Abstract: A sharpening apparatus for sharpening the blades of a forage harvester chopper drum includes a carriage to which is mounted a grindstone carrier that holds a grindstone that is moved across the chopper drum during sharpening operation. The grindstone carrier includes an element which is mounted to the carriage for movement towards the chopper drum in order to advance the grindstone. The carrier element contains a threaded bore in which is received a threaded shaft that has a ratchet wheel fixed to it. A pawl is located in the path of movement of the ratchet wheel so as to be engaged thereby when the carriage reaches a reversal point at one side of the drum, this engagement causing the ratchet wheel to be rotated by an angular distance occupied by one tooth so that the threaded shaft causes the grindstone carrier to move axially therealong and toward the chopper drum so as to advance the grindstone.

Abstract: A blade sharpening method and apparatus is characterized by sharpening the blade in a single station grinding assembly. The grinding assembly includes two opposed abrading wheels which interlock to form a nip for sharpening the blade. The wheels each include a first coarse portion for roughing an edge of the blade, a second fine portion for finishing the hone facet, and a third coarse portion for forming other facets adjacent to the hone facet. The wheels are specially contoured and have parallel axes tilted relative to the direction of travel of the blade. The striations formed on the facets of the blade by the abrading wheels extend at the same angle in both facets.

Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.

Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.

Abstract: The present invention is directed to improved apparatus' for dislodging and abrading cryolite encrustations from carbon anodes spent during aluminum smelting. Both the plow blade and flailing elements of the present invention are constructed and arranged to substantially conform to the shape of the spent carbon butts to facilitate rapid and efficient cleaning of the spent carbon anodes' surfaces. Systems and methods employing the substantially V-shaped plow blade extension and dual directional rotating flailing assemblies are also disclosed.

Abstract: An apparatus for grinding and polishing without visible flaws a variety of different size and shape full-lead crystal workpieces. A conveyor supports the workpieces and runs through the apparatus housing. A workpiece calibrator is located proximate the entrance end of the housing. A plurality of grinders having an abrasive grinding surface within a range of coarseness are located downline of the calibrator. A plurality of polishers are located downline of the grinders. Control means raises and lowers the calibrator, grinders and polishers relative to the belt conveyor and the unfinished surface of the workpiece supported thereon.A method of automatically making a finished full-lead crystal ornament using an automated machine having a housing, conveyor, a plurality of motor-driven grinding heads, and a plurality of motor-driven polishing heads.

Abstract: The grinding machine for grinding a frictional surface of a pad of the present invention comprises: a grooving cutter to be rotated; a cylindrical grinding wheel arranged at a position distant from the grooving cutter; a pad chucking portion for holding a frictional surface of the brake pad so that the frictional surface can be opposed to the outer circumferential surface of the cylindrical grinding wheel; an X-axis feed mechanism for advancing and retreating the pad chucking portion in the direction of X-axis parallel to the frictional surface of the brake pad; a Y-axis feed mechanism for advancing and retreating the pad chucking portion in the direction of Y-axis perpendicular to the frictional surface of the brake pad; a Z-axis rotation mechanism for rotating the brake pad around the Z-axis perpendicular to the frictional surface of the brake pad; and a numerically controlling circuit for controlling the motions conducted by the above mechanisms.

Abstract: A shallow notch 1 as a tentative mark is engraved on a periphery of an ingot at a position corresponding to a predetermined crystal orientation in the step of grinding the periphery of the ingot. After the ingot is sliced to wafers, a mark 2 for indication of a crystal orientation is carved on a sliced wafer at a position determined on the basis of the notch 1 by laser marking. Thereafter, the wafer is chamfered to a round shape, and the notch 1 is removed by the chamfering. Since a part where the mark 2 shall be carved is determined on the basis of the notch 1, the mark 2 is efficiently carved on the wafer without the necessity of subjecting each wafer to an X-ray analyzer.

Abstract: A method for producing semiconductor wafers is by a repeated sequence of grinding the end face of a monocrystal using a grinding tool and cutting a semiconductor wafer having a thickness from the monocrystal using a cutting tool, a grinding abrasion of a specified depth being produced during grinding and the semiconductor wafer being cut in a cutting plane which is as parallel as possible to the ground end face.

