic effect is exploited to induce a linear expansion in the plate so that the flatness or curvature of the plate is manipulated with thermal cycling. The plate is machined and charged under very specific and tightly controlled temperatures to produce a very robust, flat plate charge. As temperature cycling induces a linear expansion along a single plane across the plate, the resultant flatness change is scalar with temperature, and can be repeated and controlled. When the plate laps magnetic sliders, the plate can be thermally cycled to produce a conical surface and a high crown-to-camber ratio can be achieved.

Abstract: In a coarse honing step in a section (101), a honing head (15) provided with coarse honing hones (17) is inserted into a cylinder bore (13) of a cylinder block (11), the honing head 15 is rotated while axially moving it, and the inner peripheral surface of the cylinder bore (13) is thereby ground. In the next idling step in a section (102), the cylinder block (11) is left as it is for (60) seconds to generate a springback (S). In a subsequent finishing honing step in a section (103), a honing head (21) provided with finishing honing hones (19) is inserted into the cylinder bore (13), the honing head (21) is rotated in a reverse direction to a rotational direction in the coarse honing step while axially moving it, and the inner peripheral surface of the cylinder bore (13) is thereby ground. Further, a coolant is supplied to the sections of the coarse honing step, the idling step, and the finishing honing step from coolant nozzles (23), (25), and (27), respectively, using a common coolant supply source (29).

Abstract: In order to enable cutting of a soft ceramic green block by a dicing saw having excellent cutting accuracy, heat treatment is performed on the ceramic green block to dissociate a plasticizer, thereby improving hardness of the ceramic green block. Then the ceramic green block is cut by the dicing saw.

Abstract: A chemical mechanical polishing apparatus is described, which includes a platen, a polishing pad that is attached to the platen, and a means for adjusting the temperature of the polishing pad.

Abstract: A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.

Abstract: The invention provides a method of reducing thermal distortion in grinding machines. Such machines each comprise a machine base (60) and a grinding wheel (50) for grinding components in the machine (10). The method includes the steps of: (a) sensing a first temperature at an upper surface of the base (60) substantially below a position (110) in the machine (10) whereat component grinding using the wheel (50) occurs; (b) sensing a second temperature of an underside surface of the base (60) substantially below the position (110) whereat component grinding occurs; (c) determining a relationship between component size drift and changes in a difference between the first and second temperatures; and thereafter (d) correcting a positional offset applied to the wheel (50) during grinding in accordance with the determined relationship, thereby reducing the component size drift.

Abstract: A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.

Abstract: A method and apparatus for diamond wire cutting of metal structures, such as nuclear reactor vessels, is provided. A diamond wire saw having a plurality of diamond beads with beveled or chamfered edges is provided for sawing into the walls of the metal structure. The diamond wire is guided by a plurality of support structures allowing for a multitude of different cuts. The diamond wire is cleaned and cooled by CO2 during the cutting process to prevent breakage of the wire and provide efficient cutting. Concrete can be provided within the metal structure to enhance cutting efficiency and reduce airborne contaminants. The invention can be remotely controlled to reduce exposure of workers to radioactivity and other hazards.

Abstract: A metallic layer is cooled below room temperature, leading to an embrittlement. Subsequently, the metallic layer is stripped by performing a blasting process having a high efficiency because of the brittleness. Additionally, the substrate is prevented from being damaged by using a comparatively low blasting energy.

Abstract: An apparatus and method for stopping mechanical and chemical-mechanical polishing of a substrate at a desired endpoint. In one embodiment, a polishing machine has a platen, a polishing pad positioned on the platen, and a polishing medium located at a planarizing surface of the polishing pad. The polishing machine also has a substrate carrier that may be positioned over the planarizing surface of the polishing pad, and at least one heat sensor is coupled to the polishing machine to detect heat at a front side of the substrate. The heat sensor preferably measures a temperature of a component sensitive to heat at the front side of the substrate, such as the planarizing surface of the polishing pad, the back side of the substrate, or the byproducts produced by polishing the substrate.