Abstract: A method for ablating a synthetic diamond having a pitted surface includes applying a colloidal graphite to the surface of the diamond and subjecting it to an oxygen plasma so that preferably approximately 50 microns are removed from the surface of the synthetic diamond. The resulting surface of the diamond is virtually pit free. Preferably, the diamond is then mechanically lapped for finishing.

Abstract: The process which adds to the prior art steps of scraping, screening, and sanding the floor and applying a coat of a water-base sealer; the improvement steps of hand rubbing with fine sandpaper to remove all high spots and raised grain; subjecting the floor to the action of a rotating buffing pad having a diametric strip of sandpaper adhered thereto, followed by buffing with a rotating buffer pad unmodified with a strip of sandpaper; removing all dust by vacuuming and wiping with an aqueous dampened cloth; applying a coat of water-base finish; and repeating the above improvement steps with increasing fine sandpaper at least twice more to produce the final finished wood floor.

Abstract: The process for grinding a rotating rubber roll by means of a grinding wheel is taking place in such a way that at least during the last grinding cut a rotating plugging roll is applied to the grinding wheel which plugging roll has a harder rubber than the rubber roll.

Abstract: An interactive system for lapping transducers has an abrasive surface that communicates with the transducers in order to provide information for controlling the lapping and testing the transducers. The lapping body is preferably shaped as a disk, drum or tape, and communicates with the transducer with a type of signal that the transducer is designed to read and/or write. Thus for lapping a magnetic head or slider to be employed in a hard disk drive, the lapping body contains a magnetic medium layer that is either prerecorded or written by the head during lapping, while the signal received by the head is monitored and analyzed by a processor in order to determine, in part, when to terminate lapping. A series of transducers can be simultaneously lapped while individually monitored, so that each transducer can be removed from the lapping body individually upon receipt of a signal indicating that transducer has been lapped an optimal amount.

Abstract: A blowing device for a belt grinding machine has a nozzle arrangement having nozzles positioned relative to its grinding belt for blowing cleaning air jets onto the circulating grinding belt. The device further has an oscillating drive to oscillate the nozzle arrangement in the longitudinal direction thereof. A pair of elastic members suspend the nozzle arrangement, which is oscillated in the longitudinal direction by using a magnetic field. A ferromagnetic member is connected to the nozzle arrangement and is positioned within the magnetic field produced by an electric coil. By varying the magnetic field, the nozzle arrangement can be moved in the longitudinal direction, the spring providing an elastic restoring force to move the nozzle arrangement is the opposite direction when the magnetic field is turned off.

Abstract: For providing a method for polishing in which it is possible to polish a substance uniformly over a whole surface of a wafer without observing the polished surface of the wafer halfway through polishing, a wafer with current detective patterns formed of conductors directly contacted with a semiconductor substrate, and an insulating film covering the current detective patterns is held by a wafer holder with conductivity, and the insulating film is polished by a polisher in which a supporting plate with conductivity is exposed in openings through a polishing cloth while supplying a polishing slurry containing ions.

Abstract: A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.

Abstract: Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the housing for polishing a second face of the semiconductor wafer. The second face of the semiconductor wafer is opposite the first face of the semiconductor wafer. A first transfer mechanism is within the housing for delivering the polishing block and semiconductor wafer from the mounting apparatus to adjacent the first semiconductor wafer polisher. A controller controls operation of the mounting apparatus, the first semiconductor wafer polisher, and the first transfer mechanism.

Abstract: An apparatus and method for polishing a semiconductor wafer. A polisher includes a supporting plate having a conductive film and a polishing cloth formed on the conductive film of the supporting plate. The polishing cloth has a plurality of openings to expose the conductive film. A wafer holder has a conductive wafer holding surface to hold a semiconductor wafer having current detective patterns and an insulating film covering the current detective patterns. A polishing slurry supply device supplies a polishing slurry including ions to either the polishing cloth or the semiconductor wafer. A current detecting device, connected to the supporting plate and the wafer holder, detects a magnitude of a current flowing across the supporting plate and the wafer holder through the conductive wafer holding surface, the semiconductor wafer held by the wafer holder, the current detective patterns of the semiconductor wafer, the polishing slurry filled in the openings of the polishing cloth, and the conductive film.

Abstract: This invention completely removes a plating layer on the edge faces of a plated steel strip.

Abstract: A method and apparatus for "blending" air bearing rails of a magnetic air bearing slider used to carry a recording mechanism over a magnetic recording medium. In accordance with the present invention, a slider is held at a fixed angle with respect to a at least one essentially flat, abrasive blending surface, preferably configured as an elongated bar having a blending surface. The relative angle of the slider with respect to the plane of the blending surface causes an edge of a slider rail to make contact with the blending surface. A relative motion of the blending surface with respect to the slider in two generally orthogonal directions abrades the edge of the slider rail, generating a contoured edge, or "blend" on the slider rail which allows the slider to fly at approximately the same height over a disk medium over a broad range of skew angles and radial distances.

Abstract: In a process and apparatus for the overall machining of a ceramic tooth restoration and producing of appropriate sonotrode crowns, these sonotrode crowns act on a workpiece one after the other, however from the same direction in space and are activated by the same ultrasonic transmitter. For the production of said sonotrode crowns, a geometrical model corresponding to the ultrasonic machining apparatus is used.