Abstract: A power-operated and hand steerable machine for stripping linoleum, tile, mastic, grout, adhesive and the like from a floor and also for re-surfacing the floor after the stripping operation. The machine includes a support frame, a drive plate driven by a motor about a vertical rotational axis, a reversible work plate mounted under the drive plate and carrying cutter blocks with cutter inserts at one face and abrasive-carrying devices at the opposite face. Therefore, after a floor stripping operation by the cutter inserts, the work plate can be reversed and a floor re-surfacing operation be carried out by using the abrasive-carrying devices. A change speed system enables to drive the work plate at a higher speed during floor re-surfacing than during floor stripping. Longitudinally adjustable weights are carried by the support frame to adjustably bias the work plate against the floor.

Abstract: A glass-plate working apparatus 1 includes: a supporting device 7 for supporting a glass plate 6 from a glass plate carrying-in section 2; a main cutter head device 9 for forming a main cut line 8 for bend-breaking on the glass plate 6 supported by the supporting device 7; a maincutter-head moving device 10 for relatively moving the main cutter head device 9; bend-breaking head devices 13 and 14 for forming edge cut lines 11 for bend-breaking on the glass plate 6 and for pressing the glass plate 6 to bend-break the glass plate 6; and bend-breaking head moving devices 15 and 16 for moving the bend-breaking head devices 13 and 14.

Abstract: A photo filmstrip (14) of a regular length (L) is produced from photo film web (45) having a predetermined width (W). The photo filmstrip and the photo film web have a back surface, an emulsion surface, a pair of lateral edge faces (45a), and four corner edges (45b, 45c) defined between the back surface, the emulsion surface, and the lateral edge faces. At least one of the lateral edge faces and at least one of the corner edges of the photo film web are abraded while the photo film web is conveyed. Photo film dust, created in the abrasion is eliminated from the photo film web. Perforations (34) are formed in the photo film web. The photo film web is cut by the regular length into the photo filmstrip, which is wound into a cassette shell.

Abstract: Disclosed are an improved method and apparatus for slicing a workpiece such as a semiconductor ingot, in which coolant nozzles are disposed near the cutting edge of an annular blade, air nozzles are respectively equipped near the both side surfaces, the air nozzles are connected to a compressed air supply source via pressure regulators and electromagnetic valves, a deflection detector is located in the vicinity of one of the side surfaces, which detector is connected to the air nozzles via a computer and the pressure regulators, wherein, in the course of slicing, for example, if an actual deflection has been detected toward one of the side surfaces, the compressed air is blown from an adjacent air nozzle to the one of the side surfaces and the secondary pressure of the pressure regulator connecting to the adjacent air nozzle is regulated higher or lower, as the blade is deflected larger or smaller.

Abstract: The reprofiling installation includes, arranged below a railway carriage, a milling device consisting of two frames (8, 9) linked together. These frames (8, 9) of differing lengths and guided by the track, carry each a milling unit (22, 24). The installation further includes a track heating unit (31) located in front of each milling unit (22, 24), and a unit for cooling the tracks behind each milling unit, as well as units for measuring the deformation of the track.

Abstract: The cutting process is executed after the grinding process and for one semiconductor ingot, one grinding device and one inner diameter saw slicing machine are used to perform grinding process and cutting process respectively. During the grinding process, the entirety of the cylindrical body portion of the semiconductor ingot is cylindrically ground, a portion of the tail end is cylindrically ground, the orientation flat position is determined and an orientation flat is formed by surface grinding. During the cutting process the tail portion is cut off and a sample for lifetime measurement is taken and a wafer sample is cut off from the end of the cylindrical body portion on the tail side. The semiconductor ingot is reversed in the direction of the axis and the head portion of the semiconductor ingot is cut off and a wafer sample is cut off from the cylindrical body portion on the head side.

