Abstract: Semiconductor components, which each include at least one semiconductor chip mounted on a common carrier substrate, are singled. The separation is effected by severing of the carrier substrate. The carrier substrate is thereby bent at least in that area of the carrier substrate which is to be severed. The severing takes place beginning from the convexly curved surface of the carrier substrate. In addition, the invention describes a singling device for separating semiconductor components.

Abstract: A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

Abstract: Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished.

Abstract: An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surface of the carrier adapted to support a bar for lapping. The actuator adapted to actuate the carrier at the spaced actuation points and including a plurality of actuation members movably actuated via pressure supplied to the actuation members. The actuation members are supported in spaced staggered relation in chambers in a manifold. The actuation members are spaced relative to the spaced actuation points and are supported relative to the manifold to provide precision actuation for incrementally adjusting the profile of the carrier.

Abstract: Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks are described. In one aspect a polishing chuck includes a body dimensioned to hold a work piece, and a multi-positionable, force-bearing surface is positioned on the body. The surface has an undeflected position, and is bi-directionally deflectable away from the undeflected position. A deformable work piece-engaging member is disposed adjacent the force-bearing surface for receiving a work piece thereagainst. The work piece-engaging member is positioned for movement with the force-bearing surface. In another aspect, a yieldable surface is provided on the body and has a central area and a peripheral area outward of the central area. One of the central and peripheral areas is movable, relative to the other of is the areas to provide both inwardly and outwardly flexed surface configurations.

Abstract: A method of producing and polishing a hard-material-coated wafer. A hard-material film is disposed on a substrate to form the wafer and provide the wafer with a convex shape. A surface of the substrate is fixed on a holder of a polishing machine having a whetstone turn-table. The holder is rotated about its axis, and the whetstone turn-table is revolved about its shaft. The convex film surface of the hard-material film is polished on the whetstone turn-table while the inclination angle of the holder relative to the turn-table is changed. In this way, the convex film surface is polished either from its center to its periphery or from its periphery to its center.

Abstract: In a chemical mechanical polishing process for planarization of semiconductor wafers, a pair of opposed grippers are used to move the wafer from one station to another. During this movement, the wafer is rotated and brushes along the periphery are placed in contact with the edge of the wafer to remove foreign material and residue which builds up along the edge of the wafer. Cleaning fluid may be introduced to flush away and/or breakup the residue buildup.

Abstract: Abrasive grains are produced by gluing an abrasive powder to an elastic porous carrier. A number of abrasive grains are mixed with an abrasive liquid, and are then sprayed to the surface of a work at an oblique angle thereto to impact it while allowing the abrasive grains to slide on the surface of a work to finish the surface of the work. Over the distance of travel over which the abrasive grains slide, the surface of the work are ground. The elasticity of the carrier allows the abrasive grains to deform matching the contour of the work. By spraying a number of abrasive grains on the work, grinding action is performed in consideration of the contour even if the work is a complicatedly contoured surface such as a dental prosthesis while a polishing effect is obtained at the same time.

Abstract: A method and device which is provided for thinning flip chip bonded integrated circuit (IC) devices with better accuracy. The method and device permit a successful approach to one portion of the circuit while leaving other portions of the circuit intact. Thus, other portions of the circuit can be the subject of later analysis or can be modified as debugging may require. The method and device provide the above stated capability in an effective and efficient manner.

Abstract: A wafer carrier for polishing or planarizing semiconductor workpieces or wafers includes a pressure plate configured to hold a wafer to be polished or to be planarized against a polishing pad, and is further configured to rotate the wafer during the polishing or planarizing process. A retaining ring for holding the wafer is mounted about the periphery of the pressure plate. The retaining ring slides vertically and independently relative to the pressure plate. A polishing pad load ring is also slideably mounted about the periphery of the retaining ring. The pad load ring is biased against the polishing pad, and slides vertically and independently of the pressure plate and the wafer retaining ring. In operation, the wafer carrier is moved across the polishing pad, which is sufficiently compliant to cause wave deformation of the surface of the pad.