Abstract: The cutting process is executed after the grinding process and for one semiconductor ingot, one grinding device and one inner diameter saw slicing machine are used to perform grinding process and cutting process respectively. During the grinding process, the entirety of the cylindrical body portion of the semiconductor ingot is cylindrically ground, a portion of the tail end is cylindrically ground, the orientation flat position is determined and an orientation flat is formed by surface grinding. During the cutting process the tail portion is cut off and a sample for lifetime measurement is taken and a wafer sample is cut off from the end of the cylindrical body portion on the tail side. The semiconductor ingot is reversed in the direction of the axis and the head portion of the semiconductor ingot is cut off and a wafer sample is cut off from the cylindrical body portion on the head side.

Abstract: Disclosed is a polishing process and a polishing apparatus for polishing an end face of a connector assembly with at least one optical fiber. The process comprising the steps of attaching at least one optical fiber with an optical connector made of different material from that of the optical fiber so that the optical fiber exposes from the end face of the optical connector and polishing the end face of the connector assembly with the optical fiber while pressing the same against a flat surface of a rotating abrasive wheel containing fixed abrasive grains with a constant load.

Abstract: Disclosed is a method of planarizing a diamond film which generally includes orifices in the surface. The method includes first polishing the diamond film surface to reduce the surface roughness. Next, a filler material is applied to the surface of the film to fill the orifices in the film. Finally, the film is polished to remove excess filler material and expose the diamond film surface. Also disclosed are planarized diamond films diamond substrate having a polished surface of both diamond and filler material and a variation in thickness of less than 8 percent.

Abstract: A method of midspan or end entry accessing of one or more selected optical fibers carried by an optical ribbon fiber. The top and bottom surfaces of a first selected span of the optical ribbon fiber are friction abraded to initiate delamination of the bond between the optical fibers and the matrix encapsulant. The delamination is completed by applying a rolling force to the circumference of the first selected span, and the delamination is then propagated by introducing the first selected span into the bore of a die element and urging the die element along a relatively longer second selected span of the optical ribbon fiber. With the delamination completed, the tip of an elongated tool is inserted through the encapsulant within the second selected span and between one or more selected optical fibers and the remaining optical fibers within the optical ribbon fiber.

Abstract: A method for finishing surfaces of workpieces includes a honing process with at least two method steps. In one of the method steps the surface, for example, the inner wall of a bore, is honed to a predetermined final dimension whereby a very fine structure with minimal depth of honing traces is generated so that a great portion of the surface functions as the supporting surface. In a further method step, which can be performed before or after the finishing-honing step, crossed grooves are provided in the surface by subjecting the surface to a stream of a medium, especially a laser, whereby the pattern of the grooves provides a lubricant reservoir for the future use of the workpiece. The treatment with a stream of a medium does not cause deformations at the edges of the grooves. This ensures an optimal distribution of the lubricant.

Abstract: Blade attachment slots for gas turbine engines are prepared by grinding to a stepped, generally straight sided configuration, semi-finish grinding to an envelope about 0.005 inches to 0.010 inches above the blueprint configuration, and finishing by broaching. This reduces the overall cost of the manufacturing process, permits a more economical use of existing broach machines, and allows greater versatility for short model runs and "just-in-time" production.

Abstract: Burrs formed at the ends of a bore during a honing operation performed by a single pass honing tool are removed by a deburring attachment which is carried on the leading end of the tool. The attachment includes one set of spring-loaded blades which remove burrs at one end of the bore as the tool is retracted from the bore and further includes an axially spaced set of spring-loaded blades which remove burrs at the opposite end of the bore during retraction of the tool.

Abstract: A nozzle for producing an ultrahigh-pressure fluid fan jet is shown and described. In a preferred embodiment, the nozzle has an inner surface defined by a conical bore extending from a first end to a second end, thereby creating an entrance orifice and an exit orifice in the first and second ends, respectively. A wedge-shaped notch extends inward from the second end towards the first end to a sufficient depth such that the shape of the exit orifice is defined by the intersection of the conical bore and the wedge-shaped notch. As pressurized fluid passes through the nozzle and out the exit orifice, the shape of the exit orifice causes the pressurized fluid to exit in the form of a fan jet having a substantially oval cross-section. This fan jet may be swept across a surface to be cleaned thereby selectively removing a layer of material from an underlying surface evenly and completely, without damaging the underlying surface. The fan jet may also be used to cut a fibrous or hard material.

Abstract: The diameter, the orientation flat width/notch depth and the length of the block 10p are measured by the measuring devices 71a, 71b and 71c respectively and then the machining errors .DELTA.Dp, .DELTA.Wp and .DELTA.Lp in the measured values against the set values are calculated at the error calculation unit 833. Then .DELTA.Dp, .DELTA.Wp and .DELTA.Lp are stored in memory at the memory unit 834 in correspondence with the identification codes IDi and IDj of the grinding device 5i (i=1-N) and the cutting device 6j (j=1-M) that performed the machining. Then at the average value calculation unit 835, the average values of .DELTA.Dp and .DELTA.Wp for each of the grinding devices 51-5N and the average value of the .DELTA.Lp for each of the cutting devices 61-6M are calculated. The average values of .DELTA.Dp and .DELTA.Wp are supplied to the corresponding grinding device 5i as the diameter correction value and the width/depth correction value respectively and the average value of .DELTA.

Abstract: A method of checking that a lens suits an eyeglass frame uses the lens grinding machine itself. The lens to be ground is mounted on a support shaft and moved into contact with the grinding wheel with the latter stationary. The support shaft is rotated stepwise until the lens to be ground has rotated through one complete turn. A check is carried out to determine whether a feeler associated with a template is operated thereby during such rotation. The invention finds an application in grinding machines used to trim eyeglass lenses.

Abstract: A gun liner repair apparatus and process for repairing a gun liner without isassembly of the gun or the liner. This apparatus includes a grinding unit for grinding away a damaged area of a liner and includes a potting unit for depositing new liner material on the damaged area of the liner.