Abstract: To simplify and to shorten the cutting of a glass sheet (3) with the help of a cutting tool (11) and the removal of a coating applied on glass sheet (3) with the help of a grinding tool (12), the scratching of glass sheet (3) and the removal of the coating in strips lying on both sides of the scratch lines, running parallel to the latter, is performed in a single operation. In the device proposed for this purpose, cutting tool (11) and grinding tool (12) are mounted on a common support (8) movable on a beam (5) over a supporting surface (2) for glass sheet (3). Grinding tool (11) is fastened to an auxiliary support (17), which can be pivoted around axis (10) of cutting tool (11) oriented perpendicular to supporting surface (2). Grinding tool (12) and cutting tool (11) can be raised from glass sheet (3) independently of one another and mounted on the latter. Further, a suctioning of the dust accumulating during removal of the coating from glass sheet (3) is provided.

Abstract: A kitchen appliance has a working unit with a motor and a mounting bracket for pivotably mounting the working unit under a kitchen cabinet. The working unit has a housing with a working area at a first face and a decorative second face. In a first position of the working unit, the working area is exposed at a first location. In a second position of the working unit, the working area is concealed by the mounting bracket and the decorative second face is exposed at the first location. Deflectable cantilevered detents are provided to stationarily hold the working unit at the first and second positions until moved by a user.

Abstract: A glass plate working machine includes table 20 on which glass plate 22 is placed, breaking unit 3 for forming a cutting line on glass plate 22 placed on table 20, and pressing the glass plate in the vicinity of a portion of the glass plate 22 formed with the cutting line to break that portion off; and moving unit 67 connected to the breaking unit 3 for moving same linearly along a surface of glass plate 22 placed on table 20. Breakage by breaking unit 3 and movement by moving unit 67 are controlled by a numerical control unit.

Abstract: The open end of the nozzle 42 is positioned close to and facing the surface of the metal base 20 on the side were the portion of the semiconductor ingot is to be cut off. An electromagnetic valve 46 is provided in the passage through which compressed air is supplied to the nozzle 42. The initial position of the blade 19 is detected by the detector 50U and the counter 52 measures the distance the blade 19 travels downward from the detected position and then the comparator 56 detects the point at which the measured value matches the value set on the numeric value setting device 54. The electromagnetic valve 46 is opened to emit compressed air from the nozzle 42 after this detection, until the detection of the lower limit position of the blade 19 by the detector 50D.

Abstract: Eyeglass lens edging machine with coaxial shaft halves to hold and rotate an eyeglass lens, an edging tool located radially to the eyeglass lens to form a notch or groove at the circumference of the eyeglass lens or to bevel the edge of the eyeglass lens contour and a device for controlled radial and for controlled or unconstrained axial guidance of the edging tool in accordance with the contour of the eyeglass lens and its three dimensional curve.

Abstract: The blade track control system employs a pair of bearing pads and a pair of sensors. Each bearing pad is provided with a supply of compressed air of constant pressure to provide an aerodynamic bearing surface film against a rotating saw blade. Each bearing pad is mounted on a structure, a portion of which may be flexed in order to deflect the saw blade from a datum plane into a cutting plane. Each sensor detects a deviation in the saw blade from the cutting plane and emits a signal which effects a movement of the bearing pad toward or away from the blade in order to effect a corresponding deflection of the saw blade back to the cutting plane. The two bearing pads are mounted independently of the sensors and each is moved relative to the saw blade by deflecting a cross bar on which the bearing pad is mounted in cantilevered fashion.

Abstract: Ingot-type semiconductor single crystals having diameters of more than 200 m can be sawed into thin wafers using an annular saw if the crystal is fed towards the cutting edge of the annular saw while rotating around its longitudinal axis. The method includes having a wafer sawed out in this way until a residual joint is created between a wafer and the end face of the ingot. Ingot and wafer are finally separated by means of a residue separation technique which leaves behind various central material projections on the ingot and the wafer. Particularly suitable for residue separation are torsion separation and separation by a wire saw. This procedure reliably prevents the frequently observable, uncontrollable breaking-off of the wafer in the final phase of the annular sawing if this is exclusively used as the method of separation.