Abstract: In a process for deburring edges on an object, for example the cutting edges (14) of a cutting tool (12), a fluid guided under high pressure through at least one nozzle (26) in the form of at least one fluid jet (28) is directed onto the edges with a speed sufficiently high to separate the burrs. A device for deburring the edges (14) of an object (12) with an axis of rotation (z) has a clamping means (16) for temporary clamping of the object (12) to be deburred and at least one fluid-carrying nozzle (26) arranged transverse to the axis of rotation (z) and aimed at the object (12), where the nozzles (26) and/or the clamping means (16) are designed to perform a rotational movement about the axis of rotation (z). Deburring is carried out carefully and without damaging or rounding the edges.

Abstract: A surface treatment process employing pulsed laser energy enables selective texturizing and polishing of non-magnetizable substrate disks used in fabricating magnetic reading and recording media. Substrate surfaces are texturized over dedicated head contact zones to form multiple nodules that are highly uniform to precisely control surface roughness. Laser polishing of data zones causes localized flow of the substrate material, to remove the residual scratches of mechanical polishing without altering the non-magnetic character of the substrate at large. Between the data zones and contact zones, transition zones can be formed by selectively graduating the nodule heights in the radial direction. The rounded structure of the nodules increases surface resistance to intended or incidental transducing head contact.

Abstract: A method of machining an article including the steps of providing a resilient article having a lower face with a predetermined profile and an upper face; providing a reference article with an upper face having a reference profile; abutting at least part of the lower face against the reference article upper face and applying force to resiliently deform the resilient article a predetermined amount whereby the lower face of the resilient article substantially conforms to the shape of the reference article upper face; machining the upper face of the resilient article to a predetermined configuration; releasing the force applied to deform the resilient article whereby the upper face of the resilient article deforms to adopt a desired configuration.

Abstract: A semiconductor wafer carrier for holding a wafer is provided, where the wafer has edge portions and central portions. The carrier has a fixed permanent magnet having portions defining a cavity and a first coil slidably disposed within the cavity of the fixed permanent magnet. Also provided is a speaker cone having a conical portion and a diaphragm portion. The conical portion has a first end of a first diameter and a second end of a second diameter larger than the first diameter. The first end is fixed to the first coil. The diaphragm covers the second end and has edge portions constrained from movement and central portions free to deflect. A backing film is sealingly affixed to the diaphragm for isolating the speaker from the outside environment. Lastly, a wafer retaining means is provided for retaining the wafer against the backing film along its edge portions.

Abstract: The object of the present invention is to provide a method for recycling a substrate for an organic photosensitive member, which is excellent in environmental properties, economical properties and safety. In order to achieve the above object, the present invention provides a method for recycling a substrate for an organic photosensitive member with a photosensitive layer that contains a binder resin on an electrically conductive substrate, comprising the steps of; steeping the photosensitive member in a separating liquid to swell the photosensitive layer, and rubbing a surface of the photosensitive member with a brush having a pile length of 5-50 mm, a pile diameter of 2.5-30 denier and a pile density of 100-20000 piles/cm.sup.2.

Abstract: A method and apparatus provides a method for polishing a surface of a substrate with a polishing pad. The surface of the substrate is polished using the polishing pad. The surface of the substrate is deformed in response to changes in the polishing pad, wherein deformation of the surface of the substrate increases uniformity in polishing of the surface of the substrate.

Abstract: A wavy face ring having a smooth face and a method of manufacturing this wavy face ring. In particular, the method includes providing a ring blank having a face surface and a peripheral surface and applying a predetermined force to the peripheral surface of the ring. This force deforms the face surface of the ring blank into a first deformation pattern. The face surface of the ring blank is then treated while the force is being applied to the peripheral surface of the ring blank. Finally, the force is removed from the peripheral surface of the ring blank to allow the face surface of the ring to relax and assume a second deformation pattern. A wavy face ring assembly is also provided that includes opposing rings mounted about a rotating shaft. One of the rings is stationary with respect to the other and one of rings has a wavy face treated by a lapping machine. The ring can be a seal ring or a thrust ring.

Abstract: A workpiece is processed to manufacture a poppet valve comprising a larger diameter head and a stem. First, the stem is ground to correct bending and warping and to remove black skin formed by a mold releasing agent, and, then the stem of the workpiece is cut, thereby preventing variation of the total length and wear of support rollers.

Abstract: A system for polishing a semiconductor wafer includes a rotatable platen subassembly and a drive mechanism coupled to rotate the platen subassembly at a platen velocity. A polishing head supports and holds a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face whereby individual regions of the wafer face have different polishing rates. The polishing head includes pressure applicators for applying various localized pressures on the individual regions of the semiconductor wafer to conform the wafer face to a selected contour. The system also includes a polish control subsystem for monitoring in situ the polishing rates at various regions of the semiconductor wafer. The polish control subsystem adjusts in situ the platen velocity and/or the individual localized pressures applied to the semiconductor wafer to change the polishing rates of the individual regions of the semiconductor wafer.

Abstract: A separation process including providing a flexible belt photoreceptor comprising a photoconductive layer on the outer surface of a flexible metal belt substrate, the photoconductive layer including amorphous selenium or selenium alloy, transporting the substrate through an arcuate path having a small radius of curvature to apply stress to the photoconductive layer, and abrasively removing substantially all of the selenium or selenium alloy remaining on the substrate. This process may be carried out in an apparatus which includes at least one member having an arcuate surface with a small radius of curvature, means to transport the belt photoreceptor in an arcuate path over the arcuate surface, and abrasive means adapted to to contact and remove substantially all of the photoconductive layer from the substrate.

Abstract: A method for finishing surfaces of workpieces includes a honing process with at least two method steps. In one of the method steps the surface, for example, the inner wall of a bore, is honed to a predetermined final dimension whereby a very fine structure with minimal depth of honing traces is generated so that a great portion of the surface functions as the supporting surface. In a further method step, which can be performed before or after the finishing-honing step, crossed grooves are provided in the surface by subjecting the surface to a stream of a medium, especially a laser, whereby the pattern of the grooves provides a lubricant reservoir for the future use of the workpiece. The treatment with a stream of a medium does not cause deformations at the edges of the grooves. This ensures an optimal distribution of the lubricant.

Abstract: Blade attachment slots for gas turbine engines are prepared by grinding to a stepped, generally straight sided configuration, semi-finish grinding to an envelope about 0.005 inches to 0.010 inches above the blueprint configuration, and finishing by broaching. This reduces the overall cost of the manufacturing process, permits a more economical use of existing broach machines, and allows greater versatility for short model runs and "just-in-time" production.

Abstract: A bonding tool capable of uniformly pressing all electrodes of a semiconductor element and surely bonding all the electrodes and leads, even if the end pressing surface of a tool end part of a bonding tool is enlarged with the large-sized and long-sized tendency of semiconductor elements, is provided in which an end pressing surface of a tool end part fitted to a shank is composed of a hard material, characterized in that the end pressing surface is gradually curved to form a concave surface from the peripheral part to the central part at an application temperature of the bonding tool and the degree of flatness of the concave end pressing surface is in the range of 1 to 5 .mu.m at the application temperature of the bonding tool.

Abstract: A process for manufacturing semiconductor wafers having deformation ground in a defined way.

Abstract: One side of a sheet- or plate-like bank of metallic, plastic and/or other material is provided with at least one set of parallel grooves prior to being provided with an array of pyramidal and/or conical depressions. The grooves can be formed by brushes or by grinding, and the depressions can be formed by a rotary debossing tool having a peripheral surface provided with crossing transversely extending rows and circumferentially extending columns of protuberances. The treatment enhances the ability of the one side of the thus obtained sheet- or plate-like body to accept and retain a layer of lacquer, to be provided with an adherent layer of oxide or to accept a layer of adhesive prior to being bonded to a similarly treated or to an untreated second plate- or sheet-like body. The depth of the depressions can match or approximate the average depth of the grooves. The grooves can form two sets of parallel grooves, and the grooves of one set can cross the grooves of each other set at an angle of 90.+-.45.